Film coating support plate and film coating support plate assembly for back contact photovoltaic cell

Abstract

The utility model relates to the technical field of auxiliary tools for manufacturing photovoltaic cells, and discloses a film coating support plate and a film coating support plate assembly for a back contact photovoltaic cell. The film coating carrier plate comprises a carrier plate body, and a plurality of carrier plate modules which are arranged in sequence are mounted on the carrier plate body; a bearing cavity is formed in the carrier plate module, a bearing plate for loading a workpiece to be coated is arranged in the bearing cavity, and a plurality of openings which are distributed at intervals and are through up and down are formed in the bearing plate; one side of the bearing plate is arranged at the upper end part of one inner side wall of the bearing cavity, and the other side of the bearing plate is arranged at the lower end part of the other inner side wall of the bearing cavity, so that the bearing plate is obliquely arranged in the bearing cavity, and the to-be-coated workpiece is aligned to the lower inclined side of the bearing plate under the inclination assistance of the bearing plate by virtue of the gravity of the to-be-coated workpiece; therefore, the to-be-coated area of the to-be-coated workpiece is accurately aligned with the opening. Therefore, the film coating support plate can solve the problem of deviation of the film coating pattern, and further improves the accuracy of graphical film coating.

Description

Technical Field

[0001] This utility model relates to the field of auxiliary tools for photovoltaic cell manufacturing, specifically to a coating carrier plate and a coating carrier plate assembly for back-contact photovoltaic cells. Background Technology

[0002] In the fabrication of solar photovoltaic (PV) cells, selective deposition of film structures such as oxide layers and polycrystalline silicon layers is sometimes required on localized areas of the silicon wafer surface. For example, in the fabrication of back-contact PV cells, to form a PN junction that contacts the metal electrode on the back of the silicon wafer, it is typically necessary to deposit a film structure such as P-type polycrystalline silicon in certain localized areas on the back of the wafer, and a film structure such as N-type polycrystalline silicon in other localized areas. Similarly, in the fabrication of locally passivated contact PV cells, a tunneling oxide layer and doped polycrystalline silicon are selectively and sequentially deposited in the metallized regions on the silicon wafer surface.

[0003] In these situations, to achieve selective deposition on localized areas of the silicon wafer surface and simplify the process, an auxiliary tool—a mask carrier—is needed. For example, the patterned cutout second carrier shown in publication number CN114335250B has multiple openings arranged sequentially in the patterned cutout area. The silicon wafer is loaded onto the patterned cutout second carrier, allowing the deposit to pass through the openings and be deposited onto localized areas of the silicon wafer surface. This achieves selective deposition (also known as patterned deposition) on the silicon wafer surface, thereby assisting in the fabrication of photovoltaic cells with passivated contact structures, improving cell efficiency, and simplifying the cell manufacturing process.

[0004] To optimize the deposition carrier, existing technology, such as that described in publication CN216378389U, provides a PECVD deposition carrier comprising a carrier body and a support plate. The support plate is housed in a mounting groove on the mounting surface of the carrier body, and the support plate is detachably connected to the carrier body. This allows for cost reduction when a portion of the support plate on the PECVD deposition carrier is damaged, requiring only the damaged support plate to be removed and replaced. However, with this existing deposition carrier, accurately aligning the local area to be patterned on the silicon wafer surface with the cutout structure (i.e., the opening position) of the carrier is challenging, easily leading to pattern misalignment. This can affect cell efficiency and even pose a risk of leakage. Therefore, further structural optimization of existing deposition carriers is urgently needed to improve the accuracy of patterned deposition. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a coated carrier plate and a coated carrier plate assembly for back contact photovoltaic cells.

[0006] Based on this, the present invention discloses a coating carrier plate, including a carrier plate body, on which a plurality of carrier plate modules are installed in sequence; the carrier plate module has a vertically penetrating bearing cavity, and the bearing cavity is provided with a bearing plate for loading the workpiece to be coated; the bearing plate has a plurality of spaced and vertically penetrating openings.

[0007] One side of the support plate is located at the upper end of one inner wall of the support cavity, and the other side of the support plate is located at the lower end of another inner wall of the support cavity, so that the support plate is inclined in the support cavity, so that the workpiece to be coated is aligned with the lower inclined side of the support plate by its own gravity under the assistance of the inclination of the support plate, so that the coating area of ​​the workpiece to be coated is aligned with the opening.

[0008] Preferably, the inclination angle of the support plate is 3-30°.

[0009] More preferably, a gripper is provided on one side of the carrier plate body, so as to lift or lower that side of the carrier plate body by means of the gripper, thereby tilting the carrier plate body and making the tilting direction of the carrier plate body the same as the tilting direction of the bearing plate.

[0010] More preferably, the tilt angle of the carrier plate body is 3-30°.

[0011] Preferably, the carrier module includes a mounting frame, and the mounting frame has the bearing cavity inside;

[0012] The carrier module is detachably mounted on the carrier body, so that the carrier plate can be detachably mounted on the carrier body together with the carrier module.

[0013] More preferably, the mounting frame has mounting holes so that the external connectors can pass through the mounting holes and the carrier module can be detachably mounted on the carrier body.

[0014] More preferably, the number of mounting holes is four, and the four mounting holes are respectively set at the four corners of the mounting frame.

[0015] More preferably, the connector is a threaded connector, and the carrier module is threadedly connected to the carrier body.

[0016] This utility model also discloses a coating carrier plate assembly for back contact photovoltaic cells, including a matching first coating carrier plate and a second coating carrier plate, wherein the first coating carrier plate and the second coating carrier plate are the coating carrier plates described above in this utility model; the workpiece to be coated is a silicon wafer.

[0017] The opening positions of the first coating substrate and the second coating substrate are staggered to deposit a first type of doped polysilicon in a local area on the back side of the silicon wafer through the opening of the first coating substrate, and a second type of doped polysilicon in other local areas on the back side of the silicon wafer through the opening of the second coating substrate, with a gap between the first type of doped polysilicon and the second type of doped polysilicon.

[0018] Preferably, the opening width of the first coating carrier plate is 200-5000μm, the opening width of the second coating carrier plate is 200-5000μm, and the width of the gap is 10-200μm.

[0019] Compared with the prior art, the present invention has at least the following beneficial effects:

[0020] The coating carrier plate of this invention is positioned with one side of the carrier plate located at the upper end of one inner wall of the carrier cavity, and the other side of the carrier plate located at the lower end of another inner wall of the carrier cavity, so that the carrier plate is tilted within the carrier cavity. Thus, during the loading of the workpiece to be coated (such as a silicon wafer), with the assistance of the tilting of the carrier plate, the workpiece can align itself with the downward tilting side of the carrier plate by its own weight and be tilted onto the carrier plate. This ensures the positional accuracy of the workpiece on the carrier plate, allowing the patterned coating area of ​​the workpiece to be precisely aligned with the opening position of the carrier plate. Therefore, it effectively solves the problem of coating pattern misalignment on the surface of the workpiece, further improving the accuracy of patterned coating (i.e., selective coating), thereby improving battery efficiency and avoiding the risk of leakage. Attached Figure Description

[0021] Figure 1 This is a top view of a coated carrier plate assembly for a back-contact photovoltaic cell according to this embodiment.

[0022] Figure 2 for Figure 1 Enlarged view of section A (labeled A).

[0023] Figure 3 This is a schematic diagram of the cross-sectional installation structure of the carrier plate of the first coating carrier plate in this embodiment.

[0024] Figure 4 This is a schematic diagram of the cross-sectional installation structure of the carrier plate of the second coating carrier plate in this embodiment.

[0025] Figure 5 This is a schematic diagram of the cross-sectional structure of a coating carrier plate body according to this embodiment.

[0026] Reference numerals: First coating substrate 1; Second coating substrate 2;

[0027] Carrier plate body 10; gripper 11; carrier plate module 12; mounting frame 13; mounting hole 131; bearing cavity 14; bearing plate 15; opening 151; upper inclined side 152; lower inclined side 153;

[0028] Silicon wafer 3; Type I doped polycrystalline silicon 30. Detailed Implementation

[0029] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0030] Example

[0031] This embodiment provides a coated carrier plate assembly for back-contact photovoltaic cells. See also... Figure 1 This includes a first coating carrier plate 1 and a second coating carrier plate 2. In practice, the first coating carrier plate 1 and the second coating carrier plate 2 are both independent coating carrier plates.

[0032] However, the first coating substrate 1 and the second coating substrate 2 need to ensure their matching accuracy to the greatest extent possible; for example, the size of the first coating substrate 1 is the same as that of the second coating substrate 2 (the difference is: such as Figure 3 , 4 As shown, the position of the opening 151 of the carrier plate 15 of the first coating carrier 1 needs to be staggered from the position of the opening 151 of the carrier plate 15 of the second coating carrier 2. The purpose of this arrangement is to assist in the deposition of materials such as silicon wafer 3 on a local area of ​​the back side of the silicon wafer 3 by utilizing the opening 151 of the first coating carrier 1. Figure 4 After the first type of doped polysilicon 30 (such as P-type polysilicon) is shown, the second type of doped polysilicon (such as N-type polysilicon) can be deposited in other local areas on the back side of the silicon wafer 3 by using the opening 151 of the second coating carrier 2, so that P-type polysilicon and N-type polysilicon are alternately distributed in local areas on the back side of the silicon wafer 3, thereby obtaining a back contact photovoltaic cell.

[0033] The first coating carrier 1 and the second coating carrier 2 are both coating carriers with the structure shown in the following embodiment:

[0034] One example of a coating carrier plate in this embodiment is shown below. Figure 1-2 It includes a carrier board body 10, on which a plurality of carrier board modules 12 are mounted in sequence; such as Figure 1 As shown, taking the first coating carrier plate 1 as an example, each row of the carrier plate body 10 shows 4 carrier plate modules 12, and each column shows 8 carrier plate modules 12. In practice, the number of carrier plate modules 12 installed on the carrier plate body 10 and the specific arrangement of several carrier plate modules 12 can be designed according to actual needs.

[0035] Among them, see Figure 2-5 The carrier module 12 includes a mounting frame 13, within which a vertically extending bearing cavity 14 is formed. A bearing plate 15 is disposed within the bearing cavity 14 for loading the workpiece to be coated (such as a silicon wafer 3). In practice, the bearing plate 15 is made of carbon fiber or other materials. The carrier module 12 is detachably mounted on the carrier body 10, thus the bearing plate 15 can be detachably mounted on the carrier body 10 along with the carrier module 12.

[0036] In practice, the manufacturing and processing of carrier modules 12 and carrier plates 15 also have certain precision errors. Some carrier modules 12 and carrier plates 15 have low processing precision, while others have high processing precision. By detachably installing each carrier module 12 and carrier plate 15 on the carrier body 10, it is possible to select carrier modules 12 and carrier plates 15 with high processing precision to install on the carrier body 10, and replace some carrier modules 12 and carrier plates 15 that do not meet the precision requirements. This avoids the use of carrier modules 12 and carrier plates 15 with low processing precision, reduces the adverse effects of processing errors, ensures the standardization of each carrier module 12 and carrier plate 15 installed on the carrier body 10, and improves the accuracy of coating overprinting on the coating carrier.

[0037] Furthermore, taking the first coating carrier plate 1 as an example, if the carrier module 12 and the support plate 15 to be installed on the first coating carrier plate 1 are large in size, since the carrier module 12 and the support plate 15 are detachably installed on the carrier body 10, it is convenient to select the correspondingly larger-sized carrier module 12 and the support plate 15 to be installed on the carrier body 10. This ensures that the size of the carrier module 12 and the support plate 15 required for the first coating carrier plate 1 is consistent with the size of the actually installed carrier module 12 and the support plate 15, which can also improve the accuracy of coating overprinting on the coating carrier plate. Therefore, by detachably installing each carrier module 12 and the support plate 15 on the carrier body 10, the standardization of the carrier module 12 can be achieved, ensuring the accuracy of coating overprinting on the coating carrier plate.

[0038] Specifically, see Figure 2 The mounting frame 13 has mounting holes 131 so that external connectors can be inserted into the mounting holes 131 and the carrier module 12 can be detachably mounted on the carrier body 10.

[0039] In practice, the external connector can be detachably installed with the mounting hole 131 and the carrier plate body 10 via snap-fit, threaded connection, or other existing detachable connections. In this embodiment, the connector is preferably a threaded connector, and the carrier plate module 12 is preferably threadedly connected to the carrier plate body 10 through the mounting hole 131.

[0040] Furthermore, the number of mounting holes 131 is preferably four, with the four mounting holes 131 corresponding to the four corners of the mounting frame 13. Each mounting hole 131 is equipped with an external connector to ensure that the carrier module 12, the mounting frame 13 and the carrier plate 15 can be stably and firmly installed on the carrier body 10.

[0041] Among them, see Figure 2-4 The carrier plate 15 has several spaced openings 151 that are vertically connected. In the actual coating process, the workpiece to be coated (such as silicon wafer 3) is loaded on the upper surface of the carrier plate 15, and the deposit can reach a local area on the lower surface of the silicon wafer 3 through the openings 151 (this local area corresponds to the area of ​​the openings 151), thereby achieving coating.

[0042] To accurately fabricate back-contact photovoltaic cells, the opening 151 of the first coating carrier 1 (e.g., Figure 3 (as shown) and the position of the opening 151 of the second coating carrier plate 2 (as shown) Figure 4 (As shown) are staggered to each other so that they pass through the opening 151 of the first coating carrier 1 on the back side of the silicon wafer 3 (i.e., Figure 3-4 A first type of doped polycrystalline silicon 30 (such as P-type polycrystalline silicon) is deposited in a local area on the lower surface of the silicon wafer 3, and a second type of doped polycrystalline silicon (such as N-type polycrystalline silicon) is deposited in other local areas on the back side of the silicon wafer 3 through the opening 151 of the second coating carrier 2, and a gap is required between the P-type polycrystalline silicon and the N-type polycrystalline silicon; in this way, a back contact photovoltaic cell in which P-type polycrystalline silicon and N-type polycrystalline silicon are alternately distributed in local areas on the back side of the silicon wafer 3 can be obtained.

[0043] The opening 151 of the first coating substrate 1 has a width d1 of 200-5000 μm to ensure that the width d1 of the first type of doped polysilicon 30 (such as P-type polysilicon) deposited on the back side of the silicon wafer 3 is 200-5000 μm (such as 200 μm, 1000 μm, 3000 μm or 5000 μm); the opening 151 of the second coating substrate 2 has a width d2 of 200-5000 μm to ensure that the width d2 of the second type of doped polysilicon (such as N-type polysilicon) deposited on the back side of the silicon wafer 3 is 200-5000 μm (such as 200 μm, 1000 μm, 3000 μm or 5000 μm); thereby ensuring that the width L of the gap between the P-type polysilicon and the N-type polysilicon is 10-200 μm (such as 10 μm, 50 μm, 100 μm, 150 μm or 200 μm). Thus, by utilizing in-situ doping technology such as POPDIP, and through the cooperation of the first coating substrate 1 and the second coating substrate 2, selective deposition (also known as patterned deposition or patterned coating) of P-type polycrystalline silicon and N-type polycrystalline silicon on the back side of silicon wafer 3 can be achieved, which greatly simplifies the preparation process of conventional back contact photovoltaic cells and reduces the preparation cost.

[0044] One side of the bearing plate 15 is located at the upper end of an inner wall of the bearing cavity 14 (e.g., Figure 5 The upper inclined side 152 of the support plate 15 shown, and the other side of the support plate 15 is located at the lower end of the other inner wall of the support cavity 14 (e.g., Figure 5 The support plate 15 is tilted at its lower inclined side 153, so that it is tilted within the support cavity 14. Thus, during the loading of the workpiece to be coated (e.g., silicon wafer 3), the tilt of the support plate 15 assists in aligning the workpiece with its own weight towards the lower inclined side 153 of the support plate 15, ensuring the precise positioning of the workpiece on the support plate 15. This allows the patterned coating area of ​​the workpiece to be precisely aligned with the opening 151 of the support plate 15, effectively solving the problem of coating pattern misalignment on the workpiece surface and further improving the accuracy of patterned coating (i.e., selective coating). This, in turn, improves battery efficiency and avoids leakage risks. The tilt angle of the support plate 15 is preferably 3-30° (e.g., 3°, 10°, 20°, or 30°).

[0045] Furthermore, a gripper 11 is provided on one side of the carrier plate body 10 to lift or lower that side of the carrier plate body 10, thereby tilting the carrier plate body 10 and making the tilting direction of the carrier plate body 10 the same as the tilting direction of the support plate 15. The tilting angle of the carrier plate body 10 is preferably 3-30° (e.g., 3°, 10°, 20° or 30°).

[0046] A row of grippers 11 is designed on one side edge of the carrier plate body 10. After the silicon wafer 3 is placed on the tilted carrier plate 15, the grippers 11 can be clamped by external clamps to raise (or lower) the side edge of the carrier plate body 10. After the carrier plate body 10 is raised, the loading position of the silicon wafer 3 on the carrier plate 15 can be re-aligned, avoiding the offset effect caused by the existing use of suction cups to place the silicon wafer 3. It can also reduce the requirements for the tilt angle of the tilted carrier plate 15, thus reducing the length of the carrier plate 15 and reducing costs. Furthermore, it can ensure the alignment accuracy of the local area of ​​the silicon wafer 3 to be coated at the opening 151 of the carrier plate 15, further improving the accuracy of the coating pattern. Therefore, it can improve the yield of back contact photovoltaic cells with P-type polycrystalline silicon and N-type polycrystalline silicon alternately distributed in the local area on the back of the silicon wafer 3.

[0047] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0048] The technical solution provided by this utility model has been described in detail above. Specific examples have been used to illustrate the principle and implementation of this utility model. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​this utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​this utility model. Therefore, the content of this specification should not be construed as a limitation of this utility model.

Claims

1. A coated carrier plate, characterized in that, The device includes a carrier plate body, on which a plurality of carrier plate modules are mounted in sequence; each carrier plate module has a vertically penetrating bearing cavity, and the bearing cavity contains a bearing plate for loading the workpiece to be coated; the bearing plate has a plurality of spaced-apart, vertically penetrating openings. One side of the support plate is located at the upper end of one inner wall of the support cavity, and the other side of the support plate is located at the lower end of another inner wall of the support cavity, so that the support plate is inclined in the support cavity, so that the workpiece to be coated is aligned with the lower inclined side of the support plate by its own gravity under the assistance of the inclination of the support plate, so that the coating area of ​​the workpiece to be coated is aligned with the opening.

2. The coating carrier plate according to claim 1, characterized in that, The inclination angle of the bearing plate is 3-30°.

3. A coating carrier plate according to claim 1 or 2, characterized in that, A gripper is also provided on one side of the carrier plate body, so as to lift or lower the carrier plate body on that side by means of the gripper, thereby tilting the carrier plate body and making the tilting direction of the carrier plate body the same as the tilting direction of the bearing plate.

4. A coating carrier plate according to claim 3, characterized in that, The tilt angle of the carrier plate body is 3-30°.

5. A coating carrier plate according to claim 1, characterized in that, The carrier module includes a mounting frame, and the mounting frame has the bearing cavity inside; The carrier module is detachably mounted on the carrier body, so that the carrier plate can be detachably mounted on the carrier body together with the carrier module.

6. A coating carrier plate according to claim 5, characterized in that, The mounting frame has mounting holes so that external connectors can pass through the mounting holes and the carrier module can be detachably mounted on the carrier body.

7. A coating carrier plate according to claim 6, characterized in that, The number of mounting holes is four, and the four mounting holes are respectively set at the four corners of the mounting frame.

8. A coating carrier plate according to claim 6, characterized in that, The connector is a threaded connector, and the carrier module is threadedly connected to the carrier body.

9. A coated carrier plate assembly for back-contact photovoltaic cells, characterized in that, It includes a first coating carrier and a second coating carrier, both of which are coating carriers as described in any one of claims 1-8; the workpiece to be coated is a silicon wafer. The opening positions of the first coating substrate and the second coating substrate are staggered to deposit a first type of doped polysilicon in a local area on the back side of the silicon wafer through the opening of the first coating substrate, and a second type of doped polysilicon in other local areas on the back side of the silicon wafer through the opening of the second coating substrate, with a gap between the first type of doped polysilicon and the second type of doped polysilicon.

10. A coated carrier plate assembly for back-contact photovoltaic cells according to claim 9, characterized in that, The opening width of the first coating carrier is 200-5000μm, the opening width of the second coating carrier is 200-5000μm, and the width of the gap is 10-200μm.

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