Three-cavity full-automatic chip transfer chip heat treatment equipment

Abstract

The utility model belongs to the technical field of wafer heat treatment, and discloses a three-cavity full-automatic wafer transfer chip heat treatment device, which comprises a front cabinet and a rear cabinet, a machine turntable is fixedly arranged in the front cabinet, the flexibility and adaptability of a clamp are improved through the arrangement of a manipulator, a linear module drives the machine turntable to move, and the heat treatment efficiency is improved. The machine rotary table penetrates through the lower portion of the central platform to reach the position of the clamping and plugging table, the mechanical arm starts to work, the telescopic column stretches out to push the two clamps and the elastic plate to be close to the wafer, after the clamps clamp the wafer, the telescopic column retracts, the wafer is fixed in the clamps of the mechanical arm, and the machine rotary table is driven by the linear module to move to a proper position. The wafer is conveyed to the position near the cavity of the rear cabinet, a self-adaptive adjusting buffer structure is designed on the clamping head, a high-temperature-resistant elastic material is arranged at the contact position of the clamp and the wafer, the clamping mode can be automatically adjusted according to the wafers of different sizes and shapes, and the flexibility and adaptability of the equipment are improved.

Description

Technical Field

[0001] This utility model belongs to the field of wafer heat treatment technology, specifically a three-cavity fully automatic wafer transfer chip heat treatment equipment. Background Technology

[0002] The three-cavity fully automated wafer transfer chip heat treatment equipment is a professional device with three independent cavities that can realize fully automated wafer transfer and heat treatment. The fully automated wafer transfer function of this equipment can greatly improve production efficiency and reduce errors and time waste caused by manual operation. It can accurately and quickly transfer wafers between different processing stages to ensure the smooth operation of the production process.

[0003] When using a three-cavity fully automated wafer transfer chip thermal processing equipment, a robotic arm or automated wafer transfer device picks up wafers from a wafer cassette or other storage device. After being picked up, the wafers are first transferred to a pre-processing chamber, where some preliminary processing is performed. After pre-processing (if any), the wafers are transferred to a heating chamber, where they are preheated. During the preheating process, the equipment usually uses special heating methods or devices to ensure that the temperature of the wafers is evenly distributed. When the wafers reach the preheating temperature, the equipment enters the formal heating stage. After the thermal processing is completed, the wafers need to be cooled. When the wafers are cooled to a certain temperature, they are transferred from the heating chamber to the unloading position by the transfer system.

[0004] However, while the robot arm of this device is designed to match wafers of a specific shape, it cannot effectively grip wafers of other shapes. For example, a gripper designed for round wafers may not be able to grip square or irregularly shaped wafers well. When the gripper cannot effectively grip wafers of mismatched shapes, the robot arm needs to be more careful in the process of grasping and placing the wafers, and the movements become slower, thereby prolonging the transfer time of the wafers between various stages and reducing the overall production efficiency. Utility Model Content

[0005] To address the problems mentioned in the background art, this utility model provides a three-cavity fully automatic wafer transfer chip heat treatment device, which solves the problem that robotic arms are not easy to automatically adjust the gripping method according to wafers of different sizes and shapes.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a three-cavity fully automatic chip heat treatment equipment, including a front cabinet and a rear cabinet, wherein a machine turntable is fixedly installed inside the front cabinet, a robotic arm is installed at one end of the machine turntable, and a linear module is installed at the bottom of the machine turntable;

[0007] The robotic arm includes a clamp, an elastic plate, a telescopic column, a fixed block, and a stabilizing belt. There are two clamps and two elastic plates. There are two sets of telescopic columns, and each set has two telescopic columns. One end of each of the two telescopic columns is connected to one end of the fixed block, and the other end of each of the two telescopic columns passes through the two clamps and is connected to the two elastic plates. The stabilizing belt is sleeved on the surface of the fixed block.

[0008] Preferably, a host computer is mounted on the front end of the front cabinet via a mounting bracket, and a central platform is also provided inside the front cabinet.

[0009] Preferably, a calibrator is provided on the central platform, and the machine turntable passes under the central platform when it moves.

[0010] Preferably, the front cabinet and the rear cabinet are fixedly connected, and the rear cabinet is equipped with a low-voltage cabinet and a high-voltage cabinet respectively.

[0011] Preferably, a chamber is fixedly installed on the left and right central axes of the rear cabinet, and the chamber is the core area for wafer heat treatment.

[0012] Preferably, both clamps have through holes adapted to the telescopic column inside, and each clamp has a mounting frame on one side, with the fixing block and stabilizing band located inside the mounting frame.

[0013] Preferably, a fixing plate is fixedly connected to one side of the fixing block, one side of the fixing plate is connected to the inner sidewall of the mounting frame, and a fixing cover is fixedly installed on one side of the mounting frame.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0015] This invention improves the flexibility and adaptability of the gripper by incorporating a robotic arm. A linear module drives the machine turntable, which passes under the central platform to the clamping station. The robotic arm then begins operation, extending a telescopic column to push two grippers and an elastic plate closer to the wafer. After the grippers clamp the wafer, the telescopic column retracts, securing the wafer within the robotic arm's grippers. The turntable, driven by the linear module, moves to a suitable position, transferring the wafer to the vicinity of the rear cabinet chamber. An adaptive buffer structure is designed on the gripping head, and high-temperature resistant elastic material is placed at the contact points between the grippers and the wafer. This allows for automatic adjustment of the gripping method based on wafers of different sizes and shapes, enhancing the equipment's flexibility and adaptability. Furthermore, since wafers expand thermally during heat treatment, the aforementioned gripping mechanism ensures the stability of the grippers' handling of the wafer at different temperatures. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram showing the cooperative relationship between the machine turntable and the robotic arm of this utility model;

[0018] Figure 3 This is a schematic diagram of the robotic arm structure of this utility model;

[0019] Figure 4 This is a schematic diagram of the disassembled structure of the robotic arm of this utility model;

[0020] Figure 5 This is a front view structural diagram of the present utility model.

[0021] In the diagram: 1. Front cabinet; 2. Rear cabinet; 3. Machine turntable; 4. Robotic arm; 41. Fixture; 42. Elastic plate; 43. Telescopic column; 44. Fixing block; 441. Fixing piece; 45. Stabilizing belt; 46. Mounting frame; 5. Linear module; 6. Host computer; 7. Central platform; 8. Chamber. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] like Figures 1 to 5 As shown, this utility model provides a three-cavity fully automatic chip heat treatment equipment, including a front cabinet 1 and a rear cabinet 2. A machine turntable 3 is fixedly installed inside the front cabinet 1. A robot arm 4 is installed at one end of the machine turntable 3, and a linear module 5 is installed at the bottom of the machine turntable 3.

[0024] The robotic arm 4 includes a clamp 41, an elastic plate 42, a telescopic column 43, a fixed block 44, and a stabilizing belt 45. There are two clamps 41 and two elastic plates 42. There are two sets of telescopic columns 43, and each set has two telescopic columns 43. One end of each telescopic column 43 is connected to one end of the fixed block 44, and the other end of each telescopic column 43 passes through the two clamps 41 and is connected to the two elastic plates 42. The stabilizing belt 45 is sleeved on the surface of the fixed block 44.

[0025] The above solution employs a high-temperature resistant elastic material for the elastic plate 42. High-temperature resistant elastic materials, such as special rubber or ceramics, are used at the contact points to provide cushioning for the wafer while ensuring heat resistance, reducing impact during clamping and preventing damage. Simultaneously, the use of elastic material accommodates the thermal expansion of the wafer during heat treatment, ensuring stable clamping of the wafer by the clamp 41 at different temperatures. The front cabinet 1, as the operating front end of the equipment, provides a relatively open space for wafer transfer and operation, facilitating observation and intervention. Key components such as the internal machine turntable 3, robotic arm 4, and linear module 5 are located here, allowing operators to intuitively understand the wafer transfer process and facilitating troubleshooting and routine maintenance. Furthermore, the front cabinet 1 also houses control equipment such as the host computer 6, enabling operators to set parameters and monitor equipment operation.

[0026] like Figures 1 to 5 As shown, the front cabinet 1 has a host computer 6 mounted on the front end via a mounting bracket. The front cabinet 1 also has a central platform 7 inside, on which a calibrator is mounted. When the machine turntable 3 moves, it passes under the central platform 7. The front cabinet 1 and the rear cabinet 2 are fixedly connected. The rear cabinet 2 has a low-voltage cabinet and a high-voltage cabinet installed inside.

[0027] The above scheme is adopted: the rear cabinet 2 is the core part of the equipment, which houses important structures such as the low-voltage cabinet, the high-voltage cabinet, and the chamber 8 for wafer heat treatment. The design of the rear cabinet 2 focuses on functionality and stability, providing a solid guarantee for the normal operation of the equipment. The low-voltage cabinet and the high-voltage cabinet manage the low-voltage and high-voltage parts of the equipment respectively, ensuring the stable operation of the electrical system. The high-voltage cabinet provides power to the high-power components of the equipment, such as heating elements and the drive motor of the robotic arm 4, while the low-voltage cabinet is used for electrical components of low-voltage parts such as control circuits and sensor signal processing. This separation design can effectively avoid interference between high-voltage and low-voltage circuits and improve the reliability and stability of the equipment.

[0028] like Figures 1 to 5 As shown, a chamber 8 is fixedly installed on the left and right central axes of the rear cabinet 2. The chamber 8 is the core area for wafer heat treatment. The interior of each of the two clamps 41 is provided with through holes that are compatible with the telescopic column 43. A mounting frame 46 is provided on one side of each of the two clamps 41. The fixing block 44 and the stabilizing band 45 are located inside the mounting frame 46. A fixing piece 441 is fixedly connected to one side of the fixing block 44. One side of the fixing piece 441 is connected to the inner side wall of the mounting frame 46. A fixing cover is fixedly installed on one side of the mounting frame 46.

[0029] The above solution provides precise linear motion power for the machine turntable 3. It adopts advanced linear guide and drive motor technology to achieve high-speed and high-precision linear motion. The accuracy and stability of the linear module 5 directly affect the positional accuracy of the machine turntable 3 and the robot arm 4, thereby affecting the accuracy and reliability of wafer transfer.

[0030] The working principle and usage process of this utility model are as follows: The wafer to be processed is placed on the cassette, which is usually located at the front end of the front cabinet 1 of the equipment. The operator inputs the heat treatment process parameters, such as the temperature of the chamber 8 and the heat treatment time, through the host computer 6 installed on the mounting bracket at the front end of the front cabinet 1.

[0031] The linear module 5 drives the machine turntable 3 to move. The machine turntable 3 passes under the central platform 7 and reaches the position of the chuck. The robot arm 4 starts to work. The telescopic column 43 extends and pushes the two clamps 41 and the elastic plate 42 closer to the wafer. After the clamps 41 clamp the wafer, the telescopic column 43 retracts and fixes the wafer in the clamps 41 of the robot arm 4. The machine turntable 3 moves to the appropriate position under the drive of the linear module 5 and transfers the wafer to the vicinity of the chamber 8 of the rear cabinet 2.

[0032] Robotic arm 4 places the wafer into chamber 8, where heat treatment begins. Chamber 8 serves as the core area for wafer heat treatment, providing a stable temperature and process gas environment based on preset process parameters. After the wafer heat treatment is completed, robotic arm 4 removes the wafer from chamber 8 and transfers it to a cooling platform for cooling. The cooling platform lowers the wafer temperature through methods such as air cooling and water cooling. The process of wafer transfer, heat treatment, and cooling is repeated to achieve heat treatment of batch wafers.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A three-cavity fully automatic chip heat treatment device, comprising a front cabinet (1) and a rear cabinet (2), characterized in that: A machine turntable (3) is fixedly installed inside the front cabinet (1). A robot arm (4) is installed at one end of the machine turntable (3). A linear module (5) is installed at the bottom of the machine turntable (3). The robotic arm (4) includes a clamp (41), an elastic plate (42), a telescopic column (43), a fixed block (44), and a stabilizing belt (45). There are two clamps (41) and two elastic plates (42). There are two sets of telescopic columns (43), and each set has two telescopic columns (43). One end of each telescopic column (43) is connected to one end of the fixed block (44), and the other end of each telescopic column (43) passes through the two clamps (41) and is connected to the two elastic plates (42). The stabilizing belt (45) is sleeved on the surface of the fixed block (44).

2. The three-cavity fully automatic chip heat treatment equipment according to claim 1, characterized in that: The front end of the front cabinet (1) is equipped with a host computer (6) via a mounting bracket, and a central platform (7) is also provided inside the front cabinet (1).

3. The three-cavity fully automatic chip heat treatment equipment according to claim 2, characterized in that: A calibrator is provided on the central platform (7), and the machine turntable (3) passes under the central platform (7) when it moves.

4. The three-cavity fully automatic chip heat treatment equipment according to claim 1, characterized in that: The front cabinet (1) and the rear cabinet (2) are fixedly connected, and the rear cabinet (2) is equipped with a low-voltage cabinet and a high-voltage cabinet respectively.

5. The three-cavity fully automatic chip heat treatment equipment according to claim 1, characterized in that: A chamber (8) is fixedly installed on the left and right central axes of the rear cabinet (2), and the chamber (8) is the core area for wafer heat treatment.

6. The three-cavity fully automatic chip heat treatment equipment according to claim 1, characterized in that: Both clamps (41) have through holes that are adapted to the telescopic column (43) inside. Both clamps (41) have mounting frames (46) on one side. The fixing block (44) and the stabilizing belt (45) are located inside the mounting frames (46).

7. The three-cavity fully automatic chip heat treatment equipment according to claim 6, characterized in that: A fixing piece (441) is fixedly connected to one side of the fixing block (44), and one side of the fixing piece (441) is connected to the inner wall of the mounting frame (46). A fixing cover is fixedly installed on one side of the mounting frame (46).

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