Sealing door mechanism and semiconductor process equipment

Abstract

The utility model belongs to the technical field of semiconductor process equipment, and discloses a sealing door mechanism and semiconductor process equipment. The sealing door mechanism comprises a sliding assembly, a door body and a driving assembly, the sliding assembly comprises a guide rail and a low-dust-generation sliding block, and the low-dust-generation sliding block is installed on the guide rail in a sliding mode. The door body is installed on the low-dust-generation sliding block and can move to a first preset position and a second preset position along the guide rail. The driving assembly comprises a driving piece and a low-dust-emission connecting piece, and the driving piece can enable the door body to move to any one of the first preset position and the second preset position through the low-dust-emission connecting piece. Through the sealing door mechanism, the opening and the sealing of the equipment opening can be realized, and meanwhile, the low-dust-emission sliding block and the low-dust-emission connecting piece can obviously reduce particulate matters and metal ions generated due to the friction effect, so that the cleanliness of the internal environment of the semiconductor process device is protected, and the service life of the semiconductor process device is prolonged. Therefore, high product quality and yield of the processing technology of products such as wafers and the like can be ensured.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor process equipment technology, and in particular to a sealing door mechanism and semiconductor process equipment. Background Technology

[0002] A SiC high-temperature furnace is a semiconductor process equipment specifically designed for handling silicon carbide (SiC) materials. It is primarily used for high-temperature annealing and ion activation processes of SiC devices, as well as high-temperature oxidation processes of SiC wafers. The wafer transfer device of the SiC high-temperature furnace is designed with a loading port and a gate. This gate controls the opening and closing of the loading port to allow the wafer cassette to pass smoothly or close properly. Specifically, the gate opens when the wafer cassette needs to pass through the loading port; otherwise, the gate remains closed to ensure a stable furnace environment.

[0003] Most existing wafer transfer devices use a sliding connection between path rollers and path guides to achieve the opening and closing of the gate. While this design achieves its function to a certain extent, it has significant drawbacks: when the path rollers slide to the end of the path guides, the friction between them easily generates particulate matter and metal ions. If these particles and metal ions are not effectively controlled, they will contaminate the microenvironment inside the wafer transfer device and adhere to the wafers, severely affecting their cleanliness. This contamination not only reduces wafer quality but also adversely affects subsequent processing steps, with the most direct consequence being a significant decrease in the yield of processed products.

[0004] Therefore, there is an urgent need for a sealing door mechanism and semiconductor process equipment to solve the above-mentioned technical problems. Utility Model Content

[0005] One objective of this invention is to provide a sealing door mechanism that can reduce particulate matter and metal ions generated by friction, thereby protecting the process environment and preventing wafer contamination.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A sealing door mechanism for opening and sealing equipment openings includes a sliding assembly, a door body, and a drive assembly. The sliding assembly includes a guide rail and a low-dust-emission slider. The guide rail is fixedly installed, and the low-dust-emission slider is slidably mounted on the guide rail. The door body is mounted on the low-dust-emission slider and can move along the guide rail to a first preset position and a second preset position. When the door body is in the first preset position, the door opens the equipment opening; when the door body is in the second preset position, the door seals the equipment opening. The drive assembly includes a drive component and a low-dust-emission connector. The drive component is drivenly connected to the low-dust-emission connector, and the low-dust-emission connector is connected to the door body. The drive component can move the door body to either the first or second preset position via the low-dust-emission connector.

[0008] The beneficial effects of the sealing door mechanism provided by this utility model are as follows: This sealing door mechanism enables both opening and sealing of equipment openings, meeting the needs of material entry and exit and stabilizing the process environment. Simultaneously, the low-dust slider and low-dust connector significantly reduce particulate matter generated by friction, thereby reducing metal ions generated at high temperatures and protecting the cleanliness of the internal environment of the semiconductor process equipment. This ensures high product quality and yield when processing wafers and other products.

[0009] In some embodiments, the sealing door mechanism further includes a door frame, which is fixedly installed at the equipment opening. The door frame is fixedly connected to guide rails, and when the door is in a second preset position, the door and door frame can seal against each other to seal the equipment opening. A guide rail is installed on each side of the equipment opening, and the two guide rails are parallel and slidably connected to low-dust-generating sliders. At least one low-dust-generating slider is connected to each side of the door, and the low-dust-generating sliders are made of non-metallic materials. This allows a uniformly thick gap to be formed between the door frame and the door, thereby facilitating a better sealing effect.

[0010] In some embodiments, the door body is connected with a positioning pin, and the low-dust-generating connector includes a spherical bearing. The spherical bearing is made of a non-metallic material, and the positioning pin passes through the spherical bearing to drive the door body and the low-dust-generating connector. In this way, the spherical bearing can further reduce particulate matter and metal ions generated by friction.

[0011] In some embodiments, the aforementioned non-metallic material includes resin. Resin has a high surface smoothness and is less prone to generating fine particulate matter due to friction, impact, or vibration, thus significantly reducing dust generation.

[0012] In some embodiments, the driving component includes a double-acting cylinder with a piston inside, which divides the double-acting cylinder into a first air chamber and a second air chamber. The double-acting cylinder has a first air passage interface and a second air passage interface, the first air passage interface communicating with the first air chamber and the second air passage interface communicating with the second air chamber. The second air passage interface is sequentially connected to a pilot-operated throttle valve and a three-position five-way solenoid valve. The pilot-operated throttle valve includes a pilot valve and a main valve, the pilot valve controlling the on / off state of the main valve, and the main valve connected between the second air passage interface and the three-position five-way solenoid valve. The first air passage interface is sequentially connected to a throttle valve, a three-way air connector, and a three-position five-way solenoid valve, with the three-way air connector connected between the throttle valve, the pilot valve, and the three-position five-way solenoid valve. This prevents the door from moving during power failure, providing power-off protection.

[0013] In some embodiments, magnetic switches are provided at both ends of the double-acting cylinder, and the magnetic switches are used to sense the position of the piston inside the double-acting cylinder. By detecting the position of the piston, the controller of the semiconductor process equipment can easily identify the position of the door, thereby achieving automated detection and control.

[0014] In some embodiments, the sealing door mechanism further includes a microswitch disposed at the end of the guide rail. The microswitch is used to detect whether the door is in a first preset position and / or a second preset position, and the triggering structure of the microswitch is made of resin. After obtaining the position information of the door, the controller of the semiconductor process equipment can identify whether the door is in the preset position, thereby realizing automated detection and control.

[0015] In some embodiments, the door body is further connected to a fixing member, which has a wedge-shaped portion located between the two ends of the guide rail. An abutment slope is provided on the end of the wedge-shaped portion near the microswitch. The microswitch includes a resin rolling element, which serves as a trigger structure. The abutment slope abuts against the resin rolling element and triggers the microswitch. During the triggering process, rolling friction is generated between the abutment slope and the resin rolling element, with a relatively small abutment pressure. This significantly reduces particulate matter generated by friction, protecting the internal environment of the semiconductor process equipment.

[0016] In some embodiments, the sealing door mechanism further includes a buffer, with at least one buffer provided at each end of the guide rail. The buffer is used to cushion and brake the door body, preventing excessive vibration of the door body and thus avoiding the generation of particulate matter due to friction or collision caused by vibration.

[0017] In some embodiments, the sealing door mechanism further includes a safety component, which includes a safety light curtain. The safety light curtain can detect whether there are foreign objects at the second preset position and in the equipment opening, thereby sending a corresponding signal to the controller of the semiconductor process equipment to prevent damage to operators or materials after the door moves.

[0018] Another objective of this invention is to provide a semiconductor process equipment that can produce wafers with high cleanliness and superior yield.

[0019] To achieve this objective, the present invention adopts the following technical solution:

[0020] Semiconductor process equipment, the semiconductor process equipment has an equipment opening, and the equipment opening is provided with the aforementioned sealing door mechanism, the sealing door mechanism is used to open and seal the equipment opening.

[0021] The beneficial effects of the semiconductor process equipment provided by this utility model are as follows: By setting up the sealing door mechanism, the opening and sealing of the equipment can be realized, meeting the needs of material entry and exit and the need for a stable process environment. At the same time, the low-dust slider and low-dust connector can significantly reduce particulate matter generated by friction, thereby reducing the metal ions generated at high temperatures, protecting the cleanliness of the internal environment of the semiconductor process equipment, and thus ensuring that the processing of wafers and other products can achieve high product quality and yield. Attached Figure Description

[0022] Figure 1 This is a three-dimensional structural diagram of the semiconductor process equipment provided by this utility model;

[0023] Figure 2 This is a three-dimensional structural diagram of the sealing door mechanism provided by this utility model;

[0024] Figure 3 This is an exploded view of the sealing door mechanism provided by this utility model;

[0025] Figure 4 yes Figure 3 A magnified view of a section at point A in the middle;

[0026] Figure 5 This is a front view of the sealing door mechanism provided by this utility model;

[0027] Figure 6 yes Figure 3 A magnified view of a section at point B in the middle;

[0028] Figure 7 yes Figure 5 A magnified view of a section at point C;

[0029] Figure 8 yesFigure 3 A magnified view of a section at point D;

[0030] Figure 9 yes Figure 5 A magnified view of a section at point E in the middle;

[0031] Figure 10 yes Figure 3 A magnified view of a section at point F in the middle;

[0032] Figure 11 This is a schematic diagram showing the connection between the driving component and the low-dust-generating connector in this utility model;

[0033] Figure 12 This is a pneumatic circuit diagram of the drive component when the sealing device opens in this utility model;

[0034] Figure 13 This is a pneumatic circuit diagram of the drive component when the openable device opens in this utility model;

[0035] Figure 14 This is the pneumatic circuit diagram of the power interruption drive component of this utility model.

[0036] In the picture:

[0037] 100. Cabinet body; 200. First preset position; 300. Second preset position;

[0038] 11. Guide rail; 12. Low-dust slider;

[0039] 21. Door body; 22. Fastener; 221. Wedge-shaped part; 2211. Abutting slope; 222. Abutting plane; 23. Locating pin;

[0040] 31. Low-dust-generating connector; 32. Drive component; 321. First air chamber; 322. Second air chamber; 323. Piston;

[0041] 41. Door frame; 42. Micro switch; 421. Resin rolling element; 43. Buffer;

[0042] 51. Fixing plate; 511. Through slot; 52. Baffle; 53. Safety light curtain; 54. Detection light;

[0043] 61. Gas source; 62. Main solenoid valve; 63. Adapter; 64. Three-position five-way solenoid valve; 65. Three-way gas connection; 66. Throttling valve; 67. Pilot-operated throttle valve. Detailed Implementation

[0044] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0045] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0046] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0047] In the description of this embodiment, the terms "upper," "lower," "right," and "left," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0048] The following is based on the appendix Figure 1 To be continued Figure 14 This invention introduces the sealing door mechanism and semiconductor process equipment provided by this utility model.

[0049] like Figure 1 , Figure 2 As shown, in this embodiment, the sealing door mechanism is installed at the equipment opening of the semiconductor process equipment. This sealing door mechanism can seal the equipment opening to maintain the internal process environment (see reference). Figure 1 As shown), the equipment opening can also be left open to facilitate the entry or exit of materials into or out of the semiconductor process equipment (see reference).Figure 2 (As shown).

[0050] Specifically, such as Figure 2 , Figure 3 As shown, in this embodiment, the sealing door mechanism mainly includes a sliding assembly, a door body 21, and a driving assembly. The sliding assembly includes a guide rail 11 and a low-dust-generating slider 12. The guide rail 11 is fixedly installed on the cabinet 100 of the semiconductor process equipment, with one guide rail 11 on each side of the equipment opening. The low-dust-generating slider 12 is slidably installed on the guide rail 11. The door body 21 is installed on the low-dust-generating slider 12 and can move along the guide rail 11 to a first preset position 200 and a second preset position 300. When the door body 21 is in the first preset position 200, the door body 21 opens the equipment opening, allowing materials to enter and exit the semiconductor process equipment through the opening. When the door body 21 is in the second preset position 300, the door body 21 seals the equipment opening, thereby maintaining a stable process environment within the semiconductor process equipment. The drive assembly includes a drive component 32 and a low-dust-generating connector 31. The low-dust-generating connector 31 is connected to the door body 21 and is connected to the drive component 32 in a transmission manner, so that the drive component 32 can drive the door body 21 to move through the low-dust-generating connector 31, so that the door body 21 moves to a first preset position 200 or a second preset position 300.

[0051] For example, in this embodiment, the guide rail 11 is arranged vertically, the first preset position 200 is located above the second preset position 300, and the first preset position 200 and the side wall of the cabinet 100 of the semiconductor process equipment are set at the same height as the ground, and the second preset position 300 and the equipment opening on the side wall are set at the same height as the ground. When the door 21 slides upward along the guide rail 11 to the first preset position 200, the material can pass horizontally through the second preset position 300 and the equipment opening to enter the semiconductor process equipment, or sequentially pass through the equipment opening and the second preset position 300 to leave the semiconductor process equipment. When the door 21 slides downward along the guide rail 11 to the second preset position 300, due to the obstruction of the side wall of the cabinet 100 and the door 21, the material cannot enter or leave the semiconductor process equipment through the first preset position 200 and the second preset position 300, thereby achieving the sealing of the equipment opening and the maintenance of the process environment.

[0052] Compared to conventional aluminum, stainless steel, and other metal sliders and connectors, the low-dust slider 12 and low-dust connector 31 used in this invention have low dust generation characteristics, meaning that during use, they will not generate debris, dust, or other foreign matter due to friction or collision. Therefore, the aforementioned sealing door mechanism can achieve both opening and sealing of the equipment opening, meeting the needs of material entry and exit and maintaining a stable process environment. Simultaneously, the low-dust slider 12 and low-dust connector 31 can significantly reduce particulate matter generated by friction, thereby reducing metal ions generated at high temperatures, protecting the cleanliness of the internal environment of the semiconductor process equipment, and ensuring high product quality and yield rates in the processing of wafers and other products.

[0053] like Figure 2 , Figure 3 As shown, in this embodiment, the sealing door mechanism further includes a door frame 41, which is fixedly installed at the equipment opening. The aforementioned guide rail 11 is fixedly installed on the door frame 41. It should be noted that, compared to directly forming a sealing contact between the door body 21 and the side wall of the cabinet 100, sealing the equipment opening by forming a sealing contact between the door frame 41 and the door body 21 can achieve a better sealing effect with lower equipment cost. Of course, in some embodiments, the equipment opening can also be sealed directly by forming a sealing contact between the side wall of the cabinet 100 and the door 21, which is also within the scope of protection of this utility model.

[0054] Continue to refer to Figure 3 As shown, in this embodiment, two guide rails 11 are arranged in parallel and slidably connected to the aforementioned low-dust-generating sliders 12. Two low-dust-generating sliders 12 are connected to each side of the door body 21. Connecting two low-dust-generating sliders 12 to each side can improve the parallelism between the door body 21 and the guide rails 11, avoiding uneven thickness gaps between the door body 21 and the door frame 41 (or the side wall of the cabinet 100), which would result in poor or unstable sealing performance. Of course, in some embodiments, one low-dust-generating slider 12 can also be connected to each side of the door body 21. Simply setting the length of the low-dust-generating slider 12 along the extension direction of the guide rail 11 to a larger value can also achieve a similar effect in ensuring sealing performance.

[0055] Specifically, the low-dust slider 12 is preferably made of non-metallic materials, such as resin or plastic materials with low dust generation characteristics. Taking resin materials as an example, compared with metallic materials, it has a lower coefficient of surface friction and inherent lubrication properties. During friction, it can maintain the stability of the surface material and reduce the shedding of microparticles, thus possessing low dust generation characteristics. At the same time, resin itself is easy to achieve high-quality surface smoothing and has excellent chemical corrosion resistance, enabling it to maintain surface smoothness for a long time in semiconductor manufacturing processes, exhibiting good smoothness retention capabilities. Therefore, it can maintain low dust generation characteristics during long-term use. Of course, using resin or similar polymers as a matrix, by adding any additive such as reinforcing fibers, solid lubricants, reinforcing agents, and heat stabilizers, plastic materials with low dust generation characteristics can also be formed, which also fall within the scope of protection of this utility model.

[0056] Meanwhile, preferably, the guide rail 11 is made of metal, which is not easy to bend and deform, and has better rigidity, strength and service life, ensuring that the door body 21 and the low dust-generating slider 12 can move stably in the vertical direction between the first preset position 200 and the second preset position 300.

[0057] like Figure 3 , Figure 4 As shown, in this embodiment, the aforementioned low-dust-generating connector 31 includes a spherical bearing, which is also made of a non-metallic material such as resin or plastic with low dust-generating properties. A fixing member 22 is provided on the side of the door body 21, and a positioning pin 23 is connected to the fixing member 22. The positioning pin 23 passes through the spherical bearing, and the driving member 32 can move the spherical bearing, thereby moving the door body 21 via the spherical bearing and the positioning pin 23. Because a spherical bearing is used, the positioning pin 23 can rotate slightly during movement without friction with the spherical bearing, further reducing particulate matter generation and improving the smoothness of the door body 21's movement. Optionally, the positioning pin 23 can also be made of metal, which has superior strength and service life.

[0058] Of course, in some embodiments, the low-dust-generating connector 31 includes a resin block with a connecting hole, and the positioning pin 23 passes through the connecting hole, which can also achieve the effect of connecting the door body 21 and the drive component 32 through the low-dust-generating connector 31. Optionally, in some other embodiments, other structures of the low-dust-generating connector 31 can also be used, as long as the door body 21 can be connected to the drive component 32 through the low-dust-generating connector 31, it falls within the scope of protection of this utility model.

[0059] like Figure 6 , Figure 7As shown, in this embodiment, the sealing door mechanism also includes two microswitches 42. A microswitch 42 is provided at the upper end of one guide rail 11, and this microswitch 42 is used to detect whether the door body 21 is in a first preset position 200; a microswitch 42 is provided at the lower end of the other guide rail 11, and this microswitch 42 is used to detect whether the door body 21 is in a second preset position 300. After obtaining the position information of the door body 21, the controller of the semiconductor process equipment can identify whether the door body 21 is in the preset position, thereby achieving automated detection and control.

[0060] Furthermore, the micro switch 42 also has a trigger structure made of resin, so that when the trigger structure is triggered by an external force from the door 21 or the aforementioned fixing member 22, particulate matter can be avoided from being generated between it and the door 21 or the fixing member 22 due to friction. Of course, in some embodiments, micro switches 42 can be provided at both ends of a guide rail 11, or other methods such as light sensors can be used to sense whether the door 21 is in the first preset position 200 and the second preset position 300, or only whether the door 21 is in one of the first preset position 200 and the second preset position 300 can be detected. This utility model does not make specific limitations on these aspects.

[0061] For example, in some embodiments, the light sensor can be a slotted photoelectric sensor, and a sensing plate is provided on the door 21. When the sensing plate moves to the slotted photoelectric sensor, the slotted photoelectric sensor can be triggered, thereby realizing the identification of the position of the door 21. Of course, compared with the slotted photoelectric sensor, the micro switch 42 also has the characteristics of long service life, low probability of false triggering, and high temperature resistance, which is more conducive to realizing low-cost and high-reliability position identification.

[0062] More specifically, in this embodiment, the microswitch 42 includes a resin rolling element 421, which is the triggering structure described above. The fixing member 22 is provided with a wedge-shaped portion 221, located between the two ends of the guide rail 11. The end of the wedge-shaped portion 221 near the microswitch 42 is also provided with an abutting inclined surface 2211. When the door body 21 is located at the first preset position 200 and the second preset position 300, the wedge-shaped portion 221 is located between the door body 21 and the rolling element, and the abutting inclined surface 2211 abuts against the resin rolling element 421 and triggers the microswitch 42. Furthermore, the abutting inclined surface 2211 and the movement direction of the door body 21 are set at an angle. During the triggering process of the microswitch 42, the abutting inclined surface 2211 can form rolling friction with the resin rolling element 421, and has a small abutting pressure, thereby greatly reducing particulate matter generated by friction and protecting the internal environment of the semiconductor process equipment.

[0063] Furthermore, such as Figure 8 , Figure 9As shown, the sealing door mechanism also includes a buffer 43. At least one buffer 43 is provided at each end of the guide rail 11. The buffer 43 is used to buffer and brake the door body 21 to prevent the door body 21 from vibrating excessively, thereby avoiding the generation of particulate matter due to friction or collision caused by vibration. Preferably, in this embodiment, the buffer 43 is a hydraulic buffer 43. One hydraulic buffer 43 is provided at the upper end of one guide rail 11, and another hydraulic buffer 43 is provided at the lower end of the same guide rail 11. The end of the fixing member 22 forms an abutment plane 222, which can abut against the hydraulic buffer 43 when the door body 21 reaches the first preset position 200 and the second preset position 300 to achieve smooth braking. Compared with sudden braking, it can further reduce the generation of particulate matter.

[0064] like Figure 2 , Figure 10 As shown, in this embodiment, the sealing door mechanism also includes a safety component, which includes a safety light curtain 53. The safety light curtain 53 can detect whether there are foreign objects in the opening of the device.

[0065] Specifically, the safety component also includes a baffle 52 and two fixing plates 51. The two fixing plates 51 are respectively disposed at the second preset position 300 and are arranged in an L-shape. The baffle 52 is connected between the two fixing plates 51, thereby giving the safety component high structural strength. In this embodiment, the safety light curtain 53 includes a transmitter and a receiver. The transmitter and receiver are respectively mounted on a fixing plate 51, and the detection light 54 emitted by the transmitter can be received by the receiver after passing through the second preset position 300, thereby detecting whether there are foreign objects in the second preset position 300 and the equipment opening. For example, when an operator crawls into the equipment opening or when material stagnates in the equipment opening, the presence of foreign objects can be identified by the detection of the safety light curtain 53, thereby sending a corresponding signal to the controller to prevent the door 21 from moving again, which could cause injury to the operator or material.

[0066] Preferably, the transmitting end and the receiving end are installed on the side of the fixing plate 51 away from the second preset position 300, so that the fixing plate 51 can provide a certain anti-collision protection for the safety light curtain 53. In addition, the fixing plate 51 is also provided with a through groove 511 to facilitate the detection light 54 to pass through the through groove 511, thereby ensuring the realization of the foreign object detection function.

[0067] like Figure 11As shown, in this embodiment, the driving component 32 is a double-acting cylinder. A piston 323 is installed inside the double-acting cylinder, dividing it into a first air chamber 321 and a second air chamber 322. The double-acting cylinder has a first air passage interface and a second air passage interface. The first air passage interface communicates with the first air chamber 321, and the second air passage interface communicates with the second air chamber 322. By charging and decharging the first air chamber 321 and the second air chamber 322 through the first and second air passage interfaces respectively, the position of the piston 323 can be changed. The end of the piston 323 extends out of the double-acting cylinder and connects to the low-dust-generating connector 31, thereby driving the movement of the door 21. Optionally, magnetic switches are provided at both ends of the double-acting cylinder. The magnetic switches are used to sense the position of the piston 323 inside the double-acting cylinder, thereby facilitating automated control.

[0068] Preferably, in order to achieve power failure protection, such as Figures 12 to 14 As shown, in this embodiment, the double-acting cylinder is also connected to a pilot-operated throttle valve 67, a throttle valve 66, and a three-position five-way solenoid valve 64. Specifically, the second air passage interface is sequentially connected to the pilot-operated throttle valve 67 and the three-position five-way solenoid valve 64. The pilot-operated throttle valve 67 includes a pilot valve and a main valve. The pilot valve is used to control the on / off state of the main valve, and the main valve is connected between the second air passage interface and the three-position five-way solenoid valve 64. The first air passage interface is sequentially connected to the throttle valve 66, a three-way air connector 65, and the three-position five-way solenoid valve 64, and the three-way air connector 65 is connected between the throttle valve 66, the pilot valve, and the three-position five-way solenoid valve 64. The three-position five-way solenoid valve 64 is also connected to an air source 61 via an adapter 63 and a main solenoid valve 62. The air source 61 can supply air to the three-position five-way solenoid valve 64 through the main solenoid valve 62, thereby moving the door 21 to the first preset position 200 and the second preset position 300, respectively.

[0069] For example, when the door 21 needs to move to the second preset position 300, air is supplied from the three-position five-way solenoid valve 64 through the three-way air connector 65, the throttle valve 66, and the first air interface into the first air chamber 321. Simultaneously, air enters the pilot valve through the three-way air connector 65, causing the main valve to open. This allows the second air chamber 322 to exhaust air through the second air interface, the main valve, and the three-position five-way solenoid valve 64. At this time, the air pressure in the first air chamber 321 is greater than that in the second air chamber 322, and the gas in the second air chamber 322 can be discharged. The piston 323 then moves towards the second air chamber 322, causing the door 21 to move towards the second preset position 300.

[0070] When the door 21 needs to move to the first preset position 200, the three-position five-way solenoid valve 64 simultaneously supplies air to the pilot-operated throttle valve 67 and the three-way air connector 65. At this time, the pilot valve controls the main valve to open, so that air is supplied to the second air chamber 322. At the same time, the gas in the first air chamber 321 can be discharged through the throttle valve 66 and the three-position five-way solenoid valve 64, so that the air pressure in the second air chamber 322 is greater than that in the first air chamber 321. The piston 323 will then move toward the first air chamber 321, thereby causing the door 21 to move toward the first preset position 200.

[0071] When the power is off, the pilot valve cannot be supplied with air, the main valve is closed, the volume of the second air chamber 322 remains unchanged, and the volume of the first air chamber 321 also remains unchanged. At this time, the piston 323 can be fixed to prevent the door 21 from moving, thus achieving the effect of power failure protection.

[0072] This utility model also provides a semiconductor processing equipment, which has a cabinet 100. An equipment opening is provided on the side wall of the cabinet 100, and the aforementioned sealing door mechanism is provided at the equipment opening to both open and seal the opening. By providing this sealing door mechanism, the opening can be opened and sealed, meeting the needs of material entry and exit and maintaining a stable process environment. Simultaneously, the low-dust slider 12 and the low-dust connector 31 can significantly reduce particulate matter generated by friction, thereby reducing metal ions generated at high temperatures and protecting the cleanliness of the internal environment of the semiconductor processing equipment. This ensures that the processing of wafers and other products can achieve high product quality and yield.

[0073] In the description of this specification, references to terms such as "some embodiments," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0074] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A sealing door mechanism for opening and sealing equipment openings, characterized in that, include: A sliding assembly includes a guide rail and a low-dust-generating slider. The guide rail is fixedly disposed at the opening of the equipment, and one guide rail is installed on each side of the opening of the equipment. The low-dust-generating slider is slidably mounted on the guide rail. The door body is installed on the low-dust slider and can move along the guide rail to a first preset position and a second preset position; when the door body is in the first preset position, the door body opens the equipment opening, and when the door body is in the second preset position, the door body seals the equipment opening; The drive assembly includes a drive component and a low-dust-generating connector. The drive component is tractively connected to the low-dust-generating connector, which is connected to the door body. The drive component can move the door body to either the first preset position or the second preset position via the low-dust-generating connector.

2. The sealing door mechanism according to claim 1, characterized in that, The sealing door mechanism also includes a door frame, which is fixedly installed at the opening of the equipment. The door frame is fixedly connected to the guide rail, and when the door is in the second preset position, the door and the door frame can seal against each other to seal the opening of the equipment. The two guide rails are arranged in parallel and are slidably connected to the low dust-generating sliders. At least one low dust-generating slider is connected to each side of the door. The low dust-generating sliders are made of non-metallic materials.

3. The sealing door mechanism according to claim 1, characterized in that, The door body is connected with a positioning pin, and the low-dust-generating connector includes a spherical bearing. The spherical bearing is made of non-metallic material, and the positioning pin passes through the spherical bearing to drive the door body and the low-dust-generating connector.

4. The sealing door mechanism according to claim 3, characterized in that, The driving component includes a double-acting cylinder, within which a piston is disposed. The piston divides the double-acting cylinder into a first air chamber and a second air chamber. The double-acting cylinder has a first air passage interface and a second air passage interface, wherein the first air passage interface is connected to the first air chamber, and the second air passage interface is connected to the second air chamber. The second air circuit interface is sequentially connected to a pilot-operated throttle valve and a three-position five-way solenoid valve. The pilot-operated throttle valve includes a pilot valve and a main valve. The pilot valve is used to control the on / off state of the main valve. The main valve is connected between the second air circuit interface and the three-position five-way solenoid valve. The first air passage interface is sequentially connected to a throttle valve, a three-way air passage connector and the three-position five-way solenoid valve, and the three-way air passage connector is connected between the throttle valve, the pilot valve and the three-position five-way solenoid valve.

5. The sealing door mechanism according to claim 4, characterized in that, The double-acting cylinder is equipped with magnetic switches at both ends, which are used to sense the position of the piston inside the double-acting cylinder.

6. The sealing door mechanism according to claim 1, characterized in that, The sealing door mechanism also includes a micro switch, which is disposed at the end of the guide rail. The micro switch is used to detect whether the door is in the first preset position and / or the second preset position, and the triggering structure of the micro switch is made of resin.

7. The sealing door mechanism according to claim 6, characterized in that, The door body is also connected to a fixing member, which has a wedge-shaped portion located between the two ends of the guide rail. The end of the wedge-shaped portion near the micro switch has an abutment slope. The micro switch includes a resin rolling element, which is configured as the triggering structure, and the abutting inclined surface can abut against the resin rolling element and trigger the micro switch.

8. The sealing door mechanism according to claim 1, characterized in that, The sealing door mechanism also includes a buffer, with at least one buffer provided at each end of the guide rail, which is used to buffer and brake the door body.

9. The sealing door mechanism according to any one of claims 1-8, characterized in that, The sealing door mechanism also includes a safety component, which includes a safety light curtain that can detect whether foreign objects are present at the second preset position and in the device opening.

10. The sealing door mechanism according to claim 2 or 3, characterized in that, The non-metallic material includes resin.

11. Semiconductor process equipment, characterized in that, The semiconductor process equipment has an opening, and a sealing door mechanism as described in any one of claims 1-10 is provided at the opening, the sealing door mechanism being used to open and seal the opening.

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