Ejector pin device and die bonding equipment

Abstract

The utility model relates to an ejector pin device and die bonding equipment, the ejector pin device comprises an ejector pin seat, a displacement mechanism and a lifting mechanism, the ejector pin seat is used for fixing an ejector pin, the displacement mechanism is connected with the ejector pin seat and can drive the ejector pin seat to move along the horizontal direction, and the lifting mechanism is connected with the displacement mechanism and can drive the displacement mechanism to lift along the vertical direction. The die bonding equipment comprises the ejector pin device. According to the ejector pin device and the die bonding equipment, the lifting mechanism drives the ejector pin to move in the vertical direction, and the displacement mechanism drives the ejector pin to move in the horizontal direction, so that the operation speed is increased by shortening the operation distance, the production speed is increased, and the production efficiency is improved; the device is effectively suitable for existing die bonding equipment which is generally arranged in a horizontal mode.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of die bonder, in particular to a needle device and a die bonder. BACKGROUND

[0002] The die bonder is a key equipment in packaging process of LED, chip semiconductor and camera mounting, and the needle device as an important part of the die bonder plays a role in separating the wafer from the wafer film.

[0003] In the working process of the current needle device, the needle part located below the wafer is controlled to move upward to lift the wafer, so that the die bonder can subsequently suck the wafer and place the wafer on the substrate or PCB board at the position where the wafer needs to be bonded, thereby completing the wafer bonding process.

[0004] However, the current die bonder layout generally adopts a horizontal arrangement, but the current needle device generally adopts a vertical installation mode and the needle part can only move in the vertical direction, and the running speed has reached a bottleneck, which cannot be improved by increasing the running speed to speed up the production speed and thus improve the production efficiency. CONTENT OF THE INVENTION

[0005] Therefore, it is necessary to provide a needle device and a die bonder to solve the problem that the running speed of the needle device has reached a bottleneck and cannot speed up the production speed and improve the production efficiency.

[0006] According to an aspect of the present application, a needle device is provided, comprising:

[0007] A needle seat is used to fix a needle;

[0008] A displacement mechanism is connected with the needle seat and can drive the needle seat to move in the horizontal direction;

[0009] A lifting mechanism is connected with the displacement mechanism and can drive the displacement mechanism to lift in the vertical direction.

[0010] In one embodiment, the displacement mechanism comprises a vertical lifting assembly and a horizontal moving assembly, the vertical lifting assembly is connected with the needle seat and can drive the needle seat to lift in the vertical direction, and the horizontal moving assembly is connected with the vertical lifting assembly and can drive the vertical lifting assembly to move in the horizontal direction.

[0011] In one embodiment, the needle seat comprises a needle cap and a needle rod, the needle rod is used to fix the needle and is connected with the needle cap in a sliding fit in the vertical direction, and the vertical lifting assembly is connected with the needle cap and the needle rod and can drive the needle cap and the needle rod to lift in the vertical direction, respectively.

[0012] In one of the embodiments, the vertical lifting assembly comprises a first lifting member and a second lifting member, the first lifting member is arranged on the horizontal moving assembly and connected with the needle cap, and the second lifting member is arranged on the first lifting member and connected with the needle rod.

[0013] In one of the embodiments, the needle rod is arranged on the adsorption surface of the needle cap, the needle cap is provided with a vacuum member, and the adsorption surface is provided with a vacuum channel in communication with the vacuum member.

[0014] In one of the embodiments, the needle holder further comprises a bump stopper, the bump stopper has a flexible part, and the flexible part is located on the side of the bump stopper away from the displacement mechanism.

[0015] In one of the embodiments, the needle cap is arranged on the bump stopper and coaxial with the bump stopper.

[0016] In one of the embodiments, the lifting mechanism comprises a mounting base and a lifting cylinder, the displacement mechanism is in sliding fit connection with the mounting base in the vertical direction, and the lifting cylinder is arranged on the mounting base and connected with the displacement mechanism.

[0017] According to another aspect of the present application, a die bonding apparatus is provided, comprising the needle device according to any one of the above embodiments.

[0018] In one of the embodiments, the needle device is detachably connected with the die bonding apparatus.

[0019] The needle device and the die bonding apparatus described above drive the needle to move in the vertical direction by the lifting mechanism and drive the needle to move in the horizontal direction by the displacement mechanism, so as to shorten the running distance and improve the running speed, thereby accelerating the production speed, improving the production efficiency, and effectively adapting to the die bonding apparatus which is generally arranged in the horizontal mode. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 The figure is a structural schematic diagram of the needle device according to some embodiments of the present application.

[0021] Figure 2 The figure is a structural schematic diagram of the needle device according to some embodiments of the present application from another perspective.

[0022] Figure 3 The figure is a partial enlarged view of A of the needle device according to some embodiments of the present application.

[0023] Figure 4 The figure is a structural schematic diagram of the needle device according to some embodiments of the present application from another perspective.

[0024] REFERENCE NUMERALS:

[0025] 1, ejector pin seat; 11, ejector pin cap; 12, vacuum part; 13, vacuum channel; 14, anti-collision part;

[0026] 2, displacement mechanism; 21, vertical lifting assembly; 211, first lifting part; 212, second lifting part; 22, horizontal moving assembly;

[0027] 3, lifting mechanism; 31, mounting seat; 32, lifting cylinder;

[0028] 4, positioning pin structure. DETAILED DESCRIPTION

[0029] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of ways other than those specifically described herein, and it is to be understood that the present application is not limited to the specific embodiments disclosed, but is open to equivalents.

[0030] In the description of the present application, it should be understood that if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0031] In addition, if these terms "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0032] In the present application, unless specifically defined otherwise, if there is any appearance of the terms "mount", "connect", "connection", "fix", and the like, these terms should be interpreted in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0033] In the present application, unless specifically defined otherwise, if there is any appearance of the terms "mount", "connect", "connection", "fix", and the like, these terms should be interpreted in a broad sense. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically defined. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0035] The die bonder is a key equipment in the packaging process of LED, chip semiconductor, camera mounting, etc., mainly composed of a material taking mechanism, a material pushing mechanism, a dispensing mechanism, a dispensing platform, a swing arm mechanism, a die bonding platform and a material discharging mechanism. In the die bonding process, the substrate or PCB board is first conveyed to the dispensing platform by the material taking mechanism, then the dispensing mechanism is used to dispense glue on the substrate or PCB board at the position where the wafer needs to be bonded, the substrate or PCB board is pushed to the die bonding platform by the material pushing mechanism, the wafer is placed on the expander wafer disc supported by the film, the swing arm mechanism moves to the wafer position, the needle device below the wafer controls the needle to move upward to lift the wafer, the suction nozzle on the swing arm structure moves downward to suck the wafer, and finally the wafer is placed on the substrate or PCB board at the position where the wafer needs to be bonded, thereby completing the wafer bonding process.

[0036] However, the existing die bonding equipment layout is generally arranged in a horizontal manner, but the ejector pin device is generally arranged in a vertical manner and the ejector pin can only move in the vertical direction, so the ejector pin needs to be moved horizontally and vertically by manual adjustment again. However, the manual adjustment cannot guarantee the accuracy of the horizontal and vertical movement of the ejector pin, cannot meet the needs of users, and makes the operation speed reach a bottleneck, thereby reducing the production efficiency.

[0037] Therefore, the present application provides an ejector pin device, which drives the ejector pin to move in the vertical direction through a lifting mechanism and drives the ejector pin to move in the horizontal direction through a displacement mechanism. The adjustment is performed in an automatic manner throughout the process, without manual adjustment, thereby accelerating the production speed, improving the production efficiency, and effectively adapting to the existing die bonding equipment which is generally arranged in a horizontal manner.

[0038] Referring to Figure 1 and Figure 2 , the embodiment of the present application provides an ejector pin device, which comprises an ejector pin seat 1, a displacement mechanism 2, and a lifting mechanism 3. The ejector pin seat 1 is used to fix the ejector pin. The lifting mechanism 3 is used to drive the ejector pin seat 1 to move in the vertical direction, so that the ejector pin seat 1 can be quickly moved from a starting position to a safe standby position. The displacement mechanism 2 is used to drive the ejector pin seat 1 to move in the horizontal direction, so that the ejector pin seat 1 can be moved from the safe standby position to a working position.

[0039] Specifically, the lifting mechanism 3 is connected with the displacement mechanism 2 and can drive the displacement mechanism 2 to lift in the vertical direction, so as to drive the ejector pin seat 1 on the displacement mechanism 2 to lift in the vertical direction.

[0040] Specifically, the lifting mechanism 3 comprises a mounting seat 31 and a lifting cylinder 32. The displacement mechanism 2 is connected with the mounting seat 31 in a sliding fit in the vertical direction, and the lifting cylinder 32 is arranged on the mounting seat 31 and connected with the displacement mechanism 2. The lifting cylinder 32 drives the displacement mechanism 2 and the ejector pin seat 1 to lift in the vertical direction, so that the ejector pin seat 1 can be quickly moved from the starting position to the safe standby position. In addition, in the embodiment of the present application, a cylinder sensor for setting the stroke of the cylinder is arranged on the lifting cylinder 32, so that the lifting cylinder 32 can control the ejector pin seat 1 to quickly move between the starting position and the safe standby position each time the device is started.

[0041] The displacement mechanism 2 is connected with the ejector pin seat 1 and can drive the ejector pin seat 1 to move in the horizontal direction and lift in the vertical direction. Specifically, the displacement mechanism 2 comprises a vertical lifting assembly 21 and a horizontal moving assembly 22. The vertical lifting assembly 21 is connected with the ejector pin seat 1 and can drive the ejector pin seat 1 to lift in the vertical direction. The horizontal moving assembly 22 is connected with the vertical lifting assembly 21 and can drive the vertical lifting assembly 21 to move in the horizontal direction, so as to drive the ejector pin seat 1 to move in the horizontal direction.

[0042] More specifically, the horizontal moving assembly 22 comprises a linear motor or a voice coil motor, and drives the vertical lifting assembly 21 to move in the horizontal direction through the linear motor or the voice coil motor, so as to quickly adjust the horizontal position of the shortened pin seat 1. The vertical lifting assembly 21 comprises a linear motor or a voice coil motor, and drives the pin seat 1 to lift in the vertical direction through the linear motor or the voice coil motor, so as to quickly adjust the vertical position of the shortened pin seat 1.

[0043] In summary, the pin device of the present application drives the pin to move in the vertical direction through the lifting mechanism 3, and drives the pin to move in the horizontal direction through the displacement mechanism 2, so as to improve the running speed by shortening the running distance, thereby accelerating the production speed, improving the production efficiency, and effectively adapting to the existing general horizontal arrangement of die bonding equipment.

[0044] Referring to Figure 1 and Figure 3 In one embodiment, the pin seat 1 comprises a pin cap 11 and a pin rod, the pin rod is used for fixing the pin and is connected with the pin cap 11 in the sliding fit in the vertical direction, so that the pin cap 11 and the pin can respectively realize the lifting of the blue film and the separation of the chip and the blue film. The vertical lifting assembly 21 is connected with the pin cap 11 and the pin rod, and can respectively drive the pin cap 11 and the pin rod to lift in the vertical direction, so that when the pin cap 11 is driven to rise in the vertical direction, the pin cap 11 can lift the blue film. When the pin rod is driven to rise in the vertical direction, the pin can realize the separation of the chip and the blue film.

[0045] Specifically, referring to Figures 1-4 , the vertical lifting assembly 21 comprises a first lifting piece 211 and a second lifting piece 212, the first lifting piece 211 is arranged on the horizontal moving assembly 22 and connected with the pin cap 11, the first lifting piece 211 can drive the pin cap 11 to lift in the vertical direction, so that the pin cap 11 can lift the blue film when rising in the vertical direction. The second lifting piece 212 is arranged on the first lifting piece 211 and connected with the pin rod, the second lifting piece 212 can drive the pin rod to lift in the vertical direction, so that the pin on the pin rod can realize the separation of the chip and the blue film when rising in the vertical direction.

[0046] Understandably, in the embodiments of this application, both the first lifting member 211 and the second lifting member 212 may include a linear motor or a voice coil motor. The motor of the first lifting member 211 is connected to the cam structure and can drive the cam structure to move upward, causing the ejector cap 11 to move upward to the waiting position. The first lifting member 211 is also provided with a sensing plate. When the sensing plate senses the sensor, it can be confirmed that the ejector cap 11 has lifted the blue film. At this time, the ejector cap 11 is controlled to move downward to return to the initial position. The motor of the second lifting member 212 is connected to the eccentric wheel. When the first lifting member 211 controls the ejector cap 11 to move to the waiting position, the motor of the second lifting member 212 drives the eccentric wheel to move upward, driving the ejector rod and the ejector pins on it to move upward until the ejector pins lift the chip on the blue film, realizing the separation of the chip and the blue film.

[0047] See Figure 3 In one embodiment, the ejector pin rod passes through the adsorption surface of the ejector pin cap 11. The ejector pin cap 11 is provided with a vacuum component 12, and the adsorption surface is provided with a vacuum channel 13 communicating with the vacuum component 12. By performing a vacuuming operation on the ejector pin cap 11, the ejector pin cap 11 can assist the ejector pin in separating the chip and the blue film.

[0048] Specifically, around the axial direction of the ejector pin rod, the adsorption surface is provided with multiple vacuum channels 13 that communicate with the vacuum component 12. When the ejector pin cap 11 rises and the adsorption surface contacts the blue film, the vacuum component 12 can perform a vacuuming operation on the multiple vacuum channels 13, causing the blue film to be adsorbed onto the adsorption surface. This allows the ejector pin to smoothly lift the chip on the blue film and separate it from the blue film when the second lifting component 212 drives the ejector pin rod and its ejector pins to move upwards.

[0049] See Figure 3 In one embodiment, the ejector seat 1 further includes a shock absorber 14, which has a flexible portion located on the side of the shock absorber 14 facing away from the displacement mechanism 2. The shock absorber 14 can protect the ejector seat 1 during operation, preventing damage to the ejector pin due to accidental impact.

[0050] Specifically, the ejector cap 11 is mounted on the anti-collision member 14 and is coaxial with the anti-collision member 14. More specifically, the anti-collision member 14 is an anti-collision ring. The anti-collision ring is designed to provide cushioning in the event of an impact, reduce the impact force, and protect the ejector from damage.

[0051] See Figure 2 and Figure 4 According to another aspect of this application, a die bonding apparatus is provided, including a ejector pin device as described in any of the above embodiments. Specifically, the ejector pin device is detachably connected to the die bonding apparatus so that the ejector pin device can be removed from the die bonding apparatus for quick disassembly and replacement.

[0052] More specifically, the pin device is connected with the die bonding apparatus in a detachable manner by a positioning pin structure 4, and the positioning pin structure 4 is arranged on the pin device and the die bonding apparatus to realize the detachable connection between the positioning pin structure 4 and the die bonding apparatus.

[0053] The die bonding apparatus of the present application drives the pin to move in the vertical direction by the lifting mechanism 3 of the pin device, and drives the pin to move in the horizontal direction by the displacement mechanism 2 of the pin device, so as to shorten the running distance and improve the running speed, thereby accelerating the production speed, improving the production efficiency, and effectively adapting to the die bonding apparatuses which are generally arranged in the horizontal mode.

[0054] The technical features of the above-mentioned embodiments can be combined arbitrarily, and for the sake of brevity, all possible combinations of the technical features in the above-mentioned embodiments are not described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0055] The above-mentioned embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as the limitation of the patent application scope. It should be pointed out that for those skilled in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A pin device, characterized in that, The application relates to a top pin device for a die bonder. The top pin device comprises a top pin seat for fixing a top pin, a displacement mechanism connected with the top pin seat and capable of driving the top pin seat to move in a horizontal direction, and a lifting mechanism connected with the displacement mechanism and capable of driving the displacement mechanism to lift in a vertical direction. The top pin seat further comprises an anti-collision member with a flexible part on the side of the anti-collision member away from the displacement mechanism. The displacement mechanism comprises a vertical lifting assembly connected with the top pin seat and capable of driving the top pin seat to lift in the vertical direction, and a horizontal moving assembly connected with the vertical lifting assembly and capable of driving the vertical lifting assembly to move in the horizontal direction. The top pin seat comprises a top pin cap and a top pin rod for fixing the top pin and in sliding fit connection with the top pin cap in the vertical direction; the vertical lifting assembly is connected with the top pin cap and the top pin rod and capable of driving the top pin cap and the top pin rod to lift in the vertical direction respectively.

2. The pim device of claim 1, wherein The vertical lifting assembly comprises a first lifting member arranged on the horizontal moving assembly and connected with the top pin cap, and a second lifting member arranged on the first lifting member and connected with the top pin rod.

3. The thimble device of claim 2, wherein, The top pin rod is arranged on the adsorption surface of the top pin cap, the top pin cap is provided with a vacuum member, and the adsorption surface is provided with a vacuum channel in communication with the vacuum member.

4. The thimble device of claim 3, wherein, The top pin cap is arranged on the anti-collision member and coaxial with the anti-collision member.

5. The pim device of claim 3, wherein The lifting mechanism comprises a mounting seat and a lifting cylinder, the displacement mechanism is in sliding fit connection with the mounting seat in the vertical direction, and the lifting cylinder is arranged on the mounting seat and connected with the displacement mechanism.

6. The pim device of claim 3, wherein The application further relates to a die bonder comprising the top pin device.

7. The pim device of claim 1, wherein The top pin device is detachably connected with the die bonder.

8. A die bonding apparatus, characterized in that, ​ 9. The die bonding apparatus according to claim 8, wherein ​

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