Mask strip

Abstract

According to an embodiment, a mask strip includes: an opening region having a plurality of through holes; and a non-porous partial region surrounding the open region, the non-porous partial region including a recessed portion having a length in a first direction longer than a length in a second direction crossing the first direction and aligned with the open region along the second direction.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a mask strip. BACKGROUND

[0002] In manufacturing a display device, a mask strip for deposition can be used. In a deposition process for forming a light emitting layer, an electrode layer, etc. on a substrate, a metal mask strip such as a fine metal mask, an open mask can be used. SUMMARY

[0003] TECHNICAL PROBLEM

[0004] An embodiment is to provide a mask strip capable of effectively correcting a design error occurring in an opening region including a via, and a manufacturing method of a display device using the same.

[0005] TECHNICAL SOLUTION

[0006] A mask strip according to an embodiment includes an opening region having a plurality of vias, and a non-via portion region surrounding the opening region, the non-via portion region including a recessed portion having a length in a first direction longer than a length in a second direction crossing the first direction, and arranged along the second direction with the opening region.

[0007] A mask strip according to an embodiment includes a plurality of opening regions having a plurality of vias, and a non-via portion region surrounding the plurality of opening regions, the non-via portion region including a first recessed portion having a length in a first direction longer than a length in a second direction crossing the first direction, and arranged along the second direction with the plurality of opening regions.

[0008] The plurality of opening regions can be arranged along the first direction.

[0009] The first recessed portion can extend along the first direction by a maximum length in the first direction between a boundary of the opening region and the non-via portion region.

[0010] The non-via portion region can further include a second recessed portion arranged along the first direction with the first recessed portion.

[0011] The first recessed portion and the second recessed portion can have the same length in the first direction as each other.

[0012] The non-via portion region can further include a third recessed portion arranged along the first direction with the first recessed portion and the second recessed portion.

[0013] The length of at least some of the first recessed portions, the second recessed portions, and the third recessed portions in the first direction can be different from each other.

[0014] The length of at least some of the first recessed portions, the second recessed portions, and the third recessed portions in the first direction can be the same as each other.

[0015] The second recessed portion can be located between the first recessed portion and the third recessed portion, and the length of the second recessed portion in the first direction can be longer than the length of the first recessed portion or the third recessed portion in the first direction.

[0016] The length of the second recessed portion in the first direction can be more than one fifth of the maximum length in the first direction between the boundary of the open area and the non-hole portion area.

[0017] The length of the first recessed portion or the third recessed portion in the first direction can be less than one fifth of the maximum length in the first direction between the boundary of the open area and the non-hole portion area.

[0018] A method of manufacturing a display device according to an embodiment includes a step of preparing a mask strip including a plurality of open areas having a plurality of through-holes and a non-hole portion area surrounding the plurality of open areas, the non-hole portion area including a first recessed portion having a length in a first direction longer than a length in a second direction intersecting the first direction and arranged along the second direction with the plurality of open areas, a step of connecting the mask strip and a frame to manufacture a mask assembly, and a step of depositing a deposition material on a substrate using the mask assembly.

[0019] The mask strip can further include a second recessed portion arranged along the first direction with the first recessed portion.

[0020] The mask strip can further include a third recessed portion arranged along the first direction with the first recessed portion and the second recessed portion.

[0021] The method of manufacturing the display device can further include a step of applying heat to the non-hole portion area to correct a design error of the mask strip.

[0022] The method of manufacturing the display device can further include a step of applying heat to the first recessed portion to correct a design error of the mask strip.

[0023] The method of manufacturing the display device can further include a step of applying heat to the non-hole portion area having a thickness thicker than a thickness of the first recessed portion to correct a design error of the mask strip.

[0024] Advantageous Effects

[0025] According to embodiments, a mask strip capable of effectively correcting a design error occurring in an opening area and a manufacturing method of a display device using the same can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 FIG. 1 is a diagram illustrating a deposition process using a mask assembly including a mask strip according to an embodiment.

[0027] Figure 2 FIG. 3 is a diagram illustrating a mask strip in which a design error occurs in an opening area including a via.

[0028] Figure 3 FIG. 5 is a diagram illustrating a mask strip according to an embodiment.

[0029] Figure 4 FIG. 7 is a cross-sectional view of a mask strip taken along the IV-IV' line of FIG. 6. Figure 3

[0030] Figure 5 FIG. 11 is a diagram illustrating a design error of an opening area included in a mask strip according to an embodiment.

[0031] Figure 6 FIG. 13 is a diagram illustrating a heating portion included in a mask strip according to an embodiment.

[0032] Figure 7 FIG. 15 is a diagram illustrating a design error of an opening area included in a mask strip according to an embodiment, which is corrected.

[0033] Figure 8 FIG. 17 is a diagram illustrating a design error of an opening area included in a mask strip according to an embodiment.

[0034] Figure 9 FIG. 19 is a diagram illustrating a heating portion included in a mask strip according to an embodiment.

[0035] Figure 10 FIG. 21 is a diagram illustrating a design error of an opening area included in a mask strip according to an embodiment, which is corrected.

[0036] Figure 11 FIG. 23 is a diagram illustrating a mask strip according to an embodiment.

[0037] Figure 12 FIG. 25 is a diagram illustrating a mask strip according to an embodiment.

[0038] Figure 13 FIG. 27 is a cross-sectional view schematically illustrating a stacked structure of a display panel. ​

[0039] Figure 14 is a flowchart illustrating a method of manufacturing a display device using a mask strip.

[0040] Figure 15 is a flowchart illustrating a method of manufacturing a display device using a mask strip.

[0041] Reference Signs Description

[0042] 1: mask assembly 10: mask strip

[0043] 20: frame 100: open area

[0044] 110: through-hole 200: non-hole portion area

[0045] 300: recessed portion 300a: first recessed portion

[0046] 300b: second recessed portion 300c: third recessed portion DETAILED DESCRIPTION

[0047] Hereinafter, various embodiments of the present disclosure are described in detail with reference to the accompanying drawings so that those skilled in the art to which the present disclosure pertains can easily practice the present disclosure. The present disclosure can be implemented in various different forms and is not limited to the embodiments described herein.

[0048] In order to clearly describe the present disclosure, portions unrelated to the description are omitted, and the same reference numerals are assigned to the same or similar constituent elements throughout the specification.

[0049] Further, the size and thickness of each structure shown in the drawings are arbitrarily shown for the convenience of description, and thus the present disclosure is not necessarily limited to the drawings. In the drawings, the thicknesses are exaggerated for the sake of clarity. And in the drawings, the thicknesses of some layers and regions are exaggerated for the convenience of description.

[0050] Further, when described as a portion such as a layer, a film, a region, a plate, etc. being "on" or "above" another portion, it includes not only a case of "directly on" the other portion, but also a case with another portion therebetween. Conversely, when described as a portion "directly on" another portion, it means that there is no other portion therebetween. Further, when described as "on" or "above" a portion serving as a reference, it means above or below the portion serving as a reference, and does not necessarily mean "on" or "above" on the side opposite to the direction of gravity.

[0051] Further, throughout the specification, when described as a portion "including" any constituent element, it means that other constituent elements can also be included, unless specifically noted to the contrary, rather than excluding other constituent elements.

[0052] Further, throughout the specification, when described as "on a plane", it means a case when viewed from the top of the target portion, and when described as "on a cross section", it means a case when viewed from the side of a cross section of the target portion cut perpendicularly.

[0053] In manufacturing a display device, a mask bar for deposition can be utilized. The display device can include a display panel having a light emitting layer or the like on a substrate. The mask bar can be connected with a frame to form a mask assembly. In a deposition process for forming a light emitting layer or the like on a substrate, a metal mask bar such as a fine metal mask, an open mask can be used.

[0054] For example, a substrate on which a light emitting layer is to be formed can be aligned on a mask assembly formed with a predetermined open area, and a deposition material can be passed through a through-hole of the mask assembly, thereby forming a light emitting layer on the substrate.

[0055] Figure 1 FIG. 1 is a diagram illustrating a deposition process using a mask assembly including a mask bar according to an embodiment.

[0056] Figure 1 A mask assembly 1 (10, 20), a substrate SB, a deposition source 3, and a chamber 4 are illustrated. The mask assembly 1 can include a mask bar 10 and a frame 20.

[0057] If the deposition source 3 sprays a deposition material in the chamber 4, the deposition material passes through the mask assembly 1 and is deposited to the substrate SB while forming a thin film of a predetermined pattern.

[0058] The open area of the mask bar 10 can be designed to match a display device to be manufactured. The design of the open area can determine the shape, size, and arrangement of the open area according to the type, size, and number of the display device to be manufactured in the substrate SB.

[0059] The shape, size, and arrangement of the open area of the mask bar 10 are designed according to the type, size, and number of the display device to be manufactured in the substrate SB, but a design error can occur in the open area in a process of manufacturing the mask bar 10. The design error of the open area can mean that the shape, size, or arrangement of the open area is formed differently from the intention. For example, the mask bar 10 including the open area having a size greater than the size of the open area designed can be manufactured. Further, the mask bar 10 including the open area having a size smaller than the size of the open area designed can be manufactured.

[0060] Figure 2 FIG. 2 is a diagram illustrating a mask bar in which a design error occurs in an open area including a through-hole.

[0061] Figure 2 The mask bar 10 illustrated in FIG. 1 includes a plurality of open regions 100 and a non-hole portion region 200. The open region 100 includes a plurality of through-holes 110. The non-hole portion region 200 can include a clamp portion 210.

[0062] Figure 2 The open region 100 is illustrated in a quadrangular shape. However, in other examples, the shape of the open region 100 can be freely changed according to the shape of the display device to be manufactured in the substrate SB. For example, the shape of the open region 100 can be a circular shape or an elliptical shape. Figure 2 The mask bar 10 is illustrated as including three open regions 100. However, in other examples, the number of open regions 100 can be freely changed. For example, the number of open regions 100 included in the mask bar 10 can be 1, 2, or 4 or more.

[0063] The open region 100 includes a plurality of through-holes 110. The deposition substance can be deposited to the substrate SB through the through-holes 110. Figure 2 The size of the plurality of through-holes 110 illustrated in FIG. 1 can be exaggeratedly illustrated. The size and number of the through-holes 110 can not be limited. Figure 2 The through-holes 110 are illustrated in a quadrangular shape. However, in other examples, the shape of the through-holes 110 can be freely changed. For example, the shape of the through-holes 110 can be a circular or hexagonal shape.

[0064] The non-hole portion region 200 surrounds the open region 100 and does not include a through-hole. The non-hole portion region 200 can not pass the deposition substance in the deposition process. The deposition substance cannot pass through the non-hole portion region 200, and only the deposition substance passing through the open region 100 can be deposited to the substrate SB. The deposition substance passing through the open region 100 can be deposited on the substrate SB in a shape corresponding to the shape of the open region 100.

[0065] The mask bar 10 can extend in a first direction D1. The first direction D1 can be a length direction of the mask bar 10. The mask bar 10 can extend in a second direction D2 crossing the first direction D1. The second direction D2 can be a width direction of the mask bar 10. The length of the mask bar 10 in the first direction D1 can be longer than the length in the second direction D2. The endmost portion 201 of the mask bar 10 in the first direction D1 can be the non-hole portion region 200. The clamp portion 210 can be formed at the endmost portion 201 of the mask bar 10 in the first direction D1 which is the non-hole portion region 200. The mask bar 10 and the frame 20 can be connected with the clamp portion 210. The connected mask bar 10 and the frame 20 can form the mask assembly 1. For example, the clamp portion 210 of the mask bar 10 and the frame 20 can be welded with a welding apparatus to be connected.

[0066] The non-hole partial region 200 can extend in a first direction D1. The first direction D1 can be a length direction of the non-hole partial region 200. The non-hole partial region 200 can extend in a second direction D2 crossing the first direction D1. The second direction D2 can be a width direction of the non-hole partial region 200. The length of the non-hole partial region 200 in the first direction D1 can be longer than the length in the second direction D2.

[0067] Figure 2 A plurality of open regions 100 (100a, 100b, 100c) arranged along the first direction D1 is shown. The plurality of open regions 100 can be arranged along the first direction D1. The plurality of open regions 100 can be distinguished as a first open region 100a, a second open region 100b, and a third open region 100c. In Figure 2 In the first open region 100a is an open region located at the uppermost side, the second open region 100b is an open region located below the first open region 100a, and the third open region 100c is an open region located below the second open region 100b and at the lowermost side. That is, the first open region 100a, the second open region 100b, and the third open region 100c are arranged along the first direction D1. The second open region 100b is located between the first open region 100a and the third open region 100c.

[0068] Figure 2 The mask strip 10 shown in the first open region 100a is an open region located at the uppermost side, the second open region 100b is an open region located below the first open region 100a, and the third open region 100c is an open region located below the second open region 100b and at the lowermost side. That is, the first open region 100a, the second open region 100b, and the third open region 100c are arranged along the first direction D1. The second open region 100b is located between the first open region 100a and the third open region 100c. Figure 2 The open regions 100 shown in the first open region 100a are designed to have the same size and shape. In other words, the open regions 100 are designed to have the same length in the second direction D2 crossing the first direction D1. The second direction D2 can be a width direction of the mask strip 10. Figure 2 The mask strip 10 shown in the first open region 100a is an open region located at the uppermost side, the second open region 100b is an open region located below the first open region 100a, and the third open region 100c is an open region located below the second open region 100b and at the lowermost side. That is, the first open region 100a, the second open region 100b, and the third open region 100c are arranged along the first direction D1. The second open region 100b is located between the first open region 100a and the third open region 100c.

[0069] Figure 2 The dashed line 120 shown in the first open region 100a schematically shows the length of the open region 100 in the second direction D2 along the position in the first direction D1 of the mask strip 10. The length of the designed open region 100 in the second direction D2 is constant along the position in the first direction D1 of the mask strip 10. However, Figure 2 The length of the second open region 100b in the second direction D2 shown in the first open region 100a is formed to be longer than the length of the other open regions 100a, 100c. Therefore, Figure 2 The dashed line 120 has a shape in which the middle portion is convex.

[0070] When the opening region 100 having a design error is used for deposition, a deposition material can not be accurately deposited to an originally intended position of the substrate SB. Accordingly, a defect of a display device can occur. Thus, the mask strip 10 in which the design error occurs in the opening region 100 needs to be discarded. However, it can not be economically or timely preferable to discard all of the mask strips 10 in which the design error occurs in the opening region 100 and to newly manufacture the mask strips 10. Accordingly, the disclosure will provide a mask strip 10 capable of properly correcting the opening region 100 in which a design error occurs.

[0071] Figure 3 FIG. 1 is a view illustrating a mask strip according to an embodiment.

[0072] Figure 3 A mask strip 10 according to an embodiment is illustrated, which includes recessed portions 300 (300a, 300b, 300c) to correct a design error of an opening region 100. The recessed portions 300 can be classified into a first recessed portion 300a, a second recessed portion 300b, and a third recessed portion 300c. The second recessed portion 300b can be arranged along a first direction D1 with the first recessed portion 300a. The third recessed portion 300c can be arranged along the first direction D1 with the first recessed portion 300a and the second recessed portion 300b. The second recessed portion 300b can be located between the first recessed portion 300a and the third recessed portion 300c.

[0073] The recessed portions 300 are arranged along a second direction D2 crossing the first direction D1 with the opening region 100, and are located in a non-hole portion region 200. The non-hole portion region 200 can include the recessed portions 300 arranged along the second direction D2 with the plurality of opening regions 100. For example, the non-hole portion region 200 can include the first recessed portion 300a arranged along the second direction D2 with the first opening region 100a. Also, the non-hole portion region 200 can include the second recessed portion 300b arranged along the second direction D2 with the second opening region 100b. Also, the non-hole portion region 200 can include the third recessed portion 300c arranged along the second direction D2 with the third opening region 100c. The first direction D1 can be a length direction of the mask strip 10, and the second direction D2 crossing the first direction D1 can be a width direction of the mask strip 10. Also, the first direction D1 can be a length direction of the non-hole portion region 200, and the second direction D2 crossing the first direction D1 can be a width direction of the non-hole portion region 200. Also, a length in the first direction D1 of the non-hole portion region 200 can be longer than a length in the second direction D2.

[0074] The thickness of the recessed portion 300 is thinner than that of the adjacent non-hole portion region 200. The thickness can mean a length in a third direction perpendicular to the first direction D1 and the second direction D2, respectively. The recessed portion 300 can be formed together with the through-hole 110 in a process of forming the through-hole 110 of the mask strip 10. For example, the through-hole 110 can be formed by etching both sides of the mask strip 10, and the recessed portion 300 can be formed by etching only one side of the mask strip 10. Since both sides are etched, the through-hole 110 can be formed to penetrate the mask strip 10, and the recessed portion 300 etched only on one side can be only thinner in thickness compared to the surrounding non-hole portion region 200, and can not be formed as a hole penetrating the mask strip 10. Details regarding the shape of the recessed portion 300 will be described in detail in Figure 4

[0075] The number of the recessed portions 300 is not limited. It can be preferable that the recessed portions 300 are a plurality. The plurality of recessed portions 300 can be arranged in the first direction D1. Each of the recessed portions 300 can be a shape extending in the first direction D1. The plurality of recessed portions 300 can be located above the non-hole portion region 200 in a center of the opening region 100. The length of the plurality of recessed portions 300 arranged in one direction in the first direction D1 can be different from each other. For example, the length of at least some of the first recessed portion 300a, the second recessed portion 300b, and the third recessed portion 300c in the first direction D1 can be different from each other. Also, the length of some of the plurality of recessed portions 300 in the first direction D1 can be the same as each other. For example, the length of at least some of the first recessed portion 300a, the second recessed portion 300b, and the third recessed portion 300c in the first direction D1 can be the same. In the drawing showing the mask strip 10 according to an embodiment, Figure 3 In the drawing showing the mask strip 10 according to an embodiment, the second recessed portion 300b is located between the first recessed portion 300a and the third recessed portion 300c, and the length of the second recessed portion 300b in the first direction D1 is longer than that of the first recessed portion 300a or the third recessed portion 300c. Also, the recessed portion 300 can extend in the first direction D1 by a maximum length LT in the first direction D1 between the opening region 100 and the boundary 150 of the non-hole portion region 200. The recessed portion 300 extending in the first direction D1 can more easily correct a design error occurring in the opening region 100. This is because, when the same amount of heat is applied to the mask strip 10, the contraction of the metal can occur greater in a portion having a thin thickness than in a portion having a thick thickness, and if the recessed portion 300 extends, the portion having a thin thickness can be increased.

[0076] ​The boundary 150 between the opening area 100 and the non-hole portion area 200 can be any portion where the opening area 100 and the non-hole portion area 200 contact. For example, the boundary 150 between the opening area 100 and the non-hole portion area 200 can be any point between the opening area 100 and the non-hole portion area 200. Alternatively, the boundary 150 between the opening area 100 and the non-hole portion area 200 can be any line between the opening area 100 and the non-hole portion area 200. Since the opening area 100 is surrounded by the non-hole portion area 200, the boundary 150 between the opening area 100 and the non-hole portion area 200 can coincide with the shape of the opening area 100.

[0077] Figure 3 A maximum length LT in the first direction D1 between the boundary 150 of the opening area 100 and the non-hole portion area 200 is shown. This is a virtual line for explaining the characteristics of the mask strip 10 according to an embodiment. The maximum length LT in the first direction D1 between the boundary 150 of the opening area 100 and the non-hole portion area 200 can mean the maximum length among the lengths in the first direction D1 between the boundaries 150 of the opening area 100 and the non-hole portion area 200 that are different from each other.

[0078] The length of some of the plurality of recessed portions 300 in the first direction D1 can be more than one fifth of the maximum length LT in the first direction D1 between the boundary 150 of the opening area 100 and the non-hole portion area 200. Figure 3 The length of the second recessed portion 300b in the first direction D1 is more than one fifth of the maximum length LT in the first direction D1 between the boundary 150 of the opening area 100 and the non-hole portion area 200. In addition, the length of some of the plurality of recessed portions 300 in the first direction D1 can be less than one fifth of the maximum length LT in the first direction D1 between the boundary 150 of the opening area 100 and the non-hole portion area 200. Figure 3 The lengths of the first recessed portion 300a and the third recessed portion 300c in the first direction D1 are less than one fifth of the maximum length LT in the first direction D1 between the boundary 150 of the opening area 100 and the non-hole portion area 200.

[0079] To correct the design error of the opening region 100 of the mask strip 10 excellently, the recessed portions 300 having a relatively long length in the first direction D1 among the plurality of recessed portions 300 arranged in the first direction D1 can be disposed between the recessed portions 300 having a relatively short length in the first direction D1. For example, the recessed portions 300 having a length in the first direction D1 that is more than one fifth of the maximum length LT in the first direction D1 between the boundary 150 of the opening region 100 and the non-hole portion region 200 among the plurality of recessed portions 300 can be located between the recessed portions 300 having a length in the first direction D1 that is less than one fifth of the maximum length LT in the first direction D1 between the boundary 150 of the opening region 100 and the non-hole portion region 200. This can be the optimal arrangement when heat is applied to the mask strip 10 to correct the design error occurring in the opening region 100, in which correction of the opening region 100 can be performed appropriately while maintaining the characteristics of the non-hole portion region 200. The optimal arrangement in which correction of the opening region 100 can be performed more appropriately while maintaining the characteristics of the non-hole portion region 200 can be that the recessed portions 300 having a length in the first direction D1 that is more than one fifth of the maximum length LT in the first direction D1 between the boundary 150 of the opening region 100 and the non-hole portion region 200 among the plurality of recessed portions 300 are located between the recessed portions 300 having a length in the first direction D1 that is less than one fifth of the maximum length LT in the first direction D1 between the boundary 150 of the opening region 100 and the non-hole portion region 200. The more excellent optimal arrangement in which correction of the opening region 100 can be performed more appropriately while maintaining the characteristics of the non-hole portion region 200 can be that the recessed portions 300 having a length in the first direction D1 that is one third of the maximum length LT in the first direction D1 between the boundary 150 of the opening region 100 and the non-hole portion region 200 among the plurality of recessed portions 300 are located between the recessed portions 300 having a length in the first direction D1 that is one tenth of the maximum length LT in the first direction D1 between the boundary 150 of the opening region 100 and the non-hole portion region 200.

[0080] The characteristic of the non-porous portion region 200 can mean a property of not passing the deposition material in the deposition process. The non-porous portion region 200 generally does not pass the deposition material since it does not include a through-hole, but when the thickness of a portion of the non-porous portion region 200 is too thin, the deposition material can pass through the non-porous portion region 200, so that the characteristic of the non-porous portion region 200 can not be maintained. Also, even if the portion of the non-porous portion region 200 in which the thickness is thin is widely distributed in the non-porous portion region 200, it is possible that the deposition material passes through the non-porous portion region 200, so that the characteristic of the non-porous portion region 200 can not be maintained. When the characteristic of the non-porous portion region 200 is not maintained, the deposition material can be deposited at an unintended position above the substrate SB in the deposition process. Therefore, it is necessary to appropriately adjust the thickness of the non-porous portion region 200 or appropriately determine the position of the recessed portion 300 to maintain the characteristic of the non-porous portion region 200.

[0081] The reason why the mask strip 10 according to an embodiment includes the recessed portion 300 to be able to correct the design error occurring in the opening region 100 excellently will be described.

[0082] When the opening region 100 of the mask strip 10 has a design error, a certain region of the mask strip 10 can be shrunk or expanded to change the shape of the opening region 100. For example, heat can be applied to a certain region of the mask strip 10 to cause deformation of the mask strip 10. The certain portion of the mask strip 10 to which heat is applied is temporarily expanded during heating, but if the heat is not applied any more, it is cooled and shrunk. In this case, since stress is generated at the welding site as the molecular structure of the metal constituting the mask strip 10 is rearranged, the certain portion of the mask strip 10 to which heat is not applied any more can be further shrunk than the original shape. Thus, correction of the opening region 100 in which a design error has occurred can be performed using the principle that if heat is applied to a certain portion of the mask strip 10, the mask strip 10 can be shrunk more than the original size. However, generally, the mask strip 10 uses a material such as Invar that has a low coefficient of thermal expansion. Therefore, even if heat is applied to the mask strip 10, it can be difficult to deform the heated portion to the extent of correcting the design error of the opening region 100. Therefore, the present disclosure includes the recessed portion 300 in a portion of the mask strip 10, so that the design error of the opening region 100 can be corrected excellently.

[0083] The recessed portions 300 are arranged in the non-hole portion area 200 of the mask bar 10, so that correction of a design error of the opening area 100 can be excellent. The recessed portions 300 can be arranged along the second direction D2 with the opening area 100 and be located in the non-hole portion area 200. The recessed portions 300 can be located in the non-hole portion area 200 between the end portion 202 in the second direction D2 and the opening area 100. In addition, the thickness of the recessed portions 300 is thinner than the thickness of the adjacent non-hole portion area 200. Since the recessed portions 300 are thin in thickness and include less material than the surrounding non-hole portion area 200, they can react more sensitively to applied heat. For example, when the heat applied to the non-hole portion area 200 not formed with the recessed portions 300 is the same as the heat applied to the recessed portions 300, greater deformation can occur in the recessed portions 300. That is, the mask bar 10 of the present disclosure includes the recessed portions 300, so that correction by heat can be performed more excellently.

[0084] The mask bar 10 and the frame 20 can be formed into the mask assembly 1 by receiving heat from a welding device. The heat applied to the recessed portions 300 is using an existing device such as a welding apparatus, so that no additional device is required. Therefore, the recessed portions 300 are arranged in the non-hole portion area 200 of the mask bar 10, so that a design error of the opening area 100 can be easily corrected without an additional device.

[0085] Figure 4 is a cross-sectional view of the mask bar taken along the IV-IV' line of Figure 3

[0086] Figure 4 A cross-sectional view of the non-hole portion area 200 and the second opening area 100b included in the mask bar 10 is shown. The non-hole portion area 200 includes the second recessed portion 300b, and the second opening area 100b includes a plurality of through holes 110. The non-hole portion area 200, the second opening area 100b, the second recessed portion 300b, and the through holes 110 included in the mask bar 10 according to an embodiment shown in Figure 4 The sizes and shapes of the non-hole portion area 200, the second opening area 100b, the second recessed portion 300b, and the through holes 110 in the mask bar 10 according to an embodiment shown in

[0087] ​The recessed portion 300 can be located in the non-hole portion region 200 and is a shape recessed along a third direction D3 crossing the first direction D1 and the second direction D2, respectively. The thickness of the recessed portion 300 can be thinner than the thickness of the non-hole portion region 200 surrounding the recessed portion 300. For example, the thickness of the recessed portion 300 can be half of the thickness of the non-hole portion region 200 surrounding the recessed portion 300.

[0088] The plurality of through holes 110 can form the opening region 100. The deposition substance can pass through the through holes 110. The through holes 110 can be holes of a certain shape in the opening region 100. Each of the through holes 110 can correspond to each of the pixels in the substrate SB.

[0089] Figure 5 FIG. 1 is a diagram illustrating a design error of an opening region included in a mask strip according to an embodiment.

[0090] Figure 5 The mask strip 10 according to an embodiment illustrated in FIG. 1 has a design error in the length in the second direction D2 of the second opening region 100b. Figure 5 The mask strip 10 according to an embodiment illustrated in FIG. 1 includes a plurality of recessed portions 300 (300a, 300b, 300c) arranged along the second direction D2 with the opening region 100. Figure 5 The recessed portions 300 of FIG. 1 can be classified into a first recessed portion 300a, a second recessed portion 300b, and a third recessed portion 300c. The first recessed portion 300a is arranged along the second direction D2 with the first opening region 100a, and the length in the first direction D1 of the first recessed portion 300a is less than one fifth of the maximum length LT in the first direction D1 between the boundary of the opening region 100 and the non-hole portion region 200. The second recessed portion 300b is arranged along the second direction D2 with the second opening region 100b, and the length in the first direction D1 of the second recessed portion 300b is more than one fifth of the maximum length LT in the first direction D1 between the boundary of the opening region 100 and the non-hole portion region 200. The third recessed portion 300c is arranged along the second direction D2 with the third opening region 100c, and the length in the first direction D1 of the third recessed portion 300c is less than one fifth of the maximum length LT in the first direction D1 between the boundary of the opening region 100 and the non-hole portion region 200.

[0091] Figure 5 The mask strip 10 according to an embodiment illustrated in FIG. 1 includes the recessed portion 300, so that the design error that the second opening region 100b has can be corrected excellently. In Figure 6 and Figure 7 A process of correcting the design error that the second opening region 100b has is illustrated in FIGS. 1 and 2.

[0092] Figure 6 is a view showing a heating portion included in a mask strip according to an embodiment.

[0093] Figure 6 A heating portion 400 is shown that is arranged along the second direction D2 from the second opening region 100b and is located in the non-hole portion region 200. The heating portion 400 can overlap the second recessed portion 300b arranged along the second direction D2 from the second opening region 100b. Figure 6 The heating portion 400 of the non-hole portion region 200 can be located between the second opening region 100b and the end 202 of the non-hole portion region 200 in the second direction D2.

[0094] The heating portion 400 can be a portion that overlaps the non-hole portion region 200 and to which heat is applied. For example, heat can be applied to the heating portion 400 of the mask strip 10 using a welding apparatus. As another example, heat can be applied using a means other than a welding apparatus. If heat is applied to the heating portion 400, a trace of the application of heat can remain in the mask strip 10. For example, a welding trace can remain in the mask strip 10.

[0095] The position of the heating portion 400 can become different depending on the design error type of the opening region 100. Figure 6 The mask strip 10 according to an embodiment of the non-hole portion region 200 is a case where the length in the second direction D2 of the second opening region 100b becomes longer than the design length, and thus the heating portion 400 can be located near the second opening region 100b. For example, the heating portion 400 can be arranged along the second direction D2 from the second opening region 100b and be located in the non-hole portion region 200. Further, the heating portion 400 can be located in the non-hole portion region 200 between the end 202 of the non-hole portion region 200 in the second direction D2 and the second opening region 100b.

[0096] A process of correcting a design error of the opening region 100 by the heating portion 400 will be described with reference to Figure 7

[0097] Figure 7 is a view showing a heating portion included in a mask strip according to an embodiment.

[0098] When heat is applied to the non-hole portion region 200 of the mask strip 10, the heated non-hole portion region 200 can shrink. Expansion can occur in the non-hole portion region 200 adjacent to the shrunk non-hole portion region 200. In Figure 7 In the non-hole portion region 200, the arrows shown along the first direction D1 indicate shrinkage and expansion in the non-hole portion region 200. As Figure 7 ​As shown, shrinkage can occur along the first direction D1 in the heating portion 400 to which heat is applied, and expansion occurs along the second direction D2. In Figure 7 In the embodiment shown in FIG. 6, the arrow shown along the second direction D2 indicates the direction of shrinkage of the second open area 100b. Shrinkage in the first direction D1 occurs in the heating portion 400 to which heat is applied. In the non-hole portion area 200 adjacent to the heating portion 400 along the first direction D1, expansion occurs along the first direction D1 toward the heating portion 400, which can continue to expansion in the second direction D2 from the heating portion 400 toward the second open area 100b. As the non-hole portion area 200 of the heating portion 400 expands in the second direction D2, a design error of the second open area 100b can be corrected. Because the non-hole portion area 200 of the heating portion 400 expands in the second direction D2, the second open area 100b can be shrunk with respect to the second direction D2. Figure 7 The dotted line shown in the embodiment in FIG. 6 indicates that the mask strip 10 includes the recessed portion 300, so that a design error of the open area 100 can be more excellently corrected.

[0099] Because Figure 7 The mask strip 10 according to an embodiment shown in FIG. 6 includes the recessed portion 300, so that more excellent expansion or shrinkage can occur compared to a mask strip that does not include the recessed portion. For example, if a predetermined amount of heat can be applied to a mask strip that does not include the recessed portion to cause a predetermined expansion or shrinkage, a smaller amount of heat can be applied to the mask strip 10 including the recessed portion 300 to cause the same degree of expansion or shrinkage. Alternatively, when the same amount of heat is applied to a mask strip that does not include the recessed portion and the mask strip 10 including the recessed portion 300, more excellent expansion or shrinkage can occur in the mask strip 10 including the recessed portion 300. More excellent expansion or shrinkage can mean that the length of expansion or shrinkage is longer.

[0100] Figure 8 FIG. 7 is a diagram showing a design error of an open area included in a mask strip according to an embodiment.

[0101] Figure 8 The mask strip 10 according to an embodiment shown in FIG. 6 has a design error in the length in the second direction D2 of the second open area 100b. Figure 8 The mask strip 10 according to an embodiment shown in FIG. 6 includes a plurality of recessed portions 300 (300a, 300b, 300c) arranged along the second direction D2 from the open area 100. Figure 8The recessed portions 300 can be classified into first recessed portions 300a, second recessed portions 300b, and third recessed portions 300c. The first recessed portions 300a are arranged along the second direction D2 with the first open area 100a, and a length of the first recessed portions 300a in the first direction D1 is less than one fifth of the maximum length LT in the first direction D1 between the boundary of the open area 100 and the non-hole portion area 200. The second recessed portions 300b are arranged along the second direction D2 with the second open area 100b, and a length of the second recessed portions 300b in the first direction D1 is more than one fifth of the maximum length LT in the first direction D1 between the boundary of the open area 100 and the non-hole portion area 200. The third recessed portions 300c are arranged along the second direction D2 with the third open area 100c, and a length of the third recessed portions 300c in the first direction D1 is less than one fifth of the maximum length LT in the first direction D1 between the boundary of the open area 100 and the non-hole portion area 200.

[0102] Figure 8 The mask strip 10 according to an embodiment shown in FIG. 1 includes the recessed portions 300, so that the design error of the second open area 100b can be corrected excellently. In Figure 9 and Figure 10 The process of correcting the design error of the second open area 100b is shown in FIGS. 2A and 2B.

[0103] Figure 9 FIG. 3 is a view showing a heating portion included in the mask strip according to an embodiment.

[0104] Figure 9 The heating portion 400 arranged along the second direction D2 with the first open area 100a and the third open area 100c and located in the non-hole portion area 200 is shown. The heating portion 400 can overlap the first recessed portion 300a arranged along the second direction D2 with the first open area 100a or the third recessed portion 300c arranged along the second direction D2 with the third open area 100c. Figure 9 The heating portion 400 of FIG. 4 can be located along the second direction D2 between the first open area 100a and the end portion 202 of the non-hole portion area 200 in the second direction D2. In addition, Figure 9 The heating portion 400 of FIG. 4 can be located along the second direction D2 between the third open area 100c and the end portion 202 of the non-hole portion area 200 in the second direction D2.

[0105] The heating portion 400 can be a portion that overlaps the non-hole portion region 200 and to which heat is applied. For example, a welding apparatus can be utilized to apply heat to the heating portion 400 of the mask strip 10. As another example, a means of applying heat other than a welding apparatus can be utilized. If heat is applied to the heating portion 400, a trace of the application of heat can remain in the mask strip 10. For example, a welding trace can remain in the mask strip 10.

[0106] The location of the heating portion 400 can become different depending on the type of design error of the opening region 100. Figure 9 The mask strip 10 according to an embodiment is a case in which the length in the second direction D2 of the second opening region 100b becomes shorter than the design length, and thus the heating portion 400 can be located near the first opening region 100a and the third opening region 100c. For example, the heating portion 400 can be aligned with the first opening region 100a along the second direction D2 and located in the non-hole portion region 200. Also, the heating portion 400 can be located in the non-hole portion region 200 between the end portion 202 in the second direction D2 of the non-hole portion region 200 and the first opening region 100a. The heating portion 400 can be aligned with the third opening region 100c along the second direction D2 and located in the non-hole portion region 200. Also, the heating portion 400 can be located in the non-hole portion region 200 between the end portion 202 in the second direction D2 of the non-hole portion region 200 and the third opening region 100c.

[0107] A process of correcting a design error of an opening region included in a mask strip according to an embodiment will be described with reference to Figure 10

[0108] Figure 10 is a diagram illustrating a design error of an opening region included in a mask strip according to an embodiment being corrected.

[0109] When heat is applied to the non-hole portion region 200 of the mask strip 10, the heated non-hole portion region 200 can shrink. Expansion can occur in the non-hole portion region 200 adjacent to the shrunk non-hole portion region 200. In Figure 10 In, the arrows shown along the first direction D1 indicate shrinkage and expansion in the non-hole portion region 200. As shown in Figure 10 Shrinkage can occur in the heating portion 400 to which heat is applied along the first direction D1. As shrinkage in the first direction D1 occurs in the heating portion 400, expansion can occur in the non-hole portion region 200 adjacent to the heating portion 400 along the first direction D1. For example, expansion can occur in the non-hole portion region 200 existing adjacent to the second opening region 100b along the second direction D2 along the first direction D1. Referring to Figure 10 ​In the middle portion in the first direction D1 of the non-hole portion region 200, expansion in the first direction D1 can occur. In the non-hole portion region 200 that expands toward the first direction D1, contraction in the second direction D2 can occur. Thus, in the non-hole portion region 200 that is arranged along the second opening region 100b in the second direction D2, contraction in the second direction D2 occurs, and thus expansion in the second direction D2 can occur in the second opening region 100b. In Figure 10 In the second opening region 100b, the arrow shown in the second direction D2 indicates the expansion direction of the second opening region 100b. As the second opening region 100b expands in the second direction D2, the design error of the second opening region 100b can be corrected. Figure 10 The dotted line shown in (B) indicates that the mask strip 10 includes the recessed portion 300, and thus the design error of the opening region 100 can be corrected more favorably.

[0110] Because Figure 10 The mask strip 10 according to an embodiment shown in (B) includes the recessed portion 300, and thus can expand or contract more favorably than a mask strip that does not include a recessed portion. For example, if a predetermined amount of heat can be applied to a mask strip that does not include a recessed portion to cause a predetermined expansion or contraction, a smaller amount of heat can be applied to the mask strip 10 that includes the recessed portion 300 to cause the same degree of expansion or contraction. Alternatively, when the same amount of heat is applied to a mask strip that does not include a recessed portion and the mask strip 10 that includes the recessed portion 300, more favorable expansion or contraction can occur in the mask strip 10 that includes the recessed portion 300. More favorable expansion or contraction can mean that the length of the expansion or contraction is longer.

[0111] Figure 11 is a view showing a mask strip according to an embodiment.

[0112] Figure 11 The mask strip 10 according to an embodiment of (A) includes a first recessed portion 300a and a second recessed portion 300b. The second recessed portion 300b can be arranged along the first direction D1 from the first recessed portion 300a. Figure 11 The first recessed portion 300a and the second recessed portion 300b shown in (B) can not overlap the heating portion 400.

[0113] The first recessed portion 300a and the second recessed portion 300b can respectively extend in the first direction D1. The length of the first recessed portion 300a or the second recessed portion 300b in the first direction D1 can be freely determined. The lengths of the first recessed portion 300a and the second recessed portion 300b in the first direction D1 can be the same as each other. The first recessed portion 300a is arranged along the second direction D2 with the opening area 100 and is located in the non-hole portion area 200. Also, the second recessed portion 300b is arranged along the second direction D2 with the opening area 100 and is located in the non-hole portion area 200. The thickness of the first recessed portion 300a and the second recessed portion 300b is thinner than the thickness of the adjacent non-hole portion area 200. Since the first recessed portion 300a and the second recessed portion 300b include less material than the surrounding non-hole portion area 200 and are thin in thickness, they can react more sensitively to applied heat.

[0114] The heating portion 400 can not overlap the first recessed portion 300a. Also, the heating portion 400 can not overlap the second recessed portion 300b. For example, the heating portion 400 can be located above the non-hole portion area 200 and around the first recessed portion 300a. The heating portion 400 can be located in the non-hole portion area 200 whose thickness is thicker than the thickness of the first recessed portion 300a. When heat is applied to the heating portion 400 which does not overlap the recessed portion 300, the amount of expansion in the first recessed portion 300a or the second recessed portion 300b can be increased, and thus the amount of contraction in the heating portion 400 can be increased. As such, since the amounts of expansion and contraction in the non-hole portion area 200 are increased, the amounts of expansion and contraction in the opening area 100 can also be increased. The mask strip 10 according to an embodiment including the first recessed portion 300a and the second recessed portion 300b which do not overlap the heating portion 400 can correct the design error of the opening area 100 excellently.

[0115] Figure 12 FIG. 1 is a view illustrating a mask strip according to an embodiment.

[0116] Figure 12 The mask strip 10 according to an embodiment of FIG. 1 includes a first recessed portion 300a.

[0117] The first recessed portion 300a can extend in the first direction D1. The length of the first recessed portion 300a in the first direction D1 can be substantially the same as the maximum length LT in the first direction D1 between the boundary of the open area 100 and the non-hole portion area 200. For example, the length of the first recessed portion 300a in the first direction D1 can be 0.9 to 1.1 times the maximum length LT in the first direction D1 between the boundary of the open area 100 and the non-hole portion area 200. The first recessed portion 300a is arranged along the second direction D2 with the open area 100 and is located in the non-hole portion area 200. In addition, the thickness of the first recessed portion 300a is thinner than the thickness of the adjacent non-hole portion area 200. Since the first recessed portion 300a is thinner in thickness than the surrounding non-hole portion area 200 by including less material, it can react more sensitively to applied heat.

[0118] The first recessed portion 300a can overlap the heating portion 400. When heat is applied to the heating portion 400, both the portion in the non-hole portion area 200 that shrinks and the portion that expands can be included in the first recessed portion 300a, and thus both the amount by which the heating portion 400 shrinks and the amount by which the surrounding of the heating portion 400 expands can increase. Accordingly, the amount of expansion or shrinkage of the open area 100 can also increase. Accordingly, the mask strip 10 according to an embodiment including the first recessed portion 300a can correct design errors of the open area 100 excellently.

[0119] Figure 13 FIG. 1 is a schematic cross-sectional view schematically showing a stacked structure of a display panel.

[0120] Figure 13 A schematic cross-section of a display panel manufactured using the mask strip 10 according to an embodiment is shown. The display panel can be used as a component of a display device.

[0121] Figure 13 The third direction D3 shown in FIG. 1 can be a direction perpendicular to the first direction D1 while being perpendicular to the second direction D2.

[0122] The display panel substantially includes a substrate SB, a transistor TR formed on the substrate SB, and a light emitting diode LED connected to the transistor TR. The light emitting diode LED can correspond to a pixel.

[0123] The substrate SB can be formed of a material such as glass. The substrate SB can also be a flexible substrate including a polymeric resin such as polyimide, polyamide, polyethylene terephthalate, etc.

[0124] The buffer layer BFL can be located on the substrate SB. In forming the semiconductor layer, the buffer layer BFL can block impurities from the substrate SB to improve the characteristics of the semiconductor layer, and planarize the surface of the substrate SB to mitigate stress of the semiconductor layer. The buffer layer BFL can include an inorganic insulating substance such as silicon nitride (SiN x ), silicon oxide (SiO x ), silicon oxynitride (SiO x N y ), and the like, and can be a single layer or multiple layers. The buffer layer BFL can also include amorphous silicon (Si).

[0125] The semiconductor layer AL of the transistor TR can be located on the buffer layer BFL. The semiconductor layer AL can include a first region, a second region, and a channel region between the first region and the second region. The semiconductor layer AL can include any one of amorphous silicon, polysilicon, and an oxide semiconductor. As an example, the semiconductor layer AL can include low temperature polysilicon (LTPS), or can include an oxide semiconductor substance including at least one of zinc (Zn), indium (In), gallium (Ga), and tin (Sn). As an example, the semiconductor layer AL can include IGZO (Indium-Gallium-Zinc Oxide).

[0126] The first gate insulating layer GI1 can be located on the semiconductor layer AL. The first gate insulating layer GI1 can include an inorganic insulating substance such as silicon nitride, silicon oxide, silicon oxynitride, and the like, and can be a single layer or multiple layers.

[0127] A first gate conductive layer that can include the gate electrode GE of the transistor TR, the gate line GL, the first electrode C1 of the capacitor CS, and the like, can be located on the first gate insulating layer GI1. The first gate conductive layer can include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like, and can be a single layer or multiple layers.

[0128] The second gate insulating layer GI2 can be located on the first gate conductive layer. The second gate insulating layer GI2 can include an inorganic insulating substance such as silicon nitride, silicon oxide, silicon oxynitride, and the like, and can be a single layer or multiple layers.

[0129] A second gate conductive layer that can include the second electrode C2 of the capacitor CS and the like, can be located on the second gate insulating layer GI2. The second gate conductive layer can include molybdenum (Mo), aluminum (Al), copper (Cu), titanium (Ti), and the like, and can be a single layer or multiple layers.

[0130] An interlayer insulating layer ILD can be located on the second gate insulating layer GI2 and the second gate conductive layer. The interlayer insulating layer ILD can include inorganic insulating substances such as silicon nitride, silicon oxide, silicon oxynitride, etc., and can be a single layer or multiple layers.

[0131] A first data conductive layer that can include the first and second electrodes SE and DE of the transistor TR, the data line DL, etc. can be located on the interlayer insulating layer ILD. The first and second electrodes SE and DE can be connected to the first and second regions of the semiconductor layer AL through contact holes of the insulating layers GI1, GI2, ILD, respectively. One of the first and second electrodes SE and DE can be a source electrode, and the other can be a drain electrode. The first data conductive layer can include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), etc., and can be a single layer or multiple layers.

[0132] A first planarization layer VIA1 can be located on the first data conductive layer. The first planarization layer VIA1 can be an organic insulating layer. For example, the first planarization layer VIA1 can include organic insulating substances such as general-purpose polymers such as polymethylmethacrylate and polystyrene, polymer derivatives having phenolic groups, acrylic polymers, imide polymers, polyimide polymers, siloxane polymers, etc.

[0133] A second data conductive layer that can include the voltage line VL, the connection line CL, etc. can be located on the first planarization layer VIA1. The voltage line VL can transmit a driving voltage, a common voltage, an initialization voltage, a reference voltage, etc. The connection line CL can be connected to the second electrode DE of the transistor TR through a contact hole of the first planarization layer VIA1. The second data conductive layer can include aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), etc., and can be a single layer or multiple layers.

[0134] A second planarization layer VIA2 can be located on the second data conductive layer. The second planarization layer VIA2 can be an organic insulating layer. For example, the second planarization layer VIA2 can include organic insulating substances such as general-purpose polymers such as polymethylmethacrylate and polystyrene, polymer derivatives having phenolic groups, acrylic polymers, imide polymers, polyimide polymers, siloxane polymers, etc.

[0135] A first electrode E1 of a light emitting diode LED can be located on the second planarization layer VIA2. The first electrode E1 can be referred to as a pixel electrode. The first electrode E1 can be connected with a connection line CL through a contact hole of the second planarization layer VIA2. Accordingly, the first electrode E1 is electrically connected with a second electrode DE of a transistor TR to receive a data signal that controls brightness of the light emitting diode LED. The transistor TR connected with the first electrode E1 can be a driving transistor or a transistor electrically connected with the driving transistor. The first electrode E1 can be formed of a reflective conductive substance or a semi-transmissive conductive substance, or can be formed of a transparent conductive substance. The first electrode E1 can include a transparent conductive substance such as indium tin oxide (ITO), indium zinc oxide (IZO). The first electrode E1 can include a metal or a metal alloy such as lithium (Li), calcium (Ca), aluminum (Al), silver (Ag), magnesium (Mg), gold (Au).

[0136] A pixel definition layer PDL, which can be an organic insulating layer, can be located on the second planarization layer VIA2. The pixel definition layer PDL can be referred to as a partition wall, and can have an opening overlapping the first electrode E1.

[0137] A light emitting layer EL of a light emitting diode LED can be located on the first electrode E1. In addition to the light emitting layer EL, at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer can be located on the first electrode E1. The above-described mask assembly 1 can be used to deposit the light emitting layer EL.

[0138] A second electrode E2 of a light emitting diode LED can be located on the light emitting layer EL. The second electrode E2 can be referred to as a common electrode. The second electrode E2 can be made to have light transmissivity by forming a thin layer with a metal or a metal alloy having a low work function such as calcium (Ca), barium (Ba), magnesium (Mg), aluminum (Al), silver (Ag), etc. The second electrode E2 can include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO).

[0139] The first electrode E1, the light emitting layer EL, and the second electrode E2 of each pixel can constitute a light emitting diode LED such as an organic light emitting diode. The first electrode E1 can be an anode of the light emitting diode LED, and the second electrode E2 can be a cathode of the light emitting diode LED.

[0140] A cover layer CPL can be located on the second electrode E2. The cover layer CPL can increase light efficiency by adjusting a refractive index. The cover layer CPL can be positioned to completely cover the second electrode E2. The cover layer CPL can include an organic insulating substance, or can include an inorganic insulating substance.

[0141] An encapsulation layer EN can be located on the cover layer CPL. The encapsulation layer EN can encapsulate the light emitting diode LED to prevent moisture or oxygen from penetrating from the outside. The encapsulation layer EN can be a thin film encapsulation layer including one or more inorganic layers EIL1, EIL2 and one or more organic layers EOL.

[0142] A touch sensor layer TSL including a touch electrode can be located on the encapsulation layer EN. The touch electrode can be in a mesh shape having openings overlapping the light emitting diode LED. An anti-reflection layer AR for reducing reflection of external light can be located on the touch sensor layer TSL.

[0143] A cover window for integrally protecting a front surface of the display panel can be located on the anti-reflection layer AR.

[0144] A protection film for protecting the display panel can be located under the substrate SB. A functional sheet including at least one of a cushion layer, a heat dissipation sheet, a light shielding sheet, a waterproof tape, and an electromagnetic shielding layer can be located under the protection film.

[0145] Figure 14 is a flowchart illustrating a method of manufacturing a display device using a mask strip.

[0146] As shown in Figure 5 to Figure 10 , Figure 12 and Figure 14 , first, a step S1401 of preparing a mask strip 10 can be performed. The mask strip 10 can include a plurality of opening regions 100 having a plurality of through holes 110 and a non-hole partial region 200 surrounding the plurality of opening regions 100, and the non-hole partial region 200 can include a first recessed portion 300a having a length in a first direction D1 greater than a length in a second direction D2 and arranged along the second direction D2 with the plurality of opening regions 100. Thereafter, a step S1402 of checking whether a design error occurs in the prepared mask strip 10 can be performed. The design error of the mask strip 10 can be an error in which the size and shape of the opening region 100 are manufactured differently from the design. When it is judged that the design error occurs in the mask strip 10, a step of applying heat to the non-hole partial region 200 of the mask strip 10 to correct the design error of the mask strip 10 can be performed. For example, a step S1403 of applying heat to the recessed portion 300 included in the non-hole partial region 200 to correct the design error of the mask strip 10 can be performed. Then, a step S1404 of connecting the mask strip 10 for which the correction is completed and the frame 20 to manufacture the mask assembly 1 can be performed. For example, the jig portion 210 of the mask strip 10 and the frame 20 can be connected by welding. Thereafter, a step S1405 of depositing a deposition material onto the substrate SB using the manufactured mask assembly 1 can be performed. The deposition material can be formed of a light emitting layer, an electrode layer, etc. Thereafter, a display device including the substrate SB on which the deposition material is deposited can be manufactured.

[0147] Figure 15 This is a flowchart illustrating a method for manufacturing a display device using a mask strip.

[0148] Figure 15 This shows the direction of the mask strip 10 (reference). Figure 11 The non-porous portion of the region 200 (reference) Figure 11 The step of applying heat to correct the design error of the mask strip 10 is performed by applying heat to the area around the recessed portion 300 of the non-porous portion region 200, instead of applying heat to the recessed portion 300 (see reference). Figure 11 Heat is applied. The area surrounding the recessed portion 300 may be a non-porous region 200, which is thicker than the recessed portion 300.

[0149] When heat is applied directly to the recessed portion 300, a large contraction occurs within the recessed portion 300, thereby correcting the design error of the opening region 100. When heat is applied around the recessed portion 300, a large expansion occurs within the recessed portion 300, thereby correcting the design error of the opening region 100.

[0150] The embodiments of this disclosure have been described in detail above, but the scope of this disclosure is not limited thereto, and various modifications and improvements made by those skilled in the art using the basic concepts of this disclosure as defined in the claims also fall within the scope of this disclosure.

Claims

1. A mask strip, characterized in that, include: The opening area has multiple through holes; as well as The non-porous portion surrounding the opening region, The non-porous portion includes: The recessed portion has a length in the first direction that is longer than its length in the second direction that intersects the first direction, and is aligned with the opening region along the second direction.

2. A mask strip, characterized in that, include: Multiple opening areas with multiple through holes; as well as The non-porous portion surrounds the plurality of opening regions. The non-porous portion includes: The first recessed portion has a length in a first direction that is longer than its length in a second direction that intersects the first direction, and is arranged along the second direction with the plurality of opening regions.

3. The mask strip according to claim 2, characterized in that, The plurality of opening regions are arranged along the first direction.

4. The mask strip according to claim 2, characterized in that, The first recessed portion extends along the first direction at a maximum length in the first direction between the boundaries of the open area and the non-porous portion area.

5. The mask strip according to claim 2, characterized in that, The non-porous portion also includes: The second recessed portion is arranged along the first direction with the first recessed portion.

6. The mask strip according to claim 5, characterized in that, The first recessed portion and the second recessed portion have the same length in the first direction.

7. The mask strip according to claim 5, characterized in that, The non-porous portion also includes: The third recessed portion is arranged along the first recessed portion and the second recessed portion in the first direction.

8. The mask strip according to claim 7, characterized in that, At least some of the first recessed portion, the second recessed portion, and the third recessed portion have different lengths from each other in the first direction.

9. The mask strip according to claim 7, characterized in that, At least some of the first recessed portion, the second recessed portion, and the third recessed portion have the same length in the first direction.

10. The mask strip according to claim 7, characterized in that, The second recessed portion is located between the first recessed portion and the third recessed portion, and the length of the second recessed portion in the first direction is longer than the length of the first recessed portion or the second recessed portion in the first direction.

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