Water-cooling air cold and hot pipe combined heat dissipation device for mini-computer

Abstract

The utility model discloses a mini-computer water-cooling air cold and hot pipe combined heat dissipation device, a heat conduction mechanism is arranged on the periphery of a water-cooling heat dissipation system, the heat conduction mechanism comprises a plurality of U-shaped copper pipes which are arranged in parallel, the upper portions of the U-shaped copper pipes penetrate through heat dissipation fins, first positioning pieces are fixed on the two sides of the lower portions of the U-shaped copper pipes, and heat conduction plates are fixed on the lower portions of the U-shaped copper pipes. The water-cooling heat dissipation system is located in a U-shaped area formed by the heat conduction mechanism, the heat of the CPU is rapidly shunted in the mode that the heat conduction mechanism is additionally arranged, and the defect that the heat of the CPU cannot be rapidly transmitted and diffused is overcome. The bottom surface of the water-cooling heat dissipation system is attached to the heat conduction plate, second positioning pieces are arranged on the two sides of the bottom of the water-cooling heat dissipation system, elastic screws are arranged at the four corners of each second positioning piece, and the defect that heat of the heat conduction plate cannot be transmitted to the water-cooling heat dissipation system due to the fact that the water-cooling heat dissipation system is not firm is overcome.

Description

Technical Field

[0001] This utility model relates to the field of computer heat dissipation technology, and in particular to a combined water-cooling, air-cooling, and heat pipe heat dissipation device for mini computers. Background Technology

[0002] Currently, the most common internal cooling method for minicomputers is a combination of air cooling and heat pipe fins. Some also use a combination of heat pipes and fins, while others combine air cooling and water cooling. For example, Chinese patent (application number 2024201182097) proposes a microcomputer cooled by refrigerant, employing a combination of air and water cooling. However, this technology has drawbacks: 1. Because the heat-conducting plate in the fixed frame is attached to the CPU on one side and the bottom of the solution tank on the other, the surface areas of the CPU, the heat-conducting plate, and the bottom of the solution tank are all limited. In actual operation, the heat-conducting plate cannot quickly transfer the CPU's heat to the bottom of the solution tank, causing heat to accumulate on the CPU and degrading computer performance. 2. The water pump generates micro-vibrations during long-term operation, causing the bottom of the solution tank to not properly align with the heat-conducting plate that conducts heat to the CPU, affecting the contact area for heat conduction. Utility Model Content

[0003] To address the aforementioned technical problems, this utility model improves upon existing technical deficiencies by proposing a combined water-cooled, air-cooled, and heat pipe cooling device for mini computers. The specific solution is as follows:

[0004] The mini computer water-cooled air-cooled heat pipe combination heat dissipation device has a heat conduction mechanism set on the periphery of the water cooling system. The heat conduction mechanism includes several U-shaped copper pipes arranged in parallel. The upper part of the U-shaped copper pipe passes through the heat dissipation fins and the lower two sides are fixed with first positioning plates. A heat conduction plate is fixed on the lower part of the U-shaped copper pipe. The water cooling system is located in the U-shaped area formed by the heat conduction mechanism.

[0005] As a preferred embodiment of this utility model, the bottom surface of the water-cooled heat dissipation system is attached to the heat-conducting plate, and second positioning plates are provided on both sides of the bottom of the water-cooled heat dissipation system, with elastic screws provided at the four corners of the second positioning plates.

[0006] As a preferred embodiment of this utility model, the heat conduction mechanism is fixed with a bracket at the bottom, a first heat conduction copper sheet is provided in the middle of the upper surface of the bracket and a locking post is provided at the four corners, a second heat conduction copper sheet is provided in the middle of the lower surface of the bracket, a third heat conduction copper sheet and a fourth heat conduction copper sheet are provided on both sides, and a support column is provided on the lower surface of the bracket.

[0007] In a preferred embodiment of this utility model, the orientation of the second positioning piece is perpendicular to that of the first positioning piece, and the four corners of the bracket and the four corners of the two first positioning pieces are fitted together and secured by the locking posts. The elastic screw is fixed downward inside the locking posts to fix the water cooling heat dissipation system, the heat conduction mechanism, and the bracket.

[0008] In a preferred embodiment of this utility model, the bracket is fixed to the computer circuit board, the second heat-conducting copper sheet is closely attached to the CPU on the computer circuit board, and the third and fourth heat-conducting copper sheets are respectively attached to the storage module and the wireless communication module on the computer circuit board.

[0009] As a preferred embodiment of this utility model, the upper part of the water cooling system is connected to the air cooling system, which includes a fan and a water tank. The water cooling system, the air cooling system and the heat conduction mechanism form a computer heat dissipation circulation system installed in the mini computer case.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0011] This invention improves upon the drawback of CPU heat transfer and diffusion by rapidly distributing heat through the addition of a heat-conducting mechanism. The water-cooling system is secured to the heat-conducting mechanism by using elastic screws to stably connect the second and first positioning plates. Furthermore, it is fixed to the computer circuit board via brackets and clips. This solves the problem of heat transfer failure caused by an unstable water-cooling system, thus optimizing heat transfer and diffusion. Attached Figure Description

[0012] Figure 1 This is an exploded structural diagram of the present invention;

[0013] Figure 2 This is a diagram of the support structure;

[0014] Figure 3 yes Figure 2 Bottom surface structure diagram;

[0015] In the diagram: 1 heat-conducting plate, 2 U-shaped copper pipe, 3 heat dissipation fins, 4 first positioning plate, 5 second positioning plate, 6 elastic screw, 7 bracket, 8 second heat-conducting copper sheet, 9 retaining post, 10 first heat-conducting copper sheet, 11 support post, 12 third heat-conducting copper sheet, 14 U-shaped area. Detailed Implementation

[0016] The technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0017] Please refer to Figures 1-3 The mini computer water-cooled air-cooled heat pipe combination heat dissipation device has a heat conduction mechanism set on the periphery of the water-cooled heat dissipation system. The heat conduction mechanism includes several U-shaped copper pipes 2 arranged in parallel. The upper part of the U-shaped copper pipe passes through the heat dissipation fins 3 and the lower two sides are fixed with first positioning plates 4. A heat conduction plate 1 is fixed on the lower part of the U-shaped copper pipe. The water-cooled heat dissipation system is located in the U-shaped area 14 formed by the heat conduction mechanism.

[0018] A water-cooling system is installed in the U-shaped area of ​​the heat conduction mechanism. The bottom of the water-cooling system absorbs some of the heat from the heat conduction plate 1. At the same time, the heat from the heat conduction plate 1 is conducted to the heat dissipation fins 3 along the parallel U-shaped copper pipes, increasing the heat diffusion surface. There are many gaps between the heat dissipation fins 3 in the vertical direction. Under the suction of the top fan, the heat is carried away, which adds a path for the rapid diversion and cooling of the CPU heat.

[0019] Furthermore, the bottom surface of the water-cooled heat dissipation system is attached to the heat-conducting plate 1, and second positioning plates 5 are provided on both sides of the bottom of the water-cooled heat dissipation system, with elastic screws 6 at the four corners of the second positioning plates 5.

[0020] After the elastic screw 6 stably connects the second positioning piece 5 and the first positioning piece 4, it can securely connect the water cooling heat dissipation system and the heat conduction mechanism.

[0021] Furthermore, a bracket 7 is fixed at the bottom of the heat conduction mechanism. A first heat-conducting copper sheet 10 is provided in the middle of the upper surface of the bracket 7 and a retaining post 9 is provided at the four corners. A second heat-conducting copper sheet 8 is provided in the middle of the lower surface of the bracket 7, and a third heat-conducting copper sheet 12 and a fourth heat-conducting copper sheet 13 are provided on both sides. A support post 11 is provided on the lower surface of the bracket 7.

[0022] Furthermore, the orientation of the second positioning piece 5 is perpendicular to that of the first positioning piece 4. The four corners of the bracket 7 and the four corners of the two first positioning pieces 4 are engaged and locked by the locking post 9. The elastic screw 6 is fixed downward in the locking post 9 to fix the water cooling heat dissipation system, the heat conduction mechanism, and the bracket 7.

[0023] The locking pins 9 on the bracket 7 are fixedly engaged with the four corners of the first positioning piece 4, and the support column 11 on the bracket 7 is fixed to the computer motherboard. Thus, the water cooling system and the heat conduction mechanism are firmly installed on the bracket 7, which solves the problem that the micro-vibration caused by the long-term operation of the water cooling system (water pump) causes the bottom of the solution tank to not be properly matched and the heat conduction plate 1 that conducts heat to the CPU to be properly attached, affecting the contact area for heat conduction.

[0024] Furthermore, the bracket 7 is fixed to the computer circuit board, the second heat-conducting copper sheet 8 is closely attached to the CPU on the computer circuit board, and the third heat-conducting copper sheet 12 and the fourth heat-conducting copper sheet 13 are respectively attached to the storage module and the wireless communication module on the computer circuit board.

[0025] The CPU used in mini PCs is relatively thin, and when mounted on the computer circuit board, its height is lower than that of other surrounding component modules. Without bracket 7, directly mounting the heat dissipation mechanism above the CPU would cause it to touch other components, and the bottom of the mechanism wouldn't be able to adhere to the CPU, preventing heat dissipation. Bracket 7 and support column 11 effectively solve these two problems. Simultaneously, the second heat-conducting copper plate 8 adheres downwards to the CPU for direct heat conduction, while the third and fourth heat-conducting copper plates 12 and 13 contact the storage module and wireless communication module for heat dissipation.

[0026] Furthermore, the water-cooling system is connected to an air-cooling system at the top. The water-cooling system, the air-cooling system, and the heat conduction mechanism together form a computer heat dissipation circulation system installed inside the mini computer case.

[0027] A water-cooled heat dissipation system includes a water pump, a solution tank, a hot runner pipe, and a cold runner pipe, while an air-cooled heat dissipation system is a blower fan.

[0028] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A combination heat dissipation device for mini computer water cooling and air cooling, wherein a heat conduction mechanism is provided on the periphery of the water cooling system, the heat conduction mechanism includes several U-shaped copper pipes (2) arranged in parallel, the upper part of the U-shaped copper pipes (2) passes through the heat dissipation fins (3) and the lower two sides are fixed with first positioning plates (4), a heat conduction plate (1) is fixed on the lower part of the U-shaped copper pipes (2), and the water cooling system is located in the U-shaped area (14) formed by the heat conduction mechanism.

2. The mini computer water-cooled air-cooled heat pipe combined heat dissipation device according to claim 1, wherein the bottom surface of the water-cooled heat dissipation system is attached to the heat-conducting plate (1), and the bottom sides of the water-cooled heat dissipation system are provided with second positioning plates (5), and the four corners of the second positioning plates (5) are provided with elastic screws (6).

3. The mini computer water-cooled air-cooled heat pipe combination heat dissipation device according to claim 1, wherein a bracket (7) is fixed at the bottom of the heat conduction mechanism, a first heat-conducting copper sheet (10) is provided in the middle of the upper surface of the bracket (7) and a locking post (9) is provided at the four corners, a second heat-conducting copper sheet (8) is provided in the middle of the lower surface of the bracket (7), a third heat-conducting copper sheet (12) and a fourth heat-conducting copper sheet (13) are provided on both sides, and a support post (11) is provided on the lower surface of the bracket (7).

4. According to claim 2, the arrangement direction of the second positioning piece (5) is perpendicular to the arrangement direction of the first positioning piece (4), the four corners of the bracket (7) and the four corners of the two first positioning pieces (4) are engaged and locked by the locking post (9), and the elastic screw (6) is fixed downward in the locking post (9) to fix the water cooling heat dissipation system to the heat conduction mechanism and the bracket (7).

5. The mini computer water-cooled air-cooled heat pipe combination heat dissipation device according to claim 3, wherein the bracket (7) is fixed on the computer circuit board, the second heat-conducting copper sheet (8) is closely attached to the CPU on the computer circuit board, and the third heat-conducting copper sheet (12) and the fourth heat-conducting copper sheet (13) are respectively attached to the storage module and the wireless communication module on the computer circuit board.

6. The mini computer water-cooled and air-cooled heat pipe combined heat dissipation device according to claim 1, wherein the water-cooled heat dissipation system is connected to the air-cooled heat dissipation system at the top, and the water-cooled heat dissipation system, the air-cooled heat dissipation system and the heat conduction mechanism constitute a computer heat dissipation circulation system installed in the mini computer case.

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