Supply device and chemical mechanical polishing equipment

Abstract

The utility model discloses a supply device and chemical mechanical polishing equipment. The supply device comprises a base, a supporting arm, a supply pipe and a drop point assembly. Wherein the supporting arm is connected with the base, the supporting arm has a set length direction, and the supporting arm comprises a plurality of sections of supporting arms; the multiple sections of supporting arms are detachably connected in sequence in the length direction. The supply pipe is provided with a liquid outlet end for spraying liquid; the drop point assembly is assembled on the supporting arm in a sliding mode, the supply pipe is connected to the drop point assembly, and the drop point assembly can slide in the length direction, so that the liquid outlet end of the supply pipe is moved to a preset position. And the interference on the movement of the grinding head and the grinding pad trimmer due to the overlong supporting arm is avoided.

Description

Technical Field

[0001] This application relates to the semiconductor field, and more specifically to a supply device and a chemical mechanical polishing apparatus. Background Technology

[0002] Chemical mechanical polishing (CPM) is used in many steps of semiconductor fabrication to planarize the surface of wafers. During CPM, an polishing slurry is used. This slurry is evenly distributed on the polishing pad under the action of rotation and centrifugal force, forming a thin liquid film between the wafer and the pad.

[0003] In related technologies, the grinding head, grinding pad, grinding fluid supply device, and grinding pad dresser are all placed in the processing chamber, and the grinding fluid supply device, grinding head, and grinding pad dresser are all located above the grinding pad.

[0004] In related technologies, due to the limited area of ​​the polishing pad, the polishing fluid supply device, polishing head, and polishing pad dresser are prone to spatial overlap, leading to mutual interference. Utility Model Content

[0005] This application is made to address the aforementioned problems. According to one aspect of this application, a supply device is provided, which is applied to a chemical mechanical grinding (CMP) apparatus. The supply device includes: a base, a support arm, a supply pipe, and a drop point assembly; wherein the support arm is connected to the base, the support arm has a predetermined length direction, and the support arm includes multiple support arms; the multiple support arms are detachably connected in sequence; the supply pipe has a liquid outlet end for spraying liquid; the drop point assembly is slidably mounted on the support arm, the supply pipe is connected to the drop point assembly, and the drop point assembly is capable of sliding along the length direction, thereby moving the liquid outlet end to a predetermined position.

[0006] In some embodiments of this application, the support arm is provided with a plurality of positioning scales distributed along the length direction, and the landing point component can be moved to a position corresponding to any positioning scale.

[0007] In some embodiments of this application, the top of the landing point component is provided with a positioning scale groove, which is perpendicular to the arrangement direction of multiple positioning scales and aligned with the axis of the liquid outlet.

[0008] In some embodiments of this application, the support arm has a first end and a second end that are positioned opposite each other along its length; wherein, the first end of the support arm is provided with a snap-fit ​​portion, and the second end of the support arm is provided with a snap-fit ​​groove; in two adjacent support arm sections, the snap-fit ​​portion of the first end of one support arm section is inserted into the snap-fit ​​groove of the second end of the other support arm section.

[0009] In some embodiments of this application, a slot is provided on the base, and the snap-fit ​​portion of the first end of the support arm adjacent to the base is inserted into the slot on the base; the support arm also includes a baffle, and the snap-fit ​​portion on the baffle is inserted into the slot at the second end of the support arm away from the base.

[0010] In some embodiments of this application, a groove is provided on the side of the support arm, the groove extends along the length direction, and the grooves on two adjacent support arm sections are connected; the landing point assembly includes: a slider slidably mounted on the groove; a locking mechanism disposed on the slider, the locking mechanism being used to lock the slider in a predetermined position in the groove; and a clamp disposed on the slider and used to clamp the supply pipe.

[0011] In some embodiments of this application, the locking mechanism includes: a locking pin slidably mounted in a slider, the locking pin having a first end and a second end positioned opposite each other; a cam rotatably connected in the slider, the first end of the locking pin abutting against the cam; wherein, when the proximal point of the cam contacts the first end of the locking pin, the second end of the locking pin retracts into the slider; when the distal point of the cam contacts the first end of the locking pin, the second end of the locking pin abuts against the groove wall of the slide.

[0012] In some embodiments of this application, the supply device further includes: a cleaning fluid supply pipe and a spray device disposed below the support arm and connected to the cleaning fluid supply pipe, the spray device including at least one nozzle, the nozzle being inclined downwards.

[0013] In some embodiments of this application, the spraying device further includes a spraying communication cavity communicating with the nozzle; wherein, the spraying communication cavity in the spraying device adjacent to the base is connected to the cleaning liquid supply pipe, and the spraying communication cavities in two adjacent spraying devices are connected.

[0014] According to a second aspect of this application, a chemical mechanical polishing apparatus is also provided, comprising: a rotatable polishing table, a polishing pad disposed on the polishing table, a polishing head located above the polishing pad and used to press a wafer against the polishing pad, and any one of the above-mentioned supply devices.

[0015] According to the supply device and chemical mechanical polishing apparatus provided in the embodiments of this application, the support arm of the supply device includes multiple support arms, and the multiple support arms are detachably connected sequentially along a predetermined length direction of the support arm. In application, the number of support arms on the support arm can be increased or decreased for different sizes of polishing pads, thereby lengthening or shortening the length of the support arm. For example, when the landing point component does not need to be located at the center of the polishing pad, the length of the support arm can be appropriately shortened to provide more movement space for the polishing head and polishing pad dresser, avoiding interference with the movement of the polishing head and polishing pad dresser due to excessively long support arms. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figures 1 to 3 This is a schematic diagram of the supply device from various angles, illustrating an embodiment of this application.

[0018] Figures 4 to 6 This is a schematic diagram of the support arm at various angles according to an embodiment of this application;

[0019] Figure 7 This is a schematic diagram of the support arm structure shown in one embodiment of this application;

[0020] Figures 8 to 9 This is a schematic diagram of the baffle at various angles, illustrating an embodiment of this application.

[0021] Figure 10 This is a schematic diagram of the structure of the base shown in one embodiment of this application;

[0022] Figures 11 to 13 This is a schematic diagram of the landing point component at various angles, as shown in an embodiment of this application.

[0023] Figures 14 to 15 This is a schematic diagram of the spray device shown from various angles according to an embodiment of this application;

[0024] Figures 16 to 17 This is a partially enlarged schematic diagram of the positioning scale and positioning scale groove shown in an embodiment of this application.

[0025] Figure label:

[0026] 10-Base 20-Outrigger

[0027] 21-Snap-in part 22-Snap-in slot

[0028] 23-Slide groove 24-Snap-fit ​​groove

[0029] 30-Landing point component 31-Slider

[0030] 32-Clamp 33-Locking pin

[0031] 34-Cam 341-Remote Rest Point

[0032] 342-Near Rest Point 35-Turn the Handle

[0033] 36 - Positioning scale groove 40 - Supply pipe

[0034] 41-Discharge end 50-Baffle

[0035] 60-Spraying device 61-Sprayer head

[0036] 62-Card Block 70-Cleaning Fluid Supply Tube Detailed Implementation

[0037] To make the objectives, technical solutions, and advantages of this application more apparent, exemplary embodiments according to this application will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein. Based on the embodiments of this application described herein, all other embodiments obtained by those skilled in the art without inventive effort should fall within the protection scope of this application.

[0038] The following description provides numerous specific details to offer a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described to avoid confusion with this application.

[0039] It should be understood that this application can be implemented in various forms and should not be construed as being limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of this application to those skilled in the art.

[0040] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising” and / or “including,” when used in this specification, confirm the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0041] To fully understand this application, a detailed structure will be presented in the following description to illustrate the technical solution proposed in this application. Optional embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0042] In chemical mechanical polishing (CMP), the uniform distribution of the polishing slurry is influenced to some extent by factors such as the rotational speed of the polishing pad and the initial landing point of the slurry. Different initial landing points of the slurry result in varying flow field distributions that affect the morphology of the polished wafer. Furthermore, for W (tungsten), Co (cobalt), and Cu (copper) processes, the polishing process additionally requires a slurry supply device with dual initial landing points, or the use of different types of chemical polishing slurries. The selection of the initial landing point for the slurry is quite stringent, and the flow field distribution formed by different initial landing points has varying effects on the morphology of the polished wafer. Existing slurry supply devices cannot meet the requirements for scenarios with multiple initial landing points, necessitating additional modifications and increasing the workload of equipment engineers.

[0043] In addition, when the polishing slurry supply device is also connected to HPR, the limited space of the processing chamber affects the stroke of the polishing head and polishing pad dresser, among other things. Furthermore, the size of the polishing pad is limited, and the polishing head, polishing pad dresser, and polishing slurry supply device must all be placed above the polishing pad. If the support arm of the polishing slurry supply device is too long, it will overlap with the polishing head and polishing pad dresser, thereby interfering with the movement stroke of the polishing head and polishing pad dresser.

[0044] To address at least some of the technical problems in the aforementioned related technologies, this application proposes the following embodiments.

[0045] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0046] First, let me introduce the application scenario of the supply device illustrated in this application. The supply device is used in chemical mechanical grinding equipment to output grinding fluid to the grinding pad of the chemical mechanical grinding equipment.

[0047] refer to Figures 1 to 6 This application provides a supply device for a chemical mechanical grinding apparatus. The supply device includes a base 10, a support arm, a supply pipe 40, and a landing point assembly 30. The support arm is connected to the base 10 and has a predetermined length direction. The support arm includes multiple support arms 20. The multiple support arms 20 are detachably connected in sequence along the length direction. The supply pipe 40 has a liquid outlet end 41 for spraying liquid. The landing point assembly 30 is slidably mounted on the support arm. The supply pipe 40 is connected to the landing point assembly 30. The landing point assembly 30 can slide along the length direction, thereby moving the liquid outlet end 41 to a predetermined position.

[0048] The above embodiments have the following beneficial effects: the support arm of the supply device includes multiple support arms 20, and the multiple support arms 20 are detachably connected sequentially along the set length direction of the support arm. In application, the number of support arms 20 on the support arm can be increased or decreased for different sizes of grinding pads to lengthen or shorten the length of the support arm. For example, when the landing point assembly 30 does not need to be located at the center of the grinding pad, the length of the support arm can be appropriately shortened to provide more movement space for the grinding head and grinding pad dresser, avoiding interference with the movement of the grinding head and grinding pad dresser due to excessively long support arms. That is, by selecting an appropriate number of support arms 20 to form the support arm, the redundant length of the support arm can be reduced, thereby avoiding the redundant length of the support arm from occupying the usable space above the processing chamber and grinding pad, thus increasing the movement range of the grinding head and grinding pad dresser and increasing the process window.

[0049] The following section provides a detailed description of each of the above structures in conjunction with the accompanying drawings.

[0050] For example, the number of sections of the support arm 20 can be any number of sections, such as two, three, or four, or no fewer than two. At least two support arm sections 20 are connected to each other along the length of the support arm in a detachable manner. Specifically, each support arm 20 has a first end and a second end opposite each other along the length of the support arm. Between two adjacent support arms 20, the first end of one support arm 20 is detachably connected to the second end of the other support arm 20. At least two support arms 20 are connected to each other in the above manner to form a support arm.

[0051] There are various methods that can be used to achieve a detachable connection between two adjacent support arms 20. For example, methods such as, but not limited to, screw fastening and snap-fit ​​can be used. One method is described below as an example.

[0052] For example, refer to Figure 7 The support arm 20 has a first end and a second end positioned opposite each other along its length; wherein, the first end of the support arm 20 is provided with a snap-fit ​​portion 21, and the second end of the support arm 20 is provided with a snap-fit ​​groove 22; (Reference) Figures 1-6 In two adjacent support arms 20, the snap-fit ​​part 21 at the first end of one support arm 20 is inserted into the snap-fit ​​groove 22 at the second end of the other support arm 20.

[0053] The above embodiments have the following beneficial effects: by adopting the plug-in connection structure composed of the snap-fit ​​part 21 and the slot 22, it is convenient to quickly plug and connect the two support arms 20 or to disassemble the two support arms 20. Moreover, the plug-in connection structure composed of the snap-fit ​​part 21 and the slot 22 can improve the reliability and stability of the connection between the two support arms 20.

[0054] For example, refer to Figure 7The insertion direction of the slot 22 can be perpendicular to the grinding pad of the chemical mechanical grinding equipment, and the insertion port of the slot 22 faces away from the grinding pad, that is, the insertion port of the slot 22 is set upward, so that when the two support arms 20 are inserted together, the greater the weight borne by the support arm 20, the better the reliability and stability of the connection between the two support arms 20.

[0055] Of course, in other embodiments, the insertion direction of the slot 22 may be parallel to the grinding pad, and the insertion port of the slot 22 may face the left or right side of the length direction of the support arm.

[0056] For example, the base 10 and the support arm can also be detachably connected to facilitate quick assembly and disassembly. One detachable connection method is described below as an example.

[0057] For example, refer to Figure 10 The base 10 may be provided with a card slot 22, see reference. Figures 1-3 The first end of the support arm 20, which is adjacent to the base 10, has a snap-fit ​​portion 21 that inserts into a slot 22 on the base 10. This facilitates quick connection of the support arm to the base 10.

[0058] The configuration of the card slot 22 can be described in the previous section and will not be repeated here.

[0059] For example, the base 10 can be rotatably connected to a chemical mechanical grinding device, thereby enabling the support arm to rotate or swing. For example, the rotation direction of the base 10 can be set perpendicular to the length direction of the support arm.

[0060] For example, refer to Figures 1-6 , Figure 8 and Figure 9 The support arm also includes a baffle 50, on which a snap-fit ​​part 21 is provided. The snap-fit ​​part 21 on the baffle 50 is inserted into a slot 22 at the second end of the support arm 20 away from the base 10.

[0061] The above embodiment has the following beneficial effects: by providing a baffle 50 at the end of the support arm to block the landing point assembly 30, the landing point assembly 30 can be prevented from sliding out of the support arm. Furthermore, the baffle 50 is provided with a locking part 21, which inserts into a slot 22 at the second end of the support arm 20 away from the base 10. This allows the support arm 20 to be made into a standard part, and the required number of support arms 20 can be determined as needed, and these support arms 20 can be connected to form a support arm. Then, the baffle 50 is inserted into the second end of the support arm 20 away from the base 10 to achieve the function of blocking the landing point assembly 30, thereby simplifying the setup of each structure and the assembly method.

[0062] For example, the snap-fit ​​portion 21 and the slot 22 described above can be configured in any snap-fit ​​manner. For instance, in some embodiments, the snap-fit ​​portion 21 can be a dovetail tenon, and the slot 22 can be a dovetail groove that engages with the dovetail tenon, thereby simplifying the structure of the snap-fit ​​portion 21 and the slot 22 and improving the reliability and stability of their interlocking connection.

[0063] There are several ways to achieve the sliding connection between the landing component 30 and the support arm. Some of these methods are illustrated below.

[0064] For example, refer to Figures 4-7 The support arm 20 has a sliding groove 23 on its side, which extends along the length of the support arm, and the sliding grooves 23 on adjacent support arm sections 20 are mated together. (Reference) Figures 11-13 The landing point assembly 30 includes: a slider 31 slidably mounted on the slide groove 23; a locking mechanism disposed on the slider 31 for locking the slider 31 at a predetermined position in the slide groove 23; and a clamp 32 disposed on the slider 31 for clamping the supply tube 40.

[0065] The above embodiments have the following beneficial effects: By providing a groove 23 on the support arm, and having the grooves 23 on adjacent support arm sections 20 interlock, the slider 31 can slide along the entire length of the support arm, thereby increasing the setting range of the initial landing point of the grinding fluid in the landing point assembly 30. Furthermore, a locking mechanism is provided on the slider 31 to lock it in a predetermined position within the groove 23. After adjusting the initial position of the landing point assembly 30, the locking mechanism can lock the slider 31, preventing it from sliding within the groove 23, thus maintaining the initial landing point of the grinding fluid at the target position.

[0066] There are several ways to set up the locking mechanism, and some examples are introduced below.

[0067] For example, refer to Figures 11-13 The locking mechanism may include: a locking pin 33 slidably mounted in the slider 31, the locking pin 33 having a first end and a second end that are positioned opposite each other; a cam 34 rotatably connected in the slider 31, the first end of the locking pin 33 abutting against the cam 34; wherein, when the proximal point 342 of the cam 34 contacts the first end of the locking pin 33, the second end of the locking pin 33 retracts into the slider 31; when the distal point 341 of the cam 34 contacts the first end of the locking pin 33, the second end of the locking pin 33 abuts against the groove wall of the slide groove 23.

[0068] The above embodiments have the following beneficial effects: By providing a locking pin 33 in the slider 31 that can extend or retract from the slider 31, and by using a cam 34 as a driving mechanism to extend and retract the locking pin 33, rotating the cam 34 causes the proximal point 342 of the cam 34 to contact the first end of the locking pin 33, causing the second end of the locking pin 33 to retract into the slider 31, thus releasing the locking of the slider 31; alternatively, rotating the cam 34 causes the distal point 341 of the cam 34 to contact the first end of the locking pin 33, causing the second end of the locking pin 33 to abut against the groove wall of the slide groove 23, thereby locking the slider 31. This simplifies the structure of the locking mechanism and also simplifies the operation.

[0069] For example, the slider 31 may be provided with a through hole, and the locking pin 33 passes through the through hole, so that it can slide along the extension direction of the through hole.

[0070] For example, refer to Figure 11 The cam 34 can be connected to the slider 31 via a rotating shaft, thereby enabling rotation between the cam 34 and the slider 31. Furthermore, the first end of the locking pin 33 abuts against the cam 34, so that rotating the cam 34 drives the locking pin 33 to extend or retract.

[0071] For example, refer to Figure 11 , Figure 12 and Figure 13 A rotating handle 35 can be fixedly connected to the cam 34. The user can rotate the cam 34 by holding and rotating the rotating handle 35, thereby locking or unlocking the locking mechanism.

[0072] For example, refer to Figure 8 and Figure 11 The slide groove 23 on the support arm can be a dovetail slide groove, and the slider 31 can be a dovetail slider, so that the slider 31 can be limited in the slide groove 23 and prevent the slider 31 from coming out of the slide groove 23.

[0073] For example, refer to Figure 3 , Figure 8 and Figure 11 The extension and retraction direction of the locking pin 33 can be perpendicular to the side wall of the dovetail groove, so that the second end of the locking pin 33 abuts against the side wall of the dovetail groove to lock the slider 31. Of course, in some other embodiments, the extension and retraction direction of the locking pin 33 can be perpendicular to the bottom wall of the dovetail groove, so that the second end of the locking pin 33 abuts against the bottom wall of the dovetail groove, which can also lock the slider 31.

[0074] For example, refer to Figure 1 The slide 23 can be equipped with at least two landing point components 30. Specifically, the number of landing point components 30 that can be set on the slide 23 can be two, three, four, or any number of others.

[0075] The existing supply equipment cannot meet the requirements for scenarios with multiple initial landing points of grinding fluid, and additional modifications are needed, which will increase the workload of equipment engineers.

[0076] The above embodiments of this application have the following beneficial effects: by setting multiple drop point components 30 on the chute 23, more initial drop points for the polishing slurry can be provided, which is conducive to the uniform distribution of the polishing slurry on the polishing pad, thereby improving the polishing effect on the wafer. Moreover, no additional modifications are required; the position of the initial drop point of the polishing slurry can be changed simply by sliding the drop point components 30, thereby reducing the workload of equipment engineers.

[0077] For example, in planarization processes such as, but not limited to, W (tungsten) / Cu (copper), the supply device shown in the embodiments of this application can be used to supply polishing slurry with dual or multiple initial polishing slurry landing points, so that the polishing slurry is evenly distributed on the polishing pad, thereby improving the problem of low polishing rate in the central region of the wafer.

[0078] For example, in planarization processes such as, but not limited to, Cu / Co, a chemical buff cleaner can be added in addition to the polishing slurry to remove polishing residues from the wafer surface and reduce the workload of subsequent cleaning equipment.

[0079] For example, refer to Figure 1 The support arm 20 has a chute 23 on each of its left and right sides, and each chute 23 is equipped with a drop point component 30. This allows for the installation of more drop point components 30, thereby adjusting the initial drop point of the grinding fluid in more ways. Furthermore, the double-sided chute design can meet the application requirements of various types of grinding fluids or cleaning fluids, reducing the workload of equipment engineers.

[0080] It should be noted that the left and right sides of the support arm 20 refer to the opposite sides in the plane parallel to the grinding pad and perpendicular to the length of the support arm.

[0081] For example, refer to Figure 8 The support arm 20 can be configured with a cross-sectional shape similar to the "I" shape. A dovetail groove is formed on the left and right sides of the support arm 20, thereby setting a groove 23 on each side of the support arm 20 to simplify the structure of the support arm 20.

[0082] For example, when there are multiple landing point components 30, there can also be multiple supply pipes 40, with each landing point component 30 connected to one supply pipe 40. The types of polishing slurry transported in different supply pipes 40 can be the same or different. Compared with the related art, which has limited adjustment space for multiple supply pipes 40 and multiple polishing slurries at the initial landing point, in the above embodiment of this application, there are multiple landing point components 30, which are slidably assembled on two sliding grooves 23 on the left and right sides. Different landing point components 30 can be connected to different supply pipes 40, thereby facilitating the adjustment of multiple supply pipes 40 and multiple polishing slurries at the initial landing point.

[0083] For example, when there are multiple landing point components 30, the number of supply pipes 40 can be one, but the supply pipe 40 can be divided to form multiple liquid outlets 41, and each landing point component 30 is connected to one of the liquid outlets 41 of the supply pipe 40, so that multiple landing point components 30 output the same type of grinding fluid.

[0084] For example, refer to Figures 1-3 , Figure 14 and Figure 15 The supply device may also include: a cleaning fluid supply pipe 70, and a spray device 60 disposed below the support arm 20 and connected to the cleaning fluid supply pipe 70. The spray device 60 includes at least one nozzle 61, which is inclined downward.

[0085] Existing supply units are equipped with high-pressure flushing devices (HPR), but the existing HPR is designed for vertical flushing. When flushing with high flow rates, water accumulates under the support arm, resulting in poor flushing performance.

[0086] The above-described embodiments of this application have the following beneficial effects: By providing a spray device 60 connected to the cleaning fluid supply pipe 70 below the support arm 20, the supply device can output cleaning fluid, which helps to improve integration. Furthermore, the nozzle 61 in the spray device 60 is tilted downwards, meaning the nozzle 61 is not vertically positioned relative to the grinding pad, thus preventing water accumulation below the support arm and improving the cleaning effect on the grinding pad.

[0087] There are various ways to achieve the downward tilt of the nozzle 61. For example, the nozzle 61 can be positioned at an acute angle to the abrasive pad of the chemical mechanical polishing apparatus. For instance, the angle between the orientation of the nozzle 61 and the abrasive pad of the chemical mechanical polishing apparatus can be any acute angle such as 35°, 45°, 55°, 65°, or 75°.

[0088] For example, refer to Figures 1-3 Each support arm 20 can be equipped with a spray device 60 below it.

[0089] For example, refer to Figures 1-3 The spray device 60 also includes a spray communication cavity (not shown in the figure) that is connected to the nozzle 61; wherein, the spray communication cavity in the spray device 60 adjacent to the base 10 is connected to the cleaning liquid supply pipe 70, and the spray communication cavities of two adjacent spray devices 60 are connected.

[0090] The above embodiments have the following beneficial effects: by providing a spray device 60 under each support arm 20, and the spray communication cavity in the spray device 60 adjacent to the base 10 can be directly connected to the cleaning liquid supply pipe 70, while in the other spray devices 60, the spray communication cavities of two adjacent spray devices 60 are connected, thus eliminating the need to directly connect the cleaning liquid supply pipe 70 to all spray devices 60, simplifying the connection difficulty of the cleaning liquid supply pipe 70.

[0091] For example, refer to Figure 8 A snap-fit ​​groove 24 can be provided below the support arm 20, for reference. Figure 14 A locking block 62 can be provided above the spray device 60. The locking block 62 of the spray device 60 is engaged in the locking groove 24 of the support arm 20, thereby realizing the detachable connection between the support arm 20 and the spray device 60.

[0092] For example, refer to Figure 1 , Figure 4 , Figure 5 , Figure 16 and Figure 17 The support arm is provided with multiple positioning scales distributed along the length of the support arm, and the landing point component 30 can move to the position corresponding to any positioning scale.

[0093] The current method of adjusting the initial landing point of the polishing slurry requires the use of a scale plate. The initial landing point of the polishing slurry needs to be selected by rotating the cantilever angle, and then the base screws can be fixed. However, since the scale plate needs to be in direct contact with the polishing pad, the risk of contamination of the polishing pad is increased.

[0094] In the embodiments described above, when the liquid outlet 41 of the supply tube 40 is fixed in a predetermined position, the liquid outlet 41 of the supply tube 40 can be moved to the predetermined position by means of the positioning scale sliding landing point assembly 30 on the top surface of the support arm, thereby accurately adjusting the position of the initial landing point of the grinding slurry to the predetermined position. Furthermore, it eliminates the need for a scale plate, thus reducing the risk of contamination of the grinding pad.

[0095] For example, the aforementioned positioning scale can be set on the top surface of the support arm for easy observation by the user.

[0096] For example, refer to Figure 11 , Figure 16 and Figure 17 The top of the landing point component 30 is provided with a positioning scale groove 36, which is perpendicular to the arrangement direction of multiple positioning scales and aligned with the axis of the liquid outlet 41.

[0097] The above embodiments have the following beneficial effects: When the liquid outlet 41 of the supply pipe 40 is moved to the predetermined position, the positioning scale on the top surface of the support arm and the positioning scale groove 36 on the top of the landing point assembly 30 can be used to slide the landing point assembly 30, so that the positioning scale groove 36 on the top of the landing point assembly 30 is aligned with the predetermined position of the positioning scale, thereby accurately adjusting the initial landing point of the grinding liquid to the predetermined position. Furthermore, a scale plate is not required, thus reducing the risk of contamination of the grinding pad.

[0098] For example, refer to Figure 1 , Figure 6 and Figure 16 The liquid outlet 41 of the supply pipe 40 faces the surface of the grinding pad and is vertically downward, that is, the extension direction of the axis of the liquid outlet 41 of the supply pipe 40 is vertical, and the positioning scale groove 36 is aligned with the axis of the liquid outlet 41 of the supply pipe 40.

[0099] For example, refer to Figure 1 , Figure 4 and Figure 5 When the support arm 20 is provided with sliding grooves 23 on both the left and right sides, a row of positioning scales can be set on each of the left and right sides of the top surface of the support arm to accurately position the initial landing position of the grinding fluid of the landing component 30 on different sliding grooves 23.

[0100] For example, when adjusting the initial landing point of the polishing slurry, the base 10 can be rotated so that the length direction of the support arm is parallel to the radial direction of the polishing pad. The initial landing point of the polishing slurry can be precisely adjusted by using the positioning scale on the support arm and the positioning scale groove 36 on the landing point assembly 30. This allows for free adjustment of the initial landing point of the polishing slurry, and the adjustment process does not require the use of a scale plate, reducing the problem of initial landing point deviation caused by scale plate error. It also avoids contact between the scale plate and the polishing pad, which could cause contamination of the polishing pad.

[0101] In addition, this application also provides a chemical mechanical polishing (CMP) apparatus, which includes: a rotatable polishing table, a polishing pad disposed on the polishing table, a polishing head located above the polishing pad and used to press the wafer against the polishing pad, and any one of the above-mentioned supply devices. Thus, when the polishing table rotates the polishing pad, the wafer pressed against the polishing pad can be polished.

[0102] For example, a chemical mechanical grinding apparatus may also include a grinding pad dresser for dressing the grinding pad to maintain its grinding capability in good condition.

[0103] This application has been described through the above embodiments. However, it should be understood that the above embodiments are for illustrative purposes only and are not intended to limit this application to the scope of the described embodiments. Furthermore, those skilled in the art will understand that this application is not limited to the above embodiments, and many more variations and modifications can be made based on the teachings of this application, all of which fall within the scope of protection claimed in this application. The scope of protection of this application is defined by the appended claims and their equivalents.

Claims

1. A supply device, characterized in that, Applications in chemical mechanical grinding equipment, including: Base; A support arm connected to the base, the support arm having a predetermined length direction, the support arm comprising multiple sections; the multiple sections of the support arm are detachably connected in sequence; The supply pipe has an outlet end for spraying liquid; A landing assembly is slidably mounted on the support arm, the supply pipe is connected to the landing assembly, and the landing assembly can slide along the length direction to move the liquid outlet to a predetermined position.

2. The supply device as claimed in claim 1, characterized in that, The support arm is provided with a plurality of positioning scales distributed along the length direction, and the landing point component can be moved to a position corresponding to any of the positioning scales.

3. The supply device as described in claim 2, characterized in that, The top of the landing point component is provided with a positioning scale groove, which is perpendicular to the arrangement direction of the plurality of positioning scales and aligned with the center line of the liquid outlet end.

4. The supply device as claimed in claim 1, characterized in that, The arm has a first end and a second end that are positioned opposite each other along the length direction; The first end of the support arm is provided with a snap-fit ​​part, and the second end of the support arm is provided with a snap-fit ​​groove; In two adjacent support arms, the snap-fit ​​portion of the first end of one support arm is inserted into the snap-fit ​​groove of the second end of the other support arm.

5. The supply device as described in claim 4, characterized in that, The base is provided with a slot, and the first end of the support arm adjacent to the base is inserted into the slot on the base. The support arm also includes a baffle, which has a snap-fit ​​part that is inserted into a slot at the second end of the support arm away from the base.

6. The supply device as claimed in claim 1, characterized in that, The side of the support arm is provided with a sliding groove, which extends along the length direction and the sliding grooves on two adjacent sections of the support arm are connected. The landing point component includes: A slider that is slidably mounted on the slide groove; A locking mechanism is provided on the slider, the locking mechanism being used to lock the slider at the predetermined position in the slide groove; A clamp disposed on the slider and used to hold the supply tube.

7. The supply device as claimed in claim 6, characterized in that, The locking mechanism includes: A locking pin is slidably fitted into the slider, the locking pin having a first end and a second end that are positioned opposite each other; Rotate the cam connected in the slider, and the first end of the locking pin abuts against the cam; Specifically, when the near rest point of the cam contacts the first end of the locking pin, the second end of the locking pin retracts into the slider; when the far rest point of the cam contacts the first end of the locking pin, the second end of the locking pin abuts against the groove wall of the slide.

8. The supply device as claimed in claim 1, characterized in that, Also includes: Cleaning fluid supply tubing; A spray device is disposed below the support arm and connected to the cleaning fluid supply pipe. The spray device includes at least one nozzle, which is inclined downward.

9. The supply device as claimed in claim 8, characterized in that, The spraying device further includes: a spraying communication cavity communicating with the spray head; The spray communication chamber in the spray device adjacent to the base is connected to the cleaning liquid supply pipe, and the spray communication chambers in two adjacent spray devices are connected.

10. A chemical mechanical grinding apparatus, characterized in that, include: Rotatable grinding table; A grinding pad disposed on the grinding table; A polishing head located above the polishing pad and used to press the wafer against the polishing pad; and, The supply device as described in any one of claims 1 to 9.

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