Liquid cooling heat dissipation case

By designing a liquid-cooled heat dissipation chassis, optimizing the flow channel layout and welding connections, the problem of insufficient heat dissipation in electronic equipment was solved, improving heat dissipation performance and installation space, and enhancing the reliability and lifespan of the equipment.

CN223503158UActive Publication Date: 2025-10-31AVIC SHENYANG XINGHUA AREO ELECTRIC APPLIANCE CO LTD
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Patent Information

Application Number
CN202422914230.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-27
Publication Date
2025-10-31
Estimated Expiration
2034-11-27

AI Technical Summary

Technical Problem

In the current technology, the heat dissipation performance of electronic devices is insufficient, which leads to overheating of components and affects the reliability and lifespan of the equipment.

Method used

The liquid-cooled heat dissipation chassis design optimizes the flow channel layout to improve the utilization of installation space by setting inlet, outlet and delivery channels on the side panel of the chassis, and improves sealing and strength through welding connections.

Benefits of technology

It improves the heat dissipation performance of the chassis, increases internal installation space, and enhances the reliability and lifespan of the equipment.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223503158U_ABST
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Abstract

The utility model provides a liquid cooling heat dissipation case, and belongs to the technical field of airborne electronic equipment cases, specifically, fluid channels are arranged in an upper cold plate and a lower cold plate; a liquid inlet runner and a liquid outlet runner which are arranged at an interval are arranged on the right cold plate, and a conveying runner is arranged on the left cold plate; an inlet of the liquid inlet flow channel communicates with external cooling liquid, a liquid outlet of the liquid inlet flow channel communicates with the liquid inlet end of the fluid channel of the upper cooling plate, a liquid outlet of the fluid channel of the upper cooling plate communicates with a liquid inlet of the conveying flow channel, and a liquid outlet of the conveying flow channel communicates with a liquid inlet of the fluid channel of the lower cooling plate. A liquid outlet of the fluid channel of the lower cold plate is communicated with a liquid inlet of the liquid outlet flow channel, and a liquid outlet of the liquid outlet flow channel is communicated with an external pipeline; the central axis of the liquid inlet and the central axis of the liquid outlet of the same fluid channel are perpendicular to the right cold plate, and the central axis of the liquid inlet and the central axis of the liquid outlet of the fluid channel perpendicularly coincide. According to the processing scheme, the heat dissipation performance is improved, and the installation space in the case is enlarged.
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Description

Technical Field

[0001] This application relates to the field of airborne electronic equipment enclosures, and more particularly to a liquid-cooled heat dissipation enclosure. Background Technology

[0002] With the increasing integration of electronic devices, components are becoming smaller and smaller, resulting in highly concentrated heat dissipation. This places higher demands on the reliability of electronic devices. The main cause of premature failure in electronic devices is overstress, namely electrical, thermal, and mechanical stress, with a close relationship between electrical and thermal stress. Electronic devices require suitable operating temperatures; prolonged overheating can lead to malfunctions or failures. Temperature changes significantly affect the failure rate of electronic components; data shows that 70% of electronic device failures are related to excessively high thermal environments. The percentage increase in failure rate for electronic devices at an initial temperature of 50°C is shown for different temperature rises. The failure rate of electronic devices increases exponentially with increasing temperature. This is because thermal coupling occurs between components through convection, conduction, and radiation. Therefore, temperature has a crucial impact on the performance of electronic devices. Utility Model Content

[0003] In view of this, this application provides a liquid-cooled heat dissipation chassis, which solves the problems in the prior art and improves heat dissipation performance and internal installation space.

[0004] The liquid-cooled heat dissipation chassis provided in this application adopts the following technical solution:

[0005] A liquid-cooled heat dissipation chassis includes a front mounting plate, a rear mounting plate, an upper cooling plate, a lower cooling plate, a left cooling plate, and a right cooling plate, wherein the front mounting plate, the rear mounting plate, the upper cooling plate, the lower cooling plate, the left cooling plate, and the right cooling plate form a cubic chassis.

[0006] Both the upper and lower cooling plates are provided with fluid channels.

[0007] The right cold plate is provided with an inlet flow channel and an outlet flow channel arranged at intervals, and the left cold plate is provided with a conveying flow channel;

[0008] The inlet of the liquid inlet channel is connected to external coolant; the outlet of the liquid inlet channel is connected to the inlet end of the fluid channel of the upper cold plate; the outlet of the fluid channel of the upper cold plate is connected to the inlet of the conveying channel; the outlet of the conveying channel is connected to the inlet of the fluid channel of the lower cold plate; the outlet of the fluid channel of the lower cold plate is connected to the inlet of the liquid outlet channel; and the outlet of the liquid outlet channel is connected to an external pipe.

[0009] The central axes of the inlet and outlet of the same fluid channel are perpendicular to the right cold plate, and the central axes of the inlet and outlet of the fluid channel are perpendicularly coincident.

[0010] Optionally, the inlet of the liquid inlet channel and the outlet of the liquid outlet channel are located in the middle of the right cold plate, and the inlet of the liquid inlet channel and the outlet of the liquid outlet channel are located on the side of the right cold plate closer to the front mounting plate.

[0011] The liquid inlet channel extends from the end face of the right cold plate near the front mounting plate to the rear mounting plate side to the middle of the right cold plate, and then turns and extends to the upper cold plate.

[0012] The liquid outlet channel extends from the end face of the right cold plate near the front mounting plate to the rear mounting plate side to the middle of the right cold plate, and then turns and extends to the lower cold plate.

[0013] Optionally, a mounting block is provided on the end face of the right cold plate near the front mounting plate. The mounting block protrudes from the right cold plate toward the left cold plate. The front mounting plate is provided with a groove to accommodate the mounting block. The mounting block has a first channel communicating with the liquid inlet channel and a second channel communicating with the liquid outlet channel.

[0014] Optionally, the mounting block has a first connector and a second connector on its side facing away from the mounting plate. The first connector is connected to the first channel, and the second connector is connected to the second channel.

[0015] Optionally, the fluid channels within the upper and lower cold plates are arranged in a serpentine pattern.

[0016] Optionally, weight-reducing grooves are provided on the outer and inner surfaces of the upper and lower cold plates.

[0017] In summary, this application includes the following beneficial technical effects:

[0018] This application places the inlet and outlet channels for the liquid flowing to the upper cold plate of the chassis on one side plate, and the delivery channel for the liquid flowing to the lower cold plate on another side plate. Moreover, the channels on the left and right cold plates are almost aligned, which reduces the narrow area inside the chassis and increases the wide area, thereby increasing the usable installation space inside the chassis. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1This is a first-view structural schematic diagram of the liquid-cooled heat dissipation chassis of this application;

[0021] Figure 2 This is a structural schematic diagram of the liquid-cooled heat dissipation chassis from a second perspective;

[0022] Figure 3 This is a structural schematic diagram of the liquid-cooled heat dissipation chassis from a third-person perspective.

[0023] Figure 4 This is a schematic diagram of the unfolded planar structure of the liquid-cooled heat dissipation chassis of this application.

[0024] Explanation of reference numerals in the attached drawings: 1. Front mounting plate; 2. Rear mounting plate; 3. Upper cold plate; 4. Lower cold plate; 5. Left cold plate; 6. Right cold plate; 7. Fluid channel; 8. Inlet channel; 9. Outlet channel; 10. Conveying channel; 11. Mounting block; 12. First connector; 13. Second connector; 14. Weight reduction tank. Detailed Implementation

[0025] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0026] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0028] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The illustrations only show the components related to this application and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0029] Furthermore, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that the described aspects can be practiced without these specific details.

[0030] This application provides a liquid-cooled heat dissipation chassis.

[0031] like Figures 1 to 4 As shown, a liquid-cooled heat dissipation chassis includes a front mounting plate 1, a rear mounting plate 2, an upper cooling plate 3, a lower cooling plate 4, a left cooling plate 5, and a right cooling plate 6. The front mounting plate 1, rear mounting plate 2, upper cooling plate 3, lower cooling plate 4, left cooling plate 5, and right cooling plate 6 form a cubic chassis. In this embodiment, the upper cooling plate 3, lower cooling plate 4, left cooling plate 5, and right cooling plate 6 are joined together by electron beam welding, resulting in higher welding strength and more reliable sealing. The front mounting plate 1 is connected to the end faces of the upper cooling plate 3, lower cooling plate 4, left cooling plate 5, and right cooling plate 6 by bolts, and the rear mounting plate 2 is also connected to the end faces of the upper cooling plate 3, lower cooling plate 4, left cooling plate 5, and right cooling plate 6 by bolts.

[0032] The upper cold plate 3 and the lower cold plate 4 are both provided with fluid channels 7; the right cold plate 6 is provided with an inlet channel 8 and an outlet channel 9 arranged at intervals, and the left cold plate 5 is provided with a conveying channel 10.

[0033] The inlet of the liquid inlet channel 8 is connected to external coolant. The outlet of the liquid inlet channel 8 is connected to the inlet end of the fluid channel 7 of the upper cold plate 3. The outlet of the fluid channel 7 of the upper cold plate 3 is connected to the inlet of the conveying channel 10. The outlet of the conveying channel 10 is connected to the inlet of the fluid channel 7 of the lower cold plate 4. The outlet of the fluid channel 7 of the lower cold plate 4 is connected to the inlet of the outlet channel 9. The outlet of the outlet channel 9 is connected to an external pipe. The coolant passes sequentially through the liquid inlet channel 8, the fluid channel 7 of the upper cold plate 3, the conveying channel 10, the fluid channel 7 of the lower cold plate 4, and the outlet channel 9.

[0034] Furthermore, in this application, the central axes of the inlet and outlet of the same fluid channel 7 are perpendicular to the right cold plate 6. That is, the inlet and outlet of the same fluid channel 7 are aligned, and the flow direction of the fluid in the inlet and outlet of the same fluid channel 7 is perpendicular to the right cold plate 6. Moreover, the central axes of the inlet and outlet of the fluid channel 7 are vertically coincident.

[0035] The left cold plate 5 and right cold plate 6 are only wider in the areas without flow channels, while the width between them is smaller in the areas with flow channels. Furthermore, the inlet flow channel 8, outlet flow channel 9, and conveying flow channel 10 are all located on a single side cold plate, resulting in a smaller area of ​​greater width on both side cold plates. This application places the inlet flow channel 8 and outlet flow channel 9 flowing to the upper cold plate 3 on one side plate, and the conveying flow channel 10 flowing to the lower cold plate 4 on another side plate. Moreover, the flow channels on the left cold plate 5 and the right cold plate 6 are almost aligned, reducing the narrower areas and increasing the wider areas, thereby improving the usable installation space inside the chassis.

[0036] The inlet of the inlet channel 8 and the outlet of the outlet channel are located in the middle of the right cold plate 6, and the inlet of the inlet channel 8 and the outlet of the outlet channel are located on the side of the right cold plate 6 near the front mounting plate 1. The inlet channel 8 extends from the end face of the right cold plate 6 near the front mounting plate 1 towards the rear mounting plate 2 to the middle of the right cold plate 6, and then turns and extends to the upper cold plate 3. The outlet channel 9 extends from the end face of the right cold plate 6 near the front mounting plate 1 towards the rear mounting plate 2 to the middle of the right cold plate 6, and then turns and extends to the lower cold plate 4. In this embodiment, the direction from the front mounting plate 1 to the rear mounting plate 2 is the first direction, and the extension length of the inlet and outlet channels along the first direction is less than half the length of the right cold plate 6 along the first direction. The inlet channel 8 and the outlet channel 9 are L-shaped, and the infusion channel on the left cold plate 5 is strip-shaped, with its length direction perpendicular to the upper cold plate 3.

[0037] The right cold plate 6 has a mounting block 11 on its end face near the front mounting plate 1. The mounting block 11 protrudes from the right cold plate 6 toward the left cold plate 5. The front mounting plate 1 has a groove to accommodate the mounting block 11. The mounting block 11 has a first channel communicating with the liquid inlet channel 8 and a second channel communicating with the liquid outlet channel 9.

[0038] The mounting block 11 has a first connector 12 and a second connector 13 on its side facing away from the mounting plate. The first connector 12 is connected to the first channel, and the second connector 13 is connected to the second channel.

[0039] The fluid channels 7 within the upper cooling plate 3 and the lower cooling plate 4 are arranged in a serpentine pattern.

[0040] Weight reduction grooves 14 are provided on the outer and inner surfaces of the upper cold plate 3 and the lower cold plate 4. Weight reduction design is implemented for the structure outside the flow channel.

[0041] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A liquid-cooled heat dissipation chassis, characterized in that, The chassis includes a front mounting plate (1), a rear mounting plate (2), an upper cold plate (3), a lower cold plate (4), a left cold plate (5), and a right cold plate (6), which together form a cubic chassis. Fluid channels (7) are provided in both the upper cooling plate (3) and the lower cooling plate (4); The right cold plate (6) is provided with an inlet channel (8) and an outlet channel (9) spaced apart, and the left cold plate (5) is provided with a conveying channel (10); The inlet of the liquid inlet channel (8) is connected to the external coolant. The outlet of the liquid inlet channel (8) is connected to the inlet end of the fluid channel (7) of the upper cold plate (3). The outlet of the fluid channel (7) of the upper cold plate (3) is connected to the inlet of the conveying channel (10). The outlet of the conveying channel (10) is connected to the inlet of the fluid channel (7) of the lower cold plate (4). The outlet of the fluid channel (7) of the lower cold plate (4) is connected to the inlet of the liquid outlet channel (9). The outlet of the liquid outlet channel (9) is connected to the external pipe. The central axes of the inlet and outlet of the same fluid channel (7) are perpendicular to the right cold plate (6), and the central axes of the inlet and outlet of the fluid channel (7) are perpendicularly coincident.

2. The liquid-cooled heat dissipation chassis according to claim 1, characterized in that, The inlet of the liquid inlet channel (8) and the outlet of the liquid outlet channel are located in the middle of the right cold plate (6), and the inlet of the liquid inlet channel (8) and the outlet of the liquid outlet channel are located on the side of the right cold plate (6) near the front mounting plate (1). The liquid inlet channel (8) extends from the end face of the right cold plate (6) near the front mounting plate (1) to the rear mounting plate (2) to the middle of the right cold plate (6), and then turns to extend to the upper cold plate (3). The liquid outlet channel (9) extends from the end face of the right cold plate (6) near the front mounting plate (1) to the rear mounting plate (2) side to the middle of the right cold plate (6), and then turns to extend to the lower cold plate (4).

3. The liquid-cooled heat dissipation chassis according to claim 2, characterized in that, The right cold plate (6) has a mounting block (11) on its end face near the front mounting plate (1). The mounting block (11) protrudes from the right cold plate (6) toward the left cold plate (5). The front mounting plate (1) has a groove for accommodating the mounting block (11). The mounting block (11) has a first channel communicating with the liquid inlet channel (8) inside and a second channel communicating with the liquid outlet channel (9) inside.

4. The liquid-cooled heat dissipation chassis according to claim 3, characterized in that, The mounting block (11) has a first connector (12) and a second connector (13) on the side facing away from the mounting plate. The first connector (12) is connected to the first channel, and the second connector (13) is connected to the second channel.

5. The liquid-cooled heat dissipation chassis according to claim 1, characterized in that, The fluid channels (7) in the upper cold plate (3) and lower cold plate (4) are distributed in a serpentine pattern.

6. The liquid-cooled heat dissipation chassis according to claim 1, characterized in that, Weight reduction grooves (14) are provided on the outer and inner surfaces of the upper cold plate (3) and the lower cold plate (4).