LED lamp bead and light-emitting device
By setting up die bonding and wire bonding areas within the LED chip holder and using solid solder balls for reflow soldering, the problems of uneven soldering and poor pad matching in TOP LED chips have been solved, achieving uniform soldering and efficient production.
Patent Information
- Application Number
- CN202422062988.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-23
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-08-23
AI Technical Summary
Existing TOP LED chips have issues with uneven soldering or poor pad matching during the production process, resulting in poor soldering of the chips.
Design an LED lamp bead that uses a die-bonding area and a wire-bonding area set in the lamp bead bracket, uses solid solder balls instead of liquid solder paste for soldering, and fixes it on the PCB board by reflow soldering to ensure uniform solder thickness and position alignment.
It achieves uniform soldering of LED chips to PCB board, avoids problems of uneven solder paste distribution and difficulty in alignment, improves soldering effect and production efficiency, and prevents the occurrence of voids.
Smart Images
Figure CN223503341U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of LED technology, and in particular to an LED lamp bead and a light-emitting device. Background Technology
[0002] With the widespread application of display technology and the diversification of application scenarios, the RGB LED display market has maintained a high concentration since the industry's inception. Especially in recent years, with the gradual maturation of technology and market growth, leading companies have become increasingly advantageous in areas such as technological innovation, capacity expansion, capital support, brand influence, and channel layout. These leading RGB LED display companies have captured an increasing share of the market. As a key component of display panels, LED chips function to provide sufficient brightness and uniformly distributed light. With the widespread application of display technology, the application of LED chips, a crucial component of display screens, has become even more important.
[0003] TOP LED devices are generally LEDs that emit light from the top or the plane. They are widely used due to their simple packaging. Existing TOP LED beads generally use a stamped injection molded bracket as the bracket. The metal part and the main body of the bracket are integrally formed by injection molding. The bracket is divided into two sides. The front side consists of a plastic part and a stamped metal part as the functional area of the LED bead. The light-emitting chip is fixedly connected in the functional area. Finally, the bracket is sealed with glue through a dispensing process, and then the material is cut into individual light-emitting LED beads.
[0004] During the manufacturing of LED beads, solder paste is applied to the PCB board, and then the RGB LED beads are fixed on the PCB board. However, this method has problems such as poor alignment between the LED bead's PAD and the solder paste on the PCB board, and uneven distribution of the solder paste after applying solder to the PCB board, which leads to poor soldering of the LED beads. Utility Model Content
[0005] Based on this, the purpose of this utility model is to provide an LED bead and light-emitting device, which aims to solve the problem of uneven soldering or poor pad matching in the production process of LED beads in the prior art, which leads to poor soldering of LED beads.
[0006] The LED lamp bead proposed in this utility model includes a lamp bead bracket, a light-emitting chip group disposed on the lamp bead bracket, and a metal component. The front of the lamp bead bracket is provided with a cup-shaped receiving groove. The receiving groove is provided with a die-bonding area and multiple wire bonding areas. The light-emitting chip group includes a variety of light-emitting chips disposed in the die-bonding area. The metal component includes a straight portion disposed at the bottom of the receiving groove to form the wire bonding area, and a bent portion disposed in the lamp bead bracket. The bent portion extends out of the lamp bead bracket and is disposed at the bottom of the lamp bead bracket to form a pin. A solder ball is disposed at the bottom of the bent portion.
[0007] The aforementioned LED beads utilize a die-bonding area within the bead holder to house the light-emitting chip. The straight portion of a metal component is positioned in the wire bonding area, while the bent portion extends beyond the bead holder to form leads, thus establishing the basic structure of the LED assembly. Solder balls are placed at these leads, allowing the LED beads to be directly placed on the PCB and fixed via reflow soldering during soldering. Existing technologies involve applying solder paste to the PCB pads using a stencil, resulting in uneven thickness and difficulty in aligning the LED beads with the PCB. Solder balls, being solid, ensure uniform solder thickness and allow for easy adjustment and alignment, unlike liquid solder paste which can cause turbulence. This guarantees effective soldering of the LED beads. Furthermore, the compact internal structure of the solder balls prevents voids that can occur with liquid solder paste. Therefore, this utility model solves the problem of poor soldering of lamp beads caused by uneven soldering or poor pad matching during the production process of lamp beads in the prior art.
[0008] In addition, the LED lamp beads proposed according to this utility model may also have the following additional technical features:
[0009] Preferably, the straight portion constituting the plurality of bonding wire areas extends outward to have a plurality of bent portions constituting the pins, and each of the plurality of bent portions is provided with a solder ball, and the plurality of solder balls are evenly distributed at the bottom of the lamp bead bracket.
[0010] Preferably, each of the solder balls has a mounting surface at its bottom so that the bottom of the lamp bead bracket is flush with the base.
[0011] Preferably, the bottom and sides of the lamp bead bracket are recessed inward to form an L-shaped groove, the groove is adapted to the bending portion so that the bending portion is at least partially exposed to the outside of the lamp bead bracket, and the thickness of the bending portion is greater than the depth of the groove.
[0012] Preferably, the width of the groove is greater than the width of the bend.
[0013] Preferably, the diameter of the solder ball is not greater than the width of the bent portion.
[0014] Preferably, the bonding area includes a common electrode region and multiple sub-electrode regions, the first electrodes of the multiple light-emitting chips are electrically connected to the common electrode region, and the second electrodes of the multiple light-emitting chips are respectively electrically connected to the corresponding sub-electrode regions.
[0015] Preferably, the common electrode region is a positive electrode region, and the separate electrode region is a negative electrode region.
[0016] Preferably, the lamp bead bracket is integrally injection molded from plastic material, and the receiving groove is provided with encapsulating adhesive.
[0017] In addition, this utility model also provides a light-emitting device, which includes the above-mentioned LED beads. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of an LED lamp bead proposed in one embodiment of the present invention;
[0019] Figure 2 This is a schematic diagram of the internal structure of the receiving groove proposed in one embodiment of the present utility model.
[0020] Explanation of key component symbols:
[0021]
[0022]
[0023] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation
[0024] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.
[0025] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.
[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.
[0027] Please see Figures 1 to 2The image shows an LED bead in one embodiment of the present invention, comprising a bead holder 10, a light-emitting chip group 20 disposed on the bead holder 10, and a metal part 30, wherein:
[0028] The front of the lamp bead bracket 10 is provided with a bowl-shaped receiving groove 11. The receiving groove 11 is provided with a die bonding area 12 and multiple bonding wire areas 13. The light-emitting chip group 20 includes a variety of light-emitting chips disposed in the die bonding area 12. The metal part 30 includes a straight part 31 that forms a bonding wire area 13 at the bottom of the receiving groove 11, and a bent part 32 disposed in the lamp bead bracket 10. The bent part 32 extends out of the lamp bead bracket 10 and is disposed at the bottom of the lamp bead bracket 10 to form a lead. A solder ball 40 is provided at the bottom of the bent part 32.
[0029] Understandably, by placing the light-emitting chip in the die-bonding area 12 within the LED bead bracket 10, and placing the straight portion 31 of the metal part 30 in the wire bonding area 13, with the bent portion 32 of the metal part 30 extending out of the LED bead bracket 10 to form pins, the basic structure of the lamp assembly is achieved. By placing solder balls 40 at the pins, the LEDs can be directly placed on the PCB board and fixed to the PCB by reflow soldering during soldering. In existing technologies, soldering between the PCB board and the LEDs is achieved by brushing solder paste onto the PADs of the PCB board. Since the solder paste is applied through a stencil and is in a liquid state, uneven solder paste thickness is easily caused, and alignment between the LEDs and the PCB board is difficult. Solder balls 40, being solid structures, can effectively ensure uniform solder thickness, and their position can be adjusted for alignment without the turbulence that occurs with liquid solder paste adjustments. This ensures effective soldering of the LEDs. Furthermore, the compact internal structure of the solder balls 40 also avoids voids that occur during liquid soldering. Therefore, this utility model solves the problem of poor soldering of lamp beads caused by uneven soldering or poor pad matching during the production process of lamp beads in the prior art.
[0030] Specifically, the straight portion 31 constituting multiple bonding areas 13 extends outward with multiple bent portions 32 forming pins. Solder balls 40 are provided under each of the multiple bent portions 32, and the solder balls 40 are evenly distributed at the bottom of the LED bead bracket 10. In practical implementation, by setting different bent portions 32 corresponding to the corresponding bonding areas 13, control of different bonding areas 13 can be achieved. Furthermore, by evenly distributing the corresponding solder balls 40, when the LED bead is fixed to the PCB board by reflow soldering using the solder balls 40, the uniform distribution of the solder balls 40 results in uniform heat distribution on the PCB board during soldering, thereby reducing the degree of warping of the PCB board due to heat.
[0031] In addition, each of the solder balls 40 has a mounting surface 41 at its bottom to make the bottom of the LED bead bracket 10 flush. In practice, the mounting surface 41 can be produced by grinding the bottom of the solder balls 40, so that the LED can be placed more stably on the PCB board for reflow soldering. Furthermore, the size of the solder balls 40 can be adjusted by the grinding direction to ensure uniform distribution of solder at the bottom of the LED.
[0032] Specifically, the bottom and sides of the LED bead bracket 10 are recessed inward to form an L-shaped groove 14. The groove 14 is adapted to the bent portion 32 so that the bent portion 32 is at least partially exposed to the outside of the LED bead bracket 10. The thickness of the bent portion 32 is greater than the depth of the groove 14. By setting the groove 14, the bent portion 32 is partially exposed to the outside of the LED bead bracket 10, forming a pin, so that the LED can be connected to the PCB board through solder. In addition, by adjusting the thickness of the bent portion 32, the bent portion 32 protrudes from the groove 14, making it easier to place the solder balls 40 on the bent portion 32 during the ball-mounting process.
[0033] Furthermore, the width of the groove 14 is greater than the width of the bend 32. In a specific implementation, the connection between the solder ball 40 and the pin is also achieved through soldering. By setting the width of the groove 14 to be greater than the width of the bend 32, when the solder ball 40 is fixed on the bend 32, the liquid solder produced during soldering can flow into the groove 14, rather than into the inside or outside of the support, thus preventing solder turbulence. In addition, the diameter of the solder ball 40 is no greater than the width of the bend 32. This arrangement makes it easier to align the solder ball 40 with the bend 32 when it is fixed.
[0034] Additionally, the bonding area 13 includes a common electrode region 131 and multiple sub-electrode regions 132. The first electrodes of multiple light-emitting chips are electrically connected to the common electrode region 131, and the second electrodes of multiple light-emitting chips are electrically connected to their respective sub-electrode regions 132. Specifically, the common electrode region 131 is the positive electrode region, and the sub-electrode regions 132 are the negative electrode regions. By setting the common electrode region 131 and the sub-electrode regions 132, independent control of each chip can be achieved in a relatively small space, enabling adjustable LED color temperature, color difference, color, and brightness.
[0035] Furthermore, the LED bead bracket 10 is integrally injection molded from plastic material, and the receiving groove 11 is filled with encapsulating adhesive. By using plastic material, the LED bead bracket 10 and the metal part 30 are integrally injection molded, thereby avoiding assembly problems between the metal part 30 and the LED bead bracket 10 and improving production efficiency. In addition, by using encapsulating adhesive, the light-emitting chip is encapsulated, preventing moisture from affecting the light-emitting chip assembly 20.
[0036] In summary, the LED lamp beads in the above embodiments of this utility model achieve the basic structure of the lamp assembly by setting the light-emitting chip in the die-bonding area 12 within the lamp bead bracket 10, setting the straight portion 31 of the metal part 30 in the wire bonding area 13, and extending the bent portion 32 of the metal part 30 out of the lamp bead bracket 10 to form pins. By setting solder balls 40 at the pins, the lamp beads can be directly placed on the PCB board and fixed to the PCB board by reflow soldering. In the prior art, soldering between the PCB board and the lamp beads is achieved by brushing solder paste onto the PAD of the PCB board. However, the solder paste is applied by brushing with a stencil and is in a liquid state, which easily leads to uneven solder paste thickness and difficulty in aligning the lamp beads with the PCB board. The solder balls 40, being solid structures, can effectively ensure the uniformity of solder thickness and can be adjusted for alignment at any time, avoiding the liquid turbulence that occurs when adjusting the position of a liquid structure. This ensures the soldering effect of the lamp beads. Furthermore, the compact internal structure of the solder ball 40 also prevents voids that may occur during liquid solder paste soldering. Therefore, this invention solves the problem of uneven soldering or poor pad matching leading to poor soldering of LED chips in the prior art during LED chip production.
[0037] In addition, this utility model also provides a light-emitting device, which includes the above-mentioned LED beads.
[0038] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.
[0039] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. An LED lamp bead, characterized in that, The device includes an LED chip holder, a light-emitting chip assembly disposed on the LED chip holder, and a metal component. The front of the LED chip holder has a cup-shaped receiving groove, and the receiving groove has a die-bonding area and multiple wire bonding areas. The light-emitting chip assembly includes multiple light-emitting chips disposed in the die-bonding area. The metal component includes a straight portion disposed at the bottom of the receiving groove to form the wire bonding area, and a bent portion disposed in the LED chip holder. The bent portion extends out of the LED chip holder and is disposed at the bottom of the LED chip holder to form a pin. A solder ball is disposed at the bottom of the bent portion. The straight portion constituting the multiple bonding areas extends outward to have multiple bent portions constituting the pins, and each of the multiple bent portions is provided with a solder ball, and the multiple solder balls are evenly distributed at the bottom of the lamp bead bracket; Each of the solder balls has a mounting surface at its bottom to make the bottom of the lamp bead bracket flush with the base.
2. The LED lamp bead according to claim 1, characterized in that, The bottom and sides of the lamp bead bracket are recessed inward to form an L-shaped groove. The groove is adapted to the bending portion so that the bending portion is at least partially exposed to the outside of the lamp bead bracket. The thickness of the bending portion is greater than the depth of the groove.
3. The LED lamp bead according to claim 2, characterized in that, The width of the groove is greater than the width of the bend.
4. The LED lamp bead according to claim 1, characterized in that, The diameter of the solder ball is not greater than the width of the bent portion.
5. The LED lamp bead according to claim 1, characterized in that, The bonding area includes a common electrode region and multiple sub-electrode regions. The first electrodes of the multiple light-emitting chips are electrically connected to the common electrode region, and the second electrodes of the multiple light-emitting chips are electrically connected to the corresponding sub-electrode regions.
6. The LED lamp bead according to claim 5, characterized in that, The common electrode region is the positive electrode region, and the separate electrode region is the negative electrode region.
7. The LED lamp bead according to claim 1, characterized in that, The lamp bead bracket is integrally injection molded from plastic material, and the receiving groove is provided with encapsulating adhesive.
8. A light-emitting device, characterized in that, Includes the LED beads as described in any one of claims 1 to 7.