Enterprise-level solid state disk test board card

Abstract

The utility model relates to the technical field of storage test equipment, in particular to an enterprise-level solid state disk test board card, which comprises a circuit board serving as a test board card main body, and is characterized in that the circuit board is provided with a Gen-Z4C connector, a first limiting bracket, a second limiting bracket and a 6P DC12V power interface, the lower end of the circuit board is provided with a golden finger interface used for being connected with a PCIE X16 164P expansion slot interface of a test computer mainboard in a pluggable mode. The golden finger interface is directly connected with the Gen-Z 4C connector; a 6P DC12V power interface is arranged at the upper right corner of the circuit board, is externally connected with DC12V of a computer power supply and is used for supplying power to the enterprise-level solid state disk; the first limiting support is arranged on the front face of the circuit board, and the second limiting support is arranged on the back face of the circuit board, right faces the first limiting support and is used for fixing and limiting the enterprise-level solid-state hard disk, the performance such as the read-write speed of the enterprise-level solid-state hard disk can be tested on the premise that large-scale special equipment is not added, the structure is simple, the size is small, and the cost is low. And the cost is low.

Description

Technical Field

[0001] This utility model relates to the field of storage testing equipment technology, specifically to an enterprise-level solid-state drive testing board. Background Technology

[0002] Enterprise Solid State Drives (ESSDs) are core components for data storage, playing a crucial role in several key areas such as data centers, servers, internet services, cloud services, smart manufacturing, and high-performance computing. With continuous technological advancements, the signaling protocols of ESSDs have undergone three significant development stages: from the early SATA protocol, to the transition from SATA to PCIe, and now to the PCIe era.

[0003] During the SATA protocol era, traditional 2.5-inch SATA SSDs and M.2 SATA SSDs were the mainstream products in the market. However, with the continuous increase in data transfer demands, these products gradually became unable to meet the requirements of high-performance application scenarios. Therefore, U.2 interface enterprise-grade solid-state drives emerged. As a product of the transition from the SATA protocol to the PCIe protocol, it not only inherited some characteristics of the SATA interface but also introduced the high-speed transmission capabilities of the PCIe protocol, becoming the mainstream enterprise-grade solid-state drive in the current market.

[0004] With the widespread adoption of the PCIe protocol, E1.S and E3.S, as next-generation enterprise-grade solid-state drives (SSDs) under the PCIe protocol, are gradually replacing traditional M.2 and 2.5-inch SSDs. E1.S aims to replace M.2 SSDs, while E3.S targets the 2.5-inch SSD market. These new-generation enterprise-grade SSDs utilize a circuit board with a gold-finger interface. The thickness of the gold-finger interface ranges from 1.53mm to 1.63mm, significantly improving circuit board strength compared to the 0.75mm to 0.85mm of M.2 SSDs. This enhances the circuit board's resistance to deformation, improving mechanical strength and making it more suitable for large-size and multi-layered circuit designs. Furthermore, the gold-finger spacing reaches 0.6mm, superior to the 0.5mm of M.2, resulting in better contact and wear resistance, and enabling support for higher current power supplies. The introduction of a DC 12V high-power power supply further enhances the overall power output, making it more suitable for ultra-large capacity enterprise-grade SSD applications.

[0005] In terms of compatibility and scalability, the E1.S and E3.S demonstrate superior performance. They support multiple specifications such as PCIe x4, PCIe x8, and PCIe x16, and are backward compatible with each other, providing users with great flexibility and expansion capabilities.

[0006] However, in terms of performance testing, E1.S and E3.S are currently mainly tested by integrating the SSDs into server rack bays. While this method can evaluate performance to some extent, it also has several drawbacks. First, it is costly. Because PCIe x4, PCIe x8, and PCIe x16 differ, servers of various specifications need to be purchased for testing, undoubtedly increasing costs. Second, product replacement is inconvenient. Servers are typically rack-mounted and require brackets to secure enterprise-grade SSDs. Frequent bracket removal and installation is not only inefficient but also easily damages the brackets and causes wear on the SSD screw holes, affecting stability and lifespan. Utility Model Content

[0007] To overcome the shortcomings of existing technologies, this application provides an enterprise-grade solid-state drive (SSD) test board, which aims to achieve more accurate and efficient evaluation of the performance of next-generation enterprise-grade SSDs such as E1.S and E3.S.

[0008] The technical means adopted by this utility model to solve its technical problem is: an enterprise-level solid-state drive test board, including a circuit board as the main body of the test board, wherein the improvement is that the circuit board is provided with a Gen-Z 4C connector, a first limiting bracket, a second limiting bracket, and a 6P DC12V power interface, wherein,

[0009] The lower end of the circuit board is provided with a gold finger interface for plugging and unplugging the PCIE X16 164P expansion slot interface of the test computer motherboard; the gold finger interface is directly connected to the Gen-Z 4C connector.

[0010] The circuit board has a 6P DC12V power interface in the upper right corner, which is connected to the DC12V of the external computer power supply to power the enterprise-level solid-state drive.

[0011] The first limiting bracket is disposed on the front of the circuit board, and the second limiting bracket is disposed on the back of the circuit board and is directly opposite to the first limiting bracket, for fixing and limiting the enterprise-grade solid-state drive.

[0012] In the above technical solution, the first limiting bracket and the second limiting bracket are rectangular in shape; the first limiting bracket has a protrusion in the direction perpendicular to the circuit board, and the width of the protrusion is less than the length of the first limiting bracket.

[0013] The protrusion described in the above technical solution has beveled edges on both sides for guiding enterprise-grade solid-state drives.

[0014] In the above technical solution, through holes are provided on both sides of the first limiting bracket and the second limiting bracket, and through holes are also provided at the corresponding positions of the circuit board; a nut is embedded in the through hole of the second limiting bracket, and the first limiting bracket and the second limiting bracket are fixedly connected to the circuit board by hexagonal screws and nuts.

[0015] In the above technical solution, both the first limiting bracket and the second limiting bracket are made of metal, including but not limited to aluminum alloy or copper alloy, so as to effectively dissipate the heat generated by the enterprise-grade solid-state drive and circuit board during operation.

[0016] The Gen-Z 4C connector described in the above technical solution adopts high-speed differential signal transmission technology and supports data transmission rates of up to or exceeding 40Gbps.

[0017] The gold finger interface described in the above technical solution adopts a gold plating process.

[0018] The above technical solution involves coating the circuit board surface with an antistatic coating, setting antistatic rings around key electronic components, and connecting an antistatic grounding wire to the ground wire.

[0019] The beneficial effects of this utility model are:

[0020] Without the need for large, specialized equipment, the read and write speeds and other performance characteristics of enterprise-grade solid-state drives can be tested. The method is simple in structure, compact in size, and low in cost, successfully overcoming the shortcomings of existing testing methods in terms of cost, efficiency, and convenience. This allows for a more accurate and efficient evaluation of the performance of next-generation enterprise-grade solid-state drives such as E1.S and E3.S. Attached Figure Description

[0021] Figure 1 A front view of an enterprise-level solid-state drive test board shown in an embodiment of this utility model;

[0022] Figure 2 This is a top view of an enterprise-level solid-state drive test board according to an embodiment of the present invention;

[0023] Figure 3 This is a front view of another enterprise-level solid-state drive test board shown in an embodiment of the present invention;

[0024] Figure 4 This is a top view of another enterprise-level solid-state drive test board shown in an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of the first limiting bracket and the second limiting bracket shown in an embodiment of the present utility model. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0027] The following will clearly and completely describe the concept, specific structure, and technical effects of this utility model in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are all within the scope of protection of this utility model. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this utility model can be combined interactively without contradicting each other.

[0028] Since most computers have a PCIe x16 164P expansion slot that supports high-speed PCIe x16 communication and is backward compatible with PCIe x8, PCIe x4, PCIe x2, and PCIe x1, covering the requirements of E1.S and E3.S enterprise-grade solid-state drives, the PCIe x16 expansion slot in a typical computer is mainly used for installing graphics cards, etc., and is usually left idle when used as a test computer.

[0029] Based on this, the present invention provides an enterprise-level solid-state drive test board that converts the PCIe x16 164P interface of the computer motherboard into a Gen-Z 4C interface (supporting PCIe x16 and compatible with PCIe x8 and PCIe x4) for lossless full-speed performance testing of E1.S and E3.S enterprise-level solid-state drives.

[0030] like Figure 1-4 As shown, the enterprise-grade solid-state drive test board includes a circuit board 1 as the main body of the test board. The circuit board 1 has a thickness of 1.6mm to match the thickness requirements of the PCIe expansion slot connector.

[0031] Optionally, the anti-static protection circuit adopts a multi-layer protection design, including coating the circuit board surface with an anti-static coating, setting anti-static rings around key electronic components, and an anti-static grounding wire connected to the ground wire. In addition, the anti-static protection circuit is also designed with electrostatic discharge (ESD) detection function, which can monitor the electrostatic discharge on the circuit board in real time and trigger the protection mechanism in time when electrostatic discharge occurs to prevent damage to the electronic components on the solid-state drive and test board.

[0032] The circuit board 1 is equipped with a Gen-Z 4C connector 2, a first limiting bracket 3, a second limiting bracket 4, and a 6PDC 12V power interface 5.

[0033] The lower end of the circuit board 1 is provided with a gold finger interface 11 for plugging and unplugging the PCIE X16 164P expansion slot interface of the test computer motherboard; the gold finger interface 11 is directly connected to the Gen-Z 4C connector 2; the Gen-Z 4C connector 2 supports PCIE X16 and is compatible with PCIE X8 and PCIE X4, which can cover all the needs of E1.S and E3.S enterprise-level solid-state drives, achieving the purpose of lossless full-speed testing.

[0034] Optionally, the Gen-Z 4C connector 2 employs high-speed differential signal transmission technology, supporting data transfer rates up to or exceeding 40Gbps, and features robust error detection and correction (ECC) capabilities to ensure data transmission integrity and reliability. Furthermore, the connector is hot-swappable, allowing safe insertion or removal of enterprise-grade solid-state drives without powering off the system, and incorporates a locking mechanism to prevent loosening due to vibration or accidental impact.

[0035] Optionally, the gold finger interface 11 conforms to the PCI Express 4.0 or higher standard, provides at least 16 parallel channels, each channel supports a data transmission rate of up to 8Gbps, and the total bandwidth can reach 128Gbps or higher; the gold finger interface 11 adopts a gold plating process to improve conductivity and corrosion resistance, and is designed with a reinforced structure, including increasing the thickness and width of the gold finger 11, and setting support ribs to improve connection stability and durability.

[0036] The left side of the circuit board 1 is also provided with screw holes, which can be used to install and fix the circuit board 1 on the computer case mounting bracket with Phillips screws to enhance stability.

[0037] The upper right corner of the circuit board 1 is provided with the 6P DC12V power interface 5, which is connected to the DC12V of the external computer power supply to power the enterprise-level solid-state drive, so as to meet the high power requirements of the ultra-large capacity enterprise-level solid-state drive (up to 75W).

[0038] The first limiting bracket 3 is disposed on the front of the circuit board 1, and the second limiting bracket 4 is disposed on the back of the circuit board 1 and is directly opposite to the first limiting bracket 3, for fixing and limiting the enterprise-grade solid-state drive.

[0039] Since the weight of E1.S and E3.S enterprise-grade solid-state drives increases after the casing (including heatsinks, etc.) is installed, vibration or misalignment during insertion or removal can damage the Gen-Z 4C connector 2 or cause poor contact, interrupting the test.

[0040] The first limiting bracket 3 and the second limiting bracket 4 utilize the vertical overlap and appearance structure differences of the E1.S and E3.S enterprise-grade solid-state drives to avoid occupying space and retain the four corners as limits.

[0041] In one possible implementation, such as Figure 2 As shown, the first limiting bracket 3 and the second limiting bracket 4 are generally rectangular; the first limiting bracket 3 has a protrusion 31 in the direction perpendicular to the circuit board 1, and the width of the protrusion 31 is less than the length of the first limiting bracket 3.

[0042] The E1.S supports three thicknesses: 9.5mm, 15mm, and 25mm. A limiting bracket works in conjunction with the circuit board to secure the E1.S and E3.S enterprise-grade solid-state drives from all sides, maintaining vertical and horizontal stability.

[0043] In one possible implementation, such as Figure 5 As shown, the protrusion 31 has beveled edges 311 on both sides for guiding the enterprise-grade solid-state drive, making it easier to plug and unplug.

[0044] For one possible implementation, please refer to [link / reference]. Figure 5 As shown, the first limiting bracket 3 and the second limiting bracket 4 are respectively provided with through holes (not shown in the figure) on both sides, and the circuit board 1 is also provided with through holes at the corresponding positions; a nut is embedded in the through hole of the second limiting bracket 4, and the first limiting bracket 3 and the second limiting bracket 4 are fixedly connected to the circuit board 1 by hexagonal screws and nuts.

[0045] Optionally, the first limiting bracket 3 and the second limiting bracket 4 are both made of metal, including but not limited to aluminum alloy or copper alloy, to effectively dissipate the heat generated by the enterprise-grade solid-state drive and circuit board during operation.

[0046] This invention designs an enterprise-grade solid-state drive (SSD) test board that enables direct connection between the PCIe x16 164P gold finger interface on the circuit board and the horizontal Gen-Z 4C connector. This simplifies the circuit structure and ensures efficient and stable data transmission. The Gen-Z 4C connector fully supports the PCIe x16 standard and is backward compatible with PCIe x8 and PCIe x4 specifications. This feature allows it to comprehensively cover all connection requirements of E1.S and E3.S enterprise-grade SSDs, thereby achieving the goal of lossless full-speed testing and significantly improving data transmission efficiency and testing accuracy.

[0047] This invention employs a specially designed metal limiting bracket, specifically tailored for E1.S and E3.S enterprise-grade solid-state drives (SSDs). It flexibly accommodates the 9.5mm, 15mm, and 25mm thicknesses of E1.S SSDs. It not only provides stable fixation, precise positioning, and smooth guidance, but also effectively protects the Gen-Z 2C connector from external interference, extending its lifespan and significantly improving test yield. Furthermore, the choice of metal material provides the bracket with additional heat dissipation capabilities, further enhancing the system's cooling performance through optimized heat conduction paths.

[0048] High-efficiency heat dissipation and compact structure: The overall structural design of this invention is simple and compact. By reserving sufficient air contact area, it greatly promotes air circulation speed and effectively enhances heat dissipation. This design not only meets the high heat dissipation performance requirements of E1.S and E3.S enterprise-level solid-state drives in industrialization testing, but also ensures the stability and reliability of the testing environment. The compact structural layout also facilitates integration and maintenance, reduces production costs, and improves the flexibility and applicability of testing equipment, providing strong support for the industrialization testing of solid-state drives.

[0049] In summary, this invention significantly improves the testing efficiency, data transfer speed, and system stability of enterprise-grade solid-state drives (SSDs) through the combined application of direct connection technology, innovative limiting bracket design, and efficient heat dissipation and compact structure, providing an innovative solution for the industrial testing and application of SSDs.

[0050] The above is a detailed description of the preferred embodiments of the present utility model. However, the present utility model is not limited to the described embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present utility model. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. An enterprise-grade solid-state drive test board, comprising a circuit board as the main body of the test board, characterized in that, The circuit board is equipped with a Gen-Z 4C connector, a first limiting bracket, a second limiting bracket, and a 6P DC12V power interface. The lower end of the circuit board is provided with a gold finger interface for plugging and unplugging the PCIE X16 164P expansion slot interface of the test computer motherboard; the gold finger interface is directly connected to the Gen-Z 4C connector. The circuit board has a 6P DC12V power interface in the upper right corner, which is connected to the DC12V of the external computer power supply to power the enterprise-level solid-state drive. The first limiting bracket is disposed on the front of the circuit board, and the second limiting bracket is disposed on the back of the circuit board and is directly opposite to the first limiting bracket, for fixing and limiting the enterprise-grade solid-state drive.

2. The enterprise-level solid-state drive test board according to claim 1, characterized in that, The first limiting bracket and the second limiting bracket are generally rectangular; the first limiting bracket has a protrusion in the direction perpendicular to the circuit board, and the width of the protrusion is less than the length of the first limiting bracket.

3. The enterprise-level solid-state drive test board according to claim 2, characterized in that, The protrusion has beveled edges on both sides for guiding enterprise-grade solid-state drives.

4. The enterprise-level solid-state drive test board according to claim 1, characterized in that, The first limiting bracket and the second limiting bracket are respectively provided with through holes on both sides, and the circuit board is also provided with through holes at the corresponding positions; a nut is embedded in the through hole of the second limiting bracket, and the first limiting bracket and the second limiting bracket are fixedly connected to the circuit board by hexagonal screws and nuts.

5. The enterprise-level solid-state drive test board according to claim 1, characterized in that, Both the first and second limiting brackets are made of metal, including but not limited to aluminum alloy or copper alloy, to effectively dissipate the heat generated by the enterprise-grade solid-state drive and circuit board during operation.

6. The enterprise-level solid-state drive test board according to claim 1, characterized in that, The Gen-Z 4C connector uses high-speed differential signal transmission technology and supports data transmission rates of up to or exceeding 40Gbps.

7. The enterprise-level solid-state drive test board according to claim 1, characterized in that, The gold finger interface is made using a gold plating process.

8. The enterprise-level solid-state drive test board according to claim 1, characterized in that, The circuit board surface is coated with an antistatic coating, and antistatic rings are set around key electronic components and an antistatic grounding wire is connected to the ground wire.

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