Three-dimensional output structure high-power AC / DC source and heat dissipation structure thereof

Abstract

The utility model provides a high-power AC / DC source with a three-dimensional output structure and a heat dissipation structure thereof. The heat dissipation structure comprises two same first shells; a groove is formed in each first shell and is used for mounting a power amplification module, and an upper cover of each first shell is provided with a plurality of hole sites; a cooling fin is fixed at one end of a lower cover of the first shell, a fan is fixed at the other end of the lower cover of the first shell, the fan and the cooling fin are oppositely arranged and are separated by a convex edge on the lower cover of the first shell, and a plurality of hole sites are also reserved on the convex edge; the fixing piece simultaneously penetrates through the flanges on the lower covers of the two first shells to fix the fan together, so that the two cooling fins right opposite to the fan are attached to each other, the two first shells are relatively and fixedly connected, and an air channel is formed between the two shells. The technical problems that in the prior art, a power amplification module is poor in heat dissipation effect and not timely in heat dissipation are solved.

Description

Technical Field

[0001] This application belongs to the field of high-power AC / DC power source technology, and relates to a three-dimensional output structure high-power AC / DC power source and its heat dissipation structure. Background Technology

[0002] Power amplifier modules play a crucial role in high-power AC / DC sources. They amplify AC / DC signals and, under given distortion conditions, generate maximum power output to drive a load.

[0003] However, power amplifier modules generate a lot of heat when they are working. If this heat is not dissipated in time, it will cause the equipment to overheat, which will affect the stability and lifespan of the equipment, and may even damage the equipment.

[0004] Therefore, effective heat dissipation technology for power amplifier modules is one of the key factors that must be considered when designing and manufacturing high-performance electronic devices. At the same time, reasonable solutions must be adopted to achieve the high voltage and high current of high-power AC / DC sources. Utility Model Content

[0005] This application provides a three-dimensional output structure high-power AC / DC source and its heat dissipation structure, which solves the technical problems of poor heat dissipation and untimely heat dissipation of power amplifier modules in the prior art.

[0006] The following technical solution is adopted in this application:

[0007] This application provides a heat dissipation structure for a high-power AC / DC source, including:

[0008] Two identical first shells;

[0009] Each first housing has a groove inside for mounting a power amplifier module, and the upper cover of the first housing has multiple holes; one end of the lower cover of the first housing is fixed with a heat sink, and the other end is fixed with a fan. The fan and the heat sink are placed facing each other, and the two are separated by a protruding ridge on the lower cover of the first housing, and multiple holes are also reserved on the protruding ridge.

[0010] The fan is secured by fasteners that pass through the protruding ridges on the lower covers of the two first housings, so that the two heat sinks facing the fan are in close contact, the two first housings are fixedly connected relative to each other, and an air duct is formed between the two housings.

[0011] Optionally, the heat dissipation structure of the high-power AC / DC power source includes: a module signal input terminal at the bottom of the first housing, a module signal output terminal and a feedthrough capacitor at the top of the first housing, and both the module signal input terminal and the module signal output terminal are led out from the power amplifier module inside the first housing.

[0012] This application also provides a three-dimensional output structure high-power AC / DC power source, which includes: multiple heat dissipation structures of a high-power AC / DC power source as described in the above embodiment, the multiple heat dissipation structures of the high-power AC / DC power source are installed in a second housing, and a power amplifier module is installed in the heat dissipation structure of each high-power AC / DC power source; the outside of the second housing is provided with a signal input terminal, a signal output terminal and an output monitoring port, the signal input terminal is connected to the module signal input terminal of the power amplifier module, the signal output terminal is connected to the module signal output terminal of the power amplifier module; the outside of the second housing is also provided with a power supply terminal.

[0013] Optionally, the heat dissipation structure of multiple high-power AC / DC sources can be installed in one of the following ways: single-row parallel combination, double-row parallel combination, or multiple stacked.

[0014] Optionally, the top of the heat dissipation structure of multiple high-power AC / DC sources is covered with a cover plate, which is fixed to the first housing of the heat dissipation structure of the high-power AC / DC sources by fasteners.

[0015] Optionally, a switching power supply is also provided inside the second housing. The switching power supply is fixed to the cover plate 2 by a fastener and is internally connected to a power amplifier module.

[0016] Optionally, ventilation holes are provided on one side of the second housing opposite to the air duct formed by the heat dissipation structure of the high-power AC / DC source.

[0017] The beneficial effects of this application are:

[0018] The heat dissipation structure of the high-power AC / DC power source proposed in this application employs a small-casing heat dissipation method, namely the first housing, which helps to quickly conduct heat away from the module and prevent the module from degrading or being damaged due to overheating. The material of the first housing typically has good thermal conductivity and is designed with heat sinks and fans to increase the heat dissipation area and airflow, thereby improving thermal efficiency. The first housing can also provide a certain degree of electromagnetic shielding for the power amplifier module, reducing electromagnetic interference between modules and between modules and external devices.

[0019] This application provides a high-power AC / DC power source with a three-dimensional output structure. It employs a modular design, stacking multiple power amplifier modules to achieve a compact overall structure that facilitates maintenance. Parallel connection of multiple power amplifier modules increases the current output, thereby improving the overall power output of the high-power AC / DC power source. For the heat dissipation structure, each power amplifier module is encapsulated in a small housing designed for heat dissipation. The housing has built-in recesses, which contribute to two aspects: insulation (the recesses increase the space for insulating material, thus improving the module's insulation performance); and heat dissipation (the recesses facilitate heat dissipation, enhancing the module's heat dissipation effect and preventing overheating from affecting the power amplifier module's performance and lifespan).

[0020] Furthermore, the cover design on the power amplifier module, with the primary purpose of adding the first cover plate, aims to achieve a more uniform temperature distribution among the modules. This is achieved through the thermal conductivity of the cover plate, transferring heat from the hotter modules to the cooler ones, thereby reducing the temperature difference between the modules. The second cover plate's main function is to dissipate heat from the power supply while isolating the power supply section from the power amplifier module section. This reduces electromagnetic interference from the power supply to the power amplifier module and protects the power supply from the high temperatures generated during module heat dissipation. An independent power supply design improves system stability and safety, while also facilitating individual power supply maintenance and replacement. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of a separate heat dissipation structure for a high-power AC / DC power source provided in this application.

[0022] Figure 2 This application provides a schematic diagram of a set of two heat dissipation structures for a high-power AC / DC power source.

[0023] Figure 3 This application provides a schematic diagram of a three-dimensional output structure high-power AC / DC source.

[0024] Figure 4 This application provides a schematic diagram of a high-power AC / DC source with a three-dimensional output structure.

[0025] The components are: 1. First housing; 2. Module signal input terminal; 3. Power amplifier module; 4. Module signal output terminal; 5. Feedthrough capacitor; 6. Fan; 7. Top cover; 8. Heat sink; 9. Signal input terminal; 10. Signal output terminal; 11. Cover plate one; 12. Cover plate two; 13. Output monitoring port; 14. Bottom cover; 15. Protruding ridge; 16. Bottom; 17. Second housing; 18. Power supply terminal. Detailed Implementation

[0026] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0027] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0028] The present application will now be described in further detail with reference to the accompanying drawings:

[0029] Combination Figure 1 and Figure 2 This application provides a heat dissipation structure for a high-power AC / DC power source, comprising:

[0030] Two identical first housings 1; each first housing 1 has a groove inside for mounting a power amplifier module 3, and the upper cover 7 of the first housing 1 has multiple holes; one end of the lower cover 14 of the first housing 1 is fixed with a heat sink 8, and the other end is fixed with a fan 6. The fan 6 and the heat sink 8 are placed facing each other, and the two are separated by a protruding ridge 15 on the lower cover 14 of the first housing 1, and the protruding ridge 15 also has multiple holes.

[0031] The fan 6 is fixed together by the fasteners passing through the protruding ridges 15 on the lower cover 14 of the two first housings 1, so that the two heat sinks 8 facing the fan 6 are close to each other, the two first housings 1 are fixedly connected relative to each other, and an air duct is formed between the two housings.

[0032] In one embodiment, the heat dissipation structure of the high-power AC / DC power source provided in this application, when in use, encapsulates the power amplification module 3 in the groove of the first housing 1. The two identical structures constitute a single structure. The first housing 1 has an upper cover 7 and a lower cover 14. The fan 6 and the heat sink 8 are fixed on the lower cover 14. The air outlet of the fan 6 faces the heat sink 8. The two are separated by a protruding ridge 15 in the middle of the lower cover 14. The protruding ridge 15 is mainly used to fix the fan 6. The heat sink 8 is mainly fixed to the surface of the lower cover 14 by fasteners passing through the through holes of the heat sink 8 and the lower cover 14. It should be noted that the heat sink 8 used in this application is preferably a copper heat sink. Copper-aluminum heat sinks, aluminum heat sinks, and other metal or composite metal heat sinks can also be selected. The selection is based on the actual situation and is not limited. The upper cover 7 has multiple holes for other fixing and connection methods. The key point of this application is that two identical lower covers 14 of the first housing 1 are placed opposite each other, and the protrusions 15 on the two lower covers 14 are used to fix the same fan 6, so that the fan 6 is directly opposite the two heat sinks 8. The two heat sinks 8 are close to each other but do not intersect, forming an airflow channel between the two housings. Specifically, the lower cover 14 of the first housing 1 has screw holes. M4*10 three-in-one screws are used to fix the copper heat sinks to the first housing 1. Every two power amplifier modules are grouped together, and M4*25 three-in-one screws are used to fix the fans to the same group of power amplifiers.

[0033] It should be noted that structurally, each power amplifier module 3 is encapsulated in a small housing designed for heat dissipation. The housing has built-in recesses, a design that benefits from two aspects: insulation (the recesses increase the space for insulating material, thus improving the module's insulation performance); and heat dissipation (the recesses facilitate heat dissipation, enhancing the module's heat dissipation effect and preventing overheating from affecting the power amplifier module's performance and lifespan). Compared to existing technologies that place all power amplifier modules on a single heat sink, the structure provided in this application features an independent heat sink for each power amplifier module, with every two power amplifiers sharing a single fan, and airflow channels formed between the modules, improving the module's heat dissipation efficiency.

[0034] Optionally, the heat dissipation structure of the high-power AC / DC source includes: a module signal input terminal 2 is provided at the bottom 16 of the first housing 1, and a module signal output terminal 4 and a feedthrough capacitor 5 are provided at the top of the first housing 1. Both the module signal input terminal 2 and the module signal output terminal 4 are led out from the power amplifier module 3 inside the first housing 1.

[0035] It should be noted that, as Figure 1As shown, the module signal input terminal 2 of the power amplifier module 3 is led out from the bottom 16 of the first housing, and the module signal output terminal 4 and the feedthrough capacitor 5 are led out from the top of the first housing 1. The feedthrough capacitor 5 serves to filter out noise in the circuit. Specifically, there are screw holes in the bottom 16 of the small housing. The power amplifier board is installed and fixed with M2.5*6 three-in-one screws, and the transistors of the power amplifier board are fixed inside the housing with M3*10 three-in-one screws for heat dissipation. The module signal input terminal 2 is installed and fixed with a 2-flange MCX female RF connector; the module signal output terminal 4 is installed with a 2-flange MCX female RF connector. The power supply terminal 18 is equipped with an M3, 10pF feedthrough capacitor and connected to the positive and negative power supply terminals of the power amplifier module. Finally, the top cover 7 is fixed with M2.5*6 countersunk Phillips screws.

[0036] This application also provides a three-dimensional output structure high-power AC / DC power source, which includes: multiple heat dissipation structures of a high-power AC / DC power source as described in the above embodiment, the multiple heat dissipation structures of the high-power AC / DC power source are installed in a second housing 17, and a power amplifier module 3 is installed in the heat dissipation structure of each high-power AC / DC power source; the second housing 17 is provided with a signal input terminal 9, a signal output terminal 10 and an output monitoring port 13 on the outside, the signal input terminal 9 is connected to the module signal input terminal 2 of the power amplifier module 3, the signal output terminal 10 is connected to the module signal output terminal 4 of the power amplifier module 3; a power supply terminal 18 is also provided on the outside of the second housing 17.

[0037] Optionally, the heat dissipation structure of multiple high-power AC / DC sources can be installed in one of the following ways: single-row parallel combination, double-row parallel combination, or multiple stacked.

[0038] In one embodiment, the high-power AC / DC power source with a three-dimensional output structure provided in this application mainly houses multiple power amplifier modules, each installed in a small housing, designed in a single-row parallel arrangement, a double-row parallel arrangement, or multiple stacked configurations. Figure 3 As shown, multiple power amplifier modules 3 are connected in parallel for output. Each power amplifier module 3 has screw holes on its exterior housing. The cover plate 11 is fixed to the power amplifier housing with screws, and the entire assembly is housed within the second housing 17. Optionally, a switching power supply is also provided inside the second housing 17. The switching power supply is fixed to the cover plate 12 by fasteners and internally connected to the power amplifier module 3. When fixing the cover plate 12, which has corresponding power screw holes, the switching power supply is fixed to the cover plate 12 using M3*8 three-in-one screws. In practical use, after supplying power to the high-power AC / DC source of the stereo output structure, the signal generator output signal is connected to the signal input terminal 9. The gain module initially amplifies the signal, and then, after being connected in parallel by multiple power amplifier modules 3, the signal is further amplified and finally output from the signal output terminal 10. The output monitoring module 13 monitors the instrument's voltage in real time and outputs the signal through the output monitoring port 13.

[0039] It should be noted that the main purpose of the first cover plate (11) on the power amplifier module is to make the temperature distribution between the modules more uniform. This is achieved through the thermal conductivity of the cover plate, transferring heat from the hotter modules to the cooler modules, thereby reducing the temperature difference between the modules. The main function of the second cover plate (12) is to dissipate heat from the power supply while isolating the power supply section from the power amplifier module section. This reduces electromagnetic interference from the power supply to the power amplifier module and protects the power supply from the high temperatures generated during module heat dissipation. An independent power supply design improves system stability and safety, and also facilitates individual maintenance and replacement of the power supply.

[0040] Optionally, the top of the heat dissipation structure of multiple high-power AC / DC sources is covered with a cover plate 11, which is fixed to the first housing 1 of the heat dissipation structure of the high-power AC / DC sources by fasteners.

[0041] Optionally, ventilation holes are provided on one side of the second housing 17 opposite to the air duct formed by the heat dissipation structure of the high-power AC / DC source, which can improve heat dissipation efficiency.

[0042] Furthermore, this application provides a schematic diagram of a three-dimensional output structure high-power AC / DC source, such as... Figure 4 As shown, it includes: a signal input terminal, a gain module, a power amplification module, a power supply section, an output monitoring module, and a signal output terminal.

[0043] Among them, the signal input end inputs the signal from the signal generator to the high-power AC / DC source of the three-dimensional output structure;

[0044] The gain module amplifies the signal initially and enables digitally adjustable gain control.

[0045] The power amplifier module amplifies the input signal, and multiple modules are connected in parallel to output current amplification.

[0046] In the power supply section, the switching power supply powers the power amplifier module, and the auxiliary power board powers the other modules.

[0047] The output monitoring port, voltage monitoring port, and current monitoring port monitor voltage and current in real time.

[0048] The signal output terminal uses a BNC interface to output the amplified signal.

[0049] It should be noted that the high-power AC / DC power source with a three-dimensional output structure provided in this application adopts a modular design. By stacking multiple power amplifier modules, the overall structure of the high-power AC / DC power source with a three-dimensional output structure is compact and easy to maintain. The parallel connection of multiple power amplifier modules can increase the current output, thereby improving the overall power output of the high-power AC / DC power source with a three-dimensional output structure. Furthermore, each power amplifier module has an independent and compact heat dissipation structure, improving the heat dissipation performance of the structure and extending the service life of the components. Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this application and not to limit it. Although this application has been described in detail with reference to the above embodiments, those skilled in the art should understand that modifications or equivalent substitutions can still be made to the specific implementation methods of this application. Any modifications or equivalent substitutions that do not depart from the spirit and scope of this application should be covered within the protection scope of the claims of this application.

Claims

1. A heat dissipation structure for a high-power AC / DC power source, characterized in that, include: Two identical first shells (1); Each of the first housings (1) has a groove inside for installing a power amplifier module (3), and the upper cover (7) of the first housing (1) has multiple holes; one end of the lower cover (14) of the first housing (1) is fixed with a heat sink (8), and the other end is fixed with a fan (6). The fan (6) and the heat sink (8) are placed facing each other, and the two are separated by a protruding ridge (15) on the lower cover (14) of the first housing (1), and multiple holes are also reserved on the protruding ridge (15); The fan (6) is fixed together by the fastener passing through the protrusions (15) on the lower cover (14) of the two first housings (1) at the same time, so that the two heat sinks (8) facing the fan (6) are close to each other, the two first housings (1) are fixedly connected relative to each other, and an air duct is formed between the two housings.

2. The heat dissipation structure for a high-power AC / DC source as described in claim 1, characterized in that, include: The bottom (16) of the first housing (1) is provided with a module signal input terminal (2), and the top of the first housing (1) is provided with a module signal output terminal (4) and a feedthrough capacitor (5). The module signal input terminal (2) and the module signal output terminal (4) are both led out from the power amplifier module (3) inside the first housing (1).

3. A high-power AC / DC power source with a three-dimensional output structure, characterized in that, The three-dimensional output structure high-power AC / DC power source includes: a plurality of heat dissipation structures for a high-power AC / DC power source as described in any one of claims 1 to 2, wherein the plurality of heat dissipation structures for the high-power AC / DC power source are installed in a second housing (17), and a power amplifier module (3) is installed in each heat dissipation structure for the high-power AC / DC power source; the second housing (17) is provided with a signal input terminal (9), a signal output terminal (10) and an output monitoring port (13) on the outside, wherein the signal input terminal (9) is connected to the module signal input terminal (2) of the power amplifier module (3), and the signal output terminal (10) is connected to the module signal output terminal (4) of the power amplifier module (3); a power supply terminal (18) is also provided on the outside of the second housing (17).

4. A high-power AC / DC power source with a three-dimensional output structure as described in claim 3, characterized in that, The heat dissipation structures of the multiple high-power AC / DC sources can be installed in one of the following ways: single-row parallel combination, double-row parallel combination, or multiple stacked.

5. A high-power AC / DC power source with a three-dimensional output structure as described in claim 4, characterized in that, The top of the heat dissipation structure of the multiple high-power AC / DC sources is covered with a cover plate (11), which is fixed to the first housing (1) of the heat dissipation structure of the high-power AC / DC sources by fasteners.

6. A high-power AC / DC power source with a three-dimensional output structure as described in claim 3, characterized in that, The second housing (17) is also provided with a switching power supply, which is fixed to the cover plate (12) by a fastener and is connected to a power amplifier module (3).

7. A high-power AC / DC power source with a three-dimensional output structure as described in claim 3, characterized in that, Ventilation holes are provided on one side of the second housing (17) directly opposite the air duct formed by the heat dissipation structure of the high-power AC / DC source.

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