Photovoltaic inverter

Abstract

The utility model provides a photovoltaic inverter which comprises a shell and a circuit board assembly, a containing cavity is formed in the shell, the circuit board assembly is arranged in the containing cavity, and the circuit board assembly comprises a first circuit board and a second circuit board which are parallel to each other. And the mounting period of the first circuit board and the second circuit board is arranged on a board surface opposite to the first circuit board and / or the second circuit board. Through the design of the two circuit boards, the hierarchical utilization of the height space of the accommodating cavity is realized through the height difference between the high device and the low device, and the overall thickness of the photovoltaic inverter is reduced. Besides, a part of the bottom surface of the lower shell protrudes towards the interior of the accommodating cavity to form a convex part, and the accommodating cavity is divided into at least two sub accommodating cavities, so that the space layout in the photovoltaic inverter is optimized, and a more direct heat dissipation path is further provided for the heating component.

Description

Technical Field

[0001] This application relates to the field of inverter technology, and more particularly to a photovoltaic inverter. Background Technology

[0002] Currently, most photovoltaic inverters use a front-mounted circuit board design, where components are mounted on one side of the circuit board and the circuit board is then installed inside the housing. Due to limitations in the number and height of components, as well as auxiliary structures (such as heat dissipation structures), photovoltaic inverters are generally thick, making wall-mounting installation difficult. Furthermore, traditional photovoltaic inverters use cables for switching and PV terminal wiring, resulting in cumbersome assembly and internal EMC (electromagnetic compatibility) interference issues. Utility Model Content

[0003] This application provides a photovoltaic inverter to solve the problems of large thickness of photovoltaic inverters, cumbersome assembly due to the use of cables to connect internal switches and PV terminals, and the existence of EMC interference.

[0004] This application provides a photovoltaic inverter, comprising:

[0005] The housing has a receiving cavity inside.

[0006] A circuit board assembly is disposed within the receiving cavity, wherein the circuit board assembly includes a first circuit board and a second circuit board arranged in parallel, and a high device mounted on the first circuit board and the second circuit board is disposed on the opposite surface of the first circuit board and / or the second circuit board.

[0007] The components mounted on the first circuit board and the second circuit board include high-level components and low-level components. The high-level components and low-level components are distinguished according to the geometric height of the components perpendicular to the surfaces of the first circuit board and the second circuit board. Here, "high" and "low" are relative concepts. For example, in the direction perpendicular to the surfaces of the first circuit board and the second circuit board, if the geometric height of the switch is greater than the geometric height of the surface mount resistor, the switch can be regarded as a high-level component, and correspondingly, the surface mount resistor can be regarded as a low-level component.

[0008] It is understandable that when the taller components are positioned between the first and second circuit boards, the distance between the first and second circuit boards is greater than the geometric height of other shorter components. In this case, the shorter components can also be installed between the first and second circuit boards. Therefore, by setting two circuit boards (i.e., the first and second circuit boards), based on the difference in geometric height between the taller and shorter components, the internal cavity of the photovoltaic inverter housing can be fully utilized, achieving hierarchical utilization of the height space, reducing the thickness of the inverter housing, and shrinking the volume of the photovoltaic inverter.

[0009] In one feasible implementation, a portion of the bottom surface of the lower housing protrudes into the receiving cavity to form a protrusion, which divides the receiving cavity into at least two sub-receiving cavities.

[0010] In one feasible implementation, the receiving cavity includes a first receiving cavity and a second receiving cavity that are connected, the first circuit board is disposed in the first receiving cavity, and the second circuit board covers the first receiving cavity and the second receiving cavity at one end near the top cover.

[0011] In one possible implementation, the portion of the second circuit board covering the first receiving cavity has a notch, such that the front side of the first circuit board faces the top cover.

[0012] In one feasible implementation, a heating element is mounted on the second circuit board at a position opposite to the protrusion, the surface of the protrusion is provided with a thermally conductive contact portion, and the heating element is connected to the protrusion through the thermally conductive contact portion.

[0013] In one feasible implementation, a switch is also included, the switch having pins that are inserted into and fixedly connected to a socket in a conductive part of the first circuit board.

[0014] In one feasible implementation, a PV terminal and a thin-film terminal are also included. The first circuit board is equipped with a terminal connector. One end of the thin-film terminal is connected to the PV terminal, and the other end of the thin-film terminal is fixedly connected to the terminal connector.

[0015] In one feasible implementation, the terminal connector is a film-coated nut and / or a saddle terminal.

[0016] In one feasible implementation, heat dissipation fins are installed on the bottom surface of the lower housing, and a groove is formed on the outer side of the bottom surface of the lower housing corresponding to the protrusion. The length of the heat dissipation fins located in the groove is greater than the depth of the groove.

[0017] This application provides a photovoltaic inverter with a split circuit board design. By mounting the first and second circuit boards face-to-face, the components are arranged between the first and second circuit boards, making full use of the internal cavity of the photovoltaic inverter and thus reducing the overall thickness of the photovoltaic inverter. In addition, a portion of the bottom surface of the lower housing protrudes into the cavity, forming a convex part, dividing the cavity into at least two sub-cavities, optimizing the internal spatial layout of the photovoltaic inverter. At the same time, the convex part forms a groove on the outer surface of the lower housing, in which heat dissipation fins are installed, increasing the area of ​​the heat dissipation fins and providing a more direct heat dissipation path for heat-generating components, thereby improving heat dissipation efficiency. Attached Figure Description

[0018] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a side sectional view of a photovoltaic inverter provided in an embodiment of this application;

[0020] Figure 2 This is a top view of the internal structure of the lower housing of the photovoltaic inverter provided in the embodiment of this application;

[0021] Figure 3 This is another side sectional view of the photovoltaic inverter provided in the embodiments of this application;

[0022] Figure 4 This is a schematic diagram of the first circuit board structure in the photovoltaic inverter provided in this application embodiment;

[0023] Figure 5 This is a schematic diagram of the switching structure in the photovoltaic inverter provided in the embodiments of this application;

[0024] Figure 6 This is a schematic diagram of the PV terminal structure in a photovoltaic inverter provided in this application embodiment;

[0025] Figure 7 This is a schematic diagram of the PV terminal installation in a photovoltaic inverter provided in this application embodiment;

[0026] Figure 8 This is a schematic diagram of a rigid connector in a photovoltaic inverter provided in an embodiment of this application.

[0027] Explanation of reference numerals in the attached figures:

[0028] 1-Housing; 11-Upper cover; 12-Lower housing; 13-Receiving cavity; 131-First receiving cavity; 132-Second receiving cavity; 14-Protrusion; 141-Thermal conductive contact; 15-Second connecting post; 16-First connecting post; 12-Circuit board assembly; 21-First circuit board; 22-Second circuit board; 221-Notch; 222-Capacitor; 223-Surface mount resistor; 23-Rigid connector; 231-Nut; 3-Switch; 31-Switch body; 311-Pin; 32-Connecting rod; 33-Knob; 4-PV terminal; 5-Heat sink fins; 6-Terminal connector; 7-Sheet terminal; 71-Through hole. Detailed Implementation

[0029] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of this application.

[0030] In the description of this application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0031] In traditional photovoltaic (PV) inverter designs, the entire circuit board is typically mounted directly inside the inverter housing in a top-mounted configuration. A series of heat dissipation fins are then installed beneath the housing to dissipate heat during operation. The combination of the circuit board, heat dissipation fins, and necessary protective casing results in a relatively large inverter size. The PV inverter provided in this application employs a split circuit board design. By mounting the first and second circuit boards face-to-face and arranging the components between them, the internal cavity of the PV inverter is fully utilized, thereby reducing the overall thickness of the inverter.

[0032] The specific structure of the photovoltaic inverter provided in this application will be described in detail below with reference to the accompanying drawings.

[0033] Reference Figure 1 As shown, Figure 1 This is a side sectional view of a photovoltaic inverter provided in an embodiment of this application. The photovoltaic inverter provided in this application has a housing 1 composed of a lower housing 12 and an upper cover 11. The housing 1 includes a receiving cavity 13 for mounting the components that make up the photovoltaic inverter, forming a protective structure. A circuit board assembly 2 is installed within the receiving cavity 13. The circuit board assembly 2 includes a first circuit board 21 and a second circuit board 22, which are arranged parallel to each other. (Refer to...) Figure 3 As shown, Figure 3 This is a cross-sectional view of another side of the photovoltaic inverter provided in this application embodiment. As an example, the first circuit board 21 and the second circuit board 22 are arranged in parallel, and components are mounted on the surfaces of the first circuit board 21 and / or the second circuit board 22, where "surface" refers to the surface of the first circuit board 21 and the second circuit board 22. After the circuit board assembly 2 is installed, there is a distance L between the first circuit board 21 and the second circuit board 22. This distance L is greater than the height of any tall device mounted on the first circuit board 21 and / or the circuit board 22. For example, if a switch 3 is mounted between the first circuit board 21 and the second circuit board 22, the distance L is greater than the height of the switch 3.

[0034] It should be noted that the meaning of "and / or" here should be understood as the distance L being greater than the height of the taller component located on the first circuit board 21 and the second circuit board 22. This component can be mounted on the first circuit board 21, the second circuit board 22, or both the first and second circuit boards 21 and 22 may have taller components mounted on them. "Taller component" and "lower component" are relative concepts, referring to the geometric height of components mounted on the circuit board assembly 2. For example, the geometric height of switch 3 is greater than the geometric height of surface mount resistor 223; therefore, switch 3 can be considered a taller component, and correspondingly, surface mount resistor 223 can be considered a lower component. In addition, the first circuit board 21 or the second circuit board 22 may also have other components mounted on it, such as capacitors 222, etc. The geometric height of these components is greater than the geometric height of surface mount resistor 223 but less than the geometric height of switch 3. In this embodiment, these components are called taller components; it can also be understood that components with a geometric height greater than surface mount resistor 223 are generally referred to as taller components. In some other embodiments, for example, components with a geometric height greater than inductors are called taller components. Therefore, the concepts of "high-end device" and "low-end device" are relative and can be defined according to the specific requirements of the product application or according to the subjective judgment of those skilled in the art. Such definitions do not affect the implementation of the technical solution proposed in this application, and this application does not limit the specific dimensions of the high-end device and the low-end device.

[0035] When the tall device is positioned between the first circuit board 21 and the second circuit board 22, the distance L between the first circuit board 21 and the second circuit board 22 is greater than the geometric height of other low-profile devices. In this case, the low-profile devices can also be installed between the first circuit board and the second circuit board. Therefore, by setting up two circuit boards (i.e., the first circuit board 21 and the second circuit board 22), this application can fully utilize the internal cavity of the photovoltaic inverter housing based on the difference in geometric height of the tall and low-profile devices, thereby achieving hierarchical utilization of the height space, reducing the thickness of the inverter housing, and shrinking the volume of the photovoltaic inverter.

[0036] Continue to refer to Figure 3As shown, the first circuit board 21 is installed inside the receiving cavity 13, parallel to the bottom surface of the lower housing 12. The first circuit board 21 is fixedly connected to the bottom surface of the lower housing 12 via the first connecting post 16. The second circuit board 22 is arranged parallel to the first circuit board 21 and fixedly connected to the bottom surface of the lower housing 12 via the second connecting post 15, wherein the length of the second connecting post 15 is greater than the length of the first connecting post 16. After installation, the first circuit board 21 and the second circuit board 22 are arranged parallel to each other. All or part of the components constituting the photovoltaic inverter are installed between the first circuit board 21 and the second circuit board 22. These components include resistors, capacitors, switching components, PV ports, and relays.

[0037] In addition, refer to Figure 8 As shown, Figure 8 This is a schematic diagram of a rigid connector in a photovoltaic inverter provided in this application embodiment. A rigid connector 23 is provided between the first circuit board 21 and the second circuit board 22 to realize the electrical connection between the first circuit board 21 and the second circuit board 22. One end of the rigid connector 23 is provided with a pin, which is inserted into the insertion hole of the conductive part of the first circuit board 21 and fixedly connected by welding. The other end of the rigid connector 23 is bent, and a nut 231 is provided on the lower surface of the bend. A through hole is opened in the conductive part of the second circuit board 22. After the bolt passes through the through hole, it engages with the nut 231 by thread, so that the rigid connector 23 is fixedly connected to the second circuit board 22, thereby realizing the circuit connection between the two.

[0038] Continue to refer to Figure 3 As shown, the side of the second circuit board 22 away from the first circuit board 21 has a distance H between it and the inner surface of the top cover 11. The setting of the distance H forms a heat dissipation channel on the one hand, which enhances the heat dissipation inside the inverter. On the other hand, it allows low-profile components to be installed on the side of the second circuit board 22 away from the first circuit board 21, further optimizing the circuit board layout.

[0039] Compared to traditional photovoltaic inverters, this application divides the circuit board assembly 2 and sets the first circuit board 21 and the second circuit board 22 opposite to each other. The tall components are arranged between the first circuit board 21 and the second circuit board 22. The difference between the tall and short components maximizes the use of the cavity space, increases the hierarchical use of the height space, and reduces the volume of the photovoltaic inverter.

[0040] Reference Figure 1 and Figure 3As shown, in some embodiments, a portion of the bottom surface of the lower housing 12 protrudes into the receiving cavity 13 to form a protrusion 14, which divides the receiving cavity 13 into at least two sub-receiving cavities. As an example, in this embodiment, the protrusion 14 forms a groove with an approximately gate-shaped cross-section on the outside of the lower housing 12, dividing it into a first receiving cavity 131 and a second receiving cavity 132 within the receiving cavity 13. The first receiving cavity 131 and the second receiving cavity 132 are connected. A first circuit board 21 is disposed within the first receiving cavity 131, and a second circuit board 22 covers one end of the first receiving cavity 131 and the second receiving cavity 132 near the upper cover 11. At this time, a portion of the second circuit board 22 faces the protrusion 14. In some embodiments, heat-generating components can be installed in this area, and a thermally conductive contact portion 141 is provided on the surface of the protrusion to connect the heat-generating components (such as MOSFETs, relays, etc.) to the thermally conductive contact portion 141, improving the heat dissipation efficiency of the heat-generating components and ensuring stable operation of the device. The thermally conductive contact 141 can be a viscous thermally conductive medium or a sheet-like product made of thermally conductive material, such as thermally conductive grease or thermally conductive silicone sheet.

[0041] Heat dissipation fins 5 are installed on the bottom surface of the lower housing 12. These fins effectively conduct heat from the interior of the housing 1 to the external environment, ensuring the stability and reliability of the photovoltaic inverter operation. In the groove formed on the outside of the lower housing 12, the length of the heat dissipation fins 5 is greater than the depth of the groove. In this case, the heat dissipation fins 5 and the side of the groove also form a heat dissipation channel. Simultaneously, the area of ​​the heat dissipation fins 5 within the groove is increased, enhancing the heat dissipation effect. By changing the structure and installation position of the heat dissipation fins 5, their dimension perpendicular to the bottom surface of the lower housing 12 is reduced, thereby reducing the thickness of the inverter housing and further minimizing the size of the photovoltaic inverter.

[0042] In other embodiments, the protrusion 14 can divide the receiving cavity 13 into multiple sub-receiving cavities, which can be specifically designed according to the layout of the first circuit board 21 and / or the second circuit board 22. In other embodiments, the different sub-receiving cavities are not interconnected, and the first circuit board 21 and the second circuit board 22 are respectively installed in different sub-receiving cavities.

[0043] The lower housing 12 protrudes into the cavity 13 to form a protrusion 14, dividing the cavity 13 into at least two sub-cavities. This optimizes the internal space layout, allowing the circuit board assembly and other components to be distributed more rationally. At the same time, it allows for flexible design based on the specific requirements of the circuit board assembly layout.

[0044] Reference Figure 2 As shown, Figure 2This is a top view of the internal structure of the lower housing of the photovoltaic inverter provided in this embodiment. A notch 221 is provided in the portion of the second circuit board 22 covering the first receiving cavity 131. The notch 221 ensures that the first circuit board 21 is opposite to the upper cover 11, meaning that when the upper cover 11 is opened, the first circuit board 21 is clearly visible and not obstructed by the second circuit board 22. When the first circuit board 21 is repaired or replaced, the second circuit board 22 will not interfere with it, improving the convenience and efficiency of maintenance.

[0045] Reference Figure 4 As shown, Figure 4 This is a schematic diagram of the first circuit board structure in the photovoltaic inverter provided in this application embodiment. A switch 3 and a terminal connector 6 are mounted on the front side of the first circuit board 21. The switch 3 has pins 311, which are inserted into holes in the conductive parts of the first circuit board 21 and fixedly connected to the first circuit board 21 by soldering. By adopting an onboard switch and achieving a rigid connection through pins, the stability and reliability of the electrical connection are enhanced. Simultaneously, cable connections are eliminated, internal space is optimized, and the resistance and heat generation between the switch body and the first circuit board 21 are reduced. This improves working efficiency while reducing the risk of poor contact and enhancing overall safety.

[0046] Reference Figure 5 As shown, Figure 5 This is a schematic diagram of the switch structure in a photovoltaic inverter provided in this application embodiment. Specifically, the switch 3 includes a switch body 31, a connecting rod 32, and a knob 33, with pins 331 disposed on the switch body 31. The switch body 31 is rigidly connected to the first circuit board 21 via pins 331 and is installed together with the first circuit board 21 inside the housing 12. The connecting rod 32 penetrates the side wall of the lower housing 12, with one end connected to the switch body 31 and the other end connected to the knob 33. The switch 3 can be controlled from outside the housing 1, enhancing the convenience of operation.

[0047] Reference Figure 6 and Figure 7 As shown, Figure 6 This is a schematic diagram of the PV terminal structure in a photovoltaic inverter provided in an embodiment of this application. Figure 7This is a schematic diagram of the PV terminal installation in a photovoltaic inverter provided in this application embodiment. The photovoltaic inverter provided in this application also includes a PV terminal 4 and a thin-film terminal 7. A terminal connector 6 is installed on the first circuit board 21. One end of the thin-film terminal 7 is connected to the PV terminal 4, and the other end of the thin-film terminal 7 is locked to the terminal connector 6. The terminal connector 6 is a patch nut or a saddle terminal, which has a threaded connection hole. During installation, one end of the PV terminal 4 is located on the outside of the lower housing 12 and is used to connect to the photovoltaic module. The other end of the PV terminal 4 passes through the side of the lower housing 12 and connects to one end of the thin-film terminal 7. The other end of the thin-film terminal 7 has a through hole 71. The through hole 71 is aligned with the threaded connection hole of the patch nut or saddle terminal, and then the two are fixedly connected with bolts. The operation is simple and quick. The thin-film terminal 7 enables a rigid connection between the PV terminal 4 and the first circuit board 21, eliminating cable connections, optimizing internal space, and enhancing overall safety. The thin-film terminal 7 is a thin sheet made of conductive metal (such as copper). The thin-film terminal 7 can be a plate-like structure, or it can be bent to a certain extent according to the relative position of the PV terminal 4 and the terminal connector 6. As an example, refer to... Figure 6 As shown, the thin-film terminal 7 has a "Z" shaped structure.

[0048] The photovoltaic inverter provided in this application enhances the hierarchical utilization of space by dividing the circuit board assembly 2 into a first circuit board 21 and a second circuit board 22, which are arranged opposite each other, thereby reducing the size of the photovoltaic inverter and improving space utilization. Heat dissipation fins 5 are provided on the bottom surface of the lower housing, and the protrusions and thermally conductive contact parts 141 effectively improve the heat dissipation efficiency of heat-generating components, ensuring stable operation of the equipment. A notch 221 is provided in the portion of the second circuit board 22 covering the first receiving cavity 131, allowing a direct view of the first circuit board 21 when the top cover is opened, facilitating maintenance and replacement of the first circuit board 21 and improving the convenience and efficiency of maintenance. A rigid connection is achieved through the switch 3 and pin 31, and a locking connection is made between the thin-film terminal 7 and the PV terminal 4 and terminal connector 6, enhancing the stability and reliability of the electrical connection. The elimination of cable connections optimizes the internal space layout, reduces safety hazards caused by cable aging or poor connections, and enhances overall safety. By setting heat dissipation fins 5 in the groove formed on the outside of the lower housing 1 and forming a heat dissipation channel with the side of the groove, and increasing the area of ​​the heat dissipation fins 5 located in the groove, not only is the heat dissipation effect enhanced, but the stability of the overall structure is also improved.

[0049] It is readily understood that, based on the several embodiments provided in this application, those skilled in the art can combine, split, or reorganize the embodiments of this application to obtain other embodiments, none of which exceed the protection scope of this application.

[0050] The above detailed embodiments further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A photovoltaic inverter, characterized in that, include: A housing, wherein a receiving cavity is provided inside the housing; A circuit board assembly is disposed within the receiving cavity, wherein the circuit board assembly includes a first circuit board and a second circuit board arranged parallel to each other, and a high device mounted on the first circuit board and the second circuit board is disposed on the opposite surface of the first circuit board and / or the second circuit board.

2. The photovoltaic inverter according to claim 1, characterized in that, The housing includes a lower housing and an upper cover. A portion of the bottom surface of the lower housing protrudes into the receiving cavity to form a protrusion, which divides the receiving cavity into at least two sub-receiving cavities.

3. The photovoltaic inverter according to claim 2, characterized in that, The receiving cavity includes a first receiving cavity and a second receiving cavity that are connected. The first circuit board is disposed in the first receiving cavity, and the second circuit board covers the first receiving cavity and the second receiving cavity at one end near the top cover.

4. The photovoltaic inverter according to claim 3, characterized in that, The portion of the second circuit board covering the first receiving cavity has a notch, so that the first circuit board is opposite to the top cover.

5. The photovoltaic inverter according to claim 3, characterized in that, A heating element is mounted on the second circuit board at a position opposite to the protrusion. The surface of the protrusion is provided with a thermally conductive contact portion, and the heating element is connected to the protrusion through the thermally conductive contact portion.

6. The photovoltaic inverter according to claim 3, characterized in that, It also includes a switch, which has pins that are inserted into and fixedly connected to the conductive parts of the first circuit board.

7. The photovoltaic inverter according to claim 3, characterized in that, It also includes PV terminals and thin-film terminals. The first circuit board is equipped with terminal connectors. One end of the thin-film terminal is connected to the PV terminal, and the other end of the thin-film terminal is fixedly connected to the terminal connectors.

8. The photovoltaic inverter according to claim 7, characterized in that, The terminal connector is a film-coated nut and / or a saddle terminal.

9. The photovoltaic inverter according to claim 2, characterized in that, The bottom surface of the lower housing is equipped with heat dissipation fins, and a groove is formed on the outer side of the bottom surface of the lower housing corresponding to the protrusion. The length of the heat dissipation fins located in the groove is greater than the depth of the groove.

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