Electroplating liquid impurity sedimentation tank with overflow groove

Abstract

The utility model belongs to the technical field of electroplating equipment, and provides an electroplating liquid impurity settling pond with an overflow groove, which comprises a settling pond body, an electroplating tank and the overflow groove are arranged on the settling pond body, the electroplating tank and the overflow groove are separated by a partition wall, the electroplating tank is filled with electroplating liquid, and the electroplating liquid in the electroplating tank overflows into the overflow groove through the upper end of the partition wall; the electroplating liquid circulating assembly at least comprises a water pump and an electroplating liquid discharge pipe connected with the water pump, and the electroplating liquid discharge pipe is used for pumping the electroplating liquid in the overflow tank into the electroplating tank; a plurality of baffling filter plates used for blocking and eliminating bubbles flowing into the overflow groove are detachably connected into the overflow groove, and the baffling filter plates are obliquely arranged. And the baffling filter plate can slow down the flow speed of the electroplating liquid and reduce bubbles. And the bubble wall on the bubbles rubs with the surface of the filter screen and is limited by meshes, so that the stability of the bubbles is destroyed and the bubbles are eliminated. The influence on the quality of the electroplated workpiece due to excessive contamination of bubbles on the workpiece is avoided.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electroplating equipment, and particularly relates to an electroplating solution impurity sedimentation tank with an overflow tank. BACKGROUND

[0002] The electroplating solution overflow tank is an important component of the electroplating equipment, and is usually arranged beside or above the electroplating tank. The main function of the electroplating solution overflow tank is to collect the electroplating solution overflowing from the electroplating tank. In the electroplating process, due to the entry and exit of the workpiece, the stirring of the electroplating solution or other operations, the liquid level of the electroplating solution may fluctuate, resulting in overflow of the electroplating solution. The overflow tank can avoid the overflow of the electroplating solution to the working area, causing waste and environmental pollution. The electroplating solution overflow tank can also play a role in preliminary filtration and buffering. When the electroplating solution flows into the overflow tank, some larger impurity particles will be precipitated or preliminarily filtered out in the overflow tank.

[0003] The electroplating solution flows from the electroplating work tank to the overflow tank, and is pumped to the electroplating work tank by the filter in the overflow tank to complete a flow cycle. In the electroplating operation process, the electroplating current, mechanical agitation of the electroplating solution and excessive flow of the electroplating solution can all cause the electroplating solution to produce foam. However, when the electroplating solution overflows into the overflow tank, the foam will also be brought to the overflow tank. Excessive foam accumulation will overflow the tank, causing waste of the electroplating solution. Moreover, excessive foam will adhere to the workpiece, affecting the quality of the electroplated workpiece.

[0004] Therefore, the above-mentioned technical defects need to be changed. CONTENT OF THE INVENTION

[0005] In view of the above-mentioned deficiencies of the prior art, the purpose of the present application is to provide an electroplating solution impurity sedimentation tank with an overflow tank, which can eliminate the gas bubbles on the upper part of the electroplating solution. In addition, the generation of gas bubbles in the electroplating solution is reduced, and excessive gas bubbles are prevented from adhering to the workpiece, thereby affecting the quality of the electroplated workpiece.

[0006] The technical scheme adopted by the present application to solve the technical problems is as follows: an electroplating solution impurity sedimentation tank with an overflow tank, comprising:

[0007] A sedimentation tank body is provided, and an electroplating tank and an overflow tank are formed in the sedimentation tank body. The electroplating tank and the overflow tank are separated by a partition wall. The electroplating tank contains electroplating solution. The electroplating solution in the electroplating tank overflows through the upper end of the partition wall into the overflow tank.

[0008] An electroplating solution circulation assembly is arranged, which is used to circulate the electroplating solution in the overflow tank to the electroplating tank. The electroplating solution circulation assembly at least comprises a water pump and an electroplating solution discharge pipe connected to the water pump. The electroplating solution discharge pipe is used to pump the electroplating solution in the overflow tank to the electroplating tank.

[0009] The overflow groove is detachably connected with a plurality of baffle filter plates.

[0010] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0011] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0012] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0013] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0014] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0015] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0016] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0017] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0018] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0019] The plurality of baffle filter plates are stacked along the depth direction of the overflow groove.

[0020] Compared with the prior art, the application provides an electroplating liquid impurity precipitation tank with an overflow groove. When the electroplating liquid with bubbles flows through the baffle filter plate, the bubble wall on the bubble will rub against the surface of the filter screen and be limited by the mesh, which will cause the stability of the bubble to be destroyed and the bubble to be eliminated. Therefore, the filter screen can eliminate part of the bubbles on the electroplating liquid. In addition, when the electroplating liquid flows through the baffle filter plate, the flow rate is slowed down, and the generation of bubbles is reduced. The excessive bubbles are avoided from adhering to the workpiece, and the quality of the electroplated workpiece is affected. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed in the embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0022] Figure 1 It is a whole structure schematic diagram of the electroplating liquid impurity sedimentation tank with overflow groove provided by the embodiment;

[0023] Figure 2 It is a cross-sectional schematic diagram of the electroplating liquid impurity sedimentation tank with overflow groove provided by the embodiment;

[0024] Figure 3 It is an explosion schematic diagram of the baffle filter plate of the electroplating liquid impurity sedimentation tank with overflow groove provided by the embodiment.

[0025] In the figure: 1, sedimentation tank body; 11, electroplating tank; 12, overflow groove; 13, partition wall; 14, baffle filter plate; 141, mounting base plate; 1411, limiting step; 1412, flow guide hole; 1413, reinforcing rib; 142, limiting frame; 143, filter screen; 2, electroplating liquid circulating assembly; 21, water pump; 22, electroplating liquid discharge pipe; 3, support frame. DETAILED DESCRIPTION

[0026] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present application, and cannot be understood as a limitation on the present application.

[0027] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element indicated must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included one or more. In the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0028] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0029] In addition, the technical features involved in the different embodiments of the utility model described above can be combined with each other as long as there is no conflict between them.

[0030] The utility model provides a kind of electroplating liquid impurity sedimentation tank with overflow launder for plating metal layer on the surface of product as Figure 1 、 Figure 2 As shown in figure, a kind of electroplating liquid impurity sedimentation tank with overflow launder for plating metal layer on the surface of product;The main structure of the utility model includes: sedimentation tank body 1 and electroplating liquid circulating assembly 2, sedimentation tank body 1 is equipped with electroplating groove 11 and overflow launder 12.Electroplating groove 11 and overflow launder 12 are separated by partition wall 13, electroplating liquid is contained in electroplating groove 11, and electroplating liquid in electroplating groove 11 overflows to overflow launder 12 through the upper end of partition wall 13.Electroplating groove 11 is used for electroplating workpiece, and overflow launder 12 is used for containing electroplating liquid overflowing from electroplating groove 11, to ensure that the height of electroplating liquid in electroplating groove 11 is maintained at a constant level.Overflow launder 12 also has the effect of precipitating electroplating liquid impurities.Electroplating liquid circulating assembly 2 is used to circulate electroplating liquid in overflow launder 12 to electroplating groove 11, and electroplating liquid circulating assembly 2 at least includes water pump 21 and electroplating liquid discharge pipe 22 connected with water pump 21, and electroplating liquid discharge pipe 22 is used to pump electroplating liquid in overflow launder 12 to electroplating groove 11;Wherein, a plurality of baffling filter plates 14 are detachably connected in overflow launder 12, and baffling filter plate 14 is used to block and eliminate air bubbles flowing into overflow launder 12, and a plurality of baffling filter plates 14 are inclinedly arranged.It can be understood that the baffling filter plate 14 arranged obliquely can slow down the flow rate of electroplating liquid flowing from electroplating groove 11 to overflow launder 12.Avoiding electroplating liquid impacting the liquid level of electroplating liquid in overflow launder 12 at too fast a flow rate, causing too many bubbles in electroplating liquid.At the same time, the filter screen 143 on the baffling filter plate 14 can eliminate the air bubbles on the upper part of electroplating liquid.

[0031] It should be noted that during electroplating operation, electroplating current, mechanical agitation of electroplating liquid and excessive flow of electroplating liquid can all cause electroplating liquid to produce foam.However, when electroplating liquid overflows into overflow launder 12, it will also bring foam to overflow launder 12.At the same time, excessive foam accumulation will overflow the tank, causing waste of electroplating liquid.Moreover, excessive foam will adhere to the workpiece, affecting the quality of electroplated workpiece.

[0032] In this design, when the electroplating solution containing bubbles flows through the baffle filter plate 14, the bubble walls rub against the filter screen surface and are restricted by the mesh openings, causing the bubbles to become unstable and thus eliminated. Specifically, if the size of the foam is larger than the mesh size of the filter screen 143 on the baffle filter plate 14, the foam is more likely to break when attempting to pass through the filter screen 143. Moreover, the fibrous structure of the baffle filter plate 14 can absorb liquid on the surface of the foam, thinning the bubble walls and thus promoting bubble breakage. Therefore, the filter screen 143 on the baffle filter plate 14 can eliminate bubbles in the upper part of the electroplating solution. In addition, the baffle filter plate 14 can slow down the flow rate of the electroplating solution when it flows through the overflow tank 12, reducing the impact of the liquid and thus reducing the generation of bubbles. This prevents excessive bubbles from adhering to the workpiece, which would affect the quality of the electroplated workpiece.

[0033] Furthermore, such as Figure 1 , Figure 2 As shown, several baffle filters 14 are stacked along the depth direction of the overflow tank 12. The multiple layers of baffle filters 14 can eliminate air bubbles in the electroplating solution flowing into the overflow tank 12 layer by layer, thereby improving the effect of bubble elimination.

[0034] It should be noted that, in addition, the opening width of the baffle plate 14 can be set as wide as possible, so that the electroplating solution can flow into the overflow tank 12 along the wider and more uniform opening of the filter screen 143. This avoids the electroplating solution concentrating in one place on the filter screen 143 and generating a large impact force. This further reduces the generation of bubbles during the flow of the electroplating solution.

[0035] In other embodiments, the mesh size of the baffle filter plates 14 is different. That is, by using meshes of different sizes, air bubbles in the electroplating solution are eliminated, thereby improving the effect of eliminating air bubbles in the electroplating solution.

[0036] In this embodiment, the two adjacent baffle filter plates 14 are tilted in opposite directions.

[0037] In this embodiment, the baffle filter plate 14 is further configured to have an adjustable tilt angle. Operators can adjust the tilt angle of the baffle filter plate 14 according to the liquid level.

[0038] In this embodiment, a support frame 3 is provided inside the overflow trough 12, and the support frame 3 is used to install the baffle filter plate 14. The baffle filter plate 14 is detachably connected to the support frame 3. When it is necessary to inspect and repair the baffle filter plate 14, the entire support frame can be removed, and then the baffle filter plates 14 can be inspected and replaced one by one.

[0039] Specifically, the support frame 3 is provided with several connecting parts, and the support frame 3 is connected to both ends of the baffle filter plate 14 via hinges (e.g., Figure 2 and Figure 3(As shown). The baffle filter plate 14 adjusts its tilt angle via a hinge.

[0040] Furthermore, such as Figure 3 As shown, the baffle filter plate 14 includes: a mounting base plate 141, a limiting frame 142, and a filter screen 143. The mounting base plate 141 is detachably connected to the upper end of the partition wall 13. A limiting step 1411 is formed on the outer side wall of the mounting base plate 141, and a flow guide hole 1412 is formed on the mounting base plate 141. The limiting frame 142 is fastened to the mounting base plate 141 and abuts against the limiting step 1411. The filter screen 143 is clamped between the mounting base plate 141 and the limiting frame 142, and the filter screen 143 is used to cover the flow guide hole 1412.

[0041] It is understood that in this embodiment, the filter screen 143 is clamped between the mounting base plate 141 and the limiting frame 142, meaning the filter screen 143 is detachably connected between the mounting base plate 141 and the limiting frame 142. After prolonged use, a large amount of impurities may accumulate on the filter screen 143, affecting its filtration and bubble-eliminating effects. Therefore, the filter screen 143 needs to be replaced periodically.

[0042] Furthermore, such as Figure 3 As shown, both the mounting base 141 and the limiting frame 142 are provided with at least one reinforcing rib 1413. The reinforcing rib 1413 extends along the width direction of the mounting base 141 or the limiting frame 142, and is used to support the filter screen 143. It can be understood that the setting of the reinforcing rib 1413 can increase the structural strength of the mounting base 141 and the limiting frame 142, and at the same time, it can also support the filter screen 143 and prevent the filter screen 143 from loosening and collapsing under long-term rinsing by the electroplating solution.

[0043] Furthermore, filter 143 is made of nylon mesh.

[0044] In summary, this application provides an electroplating solution impurity sedimentation tank with an overflow tank. When the electroplating solution containing bubbles flows through the baffle filter plate 14, the bubble walls rub against the filter screen surface and are restricted by the mesh openings, causing the bubble stability to be disrupted and thus eliminated. Therefore, the filter screen 143 can eliminate some of the bubbles in the electroplating solution. Furthermore, as the electroplating solution flows through the baffle filter plate 14, the flow rate is slowed, reducing bubble generation. This prevents excessive bubble contamination of the workpiece, thus affecting the quality of the electroplated workpiece.

[0045] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A sedimentation tank for impurities in electroplating solution with an overflow tank, characterized in that, include: The sedimentation tank body has an electroplating tank and an overflow tank. The electroplating tank and the overflow tank are separated by a partition wall. The electroplating tank contains electroplating solution, and the electroplating solution in the electroplating tank overflows into the overflow tank through the upper end of the partition wall. An electroplating solution circulation assembly is provided, wherein the electroplating solution circulation assembly is used to circulate the electroplating solution in the overflow tank to the electroplating tank, and the electroplating solution circulation assembly includes at least a water pump and an electroplating solution discharge pipe connected to the water pump, and the electroplating solution discharge pipe is used to pump the electroplating solution in the overflow tank to the electroplating tank. The overflow trough is detachably connected to several baffle filter plates, which are used to block and eliminate air bubbles flowing into the overflow trough. The baffle filter plates are arranged at an angle.

2. The electroplating solution impurity sedimentation tank with overflow tank according to claim 1, characterized in that, Several of the baffle filter plates are stacked along the depth direction of the overflow channel.

3. The electroplating solution impurity sedimentation tank with overflow tank according to claim 1, characterized in that, The adjacent baffle filters are tilted in opposite directions.

4. The electroplating solution impurity sedimentation tank with overflow tank according to claim 1, characterized in that, The baffle filter plate has an adjustable tilt angle.

5. The electroplating solution impurity sedimentation tank with overflow tank according to claim 1, characterized in that, A support frame is provided inside the overflow trough, and the support frame is used to install the baffle filter plate.

6. The electroplating solution impurity sedimentation tank with overflow tank according to claim 1, characterized in that, The baffle filter plate includes: The mounting base plate is detachably connected to the upper end of the partition wall. A limiting step is provided on the outer side wall of the mounting base plate, and a guide hole is provided on the mounting base plate. A limiting frame is fastened to the mounting base plate and abuts against the limiting step; And a filter screen, which is held between the mounting base and the limiting frame, and the filter screen is used to cover the flow guide hole.

7. The electroplating solution impurity sedimentation tank with overflow tank according to claim 6, characterized in that, Both the mounting base plate and the limiting frame are provided with at least one reinforcing rib, which extends along the width direction of the mounting base plate or the limiting frame and is used to support the filter screen.

8. The electroplating solution impurity sedimentation tank with overflow tank according to claim 6, characterized in that, The filter screen is made of nylon.

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