Miniature semiconductor water cooling machine

Abstract

The utility model provides a miniature semiconductor water cooling machine which comprises a water cooling assembly, and the water cooling assembly comprises a U-shaped base, a ventilation square pipe, a supporting column, a screw, a heat dissipation water tank, an installation groove, a refrigeration hole, a transmission plate, a refrigeration sheet, a semiconductor refrigeration plate, a heat dissipation plate, a heat dissipation sheet and a heat dissipation groove. A ventilation square pipe is fixedly connected to one side of the inner bottom wall of the U-shaped base, and supporting columns are welded to the four corners of the upper surface of the ventilation square pipe. Through cooperation of the semiconductor refrigeration plate, the transmission plate and the refrigeration sheet, the heat dissipation water tank can be effectively cooled, so that efficient cooling is provided for equipment needing heat dissipation, meanwhile, the heat dissipation plate and the heat dissipation sheet can timely conduct heat generated by the semiconductor refrigeration plate out through the heat dissipation fan, and the heat dissipation efficiency is improved. Compared with the prior art, stable operation of the water cooling machine is guaranteed, large cooling fins are not needed, the overall size of the water cooling machine is greatly reduced, noise of the water cooling machine is lowered, and influences on mood and working efficiency of people are prevented.

Description

Technical Field

[0001] This utility model relates to the field of water chiller technology, and in particular to a micro semiconductor water chiller. Background Technology

[0002] In today's technological field, water chillers play a crucial role in numerous scenarios. Current mainstream water chillers primarily employ compression refrigeration technology, which, while capable of meeting heat dissipation requirements to some extent, also has some significant drawbacks.

[0003] On the one hand, compression refrigeration water chillers are usually equipped with large heat dissipation fins, which not only occupy a lot of space, making the overall size of the water chiller quite large; on the other hand, the fan noise of compression refrigeration water chillers is relatively loud, affecting people's mood and work efficiency. Therefore, a micro semiconductor water chiller has been proposed. Utility Model Content

[0004] In view of this, the present invention aims to provide a micro semiconductor water chiller to solve or alleviate the technical problems existing in the prior art, and at least provide a beneficial alternative.

[0005] The technical solution of this utility model embodiment is implemented as follows: a micro semiconductor water cooler, including a water cooling component, the water cooling component including a U-shaped base, a ventilation square tube, a support column, a heat dissipation water tank, a mounting groove, a cooling hole, a transfer plate, a cooling chip, a semiconductor cooling plate, a heat dissipation plate, a heat dissipation fin, and a heat dissipation groove;

[0006] A ventilation square tube is fixedly connected to one side of the inner bottom wall of the U-shaped base. Support columns are fixedly connected to the four corners of the upper surface of the ventilation square tube. A heat dissipation water tank is fixedly connected to the upper surface of the four support columns. The lower surface of the heat dissipation water tank has mounting grooves at the front and rear. A cooling hole is formed at the center of the inner top wall of the mounting groove. A transfer plate is fixedly connected to the inner side wall of the mounting groove. Multiple cooling fins are welded to the middle of the upper surface of the transfer plate. The top of the cooling fins penetrates the interior of the cooling hole. A semiconductor cooling plate is fixedly connected to the bottom of the transfer plate. A heat dissipation plate is fixedly connected to the bottom of the semiconductor cooling plate. Multiple heat dissipation fins are welded to the middle of the lower surface of the heat dissipation plate. Heat dissipation grooves are formed at the front and rear of the upper surface of the ventilation square tube. The bottom of the heat dissipation fins penetrates the interior of the heat dissipation grooves.

[0007] More preferably, the rear surface of the ventilation square tube is connected to a heat dissipation frame, the rear surface of the heat dissipation frame is fixedly connected to a heat dissipation fan, and the rear surface of the U-shaped base has an air outlet on the side near the heat dissipation fan.

[0008] More preferably, the front surface of the U-shaped base has multiple air inlet slots on the side near the ventilation square tube.

[0009] More preferably, a water outlet pipe is connected to the center of the front surface of the radiator, and a water pump is connected to the end of the water outlet pipe away from the radiator. The outer side wall of the water pump is fixedly connected to the other side of the inner bottom wall of the U-shaped base by a support frame.

[0010] More preferably, the rear part of the heat dissipation tank near the water pump is connected to a water inlet connector.

[0011] In a further preferred embodiment, a mounting groove is provided on the rear surface of the U-shaped base away from the cooling fan, and a temperature controller is fixedly connected to the inner wall of the mounting groove. The input terminals of the semiconductor cooling plate and the cooling fan are both electrically connected to the output terminal of the temperature controller.

[0012] More preferably, a sealing groove is formed on the outer side of the inner top wall of the mounting groove near the cooling hole, and a sealing ring is attached to the inner side wall of the sealing groove, with the bottom of the sealing ring attached to the outer side of the upper surface of the transfer plate.

[0013] More preferably, a protective shell is fixedly connected to the outer wall of the heat dissipation tank, and a U-shaped cover is fixedly connected to the outer wall of the U-shaped base.

[0014] The present invention has the following advantages due to the adoption of the above technical solution:

[0015] This invention, through the cooperation of a semiconductor cooling plate, a transfer plate, and cooling fins, can effectively cool the water tank, thereby providing efficient cooling for equipment requiring heat dissipation. At the same time, the heat dissipation plate and fins can promptly conduct the heat generated by the semiconductor cooling plate away through the cooling fan, ensuring the stable operation of the water chiller. It does not require large heat dissipation fins, which not only greatly reduces the overall size of the water chiller but also reduces the noise of the water chiller, preventing it from affecting people's mood and work efficiency.

[0016] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1This is a structural view of the present invention from one perspective;

[0019] Figure 2 This is another structural view of the present invention;

[0020] Figure 3 This is a structural diagram of the ventilation square tube and heat dissipation water tank of this utility model;

[0021] Figure 4 This is a structural diagram of the transfer plate and sealing ring of this utility model.

[0022] Reference numerals: 1. Water-cooled assembly; 11. U-shaped base; 12. Ventilation square tube; 13. Support column; 15. Water tank; 16. Mounting groove; 17. Cooling hole; 18. Transfer plate; 19. Cooling chip; 20. Semiconductor cooling plate; 21. Heat sink; 22. Heat sink fin; 23. Heat sink groove; 24. Heat sink frame; 25. Cooling fan; 26. Air outlet; 27. Air inlet groove; 28. Water outlet pipe; 29. ​​Water pump; 30. Support frame; 31. Water inlet connector; 32. Mounting groove; 33. Thermostat; 34. Sealing groove; 35. Sealing ring; 36. Protective shell; 37. U-shaped cover. Detailed Implementation

[0023] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0024] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0025] like Figures 1-4 As shown, this utility model embodiment provides a micro semiconductor water cooler, including a water cooling component 1. The water cooling component 1 includes a U-shaped base 11, a ventilation square tube 12, a support column 13, a heat dissipation tank 15, a mounting groove 16, a cooling hole 17, a transfer plate 18, a cooling chip 19, a semiconductor cooling plate 20, a heat dissipation plate 21, a heat dissipation fin 22, and a heat dissipation groove 23.

[0026] A ventilation square tube 12 is fixedly connected to one side of the inner bottom wall of the U-shaped base 11. Support columns 13 are fixedly connected to the four corners of the upper surface of the ventilation square tube 12. A heat dissipation tank 15 is fixedly connected to the upper surface of the four support columns 13. The lower surface of the heat dissipation tank 15 has mounting grooves 16 at the front and rear. A cooling hole 17 is opened at the center of the inner top wall of the mounting groove 16. A transfer plate 18 is fixedly connected to the inner side wall of the mounting groove 16. Multiple cooling plates 19 are welded to the middle of the upper surface of the transfer plate 18. The top of the cooling plates 19 penetrates the interior of the cooling hole 17. A semiconductor cooling plate 20 is fixedly connected to the bottom of the transfer plate 18. A heat sink 21 is fixedly connected to the bottom of the semiconductor cooling plate 20. Multiple heat sinks 22 are welded to the middle of the lower surface of the heat sink 21. A heat dissipation groove 23 is opened at the front and rear of the upper surface of the ventilation square tube 12. The bottom of the heat sink 22 penetrates the interior of the heat dissipation groove 23.

[0027] In one embodiment, specifically: the rear surface of the ventilation square tube 12 is connected to a heat dissipation frame 24, the rear surface of the heat dissipation frame 24 is fixedly connected to a heat dissipation fan 25, and the rear surface of the U-shaped base 11 is provided with an air outlet 26 on the side near the heat dissipation fan 25, so that the heat dissipation plate 21 inside the ventilation square tube 12 can be discharged through the heat dissipation fan 25.

[0028] In one embodiment, specifically: the front surface of the U-shaped base 11 is provided with a plurality of air inlet slots 27 on the side near the ventilation square tube 12, so that external air can enter the ventilation square tube 12 through the air inlet slots 27, thereby circulating the air inside the ventilation square tube 12.

[0029] In one embodiment, specifically: a water outlet pipe 28 is connected to the center of the front surface of the heat dissipation tank 15, and a water pump 29 is connected to the end of the water outlet pipe 28 away from the heat dissipation tank 15. The outer wall of the water pump 29 is fixedly connected to the other side of the inner bottom wall of the U-shaped base 11 through the support frame 30. The water pump 29 facilitates the pumping of water from the heat dissipation tank 15 through the water outlet pipe 28 to flow to the equipment that needs heat dissipation.

[0030] In one embodiment, specifically: a water inlet connector 31 is connected to the rear part of the side of the heat dissipation tank 15 near the water pump 29. The water inlet connector 31 on the heat dissipation tank 15 facilitates the connection of the water inlet pipe, so that the water flowing to the heat dissipation equipment can be recycled back into the heat dissipation tank 15 for cooling.

[0031] In one embodiment, specifically: a mounting groove 32 is provided on the rear surface of the U-shaped base 11 away from the cooling fan 25, and a thermostat 33 is fixedly connected to the inner wall of the mounting groove 32. The input terminals of the semiconductor cooling plate 20 and the cooling fan 25 are electrically connected to the output terminal of the thermostat 33, so that the start-up, stop and working status of the semiconductor cooling plate 20 and the cooling fan 25 can be easily controlled by the thermostat 33.

[0032] In one embodiment, specifically: a sealing groove 34 is provided on the outer side of the inner top wall of the mounting groove 16 near the cooling hole 17, and a sealing ring 35 is attached to the inner side wall of the sealing groove 34. The bottom of the sealing ring 35 is attached to the outer side of the upper surface of the transfer plate 18. The sealing ring 35 in the sealing groove 34 seals the connection between the mounting groove 16 and the transfer plate 18, thereby preventing water leakage in the heat dissipation tank 15.

[0033] In one embodiment, specifically: a protective shell 36 is fixedly connected to the outer wall of the heat dissipation tank 15, and a U-shaped cover 37 is fixedly connected to the outer wall of the U-shaped base 11. The protective shell 36 facilitates the protection and heat preservation of the heat dissipation tank 15, and the U-shaped cover 37 facilitates the protection of the internal components of the U-shaped base 11.

[0034] In operation, when the equipment requires heat dissipation, the temperature controller 33 activates the semiconductor cooling plate 20 and the cooling fan 25. The semiconductor cooling plate 20 begins to work, transferring cooling energy to the cooling element 19 via the transfer plate 18. The cooling element 19, passing through the cooling hole 17, cools the water in the heat dissipation tank 15, thereby cooling the equipment that needs heat dissipation. Simultaneously, the heat generated by the semiconductor cooling plate 20 is conducted to the heat sink 21, where the heat sink 22 on the lower surface of the heat sink 21 absorbs the heat. After the cooling fan 25 starts, air flows from the U-shaped base. The air inlet 27 on the front surface of the U-shaped base 11 enters the ventilation square tube 12. The air in the ventilation square tube 12 flows under the action of the cooling fan 25. When it passes the lower part of the cooling slot 23, it carries away the heat on the heat sink 22. The hot air is finally discharged from the air outlet 26 on the rear surface of the U-shaped base 11. The water in the cooling water tank 15 circulates under the action of the water pump 29. The water enters the cooling water tank 15 from the water inlet connector 31, and after being cooled, it flows out from the water outlet pipe 28 and then flows to the equipment that needs to be cooled. After absorbing the heat generated by the equipment, it returns to the cooling water tank 15 for cooling. This cycle repeats continuously.

[0035] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A miniature semiconductor water chiller, characterized in that: The water cooling assembly (1) includes a U-shaped base (11), a ventilation square tube (12), a support column (13), a heat dissipation tank (15), a mounting groove (16), a cooling hole (17), a transfer plate (18), a cooling chip (19), a semiconductor cooling plate (20), a heat dissipation plate (21), a heat dissipation fin (22), and a heat dissipation groove (23). A ventilation square tube (12) is fixedly connected to one side of the inner bottom wall of the U-shaped base (11). Support columns (13) are fixedly connected to the four corners of the upper surface of the ventilation square tube (12). A heat dissipation water tank (15) is fixedly connected to the upper surface of the four support columns (13). Installation grooves (16) are provided at the front and rear of the lower surface of the heat dissipation water tank (15). A cooling hole (17) is provided at the center of the inner top wall of the installation groove (16). A transfer plate (18) is fixedly connected to the inner side wall of the installation groove (16). Multiple cooling chips (19) are welded to the middle of the upper surface of the tube. The top of the cooling chip (19) passes through the interior of the cooling hole (17). A semiconductor cooling plate (20) is fixedly connected to the bottom of the transfer plate (18). A heat sink (21) is fixedly connected to the bottom of the semiconductor cooling plate (20). Multiple heat sinks (22) are welded to the middle of the lower surface of the heat sink (21). Heat dissipation grooves (23) are opened at the front and rear of the upper surface of the ventilation square tube (12). The bottom of the heat sink (22) passes through the interior of the heat dissipation groove (23).

2. The micro semiconductor water cooler according to claim 1, characterized in that: The rear surface of the ventilation square tube (12) is connected to a heat dissipation frame (24), and a heat dissipation fan (25) is fixedly connected to the rear surface of the heat dissipation frame (24). An air outlet (26) is opened on the rear surface of the U-shaped base (11) near the side of the heat dissipation fan (25).

3. The micro semiconductor water cooler according to claim 2, characterized in that: The front surface of the U-shaped base (11) near the ventilation square tube (12) has multiple air inlet slots (27).

4. The micro semiconductor water cooler according to claim 1, characterized in that: A water outlet pipe (28) is connected to the center of the front surface of the heat dissipation tank (15). A water pump (29) is connected to the end of the water outlet pipe (28) away from the heat dissipation tank (15). The outer wall of the water pump (29) is fixedly connected to the other side of the inner bottom wall of the U-shaped base (11) by a support frame (30).

5. The micro semiconductor water cooler according to claim 4, characterized in that: The rear part of the heat dissipation tank (15) near the water pump (29) is connected to a water inlet connector (31).

6. The micro semiconductor water cooler according to claim 2, characterized in that: The rear surface of the U-shaped base (11) away from the cooling fan (25) has an installation groove (32). A thermostat (33) is fixedly connected to the inner wall of the installation groove (32). The input terminals of the semiconductor cooling plate (20) and the cooling fan (25) are electrically connected to the output terminal of the thermostat (33).

7. The micro semiconductor water cooler according to claim 1, characterized in that: A sealing groove (34) is provided on the outer side of the inner top wall of the mounting groove (16) near the cooling hole (17). A sealing ring (35) is attached to the inner side wall of the sealing groove (34). The bottom of the sealing ring (35) is attached to the outer side of the upper surface of the transfer plate (18).

8. The micro semiconductor water cooler according to claim 1, characterized in that: The outer wall of the heat dissipation tank (15) is fixedly connected to a protective shell (36), and the outer wall of the U-shaped base (11) is fixedly connected to a U-shaped cover (37).

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