Lead layer, substrate thereof and inductor

Abstract

The embodiment of the utility model discloses a lead layer, a substrate thereof and an inductor. The lead layer comprises an insulating layer, and the insulating layer comprises a first short side, a first long side, a second short side and a second long side which are connected end to end in the direction perpendicular to the thickness direction of the insulating layer. The electrode is arranged on the insulating layer and comprises an internal electrode, a switching electrode and a leading-out disc, the internal electrode has a preset radian, one end of the internal electrode is connected to the leading-out disc through the switching electrode, a layer connecting disc is arranged at the other end of the internal electrode, one side of the leading-out disc is flush with the first short edge, and the other side of the leading-out disc is flush with the second short edge. The middle of the other side, away from the first short edge, of the leading-out disc is connected with the switching electrode, a connecting corner facing the second long edge is formed at the connecting position of the switching electrode and the leading-out disc, and the connecting corner has a first radian. According to the lead layer, the technical effect that short circuit is not prone to occurring is achieved.

Description

Technical Field

[0001] This utility model relates to electronic devices, and more particularly to a lead layer, its substrate, and an inductor. Background Technology

[0002] As applications place increasingly higher demands on the reliability of electronic components, the overall trend for electronic component products, such as multilayer inductors, is towards miniaturization and higher reliability. Figure 6 As shown, a lead layer of the existing multilayer inductor 600 includes an insulating layer 610, an inner electrode disposed on the insulating layer 610, and outer electrodes 631 and 632 disposed on the outside of the multilayer inductor 600. The inner electrode includes a coil electrode 621 and a lead electrode 622. Because the bend at the connection point between the lead electrode 622 and the coil electrode 621 is too close to the edge of the insulating layer 610, cracks 611 are easily generated at the bends at the connection points towards the end of the lead electrode 622 during processes such as compaction, cutting, glue removal, sintering, and chamfering after stacking multiple lead layers. During the process of silver sealing to form the lead electrode 622, liquid silver can easily penetrate through the cracks 611, causing interlayer short circuits. Therefore, there is an urgent need for a lead layer that prevents short circuits. Utility Model Content

[0003] This utility model provides a lead layer, its substrate, and an inductor, achieving the technical effect of reducing the likelihood of short circuits.

[0004] One embodiment provides a lead layer, comprising:

[0005] An insulating layer, the insulating layer comprising a first short side, a first long side, a second short side, and a second long side connected end to end perpendicular to the thickness direction of the insulating layer;

[0006] An electrode disposed on an insulating layer includes an internal electrode, a transfer electrode, and a lead-out plate. The internal electrode has a preset curvature. One end of the internal electrode is connected to the lead-out plate via the transfer electrode, and the other end of the internal electrode is provided with a layering plate. One side of the lead-out plate is flush with the first short side. The middle part of the other side of the lead-out plate away from the first short side is connected to the transfer electrode. The connection between the transfer electrode and the lead-out plate forms a connection angle facing the second long side, and the connection angle has a first curvature.

[0007] In some embodiments, the distance c2 from the inner corner position where the adapter electrode and the internal electrode are connected to the first short side is greater than or equal to the distance c1 from the internal electrode to the second short side.

[0008] In some embodiments, the distance W1 from the lead-out plate to the first long side and the distance W2 from the lead-out plate to the second long side satisfy the following relationship: W2≥1 / 4W, W1<1 / 2W.

[0009] In some embodiments, the connecting corner has a first radius r1, the corner of the lead plate facing the second long side and the second short side has a second radius r2, and the distance d from the connection point of the adapter electrode and the connecting corner to the edge of the lead plate facing the second long side satisfies the relationship: d≥r1+r2.

[0010] In some embodiments, the radius of the connecting corner satisfies r1≥10um, and the arc of the corner of the lead-out plate facing the second long side and the second short side satisfies r2≥10um.

[0011] In some embodiments, the adapter electrode and the first short side have an included angle θ, where θ satisfies: 90 degrees ≥ θ ≥ 45 degrees.

[0012] One embodiment provides a substrate comprising: an inner electrode layer and two lead layers as described above, the inner electrode layer having sub-electrodes, the inner electrode layer being sandwiched between the two lead layers, and the two ends of the sub-electrodes being respectively connected to the layer pads of the lead layers.

[0013] In some embodiments, there are multiple inner electrode layers, each comprising multiple sub-electrodes stacked sequentially, each sub-electrode having an arc-shaped electrode segment, the arc-shaped electrodes being connected end-to-end to form a spiral coil-shaped inner electrode.

[0014] One embodiment provides an inductor including a first terminal electrode, a second terminal electrode, and a substrate as described above. The first terminal electrode and the second terminal electrode are disposed on opposite sides of the substrate. The first terminal electrode is connected to a layer pad of a lead layer, and the second terminal electrode is connected to a layer pad of another lead layer.

[0015] Compared to existing technologies, the above embodiment connects the transfer electrode to the middle of the side of the lead-out pad away from the first short side. This means the connection point between the transfer electrode and the lead-out pad is far from the edge of the insulating layer, thus reducing the likelihood of cracks during continuous manufacturing processes. Furthermore, the connection point between the transfer electrode and the lead-out pad forms a connection angle facing the second long side, with a first arc, further reducing the probability of cracks and preventing interlayer short circuits during the silvering process. Moreover, even if a crack appears at the connection point between the transfer electrode and the lead-out pad, the crack will only extend along the inner edge of the lead-out pad due to the shielding effect of the lead-out pad. The crack exit point will eventually appear at the location where the insulating layer does not have a terminal electrode. This prevents molten silver from entering the crack during the silvering process, thus also avoiding short circuits. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a lead layer provided in an embodiment of the present invention;

[0018] Figure 2 This is a schematic diagram of another lead layer provided in an embodiment of the present invention;

[0019] Figure 3 This is a schematic diagram of a substrate provided in an embodiment of the present utility model;

[0020] Figure 4 yes Figure 3 Schematic diagram of the exploded structure of the matrix;

[0021] Figure 5 This is a schematic diagram of an inductor provided in an embodiment of the present invention;

[0022] Figure 6 This is a schematic diagram of a lead layer provided by existing technology. Detailed Implementation

[0023] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0024] It should be noted that the terms "first," "second," "upper," "lower," etc., used in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are used interchangeably.

[0025] See Figure 1One embodiment provides a lead layer 100, including an insulating layer 110 and electrodes 120 disposed on the insulating layer 110. The insulating layer 110 includes a first short side 111, a first long side 112, a second short side 113, and a second long side 114 connected end-to-end perpendicular to the thickness direction of the insulating layer 110. The electrode 120 includes an internal electrode 121, a connecting electrode 122, and a lead-out pad 123. The internal electrode 121 has a predetermined curvature and is approximately hook-shaped. One end of the internal electrode 121 is connected to the lead-out pad 123 via the connecting electrode 122, and the other end of the internal electrode 121 is provided with a layering pad 1211. One side of the lead-out pad 123 is flush with the first short side 111. The connecting electrode 122 is connected to the middle of the side of the lead-out pad 123 away from the first short side 111. The junction of the adapter electrode 122 and the lead-out disk 123 forms a connection angle J2 facing the second long side 114, and the connection angle J2 has a first radian.

[0026] In some embodiments, the insulating layer 110 can be formed by: using zinc oxide as the main body, doping with one or more oxides of bismuth, antimony, cobalt, titanium, nickel, and manganese to form the main body of the slurry, adding a small amount of adhesives, plasticizers and other organic substances, adding solvent, grinding and preparing into a ceramic slurry with a certain viscosity, and then these slurries are cast on PET film to form a raw tape of a certain thickness, and then a single raw tape insulating layer is formed by a cutting process.

[0027] In some embodiments, the internal electrode 121 is formed by using a metal or alloy paste as the main raw material for forming the internal electrode 121 on the surface of the raw tape insulating layer, and printing the pattern of the internal electrode 121 onto the raw tape insulating layer by screen printing.

[0028] In some embodiments, the distance c2 from the inner corner where the adapter electrode 122 and the inner electrode 121 are connected to the first short side 111 is greater than or equal to the distance c1 from the inner electrode 121 to the second short side 113.

[0029] In some embodiments, the distance W1 from the lead-out plate 123 to the first long side 112 and the distance W2 from the lead-out plate 123 to the second long side 114 satisfy the following relationship: W2≥1 / 4W, W1<1 / 2W.

[0030] In some embodiments, the connecting angle J2 has a first radian radius r2, the corner J1 of the lead-out disk facing the second long side and the second short side has a second radian radius r1, and the distance d from the connection point of the adapter electrode 122 and the connecting angle J2 to the edge of the lead-out disk 123 facing the second long side 114 satisfies the relationship: d≥r1+r2.

[0031] In some embodiments, the radius of the connecting corner satisfies r1≥10um, and the arc of the corner of the lead-out plate facing the second long side and the second short side satisfies r2≥10um.

[0032] See Figure 2 One embodiment provides another lead layer 100'. The difference between lead layer 100' and lead layer 100 in this embodiment is that there is an angle θ between the adapter electrode 122 and the first short side 111, where θ satisfies: 90 degrees ≥ θ ≥ 45 degrees. That is, the inner corner position where the adapter electrode 122 and the inner electrode 121 are connected is as close as possible to the direction of the second long side 114, and the connection position between the adapter electrode 122 and the connecting disk 123 is as close as possible to the direction of the first long side 112, so that the adapter electrode 122 has a preset tilt angle.

[0033] See Figure 3 One embodiment provides a substrate 200. The substrate 200 includes an inner electrode layer 201 and two lead layers 100 of any of the foregoing embodiments. The inner electrode layer 201 has sub-electrodes and is sandwiched between the two lead layers 100. The two ends of the sub-electrodes are respectively connected to the layer pads 1211 of the lead layers 100. In some embodiments, the outermost layer of the substrate 200 may further include two insulating layers 202 without electrodes.

[0034] See also Figure 4 In some embodiments, the multiple inner electrode layers 201 include multiple sub-electrodes stacked sequentially, each sub-electrode having an arc-shaped electrode segment, the arc-shaped electrodes being connected end to end to form a spiral coil-shaped inner electrode.

[0035] In some embodiments, the substrate 200 can be manufactured by sequentially laminating and pressing together green tape with electrodes and green tape without electrodes, for example... Figure 3 The layers are stacked sequentially as follows: electrodeless green tape 202, electrode green tape (lead layer 100), electrode green tape (inner electrode layer 201), electrode green tape (inner electrode layer 201), electrode green tape (inner electrode layer 201), electrode green tape (lead layer 100), and electrodeless green tape 202. Then, it is compacted again by warm water pressure, cut to the required product size, and then subjected to debinding, sintering, and chamfering to form a ceramic-like product, creating a semi-finished substrate with the characteristics of an inductor device.

[0036] See Figure 5 One embodiment provides an inductor 300. The inductor 300 includes a first terminal electrode 401, a second terminal electrode 402, and a substrate 200 as described in any of the preceding embodiments. The first terminal electrode 401 and the second terminal electrode 402 are disposed on opposite sides of the substrate 200. The first terminal electrode 401 is connected to a layer pad of a lead layer, and the second terminal electrode 402 is connected to a layer pad of another lead layer.

[0037] In one embodiment, the terminal electrode can be fabricated as follows: pure silver paste is selected as the terminal paste. After chamfering, the side of the semi-finished substrate 200 that needs to be sealed is sealed with silver paste. It is then dried at a temperature of about 110°C for about 30 minutes, and then silver is burned at a temperature of about 700°C. The semi-finished substrate after sealing and burning silver is then DPA ground, and then surface treated. A nickel layer and a tin layer are electroplated sequentially on the silver layer with a smooth surface to form the finished inductor 300. Then, the appearance is selected by taking pictures with a camera, and electrical sorting is performed after testing on a device test bench. Qualified finished products can be shipped after being taped.

[0038] Compared to existing technologies, the above embodiment connects the transfer electrode to the middle of the side of the lead-out pad away from the first short side. This means the connection point between the transfer electrode and the lead-out pad is far from the edge of the insulating layer, thus reducing the likelihood of cracks during continuous manufacturing processes. Furthermore, the connection point between the transfer electrode and the lead-out pad forms a connection angle facing the second long side, with a first arc, further reducing the probability of cracks and preventing interlayer short circuits during the silvering process. Moreover, even if a crack appears at the connection point between the transfer electrode and the lead-out pad, the crack will only extend along the inner edge of the lead-out pad due to the shielding effect of the lead-out pad itself. The crack exit point will eventually appear at the location where the insulating layer does not have a terminal electrode. This prevents molten silver from entering the crack during the silvering process, thus also avoiding short circuits.

[0039] The specific embodiments described above do not constitute a limitation on the scope of protection of this utility model. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the scope of protection of this utility model.

Claims

1. A lead layer, characterized in that, include: An insulating layer, the insulating layer comprising a first short side, a first long side, a second short side, and a second long side connected end to end perpendicular to the thickness direction of the insulating layer; An electrode disposed on an insulating layer includes an internal electrode, a transfer electrode, and a lead-out plate. The internal electrode has a preset curvature. One end of the internal electrode is connected to the lead-out plate via the transfer electrode, and the other end of the internal electrode is provided with a layering plate. One side of the lead-out plate is flush with the first short side. The middle part of the other side of the lead-out plate away from the first short side is connected to the transfer electrode. The connection between the transfer electrode and the lead-out plate forms a connection angle facing the second long side, and the connection angle has a first curvature.

2. The lead layer according to claim 1, characterized in that, The distance c2 from the inner corner where the adapter electrode and the internal electrode are connected to the first short side is greater than or equal to the distance c1 from the internal electrode to the second short side.

3. The lead layer according to claim 1, characterized in that, The distance W1 from the lead-out plate to the first long side and the distance W2 from the lead-out plate to the second long side satisfy the following relationship: W2≥1 / 4W, W1<1 / 2W.

4. The lead layer according to claim 1, characterized in that, The connecting corner has a first radius r1, and the corner of the lead plate facing the second long side and the second short side has a second radius r2. The distance d from the connection point of the adapter electrode and the connecting corner to the edge of the lead plate facing the second long side satisfies the relationship: d≥r1+r2.

5. The lead layer according to claim 4, characterized in that, The radius of the connecting corner satisfies r1≥10um, and the arc of the corner of the lead-out plate facing the second long side and the second short side satisfies r2≥10um.

6. The lead layer according to claim 4, characterized in that, The adapter electrode and the first short side have an included angle θ, where θ satisfies: 90 degrees ≥ θ ≥ 45 degrees.

7. A matrix, characterized in that, include: The inner electrode layer and two lead layers as described in any one of claims 1 to 6, the inner electrode layer having sub-electrodes, the inner electrode layer being sandwiched between the two lead layers, and the two ends of the sub-electrodes being respectively connected to the layer pads of the lead layers.

8. The matrix according to claim 7, characterized in that, The inner electrode layer comprises multiple layers, each including multiple sub-electrodes stacked sequentially. Each sub-electrode has an arc-shaped electrode segment, and the arc-shaped electrodes are connected end-to-end to form a spiral coil-shaped inner electrode.

9. An inductor, characterized in that, It includes a first end electrode, a second end electrode, and a substrate as described in claim 7 or 8. The first end electrode and the second end electrode are disposed on opposite sides of the substrate. The first end electrode is connected to a layer pad of a lead layer, and the second end electrode is connected to a layer pad of another lead layer.

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