Test probe cleaning device for semiconductor chip

Abstract

The utility model discloses a test probe cleaning device for a semiconductor chip, which comprises an ultrasonic cleaning machine and a support, the support is arranged above the ultrasonic cleaning machine, a plurality of rotating sleeve rods for inserting probes are arranged on the support, and clamps for automatically clamping and fixing the probes are arranged on the rotating sleeve rods. The support is provided with a driving assembly used for driving the multiple rotating sleeve rods to continuously rotate into the ultrasonic cleaning machine. According to the utility model, the beneficial effects of the utility model are that the driving assembly drives the plurality of groups of rotating sleeve rods to rotate, when the rotating sleeve rods rotate to the uppermost part, the clamp can automatically loosen and the probe can be replaced, and when the rotating sleeve rods rotate to the uppermost part, the clamp can automatically clamp and fix the probe, so that the clamp does not need to be manually controlled, and the working efficiency is improved. The probe can be automatically clamped or loosened along with rotation of the rotating sleeve rods, and only the probe in the uppermost rotating sleeve rod needs to be manually replaced.

Description

Technical Field

[0001] This utility model mainly relates to the field of probe cleaning technology, specifically a test probe cleaning device for semiconductor chips. Background Technology

[0002] When the bending probes on semiconductor testing equipment have been tested for about 150,000 times, the static electricity generated gradually increases. Debris or fragments such as wafers will stick to the bending probes, and electric arcs will be generated. All of these will greatly reduce the conductivity and lifespan of the bending probes.

[0003] After use, probes need to be cleaned. Existing probes are usually cleaned using ultrasonic cleaners. During cleaning, the probes need to be fixed. Existing cleaning machines usually require manual fixation of the probes using clamps before they are inserted into the cleaning machine for cleaning. However, when cleaning a large number of probes in a production line, manually controlling the clamps to change probes for cleaning will affect the overall cleaning efficiency. Utility Model Content

[0004] This utility model provides a solution that is significantly different from existing technologies, addressing the problem that existing technologies are too simplistic. It mainly provides a test probe cleaning device for semiconductor chips, which solves the problem mentioned in the background art that manually controlling the fixture to change probes when cleaning a large number of probes wastes a lot of time.

[0005] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows:

[0006] A test probe cleaning device for semiconductor chips includes an ultrasonic cleaner and a support. The support is positioned above the ultrasonic cleaner and has multiple rotating sleeves for inserting probes. Each rotating sleeve has a clamp for automatically holding and fixing the probe. The support also has a drive assembly for continuously rotating the multiple rotating sleeves into the ultrasonic cleaner.

[0007] Preferably, the drive assembly includes a motor, which is mounted on a bracket, and the output end of the motor is provided with a rotating shaft, which is rotatably connected to the bracket.

[0008] Preferably, a rotating block is provided on the rotating shaft, and multiple rotating sleeves are arranged in a circular array on the rotating block.

[0009] Preferably, a support block is provided inside the rotating sleeve rod, an insertion sleeve rod is provided above the support block, a spring is sleeved on the insertion sleeve rod, and a support shell is provided at the end of the insertion sleeve rod away from the support block.

[0010] Preferably, the support sleeve is provided with a guide rod, and the bracket is provided with a guide groove, and the guide rod is inserted into the guide groove.

[0011] Preferably, the clamp includes a clamping block and a linkage rod. The clamping block is disposed on the support sleeve, one end of the linkage rod is connected to the clamping block, and the end of the linkage rod away from the clamping block is connected to one end of the rotating sleeve rod.

[0012] Compared with the prior art, the beneficial effects of this utility model are as follows: the drive component drives multiple sets of rotating sleeves to rotate. When the rotating sleeve rotates to the top, the clamp will automatically release, at which point the probe can be replaced. When the rotating sleeve rotates to the top, the clamp will automatically clamp and fix the probe. In this way, the clamp does not require manual operation. As the rotating sleeve rotates, it will automatically clamp or release the probe. The operator only needs to replace the probe inside the top rotating sleeve. In this way, the overall cleaning efficiency of the probe can be improved during assembly line operation.

[0013] The present invention will be explained in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0014] Figure 1 This is a frontal three-dimensional structural diagram of the present utility model;

[0015] Figure 2 This is a side perspective view of the present invention.

[0016] Figure 3 This is a top-view three-dimensional structural diagram of the present invention;

[0017] Figure 4 This is a schematic diagram of the internal structure of the bracket of this utility model;

[0018] Figure 5 This is a schematic diagram of the internal structure of the rotating sleeve in the open state of the clamp in this utility model;

[0019] Figure 6 This is a schematic diagram of the internal structure of the rotating sleeve rod in the closed state of the clamp in this utility model;

[0020] The diagram is marked as follows:

[0021] 1. Ultrasonic cleaner; 2. Support frame; 3. Motor; 4. Rotating shaft; 5. Rotating block; 6. Rotating sleeve rod; 7. Support block; 8. Inserting sleeve rod; 9. Spring; 10. Support housing; 11. Guide rod; 12. Guide groove; 13. Clamping block; 14. Linkage rod. Detailed Implementation

[0022] To facilitate understanding of this utility model, a more comprehensive description of the utility model will be given below with reference to the accompanying drawings, which show several embodiments of the utility model. However, the utility model can be implemented in different forms and is not limited to the embodiments described in the text. On the contrary, these embodiments are provided to make the disclosure of the utility model more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly associated with those skilled in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] Please refer to the appendix carefully. Figures 1-6 A test probe cleaning device for semiconductor chips includes an ultrasonic cleaner 1 and a support 2. The support 2 is disposed above the ultrasonic cleaner 1. The support 2 is provided with a plurality of rotating sleeves 6 for inserting probes. The rotating sleeves 6 are provided with clamps for automatically clamping and fixing the probes. The support 2 is provided with a drive component for driving the plurality of rotating sleeves 6 to continuously rotate into the ultrasonic cleaner 1.

[0026] The specific operating procedure of this utility is as follows: Insert the probe into the uppermost rotating sleeve 6, start the ultrasonic cleaner 1 and the drive assembly. The drive assembly drives multiple rotating sleeves 6 to rotate. When the rotating sleeve 6 rotates away from the uppermost position, the clamp will automatically clamp and fix the probe inserted inside the rotating sleeve 6. When the rotating sleeve 6 drives the probe to the lowermost position, the probe is now inside the ultrasonic cleaner 1. The ultrasonic cleaner 1 cleans the probe. After cleaning, the probe is driven back to the uppermost position by the rotating sleeve 6. At this time, the clamp will automatically release the probe. Then, replace the probe inside the uppermost rotating sleeve 6.

[0027] Please refer to Figures 1-4 The drive component includes a motor 3, which is mounted on a bracket 2. A rotating shaft 4 is mounted on the output end of the motor 3. The rotating shaft 4 is rotatably connected to the bracket 2. A rotating block 5 is mounted on the rotating shaft 4. Multiple rotating sleeve rods 6 are arranged in a circular array on the rotating block 5.

[0028] Start motor 3, motor 3 drives rotating shaft 4 to rotate, rotating shaft 4 drives rotating block 5 to rotate, rotating block 5 drives multiple rotating sleeve rods 6 to rotate, rotating sleeve rods 6 drive the probes inserted inside to rotate.

[0029] Please refer to Figure 5 and Figure 6 The rotating sleeve rod 6 has a support block 7 inside, and an insertion sleeve rod 8 is provided above the support block 7. A spring 9 is sleeved on the insertion sleeve rod 8. A support shell 10 is provided at the end of the insertion sleeve rod 8 away from the support block 7. A guide rod 11 is provided on the support shell 10. A guide groove 12 is provided on the bracket 2. The guide rod 11 is inserted into the guide groove 12. The clamp includes a clamping block 13 and a linkage rod 14. The clamping block 13 is provided on the support shell 10. One end of the linkage rod 14 is connected to the clamping block 13, and the end of the linkage rod 14 away from the clamping block 13 is connected to one end of the rotating sleeve rod 6.

[0030] When the rotating sleeve 6 is rotated to its highest position, the guide rod 11 moves downward under the guidance of the guide groove 12. The guide rod 11 drives the support sleeve 10 to press down, and the support sleeve 10 drives the spring 9 to compress. At this time, the insertion sleeve 8 is in a downward state. The support sleeve 10 will drive the clamping block 13 to move downward. Through the transmission of the linkage rod 14, the clamping block 13 above the support sleeve 10 opens upward. At this time, the clamping block 13 is in an open state, and the probe inserted in the middle of the support sleeve 10 is not clamped or fixed. The support block 7 has a slot that matches the insertion sleeve 8. The insertion sleeve 8 can move up and down on the support block 7. However, the middle of the support block 7 is solid, and the insertion... The sleeve rod 8 is hollow in the middle, and the probe can be inserted into the middle of the sleeve rod 8. The clamping block 13 is hinged to the support sleeve 10. One end of the linkage rod 14 is hinged to the top of the clamping block 13, and the other end of the linkage rod 14 is hinged to the inner wall of the rotating sleeve rod 6. When the clamping block 13 moves down, the linkage rod 14 is pulled into an inclined state. At this time, the linkage rod 14 pulls up the clamping block 13, so that the clamping blocks 13 on both sides do not contact the probe and cannot clamp and fix the probe. When the clamping block 13 rises, the linkage rod 14 is in a relatively horizontal state. At this time, the clamping block 13 is pushed flat by the linkage rod 14. At this time, the clamping blocks 13 on both sides fit together and achieve contact and clamping fixation with the probe in the middle.

[0031] The present invention has been described above by way of example in conjunction with the accompanying drawings. Obviously, the specific implementation of the present invention is not limited to the above-described manner. Any non-substantial improvement made by adopting the inventive concept and technical solution of the present invention, or the direct application of the inventive concept and technical solution of the present invention to other occasions without modification, shall be within the protection scope of the present invention.

Claims

1. A test probe cleaning apparatus for semiconductor chips, comprising an ultrasonic cleaner (1) and a support (2), wherein the support (2) is disposed above the ultrasonic cleaner (1), characterized in that: The bracket (2) is provided with multiple rotating sleeves (6) for inserting probes. The rotating sleeves (6) are provided with clamps for automatically clamping and fixing the probes. The bracket (2) is provided with a drive assembly for driving the multiple rotating sleeves (6) to continuously rotate into the ultrasonic cleaner (1).

2. The test probe cleaning device for semiconductor chips according to claim 1, characterized in that: The drive assembly includes a motor (3), which is mounted on a bracket (2). The output end of the motor (3) is provided with a rotating shaft (4), which is rotatably connected to the bracket (2).

3. The test probe cleaning device for semiconductor chips according to claim 2, characterized in that: A rotating block (5) is provided on the rotating shaft (4), and multiple rotating sleeves (6) are arranged in a circular array on the rotating block (5).

4. The test probe cleaning device for semiconductor chips according to claim 1, characterized in that: The rotating sleeve (6) has a support block (7) inside, and a plug-in sleeve (8) is provided above the support block (7). A spring (9) is sleeved on the plug-in sleeve (8), and a support shell (10) is provided at the end of the plug-in sleeve (8) away from the support block (7).

5. The test probe cleaning device for semiconductor chips according to claim 4, characterized in that: The support housing (10) is provided with a guide rod (11), and the bracket (2) is provided with a guide groove (12). The guide rod (11) is inserted into the guide groove (12).

6. The test probe cleaning device for semiconductor chips according to claim 1, characterized in that: The clamp includes a clamping block (13) and a linkage rod (14). The clamping block (13) is mounted on the support sleeve (10). One end of the linkage rod (14) is connected to the clamping block (13), and the end of the linkage rod (14) away from the clamping block (13) is connected to one end of the rotating sleeve rod (6).

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