Heat dissipation device suitable for plane heat expansion or bidirectional heat conduction
By introducing a capillary structure and pulsating channel design into the heat dissipation device, the problem of low heat dissipation efficiency of traditional pulsating heat pipes is solved, achieving efficient heat exchange and uniform temperature distribution, and improving the service life of electronic devices.
Patent Information
- Application Number
- CN202422994771.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-12-05
AI Technical Summary
Traditional pulsating heat pipe cooling devices have low heat exchange efficiency and poor temperature uniformity, which affects the service life of electronic devices.
The heat dissipation device design includes a shell, an upper space, and a lower space. The lower space is equipped with a substrate and filled with pulsating channels of capillary core. Combined with the capillary core structure of sintered aluminum powder particles, it achieves rapid heat exchange and uniform temperature distribution.
It improves heat exchange capacity and temperature uniformity, and achieves rapid heat exchange through the phase change process of the capillary wick, thereby enhancing heat dissipation efficiency and equipment lifespan.
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Figure CN223503258U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat sinks. More specifically, this utility model relates to a heat dissipation device suitable for planar heat expansion or bidirectional heat conduction. Background Technology
[0002] Heat dissipation technology refers to the techniques and methods used to transfer heat generated by equipment or systems to the environment in order to prevent overheating and protect their normal operation. With the widespread application of electronic devices, power consumption and heat dissipation have become increasingly unavoidable issues. Traditional pulsating heat pipe cooling devices mainly rely on the flow of liquid working fluid in the channel for heat exchange, which has low heat exchange efficiency and poor temperature uniformity, thus affecting the service life of electronic equipment. Utility Model Content
[0003] The purpose of this invention is to provide a heat dissipation device suitable for planar heat expansion or bidirectional heat conduction.
[0004] The technical solution adopted by this utility model to solve this technical problem is: a heat dissipation device suitable for planar heat expansion or bidirectional heat conduction, comprising: a shell; the interior of the shell is divided into an upper space and a lower space by a partition;
[0005] The upper space is equipped with heat dissipation teeth; the lower space is sealed, and a substrate is installed in the lower space. The substrate has pulsating channels, and the pulsating channels are filled with capillary wicks.
[0006] As a further aspect of this utility model, the upper space is sealed.
[0007] As a further embodiment of this utility model, the pulsating channel is a serpentine channel structure consisting of two interconnected and symmetrically arranged columns.
[0008] As a further aspect of this utility model, the pulsating channel is filled with a liquid working medium, and the filling rate of the pulsating channel is 40%~50%.
[0009] As a further embodiment of this utility model, the shell is a square shell structure made of aluminum alloy / copper alloy.
[0010] As a further aspect of this invention, the height of the capillary core filled in the pulsating channel is not higher than 2 / 3 of the height of the pulsating channel.
[0011] As a further aspect of this utility model, the capillary core is made of sintered aluminum powder particles.
[0012] As a further aspect of this invention, the porosity of the capillary core is 30%-65%.
[0013] As a further embodiment of this utility model, the upper space of the housing is provided with an openable side cover, a plurality of heat dissipation teeth are installed at intervals on the top plate, sliders are provided on opposite sides of the top plate, a slide rail is installed on the upper part of the upper space, the top plate is slidably connected to the upper space, and the heat dissipation teeth extend downward in the upper space.
[0014] This utility model includes at least the following beneficial effects: This product adds a sintered capillary core structure to the pulsating channel, which increases the heat exchange surface area through the multi-pore capillary core, improves the heat exchange capacity of the working fluid, effectively improves the temperature uniformity of the product, and enables the product to maintain ultra-high temperature uniformity. Heat is dissipated through the heat dissipation teeth on the entire surface; the heat dissipation teeth adopt a quick disassembly and assembly form to facilitate installation, disassembly and maintenance.
[0015] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of the heat dissipation device of this utility model, which is applicable to planar heat expansion or bidirectional heat conduction.
[0017] Figure 2 This is a schematic diagram of the structure of the substrate of this utility model.
[0018] Among them, 1-heat source, 2-shell, 3-partition, 4-heat dissipation teeth, 5-substrate, 6-pulsating channel, 7-capillary core, 8-slide rail, 9-lower space. Detailed Implementation
[0019] The present invention will now be described in detail and completely with reference to the accompanying drawings. Those skilled in the art will be able to implement the present invention based on these descriptions. Before describing the present invention with reference to the accompanying drawings, it should be particularly noted that the technical solutions and features provided in the various parts of the present invention, including the following description, can be combined with each other without conflict.
[0020] Furthermore, the embodiments of the present invention described below are generally only a part of the embodiments of the present invention, and not all of the embodiments. Therefore, all other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort should fall within the protection scope of the present invention.
[0021] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. The specific implementation process is as follows:
[0022] like Figures 1-2As shown, this utility model provides a heat dissipation device suitable for planar heat expansion or bidirectional heat conduction. It is installed on the upper part of a heat source 1. The heat source 1 can be a chip, CPU, components, power module, etc. The heat dissipation device includes: a housing 2; the interior of the housing 2 is divided into an upper space and a lower space 9 by a partition 3.
[0023] The upper space is equipped with heat dissipation teeth 4; the lower space 9 is sealed, and a substrate 5 is installed in the lower space 9. In this embodiment, the substrate 5 is made of aluminum alloy plate, and a pulsating channel 6 is opened on the substrate 5. The pulsating channel 6 is filled with a capillary core 7.
[0024] The heat dissipation device of this application incorporates sintered capillary structures within the pulsating channel 6. When the heat source 1 operates, its temperature rises, causing the liquid working fluid to evaporate into a gas. This gas flows through the lower space 9 and condenses back into liquid upon encountering a cooler area. It is then drawn back into the capillary core 7 to continue absorbing heat. This cycle repeats rapidly, enabling quick heat exchange and rapid cooling of the heat source 1, thus improving the heat exchange capacity of the working fluid and effectively enhancing the product's temperature uniformity. Furthermore, an upper space is added to the housing 2 to accommodate a full-surface heat dissipation fin 4, which further accelerates heat dissipation.
[0025] This technical solution may also include the following technical details to better achieve the technical effect: the upper space is sealed.
[0026] This technical solution may also include the following technical details to better achieve the technical effect: the pulsating channel 6 is a serpentine channel structure with two rows of interconnected and symmetrically arranged channels, which makes the capillary core 7 more evenly distributed in the lower space 9. The spacing and width of the pulsating channel 6 are limited according to the heat exchange performance requirements in actual applications.
[0027] This technical solution may also include the following technical details to better achieve the technical effect: the pulsating channel 6 is filled with a liquid working fluid, and the filling rate of the pulsating channel 6 is 40%~50%. The type of liquid working fluid is selected according to the heat exchange efficiency required in actual application.
[0028] This technical solution may also include the following technical details to better achieve the technical effect: the shell 2 is an aluminum alloy / copper alloy square shell 2 structure.
[0029] This technical solution may also include the following technical details to better achieve the technical effect: the height of the capillary core 7 filled in the pulsating channel 6 is not higher than 2 / 3 of the height of the pulsating channel 6.
[0030] This technical solution may also include the following technical details to better achieve the technical effect: the capillary core 7 is made of sintered aluminum powder particles, which has strong heat exchange capacity.
[0031] This technical solution may also include the following technical details to better achieve the technical effect: the porosity of the capillary core 7 is 30%-65%.
[0032] This technical solution may also include the following technical details to better achieve the technical effect: the side of the upper space of the housing 2 is provided with an openable side cover, a number of heat dissipation teeth 4 are installed at intervals on the top plate, sliders are provided on opposite sides of the top plate, a slide rail 8 is installed on the upper part of the upper space, the top plate is slidably connected to the upper space, and the heat dissipation teeth 4 extend downward in the upper space.
[0033] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and embodiments shown and described herein.
Claims
1. A heat dissipation device suitable for planar heat amplification or bidirectional heat conduction, characterized in that, include: case; The interior of the shell is divided into an upper space and a lower space by a partition; The upper space is equipped with heat dissipation teeth; the lower space is sealed, and a substrate is installed in the lower space. The substrate has pulsating channels, and the pulsating channels are filled with capillary wicks.
2. The heat dissipation device suitable for planar heat amplification or bidirectional heat conduction as described in claim 1, characterized in that, The upper space is sealed.
3. The heat dissipation device suitable for planar heat amplification or bidirectional heat conduction as described in claim 1, characterized in that, The pulsating channel is a serpentine channel structure consisting of two interconnected and symmetrically arranged rows.
4. The heat dissipation device suitable for planar heat amplification or bidirectional heat conduction as described in claim 3, characterized in that, The pulsating channel is filled with a liquid working medium, and the filling rate of the pulsating channel is 40%~50%.
5. The heat dissipation device suitable for planar heat amplification or bidirectional heat conduction as described in claim 1, characterized in that, The shell is a square shell structure made of aluminum alloy / copper alloy.
6. The heat dissipation device suitable for planar heat amplification or bidirectional heat conduction as described in claim 1, characterized in that, The height of the capillary core filling the pulsating channel is no higher than 2 / 3 of the height of the pulsating channel.
7. The heat dissipation device suitable for planar heat amplification or bidirectional heat conduction as described in claim 1, characterized in that, The capillary core is made of sintered aluminum powder particles.
8. The heat dissipation device suitable for planar heat amplification or bidirectional heat conduction as described in claim 7, characterized in that, The porosity of the capillary core is 30%-65%.
9. The heat dissipation device suitable for planar heat amplification or bidirectional heat conduction as described in claim 1, characterized in that, The upper space of the housing is provided with an openable side cover, a number of heat dissipation teeth are installed at intervals on the top plate, sliders are provided on opposite sides of the top plate, a slide rail is installed on the upper part of the upper space, the top plate is slidably connected to the upper space, and the heat dissipation teeth extend downward in the upper space.