Heat dissipation shell of pressure gauge for chemical grinding of semiconductor

Abstract

The utility model discloses a semiconductor chemical polishing pressure gauge heat dissipation shell, which comprises a first shell and a second shell, and is characterized in that the second shell comprises a second side plate and a second heat dissipation plate; the edges of the second side plate and the second heat dissipation plate are fixedly connected with each other; the bottom edge of the second side plate and the bottom edge of the second heat dissipation plate are connected to the edge of the bottom plate, so that the first shell and the second shell are connected to form a heat dissipation shell with an opening in the top and capable of containing a semiconductor chemical grinding pressure gauge. A circular fan hole is formed in the second side plate, threaded holes are formed in the periphery of the fan hole, and the cooling fan is connected to the fan hole through the threaded holes. When the pressure gauge works, the heat dissipation fan blows air to the inside or the outside of the heat dissipation shell, it is guaranteed that the pressure gauge in the heat dissipation shell can have a good heat dissipation effect, it is guaranteed that the pressure gauge works within a proper temperature range, and the sensitivity and the reliability of the pressure gauge are kept.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chemical polishing of semiconductors, and more particularly to a pressure gauge heat dissipation shell for chemical polishing of semiconductors. BACKGROUND

[0002] Chemical polishing of semiconductors (CMP, Chemical Mechanical Polishing) is a processing technology combining chemical corrosion and mechanical removal, mainly used to achieve global planarization of the surface. CMP technology plays a key role in the semiconductor manufacturing process, especially in the processes of multi-layer wiring formation, interlayer insulating film planarization, metal plug formation, and buried wiring formation. The use of CMP technology in the semiconductor manufacturing process can ensure material removal efficiency while obtaining a perfect surface and achieving nanometer to atomic level surface roughness.

[0003] In CMP technology, the selection and use of pressure gauges are very critical, and appropriate and accurate pressure is essential for obtaining uniform and fine polishing results. In the CMP process, small changes in pressure can have a significant impact on polishing results. Therefore, the pressure gauge needs to be kept in good working environment and working condition during its operation. However, CMP equipment is complex and compact, and the pressure gauge needs to be separated from other components by a shell. The pressure gauge generates heat during operation, and the temperature rises over time, which affects the sensitivity of the pressure gauge and even causes damage to the pressure gauge, seriously affecting the CMP process. SUMMARY

[0004] To solve the above problems, the present application provides a pressure gauge heat dissipation shell for chemical polishing of semiconductors, which solves the problem of temperature rise of the pressure gauge in the CMP equipment after a long time of operation, affecting the sensitivity of the pressure gauge, and even causing damage to the pressure gauge.

[0005] To achieve the above purpose, the present application provides a pressure gauge heat dissipation shell for chemical polishing of semiconductors, comprising a first shell and a second shell, the first shell comprising a first side plate, a first heat dissipation plate and a bottom plate; the first side plate, the first heat dissipation plate and the bottom plate are arranged perpendicular to each other, and the adjacent edges are fixedly connected to each other.

[0006] The second shell comprises a second side plate and a second heat dissipation plate; the second side plate and the second heat dissipation plate are arranged perpendicular to each other, and the edges are fixedly connected to each other.

[0007] The bottom edges of the second side plate and the second heat dissipation plate are connected to the edges of the bottom plate, so that the first shell and the second shell form a heat dissipation shell with an open top after being connected, which can accommodate the pressure gauge for chemical polishing of semiconductors.

[0008] A circular fan hole is formed on the second side plate, and threaded holes are arranged around the fan hole, and the heat dissipation fan is connected to the fan hole through the threaded holes.

[0009] In the preferred mode of the semiconductor chemical polishing pressure gauge heat dissipation shell, a detachable inspection plate is arranged at the middle position of the upper side of the second heat dissipation plate, and the inspection plate is higher than the plane where the second heat dissipation plate is located.

[0010] In the preferred mode of the semiconductor chemical polishing pressure gauge heat dissipation shell, small holes for heat dissipation are formed on the first side plate, the second heat dissipation plate and the inspection plate.

[0011] In the preferred mode of the semiconductor chemical polishing pressure gauge heat dissipation shell, a connecting through hole is formed at the side edge of the first side plate away from the first heat dissipation plate; and a connecting part parallel to the first heat dissipation plate is arranged at the end of the first heat dissipation plate away from the first side plate.

[0012] In the preferred mode of the semiconductor chemical polishing pressure gauge heat dissipation shell, a connecting part perpendicular to the bottom plate is arranged at the edge where the bottom plate is connected to the second side plate and the second heat dissipation plate.

[0013] In the preferred mode of the semiconductor chemical polishing pressure gauge heat dissipation shell, a connecting through hole is formed at the side edge of the second side plate away from the second heat dissipation plate; and a connecting part parallel to the second heat dissipation plate is arranged at the end of the second heat dissipation plate away from the second side plate, and threaded connecting holes are arranged on the connecting part; and connecting through holes are formed at the connection between the second side plate and the second heat dissipation plate and the bottom plate.

[0014] In the preferred mode of the semiconductor chemical polishing pressure gauge heat dissipation shell, the connecting through hole on the second side plate and the threaded connecting hole on the connecting part of the first heat dissipation plate are fixed by screws; the connecting through hole on the first side plate and the threaded connecting hole on the connecting part of the second heat dissipation plate are fixed by screws; and the connecting through holes at the bottom of the second side plate and the second heat dissipation plate and the threaded connecting holes on the connecting part arranged at the edge of the bottom plate are fixed by screws.

[0015] In the preferred mode of the semiconductor chemical polishing pressure gauge heat dissipation shell, a square hole for mounting a terminal block is further formed on the second side plate; and a wire hole through which a wire passes is formed on the bottom plate.

[0016] In the preferred mode of the semiconductor chemical polishing pressure gauge heat dissipation shell, the heat dissipation fan blows air into the interior of the heat dissipation shell when rotating.

[0017] In the preferred mode of the semiconductor chemical polishing pressure gauge heat dissipation shell, the heat dissipation fan blows air outside the heat dissipation shell when rotating.

[0018] This invention ensures that the pressure gauge inside the heat dissipation shell can have good heat dissipation by opening a circular fan hole on the second side plate and installing a cooling fan, and by opening small holes for heat dissipation on the first side plate, the second heat dissipation plate and the inspection plate, so that the pressure gauge can work within a suitable temperature range and maintain its sensitivity and reliability. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is an exploded view of the three-dimensional structure of the present invention;

[0021] Figure 3 This is a three-dimensional structural view of the present invention from another perspective.

[0022] Figure 4 This is an exploded view of the three-dimensional structure from another view direction of the present invention;

[0023] Figure 5 This is a schematic diagram of the cooling fan in this invention.

[0024] In the figure, 1 is the first housing, 11 is the first side plate, 12 is the first heat sink, 13 is the bottom plate, 131 is the wire hole, 2 is the second housing, 21 is the second side plate, 22 is the second heat sink, 221 is the inspection plate, 23 is the fan hole, 24 is the threaded hole, 3 is the connecting through hole, 4 is the connecting part, 5 is the threaded connecting hole, and 6 is the cooling fan. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate the present invention.

[0026] like Figure 1 As shown, the present invention is a heat dissipation housing for a pressure gauge used in semiconductor chemical polishing, comprising a first housing 1 and a second housing 2. The first housing 1 includes a first side plate 11, a first heat dissipation plate 12 and a bottom plate 13. The first side plate 11, the first heat dissipation plate 12 and the bottom plate 13 are arranged perpendicularly to each other, and two adjacent edges are fixedly connected to each other.

[0027] like Figure 3 As shown, the second housing 2 includes a second side plate 21 and a second heat sink 22; the second side plate 21 and the second heat sink 22 are arranged perpendicularly to each other and are fixedly connected to each other at their edges. The bottom edges of the second side plate 21 and the second heat sink 22 are connected to the edge of the base plate 13, so that after the first housing 1 and the second housing 2 are connected, a top opening is formed to accommodate the heat sink housing of the pressure gauge for semiconductor chemical polishing.

[0028] As shown in Figure 3 , Figure 4 , a circular fan hole 23 is formed on the second side plate 21, and a threaded hole 24 is arranged around the fan hole 23, as shown in Figure 5 , a cooling fan 6 is connected to the fan hole 23 through the threaded hole 24. The cooling fan 6 is connected to the power supply inside the cooling shell, and blows air to the inside of the cooling shell when rotating, or blows air to the outside of the cooling shell when rotating, so as to achieve the purpose of heat dissipation.

[0029] A detachable inspection plate 221 is arranged at the upper middle position of the second heat dissipation plate 22, and the inspection plate 221 is higher than the plane where the second heat dissipation plate 22 is located. Small holes for heat dissipation are formed on the first side plate 11, the second heat dissipation plate 22 and the inspection plate 221.

[0030] As shown in Figure 1 , a connecting through hole 3 is formed on the side edge of the first side plate 11 away from the first heat dissipation plate 12; and a connecting part 4 parallel to the first heat dissipation plate 12 is arranged at the end of the first heat dissipation plate 12 away from the first side plate 11.

[0031] As shown in Figure 4 , a connecting part 4 perpendicular to the bottom plate 13 is arranged at the edge of the bottom plate 13 connected with the second side plate 21 and the second heat dissipation plate 22.

[0032] As shown in Figure 4 , a connecting through hole 3 is formed on the side edge of the second side plate 21 away from the second heat dissipation plate 22. As shown in Figure 2 , a connecting part 4 parallel to the second heat dissipation plate 22 is arranged at the end of the second heat dissipation plate 22 away from the second side plate 21, and a threaded connecting hole 5 is arranged on the connecting part 4. Figure 3 As shown in , connecting through holes 3 are formed on the connecting parts 4 of the second side plate 21 and the second heat dissipation plate 22 connected with the bottom plate 13.

[0033] As shown in Figures 1 to 4 , the connecting through hole 3 on the second side plate 21 and the threaded connecting hole 5 on the connecting part 4 of the first heat dissipation plate 12 are fixed by screw connection; the connecting through hole 3 on the first side plate 11 and the threaded connecting hole 5 on the connecting part 4 of the second heat dissipation plate 22 are fixed by screw connection; and the connecting through holes 3 at the bottom of the second side plate 21 and the second heat dissipation plate 22 and the threaded connecting holes 5 on the connecting part 4 arranged at the edge of the bottom plate 13 are fixed by screw connection.

[0034] As shown in Figure 3 , Figure 4As shown, the second side plate 21 is further provided with a square hole 211 for installing a terminal block; and the bottom plate 13 is provided with a wire hole 131 for allowing a wire to pass through.

[0035] In operation, one or more pressure gauges are arranged in the heat dissipation shell, the first shell 1 and the second shell 2 are fixed, and the check plate 221 is fixed, the gas connecting pipe of the pressure gauge is connected to the top opening of the heat dissipation shell, the wire used by the pressure gauge is passed through the wire hole 131 of the bottom plate 13 and connected to the circuit board on the inner side of the check plate 221, the heat dissipation fan 6 is powered on from the circuit board on the inner side of the check plate 221, blows air to the pressure gauge in the heat dissipation shell, and the heat is dissipated from the small holes on the first side plate 11, the second heat dissipation plate 22 and the check plate 221, and the top opening of the heat dissipation shell, or the heat dissipation fan 6 blows air to the outside of the heat dissipation shell, forms a low pressure in the heat dissipation shell, and the external air flows into the small holes on the first side plate 11, the second heat dissipation plate 22 and the check plate 221, and the top opening of the heat dissipation shell, so as to achieve the cooling purpose. The circuit board in the heat dissipation shell is designed on the inner side of the check plate 221, if the equipment in the heat dissipation shell fails, the check plate 221 can be disassembled first, so as to check the circuit board.

[0036] The above is only the preferred embodiment of the present application, but the protection scope of the present application is not limited to this, any skilled person in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered in the protection scope of the present application.

Claims

1. A heat dissipation housing for a pressure gauge used in semiconductor chemical polishing, comprising a first housing (1) and a second housing (2), characterized in that, The first housing (1) includes a first side plate (11), a first heat sink (12), and a bottom plate (13); the first side plate (11), the first heat sink (12), and the bottom plate (13) are arranged perpendicularly to each other, and two adjacent edges are fixedly connected to each other; The second housing (2) includes a second side plate (21) and a second heat sink (22); the second side plate (21) and the second heat sink (22) are arranged perpendicular to each other and are fixedly connected to each other at their edges; The bottom edges of the second side plate (21) and the second heat sink plate (22) are connected to the edge of the base plate (13), so that the first housing (1) and the second housing (2) are connected to form a top opening that can accommodate the heat sink housing of the pressure gauge for semiconductor chemical polishing. A circular fan hole (23) is provided on the second side plate (21), and threaded holes (24) are provided around the fan hole (23). The cooling fan (6) is connected to the fan hole (23) through the threaded holes (24).

2. The heat dissipation housing for a pressure gauge used in semiconductor chemical polishing according to claim 1, characterized in that, A detachable inspection plate (221) is provided at the upper middle position of the second heat sink (22), and the inspection plate (221) is higher than the plane of the second heat sink (22).

3. The heat dissipation housing for a pressure gauge used in semiconductor chemical polishing according to claim 2, characterized in that, Small holes for heat dissipation are provided on the first side plate (11), the second heat dissipation plate (22), and the inspection plate (221).

4. The heat dissipation housing for a pressure gauge used in semiconductor chemical polishing according to claim 1, characterized in that, A connecting through hole (3) is provided on the side edge of the first side plate (11) away from the first heat sink (12); a connecting part (4) parallel to the first heat sink (12) is provided at the end of the first heat sink (12) away from the first side plate (11).

5. The heat dissipation housing for a pressure gauge used in semiconductor chemical polishing according to claim 4, characterized in that, A connecting part (4) perpendicular to the base plate (13) is provided at the edge where the base plate (13) connects to the second side plate (21) and the second heat sink (22).

6. The heat dissipation housing for a pressure gauge used in semiconductor chemical polishing according to claim 5, characterized in that, A connecting through hole (3) is provided on the edge of the second side plate (21) away from the second heat sink (22); a connecting part (4) parallel to the second heat sink (22) is provided at the end of the second heat sink (22) away from the second side plate (21), and a threaded connecting hole (5) is provided on the connecting part (4); a connecting through hole (3) is provided at the connection between the second side plate (21) and the second heat sink (22) and the bottom plate (13).

7. The heat dissipation housing for a pressure gauge used in semiconductor chemical polishing according to claim 6, characterized in that, The connecting through hole (3) on the second side plate (21) is connected and fixed to the threaded connecting hole (5) on the connecting part (4) of the first heat sink (12) by screws; the connecting through hole (3) on the first side plate (11) is connected and fixed to the threaded connecting hole (5) on the connecting part (4) of the second heat sink (22) by screws; the connecting through hole (3) at the bottom of the second side plate (21) and the second heat sink (22) is connected and fixed to the threaded connecting hole (5) on the connecting part (4) at the edge of the base plate (13) by screws.

8. The heat dissipation housing for a pressure gauge used in semiconductor chemical polishing according to claim 1, characterized in that, The second side plate (21) also has a square hole (211) for installing a terminal block; the bottom plate (13) has a wire hole (131) for wires to pass through.

9. The heat dissipation housing for a pressure gauge used in semiconductor chemical polishing according to claim 1, characterized in that, When the cooling fan (6) rotates, it blows air into the heat dissipation shell.

10. The heat dissipation housing for a pressure gauge used in semiconductor chemical polishing according to claim 1, characterized in that, When the cooling fan (6) rotates, it blows air out of the heat dissipation shell.

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