Luminous cushion block and chip mounting machine table

Abstract

The utility model provides a light-emitting cushion block and a chip mounting machine table, the light-emitting cushion block is used for supporting a lead frame conveyed from a first direction, and the lead frame comprises base areas arranged in a matrix. The light-emitting cushion block comprises a base and a light-emitting assembly. The base is in a strip shape and is fixedly arranged in the direction parallel to the second direction. The light-emitting assembly is installed on the base and arranged in the length extending direction of the base to form a strip-shaped light-emitting area. The length of the strip-shaped light-emitting area at least covers all base areas of a longitudinal column of the lead frame, and the width of the strip-shaped light-emitting area at least covers at least one base area of a transverse column of the lead frame. According to the technical scheme, whether the glue crossing problem occurs in the glue dispensing process or not can be detected in a non-destructive manner through the change of the light and shadow pattern, so that the problem can be found and corrected in time under the condition that the chip is not damaged, and the production efficiency and the product quality are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically, to a light-emitting pad and a die-loading machine. Background Technology

[0002] In the semiconductor die bonding process, the lead frame is first fed into the dispensing area on a track, and then the dispensing head precisely applies adhesive to the base island of the lead frame. Subsequently, the frame is moved to the die bonding area, where the bonding head picks up the chip and places it on the adhesive, followed by ejection. After subsequent baking steps, the adhesive cures, and the chip is firmly bonded to the frame via the adhesive, completing the die bonding process. Normally, electrical isolation must be maintained between the lead frame pins and the base island to prevent short circuits and other malfunctions. Conductive adhesives may be used during dispensing; under normal circumstances, proper dispensing will not cause adhesive to connect the base island and the pins. However, sometimes due to air pressure fluctuations, improper dispensing volume settings, or operational errors, excessive dispensing or misalignment may occur, causing adhesive to overflow from the base island and contact the pins, forming an electrical path and ultimately rendering the product unusable.

[0003] However, in existing technologies, the color of the pad is similar to the color of the adhesive in the machine's identification system, making it difficult for the system to distinguish between the pad and the adhesive. Therefore, it cannot detect in a timely manner whether the adhesive has connected the base island and the pins. This defect can lead to an increased product scrap rate, and in severe cases, may even render the entire batch of products scrap, causing significant economic losses. Utility Model Content

[0004] The purpose of this application is to provide a light-emitting pad and a die-loading machine, which can detect whether glue overflow occurs during the dispensing process in a non-destructive manner by changing the light and shadow pattern, thereby timely detecting and correcting the problem without damaging the chip, and improving production efficiency and product quality.

[0005] In a first aspect, this application provides a light-emitting pad for supporting a lead frame conveyed from a first direction, wherein a second direction is defined as a direction parallel to a horizontal plane and perpendicular to the first direction. The lead frame includes base regions arranged in a matrix, the matrix arrangement including rows and columns. When the lead frame is supported by the light-emitting pad, the rows are along the first direction and the columns are along the second direction.

[0006] The light-emitting pad includes a base and a light-emitting component. The base is strip-shaped and fixedly positioned parallel to a second direction. The light-emitting component is mounted on the base and arranged along the length of the base to form a strip-shaped light-emitting area. The length of the strip-shaped light-emitting area is sufficient to cover at least one column of the lead frame's base area, and the width of the strip-shaped light-emitting area is sufficient to cover at least one column of the base area.

[0007] In one feasible solution, the light-emitting pad includes locking parts disposed on both sides of the base along its length direction for fixing the light-emitting pad to the mounting machine table.

[0008] In one feasible solution, a mounting groove is provided on the upper surface of the base, and the light-emitting component is fixedly installed in the mounting groove.

[0009] In one feasible embodiment, the upper surface of the light-emitting pad is provided with a transparent cover plate, the upper surface of which forms a support plane for supporting the lead frame.

[0010] In one feasible embodiment, a light-diffusing layer is provided on the upper and / or lower surfaces of the cover plate. Light generated by the light-emitting component is scattered as it passes through the light-diffusing layer.

[0011] Secondly, this application also provides a wafer loading machine, including a light-emitting pad and a machine body. The machine body has a table extending along a first direction and a second direction, the first direction being the feeding direction of the lead frame. The light-emitting pad is mounted on the table, wherein the length direction of the base of the light-emitting pad is parallel to the second direction.

[0012] In one feasible embodiment, two locking mechanisms are fixedly disposed parallel to each other and spaced apart along a second direction on the surface of the table, forming a receiving space between the two locking mechanisms and the table. The light-emitting pad includes locking parts disposed on both sides of the base along its length direction, the light-emitting pad is placed between the two locking mechanisms, and the locking parts on both sides of the base along its length direction are respectively engaged in the receiving spaces on both sides.

[0013] In one feasible embodiment, the wafer mounter includes a controller that is signal-connected to the light-emitting pad.

[0014] In one feasible embodiment, the wafer mounter includes an identification device positioned above a light-emitting pad, with its identification direction facing the pad. A controller is signal-connected to the identification device.

[0015] Compared with the prior art, the beneficial effects of this application include at least the following:

[0016] When the light-emitting pad of this application is in operation, part of the light emitted passes through the hollowed-out portion of the base area, while part is blocked by the non-hollowed-out portion, thus forming a light and shadow pattern in the base area. If an accident occurs during the dispensing process, and the adhesive connects the base island and the pin, additional shadows will appear at the corresponding positions of the light and shadow pattern in the base area. Therefore, by observing the changes in the light and shadow pattern, it is possible to quickly identify whether an adhesive overflow problem has occurred. This detection method utilizes changes in the light and shadow pattern to identify potential manufacturing defects. It is a non-destructive inspection technology that enables timely detection and correction of problems in the dispensing process without damaging the chip, thereby improving production efficiency and product quality. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a top view of the light-emitting pad shown according to an embodiment of this application;

[0019] Figure 2 This is a front view of the light-emitting pad.

[0020] Figure 3 A top view of the light-emitting pads mounted on the die-loading machine platform;

[0021] Figure 4 A top view of the lead frame being placed on the die mounter table;

[0022] Figure 5 This is a schematic diagram showing the operation of the light-emitting pad and the mounting machine.

[0023] Figure 6 This is a schematic diagram of the base area under normal dispensing conditions;

[0024] Figure 7 A schematic diagram of the base area where the glue connects the pins and the base island.

[0025] In the diagram: 1. Body; 2. Light-emitting pad; 3. Controller; 4. Identification device; 5. Lead frame; 101. Platform; 102. Limiting part; 103. Locking mechanism; 201. Base; 202. Light-emitting component; 203. Locking part; 204. Cover plate; 205. Soft light layer; 211. Mounting slot; 501. Base area; 511. Base island; 512. Pin; 513. Chip; 514. Adhesive; L1. First direction; L2. Second direction. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] like Figure 1 and Figure 2 As shown, this application provides a light-emitting pad 2. The light-emitting pad 2 is used to support the lead frame 5 conveyed from the first direction L1. The direction parallel to the horizontal plane and perpendicular to the first direction L1 is defined as the second direction L2, as detailed in [reference needed]. Figure 3 and Figure 4 The direction is indicated in the middle. For example... Figure 4 As shown, the lead frame 5 includes base regions 501 arranged in a matrix, the matrix arrangement including horizontal and vertical columns. Figure 6 and Figure 7 As shown, the base region 501 includes a base island 511 and a plurality of pins 512 arranged around the base island 511. When the lead frame 5 is supported by the light-emitting pad, the horizontal columns are along the first direction L1 and the vertical columns are along the second direction L2.

[0029] like Figure 1 As shown, the light-emitting pad includes a base 201 and a light-emitting component 202. The base 201 is strip-shaped and fixedly disposed parallel to a second direction. The light-emitting component 202 is mounted on the base 201 and arranged along the length of the base 201 to form a strip-shaped light-emitting area. The length of the strip-shaped light-emitting area is sufficient to cover at least all base areas 501 in one longitudinal column of the lead frame 5, and the width of the strip-shaped light-emitting area is sufficient to cover at least one base area 501 in one transverse column.

[0030] like Figure 6 and Figure 7 As shown, each base area 5 is provided with a base island 201 and multiple pins 512. Adhesive is applied to the base island 201 and the chip 513 is then mounted. Figure 4 and Figure 5 As shown, during operation, the lead frame 5 is placed on the pad 2. Part of the light emitted by the light-emitting component 202 passes through the hollow part of the base area, and part is blocked by the non-hollow part, thus forming a light and shadow pattern in the base area.

[0031] like Figure 6 As shown, when the dispensing and chip mounting are normal, the adhesive 514 only covers the base island 511 and does not directly connect to the pin 512. At this time, the area between the base island 511 and the pin 512 remains open, so the light emitted by the light-emitting component 202 can pass directly through this area. Figure 7As shown, if too much adhesive is applied or the application position deviates from the preset position, the adhesive 514 area may become too large or accidentally shift, connecting the base island 511 and the pin 512, causing a short circuit after power-on and damaging the chip 513. In this case, if the adhesive 514 accidentally covers the cutout area between the base island 511 and the pin 512, this area will change from a transparent to an opaque state, creating additional shadows at the corresponding positions of the light and shadow pattern in the base area. By observing the changes in the light and shadow pattern, it is possible to quickly identify whether an adhesive over-limit problem has occurred. This detection method utilizes changes in the light and shadow pattern to identify potential manufacturing defects. It is a non-destructive detection technology that allows for timely detection and correction of problems during the adhesive application process without damaging the chip, thereby improving production efficiency and product quality.

[0032] In one embodiment, such as Figure 1 and Figure 2 As shown, the light-emitting pad includes a locking part 203, which is disposed on both sides of the base 201 in the length direction, for fixing the light-emitting pad 2 on the mounting machine table.

[0033] In one embodiment, such as Figure 3 As shown, a mounting groove 211 is provided on the upper surface of the base 201, and the light-emitting component 202 is fixedly disposed within the mounting groove 211. Preferably, the mounting groove 211 can extend along the length direction of the base 201. Depending on actual needs, the light-emitting component 202 can be disposed at the bottom of the mounting groove 211, on the side of the mounting groove 211, or simultaneously at the bottom and side of the mounting groove 211. It should be noted that the opening area of ​​the mounting groove 211 of the base 201 is the size of the formed strip-shaped light-emitting area. The light-emitting component 202 can be one or more of LED lamp modules, fluorescent lamps, or electroluminescent panels, and is not limited here. In addition, since the light-emitting component 202 may generate a lot of heat when working for a long time, a heat dissipation device, such as a heat dissipation channel or heat sink, can be provided between the light-emitting component 202 and the bottom of the mounting groove to reduce the risk of failure of the light-emitting component 202 due to overheating.

[0034] In one embodiment, such as Figure 3As shown, a transparent cover plate 204 is provided on the upper surface of the light-emitting pad 2. Depending on actual needs, the cover plate 204 can cover the opening of the mounting groove 211 or be placed inside the mounting groove 211, and the upper surface of the cover plate 204 forms a support plane for supporting the lead frame 5. The cover plate 204 can be made of a transparent material with good heat resistance, hardness, and wear resistance, such as transparent plastic or glass; there are no restrictions here. The cover plate 204 can protect the light-emitting component 202 inside the pad 2 from the influence of the external environment, such as dust, moisture, or other contaminants that may affect its performance. Operators can directly observe the internal condition of the pad 2 through the cover plate 204, facilitating monitoring and adjustment of the working status of the light-emitting component 202, which improves the convenience and efficiency of operation. The cover plate 204 also helps prevent accidental contact with the light-emitting component 203 during operation, thereby avoiding damage to the chip or malfunction. Furthermore, the cover plate 204 helps enhance the overall structural stability of the pad 2, especially when the pad 2 needs to withstand a certain pressure or weight. Therefore, by designing a reasonable cover plate 2, the working efficiency and stability of the wafer loading machine can be improved, and the risk of failure caused by external environmental factors can be reduced.

[0035] In one embodiment, such as Figure 3 As shown, a light-diffusing layer 205 is provided on the upper and / or lower surfaces of the cover plate 204; the light generated by the light-emitting component 202 is scattered when it passes through the light-diffusing layer 205. The light-diffusing layer 205 helps to make the light softer and more evenly distributed, especially helping to avoid producing obvious shadows on the illuminated object, making the final light and shadow pattern visually clear and easy to distinguish. In practical applications, the light-diffusing layer 205 can be made of materials with good heat resistance (such as polycarbonate, polytetrafluoroethylene propylene, etc.) according to specific needs, or a light-diffusing material can be coated on the surface of the cover plate 204 to form the light-diffusing layer 205. In addition, the cover plate 204 can also be surface-treated (such as frosted) to achieve an effect similar to that of the light-diffusing layer 205.

[0036] like Figures 3-5 As shown, this application also provides a wafer loading machine, including a machine body 1 and a light-emitting pad 2. The machine body 1 has a table surface 101 extending along a first direction L1 and a second direction L2, where the first direction L1 is the feeding direction of the lead frame 5. The light-emitting pad is mounted on the table surface 101, wherein the length direction of the base 201 of the light-emitting pad is parallel to the second direction L2. Furthermore, as... Figure 3 As shown, limiting portions 102 parallel to the first direction L1 can be provided on both sides of the platform 101. The limiting portions 102 are higher than the platform 101 to prevent the lead frame 5 from accidentally shifting along the second direction L2 during operation. This design helps to improve the accuracy and efficiency of die mounting and ensures the consistency and reliability of chip mounting.

[0037] In one embodiment, such as Figure 3 and Figure 5 As shown, two parallel and spaced locking mechanisms 103 are fixedly disposed on the surface of the table 101 along the second direction L2, forming a receiving space between the two locking mechanisms 103 and the table 101. Figure 1 As shown, the locking part 203 can be a limiting boss fixedly disposed on the side of the base 201. Each side of the base 201 includes at least one limiting boss, the specific number of which is not limited here. The locking mechanism 103 can be fixedly connected to the table surface 101 by bolts or snap-fit. Figure 3 As shown, when in use, the locking parts 203 on both sides of the base 201 along the length direction are respectively placed into the receiving spaces on both sides to fix the light-emitting pad 2 on the table 101.

[0038] In one embodiment, such as Figure 5 As shown, the die mounter includes a controller 3, which is signal-connected to the light-emitting pad 2. An interface can be provided on the base 201 or locking part 203 of the light-emitting pad 2, allowing power and control signals to be transmitted through a single interface, simplifying wiring and installation, and improving the reliability and maintenance convenience of the die mounter. During operation, a signal can be sent through the controller 3 to turn off the light-emitting component 202 before dispensing to avoid interference with the dispensing process, and then turn on the light-emitting component 202 after dispensing and chip mounting to check if the adhesive has exceeded the specified limits.

[0039] In one embodiment, such as Figure 5 As shown, the mounting machine includes an identification device 4, positioned above the pad 2, with its identification direction facing the light-emitting pad 2. The controller 3 is signal-connected to the identification device 4. During operation, the identification device 4 can monitor the light and shadow pattern formed by the light from the light-emitting component 202 passing through the lead frame 5 in real time and transmit the signal to the controller 3. The controller 3 can have a built-in analysis program that checks whether a specific location in the light and shadow pattern is transparent to determine if that location is covered by adhesive, thus promptly detecting any adhesive over-limit issues. The identification device 4 can be a high-resolution camera or a photodetector, etc., and is not limited here.

[0040] In one embodiment, the die mounter includes a conveying device (not shown) for conveying the lead frame 5 along a first direction L1. The controller 3 can be signal-connected to the conveying device. During operation, after completing a certain amount of dispensing and chip mounting, the conveying device can automatically convey the lead frame 5 a distance along the first direction L1 to continue dispensing and chip mounting on the remaining substrate area, thereby improving production efficiency.

[0041] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A light-emitting pad for supporting a lead frame (5) conveyed from a first direction, wherein a second direction is defined as a direction parallel to a horizontal plane and perpendicular to the first direction; the lead frame (5) includes base regions (501) arranged in a matrix, the matrix arrangement including horizontal columns and vertical columns; characterized in that, When the lead frame (5) is supported by the light-emitting pad, the horizontal column is along the first direction and the vertical column is along the second direction; The light-emitting pad includes: The base (201) is strip-shaped and fixedly disposed parallel to the second direction; A light-emitting component (202) is mounted on the base (201) and arranged along the length of the base (201) to form a strip light-emitting area; the length of the strip light-emitting area is sufficient to cover at least one column of the base area (501) of the lead frame (5), and the width of the strip light-emitting area is sufficient to cover at least one column of the base area (501).

2. The light-emitting pad according to claim 1, characterized in that, The light-emitting pad includes a locking part (203) disposed on both sides of the base (201) in the length direction, for fixing the light-emitting pad on the mounting machine table.

3. The light-emitting pad according to claim 1, characterized in that, The upper surface of the base (201) is provided with a mounting groove (211), and the light-emitting component (202) is fixedly disposed in the mounting groove (211).

4. The light-emitting pad according to claim 3, characterized in that, The upper surface of the light-emitting pad is provided with a transparent cover plate (204), and the upper surface of the cover plate (204) forms a support plane for supporting the lead frame (5).

5. The light-emitting pad according to claim 4, characterized in that, The cover plate (204) has a light-diffusing layer (205) on its upper and / or lower surfaces; the light generated by the light-emitting component (202) is scattered when it passes through the light-diffusing layer (205).

6. A wafer loading machine, characterized in that, The device includes the light-emitting pad as described in any one of claims 1 to 5, and also includes the body (1); The machine body (1) has a platform (101) extending along a first direction and a second direction, wherein the first direction is the material feeding direction of the lead frame; The light-emitting pad is mounted on the table surface (101), wherein the length direction of the base (201) of the light-emitting pad is parallel to the second direction.

7. The wafer loading machine according to claim 6, characterized in that, Two locking mechanisms (103) are fixedly arranged parallel to each other and spaced apart along the second direction on the surface of the table (101), and a receiving space is formed between the two locking mechanisms (103) and the table (101). The light-emitting pad includes locking parts (203) disposed on both sides of the base (201) along its length. The light-emitting pad is placed between the two locking mechanisms (103), and the locking parts (203) on both sides of the base (201) along its length are respectively locked in the receiving spaces on both sides.

8. The wafer loading machine according to claim 6, characterized in that, The mounting machine includes a controller (3), which is signal-connected to the light-emitting pad.

9. The wafer loading machine according to claim 6, characterized in that, The mounting machine includes an identification device (4), which is located above the light-emitting pad and its identification direction is directly facing the light-emitting pad. The controller (3) is signal-connected to the identification device (4).

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