Jacking device and flip chip die bonding equipment

Abstract

The utility model relates to a jacking device and flip chip bonding equipment, the jacking device is used for jacking up a chip on a diaphragm, and the jacking device comprises a rack, a lifting assembly, a chip stabbing structure and a hot air assembly. Wherein the lifting assembly is arranged on the rack; the wafer pricking structure is connected with the lifting assembly and can be driven by the lifting assembly to jack up the chip on a target area of the diaphragm from the lower part of the diaphragm so as to separate the chip from the diaphragm; the hot air assembly is connected with the rack, an air outlet is formed in the hot air assembly, and the air outlet faces the membrane and can blow hot air to a target area of the membrane so as to adjust the viscosity of the target area of the membrane.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a lifting device and a flip-chip die bonding device. Background Technology

[0002] In modern electronics manufacturing, the continuous development of integrated circuits and semiconductor technology has placed higher demands on chip manufacturing and packaging technologies. Flip chip bonding, as an advanced chip packaging method, has gradually become one of the mainstream choices in the industry due to its ability to achieve high-density, high-performance chip connections. Traditional chip packaging methods typically require complex soldering and connections between the chip and the substrate, which not only increases process complexity but can also lead to unstable connections and low signal transmission efficiency. Flip chip bonding, by inverting the chip and directly mounting it on the substrate, significantly shortens the electrical connection path between the chip and the substrate, reduces signal delay, and improves electrical performance and heat dissipation efficiency.

[0003] However, flip-chip bonding technology also faces several challenges. One of these is the extremely high precision required for chip positioning; even the slightest positioning error can lead to connection failure or performance degradation. Specifically, in traditional solutions, the diaphragm, after high-temperature radiation, is prone to detachment during chip lifting. This not only affects the chip's positioning accuracy but can also cause misalignment or damage in subsequent processes, increasing the scrap rate. Furthermore, the unstable adhesion of the diaphragm impacts the efficiency of the entire process, further exacerbating production cost and time pressures.

[0004] The above information disclosed in the background art of this utility model is only used to understand the background of the concept of this utility model, and may include information that does not constitute prior art. Utility Model Content

[0005] Therefore, it is necessary to provide a lifting device and a flip-chip die bonding device to address the above problems.

[0006] A lifting device for lifting a chip on a diaphragm, the lifting device comprising:

[0007] frame;

[0008] A lifting assembly, wherein the lifting assembly is disposed on the frame;

[0009] A crystal-piercing structure, connected to the lifting assembly and capable of lifting the chip on a target area of ​​the diaphragm from below the diaphragm under the action of the lifting assembly, thereby separating the chip from the diaphragm; and

[0010] A hot air assembly is connected to the frame. The hot air assembly has an air outlet that faces the diaphragm and can blow hot air onto the target area of ​​the diaphragm to adjust the viscosity of the target area of ​​the diaphragm.

[0011] The aforementioned lifting device achieves at least the following beneficial effects: the crystal-piercing structure precisely lifts the chip in the target area, ensuring a controllable separation process between the chip and the diaphragm without damaging the chip or diaphragm. The hot air assembly heats the target area of ​​the diaphragm before separation, adjusting its viscosity. Because the hot air assembly can adjust heating at different locations, the device can adapt to different types and sizes of chips, improving process flexibility. By adjusting the temperature and velocity of the hot air, the viscosity change of the diaphragm can be precisely controlled, thereby optimizing the chip lifting process. This helps reduce the adhesion between the diaphragm and the chip in the target area, making the chip easier to lift without damage. Local heating of the diaphragm with hot air reduces mechanical stress during chip separation, thus reducing the risk of chip or diaphragm damage. The hot air assembly can quickly respond and adjust the temperature, making the entire lifting process more efficient, reducing waiting time, and improving production efficiency. It effectively reduces damage to chips and diaphragms during separation, potentially significantly reducing scrap rates and improving product yield. It is important to emphasize that some transmission schemes that use high-temperature radiation to heat the entire diaphragm may affect the adhesion characteristics of the diaphragm and the chip, leading to easy detachment during chip lifting. In high-temperature environments, temperature gradients may exist between the diaphragm and the chip, causing inconsistent expansion and contraction in different areas. This uneven deformation may cause the chip to detach from the diaphragm during lifting. High-temperature radiation may induce thermal stress concentration on the diaphragm and chip, especially at edges or irregular areas. This stress concentration may lead to adhesion failure between the diaphragm and the chip. The hot air assembly of this application can locally heat specific areas of the diaphragm, rather than heating the entire diaphragm. This reduces the impact on unprocessed areas, minimizes unnecessary thermal stress and material deformation, and also reduces the problem of the chip easily detaching from the diaphragm.

[0012] In some embodiments, the hot air assembly includes a compression nozzle and an air guide pipe disposed on the frame. One end of the air guide pipe is connected to one end of the compression nozzle, and the other end of the air guide pipe is provided with an air outlet. The compression nozzle can enhance the pressure and velocity of the airflow, ensuring that the hot air can be quickly and evenly delivered to the target area of ​​the diaphragm, improving heating efficiency. The presence of the air guide pipe allows the hot air to maintain a stable temperature and flow rate during transmission, reducing heat loss and further improving heating accuracy. The design of the air outlet allows the hot air to act directly on the target area, achieving localized heating, thereby effectively adjusting the viscosity of the diaphragm, reducing the adhesion between the chip and the diaphragm, and ensuring that the chip can be smoothly lifted without damage.

[0013] In some embodiments, the hot air assembly further includes a fixing block connected to the frame, the fixing block having a slot in which the compression nozzle is detachably fitted. The design of the fixing block and slot provides a stable mounting structure, ensuring the compression nozzle remains stable during operation, thereby guaranteeing the accuracy of the hot air output direction and position. Secondly, the detachable nature of the compression nozzle enhances the system's flexibility and maintenance convenience, eliminating the need to disassemble the entire device when nozzle replacement or maintenance is required, saving time and labor costs. Furthermore, this design allows for the rapid replacement of nozzles of different specifications or functions to adapt to different process requirements, improving the equipment's adaptability. Finally, this modular design helps extend the equipment's service life, as individual components can be replaced and maintained independently, reducing the overall equipment's wear and tear and failure risk. In summary, this embodiment, through the ingenious design of the fixing block and slot, significantly improves the stability, flexibility, and maintenance efficiency of the hot air assembly, providing higher reliability and adaptability for equipment applications in precision manufacturing.

[0014] In some embodiments, the hot air assembly further includes a throttle valve located at the end of the compression nozzle away from the air guide pipe. The introduction of the throttle valve allows for adjustment of the airflow pressure and flow rate according to actual needs, thereby achieving precise control of the hot air temperature and speed. This precise control helps improve the stability and consistency of the heating process, ensuring that the hot air acts optimally on the target area. Secondly, the throttle valve effectively reduces unnecessary energy consumption, improves the system's energy efficiency, and lowers operating costs. Furthermore, by adjusting the throttle valve, the system can quickly respond to different process requirements, providing the necessary hot air characteristics, enhancing the flexibility and adaptability of the equipment. Finally, the presence of the throttle valve also protects the equipment from damage caused by excessive pressure or flow, extending its service life. In summary, this embodiment, by integrating a throttle valve into the compression nozzle, significantly improves the control accuracy, energy efficiency, and service life of the hot air assembly, providing reliable technical support for complex manufacturing and processing applications.

[0015] In some embodiments, the lifting assembly includes a lead screw, a bracket, and a lifting plate. The lead screw is rotatably mounted on the frame, the bracket is sleeved on the lead screw and threadedly connected to it, and the lifting plate is mounted on the bracket and connected to the crystal spike structure. When the lead screw rotates, it can drive the bracket, the lifting plate, and the crystal spike structure connected to the lifting plate to move up and down relative to the diaphragm along the axial direction of the lead screw. The rotatable design of the lead screw allows for linear displacement through rotational motion, providing precise height adjustment capability. This precise lifting control is particularly important for applications requiring adjustment of the distance between the crystal spike structure and the diaphragm, ensuring that the crystal spike structure operates in the optimal position, improving process efficiency and product quality. Secondly, the threaded connection design between the bracket and the lead screw ensures a smooth and controllable lifting process, avoiding mechanical impact or damage caused by rapid or uneven movement. This design also allows the bracket to withstand larger loads, making it suitable for crystal spike structures of different sizes and weights. Furthermore, the lifting plate not only provides a stable mounting platform for the crystal spike structure but also enables synchronous lifting through its connection with the bracket. This synchronization ensures that the spiked crystal structure remains horizontal during the lifting and lowering process, avoiding operational errors caused by tilting.

[0016] In some embodiments, the lifting assembly includes a drive component and a transmission belt. The drive component is a motor, and the transmission belt is fitted onto the outer circumferential surface of the motor's output shaft and the outer circumferential surface of one end of the lead screw. The drive component can drive the lead screw to rotate via the transmission belt. In this embodiment, the lifting assembly achieves automated drive of the lead screw through the ingenious combination of the motor and the transmission belt, thus bringing a series of technical advantages. The motor, as the drive component, provides a strong and stable power source, which is transmitted to the lead screw via the transmission belt, realizing the rotation of the lead screw. This design enables the lifting assembly to achieve automated control, significantly improving operational efficiency and accuracy. The use of the transmission belt not only simplifies the mechanical structure but also effectively reduces energy loss during transmission. The transmission belt, fitted onto the outer circumferential surface of the motor's output shaft and one end of the lead screw, ensures the reliability and stability of power transmission, while reducing mechanical noise and wear, and extending the service life of the equipment. Furthermore, through the motor's control system, the rotational speed and direction of the lead screw can be precisely adjusted, thereby achieving precise control of the lifting motion of the crystal spike structure. This precise control capability is particularly important for applications that require frequent adjustments, enabling rapid response to different process requirements and ensuring the flexibility and adaptability of the equipment.

[0017] In some embodiments, the lifting assembly further includes a guide rail erected on the frame and a slider slidably mounted on the guide rail, the slider being fixed to the lifting plate. The lifting assembly enhances the stability and accuracy of the system by introducing the guide rail erected on the frame and the slider slidably mounted on the guide rail. The guide rail provides a straight guiding path for the slider, ensuring the lifting plate remains stable and vertical during lifting. This design not only improves the accuracy of motion, making it suitable for applications requiring high-precision positioning, but also enhances the stability of the system under load, effectively supporting the lifting plate and the object it carries. The vertical mounting of the guide rail saves space, simplifies the overall structural design, makes installation and commissioning more convenient, and provides greater flexibility for the arrangement of other components. The modular design of the slider and guide rail also simplifies system cleaning and lubrication, reducing maintenance difficulty and cost. Furthermore, by adjusting the position of the slider on the guide rail, the range of motion of the lifting plate can be flexibly changed to adapt to different process requirements.

[0018] In some embodiments, the lifting assembly further includes a limiting structure disposed on the frame and capable of abutting against the lifting plate to limit the descent range of the lifting plate. The introduction of the limiting structure provides a safety boundary for the movement of the lifting plate, preventing it from exceeding a predetermined descent range. This plays a crucial role in preventing equipment damage and ensuring operational safety, especially in automated or unattended operation, effectively avoiding accidents caused by misoperation or system malfunction. By adjusting the position of the limiting structure, the maximum descent range of the lifting plate can be flexibly changed to adapt to different process requirements.

[0019] In some embodiments, the lifting assembly further includes a limiting block disposed on the lifting plate. The limiting structure further includes an elastic element, a limiting frame, and a limiting rod. One end of the elastic element is connected to the frame, and the other end is connected to the limiting frame. The limiting rod is disposed on the side of the limiting frame opposite to the elastic element. When the lifting plate descends, the limiting block abuts against the limiting rod and, through the limiting frame, squeezes the elastic element. In this embodiment, the lifting assembly achieves effective control of the lifting plate's movement by introducing a limiting block disposed on the lifting plate and a limiting structure including an elastic element, a limiting frame, and a limiting rod. Specifically, one end of the elastic element is connected to the frame, and the other end is connected to the limiting frame, while the limiting rod is disposed on the limiting frame, located on the side opposite to the elastic element. When the lifting plate descends, the limiting block abuts against the limiting rod, thereby squeezing the elastic element through the limiting frame. The key advantage of this design is that it provides a dual function of buffering and limiting. First, the elastic element provides cushioning when compressed, slowing the descent of the lifting platform and reducing the impact of sudden stops, thus protecting the equipment and load. Second, the contact between the limit block and the limit rod provides a clear physical limit to the lowest position of the lifting platform, preventing it from exceeding the predetermined range of motion and ensuring the safe operation of the system. Furthermore, this limiting and cushioning design effectively absorbs and disperses energy during movement, extending the equipment's lifespan while reducing noise and vibration, improving overall operational smoothness and comfort. Through this ingenious design, the system not only achieves precise control of lifting motion but also enhances the equipment's reliability and safety, making it suitable for various applications requiring precise positioning and safety assurance.

[0020] In some embodiments, the lifting device further includes a mounting base, a first adjusting component, and a second adjusting component. The first adjusting component is disposed on the mounting base, and the second adjusting component is disposed on the first adjusting component and connected to the frame. The first adjusting component can drive the second adjusting component and the frame to move relative to the mounting base along a first direction, and the second adjusting component can drive the frame to move relative to the first adjusting component along a second direction. The first direction and the second direction are perpendicular to the lifting direction of the lifting component. By adding the mounting base, the first adjusting component, and the second adjusting component, the lifting device achieves multi-dimensional motion control. Specifically, the first adjusting component is mounted on the mounting base, and the second adjusting component is disposed on the first adjusting component and connected to the frame. With this design, the first adjusting component can drive the second adjusting component and the frame to move relative to the mounting base along the first direction, while the second adjusting component can drive the frame to move relative to the first adjusting component along the second direction. Both directions are perpendicular to the lifting direction of the lifting component. This multi-directional adjusting design provides the system with great flexibility and accuracy. In practical applications, this means the equipment can not only be lifted and lowered vertically, but also adjusted and positioned horizontally. This is extremely useful for applications requiring precise positioning in multiple directions, such as multi-angle machining or assembly of workpieces in automated production lines. Through the cooperation of these two directional components, the system can flexibly adjust the position of the frame without moving the entire device. This not only improves operational efficiency but also reduces installation space requirements and adapts to more complex operating environments. Furthermore, this design helps reduce equipment wear, as the coordinated movement of moving parts in multiple directions optimizes load distribution and extends the system's lifespan. In summary, this multi-dimensional motion control design provides strong support for the equipment's application range and operational precision.

[0021] This application also provides a flip-chip bonding apparatus, which includes an adsorption device for adsorbing the chip and a lifting device as described in any of the above embodiments.

[0022] The aforementioned flip-chip bonding equipment includes the lifting device described in any of the above embodiments. Therefore, the flip-chip bonding equipment also includes at least the following beneficial effects: the chip-piercing structure of the lifting device can accurately lift the chip in the target area, ensuring that the separation process between the chip and the diaphragm is controllable and does not damage the chip or diaphragm. The hot air assembly can heat the target area of ​​the diaphragm before separation, adjusting its viscosity. Since the hot air assembly can adjust the heating at different locations, the device can adapt to chips of different types and sizes, improving process flexibility. By adjusting the temperature and wind speed of the hot air, the viscosity change of the diaphragm can be precisely controlled, thereby optimizing the chip lifting process. This helps to reduce the adhesion between the diaphragm and the chip in the target area, making the chip easier to lift without damage. Local heating of the diaphragm by hot air can reduce the mechanical stress during chip separation, thereby reducing the risk of chip or diaphragm damage. The hot air assembly can respond and adjust the temperature quickly, making the entire lifting process more efficient, reducing waiting time, and improving production efficiency. It can effectively reduce damage to the chip and diaphragm during the separation process, potentially significantly reducing the scrap rate and improving product yield. It is important to emphasize that some transmission schemes that use high-temperature radiation to heat the entire diaphragm may affect the adhesion characteristics of the diaphragm and the chip, leading to easy detachment during chip lifting. In high-temperature environments, temperature gradients may exist between the diaphragm and the chip, causing inconsistent expansion and contraction in different areas. This uneven deformation may cause the chip to detach from the diaphragm during lifting. High-temperature radiation may induce thermal stress concentration on the diaphragm and chip, especially at edges or irregular areas. This stress concentration may lead to adhesion failure between the diaphragm and the chip. The hot air assembly of this application can locally heat specific areas of the diaphragm, rather than heating the entire diaphragm. This reduces the impact on unprocessed areas, minimizes unnecessary thermal stress and material deformation, and also reduces the problem of the chip easily detaching from the diaphragm. The adsorption device can adsorb the chip to complete subsequent processes. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this utility model or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 A schematic diagram of a lifting device provided in one embodiment of the present invention.

[0025] Figure 2 This is a schematic diagram of the structure of the spiked crystal structure provided in one embodiment of the present invention when it lifts the chip on the diaphragm.

[0026] Figure 3 This is a partial structural schematic diagram of a lifting device provided in one embodiment of the present invention.

[0027] Figure 4 This is another partial structural schematic diagram of a lifting device provided in one embodiment of the present utility model.

[0028] Figure 5 This is another partial structural schematic diagram of a lifting device provided in one embodiment of the present utility model.

[0029] Figure label:

[0030] 10. Lifting device; 100. Frame; 200. Lifting assembly; 210. Lead screw; 220. Bracket; 230. Lifting plate; 240. Drive component; 250. Transmission belt; 260. Guide rail; 270. Slider; 280. Limiting structure; 281. Elastic component; 282. Limiting frame; 283. Limiting rod; 290. Limiting block; 300. Crystal spike structure; 400. Hot air assembly; 410. Compression nozzle; 420. Air guide pipe; 421. Air outlet; 430. Fixing block; 431. Slot; 440. Throttling valve; 500. Diaphragm; 600. Chip; 700. Mounting base; 810. First adjusting assembly; 820. Second adjusting assembly; 830. Locking structure. Detailed Implementation

[0031] To make the above-mentioned objects, features, and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a full understanding of this utility model. However, this utility model can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this utility model. Therefore, this utility model is not limited to the specific embodiments disclosed below.

[0032] Please see Figures 1 to 5In some embodiments, this invention provides a lifting device 10 for lifting a chip 600 on a diaphragm 500. The lifting device 10 includes a frame 100, a lifting assembly 200, a crystal-piercing structure 300, and a hot air assembly 400. The lifting assembly 200 is disposed on the frame 100. The crystal-piercing structure 300 is connected to the lifting assembly 200 and, driven by the lifting assembly 200, can lift the chip 600 from below the diaphragm 500 to a target area, thus separating the chip 600 from the diaphragm 500. The hot air assembly 400 is connected to the frame 100 and has an air outlet 421 facing the diaphragm 500 and capable of blowing hot air onto the target area of ​​the diaphragm 500 to adjust the viscosity of the target area.

[0033] The aforementioned lifting device 10 achieves at least the following beneficial effects: the crystal-piercing structure 300 can precisely lift the chip 600 in the target area, ensuring that the separation process between the chip 600 and the diaphragm 500 is controllable and does not damage the chip 600 or the diaphragm 500. The hot air assembly 400 can heat the target area of ​​the diaphragm 500 before separation, adjusting its viscosity. Since the hot air assembly 400 can adjust the heating at different locations, the device can adapt to different types and sizes of chips 600, improving process flexibility. By adjusting the temperature and wind speed of the hot air, the viscosity change of the diaphragm 500 can be precisely controlled, thereby optimizing the lifting process of the chip 600. This helps to reduce the adhesion between the diaphragm 500 and the chip 600 in the target area, making it easier for the chip 600 to be lifted without damage. Local heating of the diaphragm 500 with hot air can reduce the mechanical stress during chip 600 separation, thereby reducing the risk of damage to the chip 600 or the diaphragm 500. The hot air assembly 400 can quickly respond to and regulate temperature, making the entire lifting process more efficient, reducing waiting time, and improving production efficiency. It can effectively reduce damage to the chip 600 and diaphragm 500 during separation, potentially significantly reducing scrap rates and improving product yield. It is important to emphasize that some transmission schemes that use high-temperature radiation to heat the entire diaphragm 500 may affect the adhesion characteristics of the diaphragm 500 and chip 600, leading to easy detachment during chip lifting. In high-temperature environments, temperature gradients may occur between the diaphragm 500 and chip 600, resulting in inconsistent expansion and contraction in different areas. This uneven deformation may cause the chip 600 to detach from the diaphragm 500 during lifting. High-temperature radiation may cause thermal stress concentration between the diaphragm 500 and chip 600, especially at edges or irregular areas. This stress concentration may lead to adhesion failure between the diaphragm 500 and chip 600. The hot air assembly 400 of this application can locally heat specific areas of the diaphragm 500, rather than heating the entire diaphragm 500. This reduces the impact on unprocessed areas, minimizes unnecessary thermal stress and material deformation, and also reduces the problem of chip 600 easily detaching from film 500.

[0034] Specifically, such as Figure 3As shown, in some embodiments, the hot air assembly 400 includes a compression nozzle 410 and an air guide pipe 420 disposed on the frame 100. One end of the air guide pipe 420 is connected to one end of the compression nozzle 410, and the other end of the air guide pipe 420 is provided with an air outlet 421. The compression nozzle 410 can enhance the pressure and velocity of the airflow, ensuring that the hot air can be quickly and evenly delivered to the target area of ​​the diaphragm 500, thereby improving heating efficiency. The presence of the air guide pipe 420 allows the hot air to maintain a stable temperature and flow rate during transmission, reducing heat loss and further improving heating accuracy. The design of the air outlet 421 allows the hot air to act directly on the target area, achieving localized heating, thereby effectively adjusting the viscosity of the diaphragm 500, reducing the adhesion between the chip 600 and the diaphragm 500, and ensuring that the chip 600 can be smoothly lifted without damage.

[0035] Specifically, such as Figure 3 As shown, in some embodiments, the hot air assembly 400 further includes a fixing block 430 connected to the frame 100. The fixing block 430 has a slot 431 in which the compression nozzle 410 is detachably embedded. The design of the fixing block 430 and the slot 431 provides a stable installation structure, ensuring that the compression nozzle 410 remains stable during operation, thereby guaranteeing the accuracy of the hot air output direction and position. Secondly, the detachable nature of the compression nozzle 410 enhances the system's flexibility and maintenance convenience, eliminating the need to disassemble the entire device when the nozzle needs replacement or maintenance, saving time and labor costs. Furthermore, this design allows for the rapid replacement of nozzles of different specifications or functions according to different production needs, adapting to different process requirements and improving the equipment's adaptability. Finally, this modular design helps extend the equipment's service life because individual components can be replaced and maintained independently, reducing the overall equipment's wear and tear and failure risk. In summary, this implementation method, through the ingenious design of the fixing block 430 and the slot 431, significantly improves the stability, flexibility and maintenance efficiency of the hot air assembly 400, providing higher reliability and adaptability for the application of the equipment in precision manufacturing.

[0036] More specifically, such as Figure 3As shown, in some embodiments, the hot air assembly 400 further includes a throttle valve 440 located at the end of the compression nozzle 410 away from the air guide pipe 420. The introduction of the throttle valve 440 allows the pressure and flow rate of the airflow to be adjusted according to actual needs, thereby achieving precise control of the hot air temperature and speed. This precise control capability helps improve the stability and consistency of the heating process, ensuring that the hot air acts optimally on the target area. Secondly, the throttle valve 440 can effectively reduce unnecessary energy consumption, improve the system's energy efficiency, and lower operating costs. Furthermore, by adjusting the throttle valve 440, the system can quickly respond to different process requirements, providing the required hot air characteristics, enhancing the flexibility and adaptability of the equipment. Finally, the presence of the throttle valve 440 also protects the equipment from damage caused by excessive pressure or flow, extending the equipment's service life. In summary, this embodiment significantly improves the control accuracy, energy efficiency, and service life of the hot air assembly 400 by integrating a throttle valve 440 into the compression nozzle 410, providing reliable technical support for complex manufacturing and processing applications.

[0037] Please see Figure 4 In some embodiments, the lifting assembly 200 includes a lead screw 210, a bracket 220, and a lifting plate 230. The lead screw 210 is rotatably mounted on the frame 100. The bracket 220 is sleeved on the lead screw 210 and threadedly connected to it. The lifting plate 230 is mounted on the bracket 220 and connected to the crystal spike structure 300. When the lead screw 210 rotates, it can drive the bracket 220, the lifting plate 230, and the crystal spike structure 300 connected to the lifting plate 230 to move up and down relative to the diaphragm 500 along the axial direction of the lead screw 210. The rotatable configuration of the lead screw 210 allows linear displacement to be achieved through rotational movement, providing precise height adjustment capability. This precise lifting control is particularly important for applications requiring adjustment of the distance between the crystal spike structure 300 and the diaphragm 500, ensuring that the crystal spike structure 300 operates in the optimal position, improving process efficiency and product quality. Secondly, the threaded connection between the bracket 220 and the lead screw 210 ensures a smooth and controllable lifting process, avoiding mechanical impact or damage caused by rapid or uneven movement. This design also allows the bracket 220 to withstand larger loads, making it suitable for crystal spike structures 300 of varying sizes and weights. Furthermore, the lifting plate 230 not only provides a stable mounting platform for the crystal spike structure 300 but also enables synchronized lifting through its connection with the bracket 220. This synchronization ensures that the crystal spike structure 300 remains horizontal during lifting, preventing operational errors caused by tilting.

[0038] Specifically, such as Figure 4As shown, in some embodiments, the lifting assembly 200 includes a drive component 240 and a transmission belt 250. The drive component 240 is a motor, and the transmission belt 250 is sleeved on the outer circumferential surface of the motor's output shaft and the outer circumferential surface of one end of the lead screw 210. The drive component 240 can drive the lead screw 210 to rotate via the transmission belt 250. In this embodiment, the lifting assembly 200 achieves automated drive of the lead screw 210 through the ingenious combination of the motor and the transmission belt 250, thus bringing a series of technical advantages. The motor, as the drive component 240, provides a strong and stable power source, and transmits the power to the lead screw 210 through the transmission belt 250, realizing the rotation of the lead screw 210. This design enables the lifting assembly 200 to achieve automated control, significantly improving operating efficiency and accuracy. The use of the transmission belt 250 not only simplifies the mechanical structure but also effectively reduces energy loss during transmission. A transmission belt 250 is fitted onto the outer circumference of the motor output shaft and one end of the lead screw 210, ensuring the reliability and stability of power transmission while reducing mechanical noise and wear, thus extending the service life of the equipment. Furthermore, the motor's control system allows for precise adjustment of the lead screw 210's rotational speed and direction, thereby achieving precise control of the lifting and lowering motion of the crystal spike structure 300. This precise control capability is particularly important for applications requiring frequent adjustments, enabling rapid response to different process demands and ensuring the equipment's flexibility and adaptability.

[0039] Specifically, such as Figure 4 As shown, in some embodiments, the lifting assembly 200 further includes a guide rail 260 erected on the frame 100 and a slider 270 slidably mounted on the guide rail 260, the slider 270 being fixed to the lifting plate 230. The lifting assembly 200 enhances the stability and accuracy of the system by introducing the guide rail 260 erected on the frame 100 and the slider 270 slidably mounted on the guide rail 260. The guide rail 260 provides a straight guide path for the slider 270, ensuring that the lifting plate 230 remains stable and vertical during lifting. This design not only improves the accuracy of motion, making it suitable for applications requiring high-precision positioning, but also enhances the stability of the system under load, effectively supporting the lifting plate 230 and the object it carries. The vertical mounting of the guide rail 260 saves space, simplifies the overall structural design, makes installation and debugging more convenient, and provides greater flexibility for the arrangement of other components. The modular design of the slider 270 and guide rail 260 also simplifies system cleaning and lubrication, reducing maintenance difficulty and cost. In addition, by adjusting the position of the slider 270 on the guide rail 260, the range of motion of the lifting plate 230 can be flexibly changed to adapt to different process requirements.

[0040] Specifically, such as Figure 4As shown, in some embodiments, the lifting assembly 200 further includes a limiting structure 280, which is disposed on the frame 100 and can abut against the lifting plate 230 to limit the descent range of the lifting plate 230. The introduction of the limiting structure 280 provides a safety boundary for the movement of the lifting plate 230, preventing it from exceeding the predetermined descent range. This plays a crucial role in preventing equipment damage and ensuring operational safety, especially in automated or unattended operation, effectively avoiding accidents caused by misoperation or system failure. By adjusting the position of the limiting structure 280, the maximum descent range of the lifting plate 230 can be flexibly changed to adapt to different process requirements.

[0041] Specifically, such as Figure 4 As shown, in some embodiments, the lifting assembly 200 further includes a limiting block 290 disposed on the lifting plate 230. The limiting structure 280 further includes an elastic element 281, a limiting frame 282, and a limiting rod 283. One end of the elastic element 281 is connected to the frame 100, and the other end of the elastic element 281 is connected to the limiting frame 282. The limiting rod 283 is disposed on the side of the limiting frame 282 opposite to the elastic element 281. When the lifting plate 230 descends, the limiting block 290 can abut against the limiting rod 283 and compress the elastic element 281 through the limiting frame 282. In this embodiment, the lifting assembly 200 achieves effective control of the movement of the lifting plate 230 by introducing the limiting block 290 disposed on the lifting plate 230 and the limiting structure 280 including the elastic element 281, the limiting frame 282, and the limiting rod 283. Specifically, one end of the elastic element 281 is connected to the frame 100, and the other end is connected to the limiting frame 282. The limiting rod 283 is mounted on the limiting frame 282, located on the side opposite to the elastic element 281. When the lifting plate 230 descends, the limiting block 290 abuts against the limiting rod 283, thereby compressing the elastic element 281 through the limiting frame 282. The key advantage of this design is that it provides a dual function of buffering and limiting. First, the elastic element 281 provides a buffering effect when compressed, slowing down the descent speed of the lifting plate 230, reducing the impact force caused by sudden stopping, and protecting the safety of the equipment and load. Second, the abutment between the limiting block 290 and the limiting rod 283 provides a clear physical limit for the lowest position of the lifting plate 230, preventing it from exceeding the predetermined range of motion and ensuring the safe operation of the system. In addition, this limiting and buffering design can effectively absorb and disperse energy during movement, extend the service life of the equipment, reduce noise and vibration, and improve the overall smoothness and comfort of operation. Through this ingenious design, the system not only achieves precise control over lifting movements, but also enhances the reliability and safety of the equipment, making it suitable for various application scenarios that require precise positioning and safety assurance.

[0042] Please see Figure 5 In some embodiments, the lifting device 10 further includes a mounting base 700, a first adjusting component 810, and a second adjusting component 820. The first adjusting component 810 is disposed on the mounting base 700, and the second adjusting component 820 is disposed on the first adjusting component 810 and connected to the frame 100. The first adjusting component 810 can drive the second adjusting component 820 and the frame 100 to move relative to the mounting base 700 in a first direction. The second adjusting component 820 can drive the frame 100 to move relative to the first adjusting component in a second direction, and the first direction and the second direction are perpendicular to the lifting direction of the lifting component 200. By adding the mounting base 700, the first adjusting component 810, and the second adjusting component 820, the lifting device 10 achieves multi-dimensional motion control. Specifically, the first adjusting component 810 is mounted on the mounting base 700, while the second adjusting component 820 is disposed on the first adjusting component 810 and connected to the frame 100. Through this design, the first adjusting component 810 can drive the second adjusting component 820 and the frame 100 to move relative to the mounting base 700 in a first direction, while the second adjusting component 820 can drive the frame 100 to move relative to the first adjusting component 810 in a second direction. Both directions are perpendicular to the lifting direction of the lifting component 200. This multi-directional adjusting design provides the system with great flexibility and precision. In practical applications, this means that the equipment can not only perform lifting operations in the vertical direction, but also adjust and position in the horizontal plane. This is very useful for applications that require precise positioning in multiple directions, such as when workpieces need to be processed or assembled at multiple angles in automated production lines. Through the cooperation of these two adjusting components, the system can flexibly adjust the position of the frame 100 without moving the entire device. This not only improves operational efficiency but also reduces the requirements for installation space and adapts to more complex operating environments. In addition, this design also helps to reduce equipment wear, because the coordinated movement of moving parts in multiple directions can optimize load distribution and extend the service life of the system. In summary, this multi-dimensional motion control design provides strong support for the application range and operational precision of the equipment.

[0043] Specifically, such as Figure 5 As shown, in some embodiments, the lifting device 10 further includes a locking device that can be used to lock the positions of the first adjusting component 810 and the second adjusting component 820. For example, the locking device can be a limit knob screw, which can maintain the adjusted position unchanged after the first adjusting component 810 and the second adjusting component 820 have adjusted the position of the spiked structure 300.

[0044] In addition, this application also provides a flip-chip bonding apparatus, which includes an adsorption device for adsorbing the chip 600 and a lifting device 10 as described in any of the above embodiments.

[0045] The aforementioned flip-chip bonding equipment includes the lifting device 10 described in any of the above embodiments. Therefore, the flip-chip bonding equipment also has at least the following beneficial effects: the lifting device's die-piercing structure 300 can precisely lift the chip 600 in the target area, ensuring that the separation process of the chip 600 and the diaphragm 500 is controllable and does not damage the chip 600 or the diaphragm 500. The hot air assembly 400 can heat the target area of ​​the diaphragm 500 before separation to adjust its viscosity. Since the hot air assembly 400 can adjust the heating at different locations, the device can adapt to different types and sizes of chips 600, improving process flexibility. By adjusting the temperature and wind speed of the hot air, the viscosity change of the diaphragm 500 can be precisely controlled, thereby optimizing the lifting process of the chip 600. This helps to reduce the adhesion between the diaphragm 500 and the chip 600 in the target area, making it easier for the chip 600 to be lifted without damage. Local heating of the diaphragm 500 with hot air can reduce the mechanical stress during chip 600 separation, thereby reducing the risk of damage to the chip 600 or the diaphragm 500. The hot air assembly 400 can quickly respond to and regulate temperature, making the entire lifting process more efficient, reducing waiting time, and improving production efficiency. It can effectively reduce damage to the chip 600 and diaphragm 500 during separation, potentially significantly reducing scrap rates and improving product yield. It is important to emphasize that some transmission schemes that use high-temperature radiation to heat the entire diaphragm 500 may affect the adhesion characteristics of the diaphragm 500 and chip 600, leading to easy detachment during chip lifting. In high-temperature environments, temperature gradients may occur between the diaphragm 500 and chip 600, resulting in inconsistent expansion and contraction in different areas. This uneven deformation may cause the chip 600 to detach from the diaphragm 500 during lifting. High-temperature radiation may cause thermal stress concentration between the diaphragm 500 and chip 600, especially at edges or irregular areas. This stress concentration may lead to adhesion failure between the diaphragm 500 and chip 600. The hot air assembly 400 of this application can locally heat specific areas of the diaphragm 500, rather than heating the entire diaphragm 500. This reduces the impact on unprocessed areas, minimizes unnecessary thermal stress and material deformation, and also reduces the problem of chip 600 easily detaching from membrane 500. The adsorption device can adsorb chip 600 to complete subsequent processes.

[0046] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0047] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

[0048] In the description of this utility model, it should be understood that if terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0049] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0051] In this utility model, unless otherwise explicitly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact, or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only possible implementation.

[0053] In this specification, the use of terms such as "an embodiment," "another implementation," etc., refers to a specific feature, structure, material, or characteristic described in connection with that embodiment or example that is included in at least one embodiment or example of the present invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

Claims

1. A lifting device for lifting a chip on a diaphragm, characterized in that, The lifting device includes: frame; A lifting assembly, wherein the lifting assembly is disposed on the frame; A crystal-piercing structure, connected to the lifting assembly and capable of lifting the chip on a target area of ​​the diaphragm from below the diaphragm under the action of the lifting assembly, thereby separating the chip from the diaphragm; and A hot air assembly is connected to the frame. The hot air assembly has an air outlet that faces the diaphragm and can blow hot air onto the target area of ​​the diaphragm to adjust the viscosity of the target area of ​​the diaphragm.

2. The lifting device according to claim 1, characterized in that, The hot air assembly includes a compression nozzle and an air guide pipe disposed on the frame. One end of the air guide pipe is connected to one end of the compression nozzle, and the other end of the air guide pipe is provided with the air outlet.

3. The lifting device according to claim 2, characterized in that, The hot air assembly also includes a fixing block connected to the frame, the fixing block having a slot, and the compression nozzle being detachably embedded in the slot; And / or, the hot air assembly further includes a throttle valve located at the end of the compression nozzle away from the air guide pipe.

4. The lifting device according to claim 1, characterized in that, The lifting assembly includes a lead screw, a bracket, and a lifting plate. The lead screw is rotatably mounted on the frame. The bracket is sleeved on the lead screw and threadedly connected to the lead screw. The lifting plate is mounted on the bracket and connected to the spiked crystal structure. When the lead screw rotates, it can drive the bracket, the lifting plate, and the spiked crystal structure connected to the lifting plate to move up and down relative to the diaphragm along the axial direction of the lead screw.

5. The lifting device according to claim 4, characterized in that, The lifting assembly includes a driving component and a transmission belt. The driving component is a motor, and the transmission belt is sleeved on the outer peripheral surface of the output shaft of the motor and the outer peripheral surface of one end of the lead screw. The driving component can drive the lead screw to rotate through the transmission belt.

6. The lifting device according to claim 4, characterized in that, The lifting assembly also includes a guide rail erected on the frame and a slider slidably mounted on the guide rail, the slider being fixed to the lifting plate.

7. The lifting device according to claim 4, characterized in that, The lifting assembly also includes a limiting structure, which is disposed on the frame and can abut against the lifting plate to limit the descent range of the lifting plate.

8. The lifting device according to claim 7, characterized in that, The lifting assembly also includes a limiting block disposed on the lifting plate. The limiting structure also includes an elastic element, a limiting frame, and a limiting rod. One end of the elastic element is connected to the frame, and the other end of the elastic element is connected to the limiting frame. The limiting rod is disposed on the side of the limiting frame facing away from the elastic element. When the lifting plate descends, the limiting block can abut against the limiting rod and squeeze the elastic element through the limiting frame.

9. The lifting device according to any one of claims 1 to 8, characterized in that, The lifting device further includes a mounting base, a first adjusting component, and a second adjusting component. The first adjusting component is disposed on the mounting base, and the second adjusting component is disposed on the first adjusting component and connected to the frame. The first adjusting component can drive the second adjusting component and the frame to move relative to the mounting base in a first direction. The second adjusting component can drive the frame to move relative to the first adjusting component in a second direction. The first direction and the second direction are perpendicular to the lifting direction of the lifting component.

10. A flip-chip die bonding apparatus, characterized in that, It includes an adsorption device for adsorbing chips and a lifting device as described in any one of claims 1 to 9.

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