Wafer carrier for chemical plating

Abstract

The utility model discloses a wafer carrier for chemical plating, and relates to the field of wafer equipment. The wafer carrier for chemical plating comprises a carrier main body which is provided with a plurality of supporting grooves capable of supporting wafers; the matching piece is arranged above the carrier main body and connected with the carrier main body, and the matching piece is configured to be connected through a transferring mechanism so as to flow in the plurality of plating tanks; and the coating structure covers the plurality of supporting grooves, and the coating structure is configured to be in direct contact with the wafer when the wafer is loaded to the carrier main body. The wafer carrier for chemical plating provided by the utility model can reduce the influence on the flowing mode of a chemical solution and improve the quality of chemical plating.

Description

Technical Field

[0001] This utility model relates to the field of wafer equipment, and more specifically, to a wafer carrier for chemical plating. Background Technology

[0002] When performing electroless plating on wafers, a batch of wafers needs to be loaded into baskets, and then the baskets are loaded onto electroless plating carriers. The electroless plating carriers are driven by a drive device to overlap with the plating tank and move in the plating tank, so that the chemical solution in the plating tank and the wafer surface in the baskets undergo metal displacement and deposition reactions.

[0003] In existing technologies, the presence of the basket of particles affects the flow of the chemical solution, resulting in poor coating effect on the wafer surface. Furthermore, the presence of the basket of particles increases the risk of contamination of the chemical solution. Utility Model Content

[0004] The purpose of this invention is to provide a wafer carrier for electroless plating that can reduce the impact on the flow pattern of chemical solutions and improve the quality of electroless plating.

[0005] The embodiments of this utility model provide a technical solution:

[0006] A wafer carrier for electroless plating, comprising:

[0007] The carrier body has several support slots capable of supporting the wafer;

[0008] A mating component is disposed above the carrier body and connected to the carrier body, the mating component being configured to be connected via a transfer mechanism to flow in several plating tanks;

[0009] A coating structure covers a plurality of the support grooves, the coating structure being configured to directly contact the wafer when the wafer is loaded onto the carrier body.

[0010] In an optional embodiment, the mating component has an overlapping portion for overlapping with the plating tank.

[0011] In an optional embodiment, the mating component further includes a hook portion for holding the transfer mechanism.

[0012] In an optional embodiment, the mating component is integrally formed with the vehicle body, or...

[0013] The mating component is detachably connected to the vehicle body.

[0014] In an optional embodiment, the wafer carrier for electroless plating further includes an acid and alkali protective layer covering at least the surface of the carrier body.

[0015] In an optional embodiment, the vehicle body includes a hollow insulation layer structure and a reinforcing member disposed inside the hollow insulation layer structure, and the support groove is located on the insulation layer structure.

[0016] In an optional embodiment, the hollow insulation layer structure is integrally formed.

[0017] In an optional embodiment, at least a portion of the hollow insulating layer structure serves as the covering structure.

[0018] In an optional embodiment, the metal reinforcement is a tubular structure, or...

[0019] The metal reinforcement is a hollowed-out plate-like structure.

[0020] In an optional embodiment, the carrier body includes an interconnected frame and a support member, the mating member is connected to the top of the frame, the support member is located at the bottom of the frame, and together with the frame, they form an accommodating space for accommodating the wafer, and a plurality of the support slots are located on the frame and the support member.

[0021] Compared to existing technologies, the wafer carrier for electroless plating provided by this utility model includes a carrier body, mating parts, and a coating structure. The carrier body is provided with several support grooves capable of supporting wafers. The carrier body is connected to the mating parts for connection with a transfer mechanism and for cooperation with the plating tank, thereby realizing the loading of wafers without the need for a separate basket for loading wafers. This reduces the impact of the basket's presence on the flow of the chemical solution and improves the plating effect on the wafers. In addition, by providing a coating structure on the several support grooves, the wafers are in direct contact with the coating structure when supported in the carrier, reducing friction between the wafers and the carrier body. This prevents wafer damage or prevents the coating on the carrier body from peeling off during friction and contaminating the chemical solution in the plating tank. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this utility model and therefore should not be considered as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without any creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of a wafer carrier for chemical plating provided in the first embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of a wafer carrier for chemical plating provided in the second embodiment of the present invention;

[0025] Figure 3 A partial structural schematic diagram of a wafer carrier for chemical plating provided in the third embodiment of this utility model;

[0026] Figure 4 This is a partial structural schematic diagram of a wafer carrier for chemical plating provided in the fourth embodiment of the present invention.

[0027] Icons: 100-Wafer carrier for electroless plating; 110-Carrier body; 111-Frame; 1111-Reinforcing member; 1112-Hollow isolation layer structure; 112-Support member; 113-Accommodation space; 120-Matching part; 121-Overlapping part; 122-Hook part; 130-Support groove; 200-Wafer. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0030] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0031] In the description of this utility model, it should be understood that the terms "upper", "lower", "inner", "outer", "left", "right", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the utility model product is usually placed in during use, or the orientation or positional relationship that is commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0032] Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0033] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, terms such as "set" and "connection" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0034] The specific embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0035] Please see Figures 1-4 As shown, the wafer carrier 100 for electroless plating provided in this application is used to load wafers 200 in batches and drive the batch of wafers 200 to move in the plating tank, thereby completing the electroless plating on the surface of the wafers 200.

[0036] Specifically, the wafer carrier 100 for electroless plating includes a carrier body 110, a mating component 120, and a coating structure. The carrier body 110 has a plurality of support grooves 130 capable of supporting the wafer 200. The mating component 120 is disposed above the carrier body 110 and connected to the carrier body 110. The mating component 120 is configured to be connected by a transfer mechanism to flow in a plurality of plating tanks. The coating structure covers the plurality of support grooves 130 and is configured to be in direct contact with the wafer 200 when the wafer 200 is loaded onto the carrier body 110.

[0037] More specifically, the mating part 120 has an overlapping portion 121 and a hook portion 122. The overlapping portion 121 is used to overlap with the plating tank, and the hook portion 122 is used to hold the transfer mechanism. In practical applications, the plating tank is provided with an overlapping groove that matches the overlapping portion 121. When it is necessary to plate the wafers 200, a batch of wafers 200 are supported by several support grooves 130. The transfer mechanism holds the hook portion 122 and moves the entire carrier into the plating tank. Then, the overlapping groove and the overlapping portion 121 are used to achieve relative stability between the carrier and the plating tank, thereby realizing the plating of a batch of wafers 200 on the carrier.

[0038] Understandably, the carrier body 110 is provided with several support grooves 130 to support the wafer 200, eliminating the need for a separate basket for loading the wafer 200. This reduces the cost of producing baskets and also minimizes the flow of chemical solution during coating formation caused by the baskets, improving the coating effect on the wafer 200 surface. Furthermore, it reduces contamination of the chemical solution by particles in dead corners caused by the baskets. The coating structure on the support grooves 130 prevents contact between the wafer 200 and the carrier body 110, avoiding wear on either the wafer 200 or the carrier body 110.

[0039] It should be noted that the coating structure is made of PTFE material, which has the characteristics of resistance to strong acids, strong alkalis, organic solvents, and low coefficient of friction.

[0040] First Embodiment

[0041] refer to Figure 1 As shown, in this embodiment, in order to ensure the strength of the vehicle, the vehicle is made of metal, that is, both the mating part 120 and the vehicle body 110 are made of metal, and the mating part 120 and the vehicle body (110) are integrally formed.

[0042] In this embodiment, the one-piece molding process is injection molding, which avoids gaps or dead corners at the connection points of various parts of the carrier. This can reduce the entry of particles from gaps and dead corners into the chemical solution and prevent chemical solution residues from causing cross-contamination between different chemical solutions.

[0043] In this embodiment, since both the carrier body 110 and the mating component 120 are made of metal, direct placement in a chemical solution could lead to corrosion. To prevent corrosion and contamination of the chemical solution, the surfaces of the carrier body 110 and the mating component 120 are covered with an acid-base protective layer. Preferably, the acid-base protective layer is a fluorine-coated layer. It should be noted that in this embodiment, the aforementioned coating structure prevents the acid-base protective layer from peeling off due to direct contact between the wafer 200 and the carrier.

[0044] To ensure reliable support for the wafer 200 and the stability of the wafer 200 within the carrier body 110, in this embodiment, the carrier body 110 includes an interconnected frame 111 and a support member 112. A mating member 120 is connected to the top of the frame 111, and the support member 112 is located at the bottom of the frame 111, together with the frame 111 forming an accommodating space 113 for accommodating the wafer 200. Several support grooves 130 are located on the frame 111 and the support member 112.

[0045] In fact, there are two mating parts 120. The two mating parts 120 are positioned opposite each other and spaced apart at both ends of the top of the frame 111. When mating with the transfer mechanism or the plating tank, they provide stable and reliable support for the carrier body 110 and can maintain the stability of the carrier body 110.

[0046] Multiple support slots 130 are provided on the two opposite side walls of the frame 111 that form the accommodating space 113. Multiple support slots 130 are also provided on the support member 112 at the bottom of the frame 111. The multiple support slots 130 on the support member 112 are one-to-one with the multiple support slots 130 on the two side walls of the frame 111 body, forming multiple holding units. The multiple holding units hold and fix the multiple wafers 200 respectively.

[0047] Understandably, the support grooves 130 on the two side walls of the frame 111 limit the horizontal movement of the wafer 200, while the support grooves 130 on the support member 112 primarily support the wafer 200. Multiple clamping units are arranged at intervals to ensure smooth flow of the chemical solution between adjacent wafers 200.

[0048] Second Embodiment

[0049] Please see Figure 2 In the second embodiment, the difference from the first embodiment is that the mating part 120 is detachably connected to the carrier body 110, so as to facilitate the replacement of the mating part 120 with a suitable one according to different models of transfer mechanisms or plating tanks. In practical applications, the mating part 120 does not need to come into contact with the chemical solution, so there is no need to consider the influence of gaps or dead corners on the chemical solution.

[0050] In this embodiment, the mating part 120 and the vehicle body 110 are connected by bolts.

[0051] Third Embodiment

[0052] Please see Figure 3 , Figure 3 The diagram shown is a partial structural schematic of the wafer carrier 100 for electroless plating provided in this embodiment.

[0053] The difference between the wafer carrier 100 for electroless plating provided in this embodiment and the first embodiment is that the carrier body 110 includes a hollow isolation layer structure 1112 and a reinforcing member 1111 disposed inside the hollow isolation layer structure 1112, and the support groove 130 is located on the hollow isolation layer structure 1112.

[0054] In other words, in this embodiment, both the frame 111 and the support member 112 are composed of a hollow isolation layer structure 1112 and a reinforcing member 1111 disposed inside the hollow isolation layer structure 1112. Several support grooves 130 are provided on the hollow isolation layer structure 1112 of the frame 111 and the support member 112.

[0055] In this embodiment, the hollow isolation layer structure 1112 is integrally formed. Similarly, the hollow isolation layer structure 1112 is also injection molded, with no gaps or dead corners at the joints of each part. Furthermore, the hollow isolation layer structure 1112 is made of PTFE material. In this embodiment, since the PTFE hollow isolation layer structure 1112 is in direct contact with the wafer 200, there is no need to set a separate cover structure. At this time, at least a portion of the hollow isolation layer structure 1112 serves as a cover structure.

[0056] It is understood that in this embodiment, the reinforcing member 1111 is a metal tubular structure, which ensures that the carrier body 110 has sufficient strength while achieving lightweight, thereby reducing the overall weight of the chemical plating wafer carrier 100.

[0057] Fourth embodiment

[0058] See Figure 4 As shown, in this embodiment, the difference from the third embodiment is that the reinforcing member 1111 is a hollow plate-like structure, which can achieve lightweighting while ensuring sufficient strength of the carrier body 110, thereby reducing the overall weight of the electroless plating wafer carrier 100. In other embodiments, the specific shape and arrangement of the reinforcing member 1111 are not specifically limited, and can be set according to requirements, as long as the above-mentioned effects can be achieved.

[0059] In summary, the wafer carrier 100 for electroless plating provided in this application eliminates the need for a separate basket, saving costs associated with basket configuration and avoiding the impact of the basket on the flow of the chemical solution, as well as the contamination of the chemical solution by particles in the dead corners of the basket, thus improving the quality of electroless plating on the wafer 200. Furthermore, the coating structure effectively reduces friction between the wafer 200 and the carrier body 110, protecting the wafer 200 and preventing contamination of the chemical solution, further enhancing the quality of the electroless plating.

[0060] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer carrier for chemical plating, characterized in that, include: The carrier body (110) has a plurality of support slots (130) capable of supporting the wafer (200); A mating part (120) is disposed above the carrier body (110) and connected to the carrier body (110). The mating part (120) is configured to be connected by a transfer mechanism to flow in a plurality of plating tanks. A coating structure covers a plurality of the support grooves (130), the coating structure being configured to be in direct contact with the wafer (200) when the wafer (200) is loaded onto the carrier body (110).

2. The wafer carrier for electroless plating according to claim 1, characterized in that, The mating component (120) is integrally formed with the vehicle body (110), or, The mating component (120) is detachably connected to the vehicle body (110).

3. The wafer carrier for electroless plating according to claim 1, characterized in that, The electroless plating wafer carrier (100) also includes an acid and alkali protective layer covering at least the surface of the carrier body (110).

4. The wafer carrier for electroless plating according to claim 1, characterized in that, The vehicle body (110) includes a hollow isolation layer structure (1112) and a reinforcing member (1111) disposed inside the hollow isolation layer structure (1112), and the support groove (130) is located on the hollow isolation layer structure (1112).

5. The wafer carrier for electroless plating according to claim 4, characterized in that, The hollow isolation layer structure (1112) is integrally formed.

6. The wafer carrier for electroless plating according to claim 4, characterized in that, At least a portion of the hollow insulating layer structure (1112) serves as the cladding structure.

7. The wafer carrier for electroless plating according to claim 4, characterized in that, The reinforcing member (1111) is a metal tubular structure; or, The reinforcing member (1111) is a metal perforated plate structure.

8. The wafer carrier for electroless plating according to any one of claims 1-7, characterized in that, The carrier body (110) includes a frame (111) and a support member (112) connected to each other. The mating member (120) is connected to the top of the frame (111). The support member (112) is located at the bottom of the frame (111) and together with the frame (111), they form an accommodating space (113) for accommodating the wafer (200). A plurality of the support grooves (130) are located on the frame (111) and the support member (112).

9. The wafer carrier for electroless plating according to any one of claims 1-7, characterized in that, The mating part (120) has an overlap portion (121) for overlapping with the plating tank.

10. The wafer carrier for electroless plating according to any one of claims 1-7, characterized in that, The mating part (120) also has a hook portion (122) for holding the transfer mechanism.

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