Ball mounting device and semiconductor equipment

Abstract

The utility model discloses a ball mounting device and semiconductor equipment, and relates to the technical field of semiconductor equipment. The ball mounting device comprises at least two printing steel meshes, the at least two printing steel meshes are used for being sequentially placed on a base plate to be subjected to ball mounting, and according to the sequence of the printing steel meshes placed on the base plate to be subjected to ball mounting, the hole diameters of the at least two printing steel meshes are gradually reduced. According to the ball mounting device and the semiconductor equipment, the at least two printing steel meshes with different apertures are used for manual ball mounting, so that the problem that solder balls are different in size due to the fact that one steel mesh is used for printing in manual ball mounting in the prior art, and holes of the steel mesh are prone to being blocked can be solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a bulb planting device and a semiconductor device. Background Technology

[0002] Fan-out wafer-level packaging (FOWLP) is widely used in the semiconductor industry. Its main advantages include high-density integration, small package size, superior product performance, and high signal transmission frequency. FOWLP technology primarily achieves multi-pin outputs and smaller pin pitch. To meet the requirements of multi-chip packaging, a larger package area is often needed. Generally, after rewiring on the wafer, a ball-mounting process is performed again, followed by dicing into individual chips.

[0003] In existing technologies, if the machine malfunctions, a manual ball-mounting fixture is typically used for ball placement. The principle involves forming a solder layer on the ball-mounting pads on the back of the substrate using stencil printing, followed by reflow to form the solder balls. However, as the diameter of the solder balls increases, residual solder layer tends to accumulate in the stencil holes during printing, causing blockages. This can lead to insufficient solder application, resulting in solder balls of varying sizes. Utility Model Content

[0004] The purpose of this application is to provide a ball-planting device and semiconductor equipment, which can solve the problem of inconsistent solder ball sizes caused by the stencil clogging that occurs when using a single stencil for manual ball planting in the prior art.

[0005] The embodiments of this application are implemented as follows:

[0006] A first aspect of this application provides a solder ball placement apparatus, comprising at least two printed stencils, which are sequentially placed on a substrate to be soldered, wherein the aperture of the at least two stencils gradually decreases according to the order in which they are placed on the substrate. This solder ball placement apparatus, by manually placing solder balls using at least two stencils with different apertures, solves the problem in the prior art where manual solder ball placement using a single stencil easily leads to clogging and inconsistent solder ball sizes.

[0007] As one possible implementation, it also includes a placement base for placing the substrate to be planted and the printed stencil.

[0008] As one possible implementation, the placement base is provided with a placement groove, and the substrate to be planted is positioned and placed in the placement groove.

[0009] As an implementable mode, the placing base is provided with a first matching part, the printing steel net is provided with a second matching part, and the first matching part and the second matching part are matched with each other to position and place the printing steel net in the placing base.

[0010] As an implementable mode, the first matching part is a protrusion, and the second matching part is a groove corresponding to the protrusion; or the first matching part is a groove, and the second matching part is a protrusion corresponding to the groove.

[0011] As an implementable mode, the placing base is provided with a first matching part, the printing steel net is provided with a second matching part, and the first matching part and the second matching part are matched with each other to position and place the printing steel net in the placing base.

[0012] As an implementable mode, the positioning frame comprises a side wall frame and a surrounding wall frame detachably connected with the side wall frame, and the side wall frame protrudes from the surrounding wall frame in the stacking direction.

[0013] As an implementable mode, the side wall frame is provided with a plurality of mounting holes in the stacking direction, and the surrounding wall frame can be mounted in any one of the mounting holes.

[0014] As an implementable mode, the mesh holes of the at least two printing steel nets are one-to-one corresponding.

[0015] The second aspect of the embodiment of the present application provides a semiconductor device comprising the ball mounting device. The ball mounting device can solve the problem of different sizes of tin balls caused by the blockage of the mesh holes of the steel net in the prior art by manually mounting balls by using at least two printing steel nets with different mesh diameters.

[0016] The beneficial effects of the embodiment of the present application include:

[0017] The ball mounting device comprises at least two printing steel meshes which are sequentially placed on the substrate to be mounted with balls, and the aperture of the at least two printing steel meshes gradually decreases according to the sequence of being placed on the substrate to be mounted with balls. In actual use, the printing steel mesh with a larger aperture can be placed on the substrate to be mounted with balls first for coating printing, and then the printing steel mesh with a smaller aperture is placed on the substrate to be mounted with balls for coating printing. Compared with the problem that the tin ball size is not uniform due to the phenomenon of hole blocking of the steel mesh in the prior art, the ball mounting device provided in the application comprises at least two printing steel meshes with different apertures, and in actual use, by using the at least two printing steel meshes with different apertures for manual ball mounting, the amount of tin paste in the mesh hole of each printing steel mesh can be reduced, the probability of the phenomenon of hole blocking of the printing steel mesh is reduced, so that the amount of tin in the mesh hole of each printing steel mesh is sufficient, and the uniformity of the size of the tin ball obtained can be ensured. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor.

[0019] Figure 1 The ball mounting device provided in the embodiments of the application is shown in an exploded schematic view.

[0020] Figure 2 The assembly schematic view of the ball mounting device provided in the embodiments of the application is shown.

[0021] Figure 3 The structure schematic view of the placement base provided in the embodiments of the application is shown.

[0022] Figure legend: 100-ball mounting device; 10a, 10b, 10c-printing steel mesh; 11-second matching part; 20-placement base; 21-placement groove; 22-first matching part; 30-positioning frame; 31-side wall frame; 32-enclosure frame; 200-substrate to be mounted with balls. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical solutions and advantages of the embodiments of the application more clear, the technical solutions in the embodiments of the application will be described clearly and completely below in combination with the drawings in the embodiments of the application. Obviously, the described embodiments are some embodiments of the application, but not all the embodiments. The components of the embodiments of the application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0024] The following detailed description of embodiments of the application in the drawings provided by the application is not intended to limit the scope of the application claimed, but merely represents selected embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those of ordinary skill in the art without creative labor are within the scope of protection of the application.

[0025] It should be noted that similar reference numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0026] In the description of the application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship when the product of the application is normally placed, and are only for the convenience of describing the application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0027] In addition, the terms "horizontal", "vertical", etc. do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that its direction is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0028] In the description of the application, it should also be noted that unless otherwise explicitly specified and limited, the terms "provided", "mounted", "connected", "connected" should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the connection between two elements inside. For those of ordinary skill in the art, the specific meaning of the above terms in the application can be understood according to the specific circumstances.

[0029] Please refer to Figures 1 to 3 The embodiment of the application provides a ball planting device 100, which comprises at least two printing steel meshes, the at least two printing steel meshes are used to be placed on a to-be-planted ball substrate 200 in sequence, and the aperture of the at least two printing steel meshes gradually decreases according to the sequence of being placed on the to-be-planted ball substrate 200. The ball planting device 100 can solve the problem of different sizes of tin balls caused by the phenomenon of hole blocking of the steel mesh in the prior art by manually planting balls by using at least two printing steel meshes with different apertures.

[0030] It should be noted that, as shown in Figure 1 The ball planting device 100 includes at least two printing steel meshes, wherein the at least two printing steel meshes have different hole diameters, and the hole diameters of the at least two printing steel meshes gradually decrease according to the order of placement on the substrate 200 to be planted with balls. In other words, in actual use, the printing steel mesh with a larger hole diameter can be placed on the substrate 200 to be planted with balls first for coating and printing, and then the printing steel mesh with a smaller hole diameter can be placed on the substrate 200 to be planted with balls for coating and printing.

[0031] Compared with the problem of uneven tin ball size caused by the phenomenon of hole blocking of a steel mesh in the prior art, the ball planting device 100 provided by the present application includes at least two printing steel meshes with different hole diameters. In actual use, by using at least two printing steel meshes with different hole diameters for manual ball planting, the amount of tin paste in each mesh hole of the printing steel mesh can be reduced, and the probability of hole blocking of the printing steel mesh can be reduced, thereby ensuring that the amount of tin in each mesh hole of the printing steel mesh is sufficient, and further ensuring the consistency of the size of the tin balls obtained.

[0032] For example, as shown in Figure 1 In this embodiment, the number of printing steel meshes is three, and the hole diameters of the printing steel mesh 10a, the printing steel mesh 10b, and the printing steel mesh 10c gradually decrease according to the order of placement on the substrate 200 to be planted with balls. In actual use, the printing steel mesh 10a can be placed on the substrate 200 to be planted with balls first for coating and printing of tin paste, then the printing steel mesh 10b can be placed on the substrate 200 to be planted with balls for coating and printing of tin paste, and finally the printing steel mesh 10c can be placed on the substrate 200 to be planted with balls for coating and printing of tin paste, and tin balls are formed after reflow.

[0033] As an implementable manner, as shown in Figures 1 to 3 The ball planting device 100 further includes a placement base 20 for placing the substrate 200 to be planted with balls and the printing steel mesh, so as to provide installation and support for the substrate 200 to be planted with balls and the printing steel mesh through the placement base 20, thereby ensuring the smooth progress of the manual ball planting process.

[0034] As an implementable manner, as shown in Figure 1 and Figure 2 The placement base 20 is provided with a placement groove 21, and the substrate 200 to be planted with balls is positioned and placed in the placement groove 21, so as to play a positioning role for the substrate 200 to be planted with balls through the placement groove 21. The shape and size of the placement groove 21 should match the shape and size of the substrate 200 to be planted with balls.

[0035] As an implementable manner, as shown in Figure 1 The placing base 20 is provided with a first matching part 22, and the printing steel mesh is provided with a second matching part 11. The first matching part 22 and the second matching part 11 match with each other to position the printing steel mesh in the placing base 20. Thus, under the joint action of the first matching part 22 and the second matching part 11, the printing steel mesh can be positioned and assembled in the placing base 20, thereby ensuring that the printing steel mesh can be aligned with the ball-planting substrate 200.

[0036] As an implementable manner, as shown in Figure 1 In this embodiment, the first matching part 22 is a protrusion, and the second matching part 11 is a groove corresponding to the protrusion. Alternatively, in other embodiments, the first matching part 22 is a groove, and the second matching part 11 is a protrusion corresponding to the groove. As long as the first matching part 22 and the second matching part 11 can match to play a positioning role and can ensure that the printing steel mesh is aligned with the ball-planting substrate 200, it is acceptable.

[0037] As an implementable manner, as shown in Figure 1 and Figure 3 The ball-planting device 100 further includes a positioning frame 30. The ball-planting substrate 200, the printing steel mesh, and the positioning frame 30 are sequentially stacked to match the printing steel mesh with the positioning frame 30 to coat the printing tin paste, so that the tin paste is prevented from overflowing by the positioning frame 30.

[0038] For example, as shown in Figure 1 In actual use, the printing steel mesh 10a can be first placed on the ball-planting substrate 200, and then the positioning frame 30 is placed on the printing steel mesh 10a to coat the tin paste. After the first coating and printing, the positioning frame 30 is removed, and then the printing steel mesh 10b is placed on the ball-planting substrate 200. Then, the positioning frame 30 is placed on the printing steel mesh 10b to coat the tin paste. After the second coating and printing, the positioning frame 30 is removed, and then the printing steel mesh 10c is placed on the ball-planting substrate 200. Then, the positioning frame 30 is placed on the printing steel mesh 10c to coat the tin paste. Finally, the positioning frame 30 and all the printing steel meshes are removed, and the tin paste is reflowed to form tin balls.

[0039] As an implementable manner, as shown in Figure 1 The positioning frame 30 includes a side wall frame 31 and a surrounding wall frame 32 detachably connected to the side wall frame 31. In the stacking direction, the side wall frame 31 protrudes from the surrounding wall frame 32, so that the tin paste in the surrounding wall frame 32 is further prevented from overflowing, thereby playing a double protection role.

[0040] As an implementation, a plurality of mounting holes are arranged on the side wall frame 31 along the stacking direction, and the surrounding wall frame 32 can be mounted in any one of the mounting holes to change the height difference between the side wall frame 31 and the surrounding wall frame 32.

[0041] As an implementation, as shown in Figure 1 At least two printing steel meshes are arranged in one-to-one correspondence to ensure that the tin paste in the corresponding mesh holes along the stacking direction forms tin balls after reflowing again.

[0042] In a second aspect, the application provides a semiconductor device comprising the ball mounting device 100. Since the structure and advantages of the ball mounting device 100 have been described in detail in the foregoing embodiments, they will not be described here again.

[0043] The above only describes optional embodiments of the application and is not intended to limit the application. For those skilled in the art, the application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. within the spirit and principles of the application shall be included in the protection scope of the application.

[0044] In addition, it should be noted that each specific technical feature described in the foregoing specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, various possible combinations will not be described again in the application.

Claims

1. A bulb planting device, characterized in that, It includes at least two printed stencils, which are used to be placed sequentially on a substrate to be planted with balls, and the aperture of the at least two printed stencils gradually decreases according to the order in which they are placed on the substrate to be planted with balls.

2. The bulb-planting device according to claim 1, characterized in that, It also includes a placement base for placing the substrate to be planted and the printed stencil.

3. The bulb-planting device according to claim 2, characterized in that, The placement base is provided with a placement groove, and the substrate to be planted is positioned and placed in the placement groove.

4. The bulb-planting device according to claim 2, characterized in that, The placement base is provided with a first mating part, and the printed steel mesh is provided with a second mating part. The first mating part and the second mating part cooperate with each other to position the printed steel mesh within the placement base.

5. The bulb-planting device according to claim 4, characterized in that, The first mating part is a protrusion, and the second mating part is a groove corresponding to the protrusion; or, the first mating part is a groove, and the second mating part is a protrusion corresponding to the groove.

6. The bulb-planting device according to claim 2, characterized in that, It also includes a positioning frame, wherein the substrate to be implanted, the printed stencil, and the positioning frame are stacked in sequence so that the printed stencil and the positioning frame cooperate with each other to apply solder paste.

7. The bulb-planting device according to claim 6, characterized in that, The positioning frame includes a side wall frame and a surrounding wall frame detachably connected to the side wall frame, wherein the side wall frame protrudes from the surrounding wall frame along the stacking direction.

8. The bulb-planting device according to claim 7, characterized in that, Along the stacking direction, the side wall frame is provided with multiple mounting holes, and the enclosure frame can be installed in any one of the mounting holes.

9. The pelleting device according to any one of claims 1 to 8, characterized in that, At least two printed steel meshes have corresponding mesh openings.

10. A semiconductor device, characterized in that, Includes the ball-planting device according to any one of claims 1 to 9.

Images