Efficient heat dissipation fin type device and power semiconductor

Abstract

The utility model provides a high-efficiency heat radiation fin type device and a power semiconductor, and relates to the technical field of heat radiation devices, the high-efficiency heat radiation fin type device comprises a fin group which is arranged on a heat conduction member and comprises a plurality of fins; the two clamping plates are oppositely arranged on the two sides of the fin set, each clamping plate is provided with a plurality of interval grooves, and the ends, away from the heat conduction piece, of the fins are correspondingly clamped into the interval grooves respectively. The fin group has the advantages that the clamping plates are arranged on the two sides of the fin group, the ends, away from the heat conduction piece, of the fins can be clamped to the clamping plates, the distance between the fins is fixed through the interval grooves, the stability of the distance between the fin groups in the carrying or transporting process is guaranteed, and the service life of the fin groups is prolonged. The phenomenon that the heat dissipation effect of the fin group is affected due to the fact that the distance between the ends, away from the heat conduction piece, of the fin group is changed when the fin group is extruded in the carrying or transporting process is effectively avoided.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation device technology, and in particular to a high-efficiency heat dissipation fin device and a power semiconductor. Background Technology

[0002] Power semiconductors, as key components in modern electronic devices, generate a significant amount of heat during operation. If heat dissipation is ineffective, the temperature of these semiconductor components will rise sharply, affecting their performance and potentially causing damage. Therefore, ensuring proper temperature control of power semiconductors during operation is a core task for improving equipment reliability and lifespan. Finned heat sinks are commonly used for effective heat dissipation, and this is a widely adopted method.

[0003] The basic principle of finned heat sinks is to accelerate heat dissipation by increasing the heat exchange area. Specifically, a heat sink typically consists of a heat-conducting plate and multiple fins, arranged in an array and fixed to the heat-conducting plate. Due to the large surface area of ​​the fins, they can exchange heat more efficiently with the air or surrounding heat dissipation medium, thereby accelerating heat dissipation and preventing heat buildup inside the semiconductor. Under normal circumstances, the number, density, and shape of the fins are precisely designed to ensure optimal heat dissipation performance. Generally, the more fins and the smaller the gaps, the larger the heat dissipation area, thus improving the overall heat dissipation effect.

[0004] However, this design also faces some challenges in practical use, especially during the transportation and handling of the device. Because the fin array is dense and often packaged with other components, the device is susceptible to external pressure. Particularly during transportation, the finned heatsink may be subjected to impacts or pressure, causing deformation of the fins away from the heatsink, thus altering the gaps between the fins. This deformation can be more severe in densely finned designs, causing some gaps between fins to widen or narrow, affecting airflow and leading to uneven heat dissipation. Uneven heat dissipation prevents heat from being effectively conducted from the heat-generating area to the fins and air, potentially causing localized overheating. This not only reduces heat dissipation efficiency but may also cause thermal damage to semiconductor components, shortening their lifespan. Utility Model Content

[0005] To address the problems existing in the prior art, this utility model provides a high-efficiency heat dissipation fin type device, comprising:

[0006] A fin assembly is disposed on a heat-conducting component, and the fin assembly contains multiple fins;

[0007] Two retaining plates are disposed opposite each other on both sides of the fin assembly. Each retaining plate has multiple spacer slots, and the end of each fin away from the heat-conducting element is respectively engaged in each of the spacer slots.

[0008] Preferably, each fin has a slot on its side away from the heat conductor, and the slot and the spacer slot are engaged in a one-to-one manner.

[0009] Preferably, the heat-conducting component is a copper plate.

[0010] Preferably, it also includes a cooling fan, which is disposed above the fin assembly, and a connecting plate is fixed to the side of the cooling fan, with the bottom of the connecting plate connected to the retaining plate.

[0011] Preferably, each of the fins includes a first fin located at both sides of the fin group and multiple sets of second fins arranged in an array between two of the first fins.

[0012] Preferably, each group of second fins includes two fins, and the distance between two adjacent second fins in the same group is greater at the end facing the heat conductor than at the end away from the heat conductor.

[0013] Preferably, each of the fins has a plurality of insertion holes, and a plurality of heat pipes pass through each of the insertion holes and are inserted into the fin group.

[0014] This utility model also provides a power semiconductor, including a semiconductor body, on which the above-mentioned high-efficiency heat dissipation fin type device is provided, wherein the semiconductor body is connected to the side of the heat-conducting element opposite to the fin group.

[0015] The above technical solution has the following advantages or beneficial effects: by setting clamping plates on both sides of the fin assembly, the end of each fin away from the heat-conducting component can be clamped onto the clamping plate, and the spacing between each fin is fixed through each spacing groove, ensuring the stability of the spacing of the fin assembly during carrying or transportation, effectively avoiding the phenomenon that the spacing of the end of the fin assembly away from the heat-conducting component changes due to compression during carrying or transportation, thus affecting the heat dissipation effect of the fin assembly. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a high-efficiency heat dissipation fin device in a preferred embodiment of the present invention.

[0017] Figure 2 A right view of a power semiconductor equipped with a high-efficiency heat dissipation fin device, which is a preferred embodiment of this utility model.

[0018] Figure 3A left view of a power semiconductor equipped with a high-efficiency heat dissipation fin device, which is a preferred embodiment of this utility model.

[0019] Figure 4 A side view of a power semiconductor equipped with a high-efficiency heat dissipation fin device, which is a preferred embodiment of this utility model.

[0020] In the attached diagram, 1 is the fin assembly; 2 is the heat-conducting component; 3 is the retaining plate; 31 is the spacer groove; 4 is the retaining slot; 5 is the cooling fan; 6 is the connecting plate; 71 is the first fin; 72 is the second fin; 8 is the insertion hole; 9 is the heat pipe; and 10 is the semiconductor body. Detailed Implementation

[0021] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. The present invention is not limited to this embodiment; other embodiments that conform to the spirit of the present invention may also fall within its scope.

[0022] In a preferred embodiment of this utility model, existing finned heat dissipation devices, due to the dense array arrangement of fins during carrying or transportation, are prone to deformation of the fins furthest from the heat-conducting component when subjected to external pressure. This deformation alters the gaps between adjacent fins, affecting not only their heat dissipation performance but also potentially causing uneven heat dissipation and even overheating of semiconductor components, impacting their normal operation and lifespan. Therefore, this invention provides a high-efficiency heat dissipation finned device, such as... Figure 1 As shown, it includes:

[0023] Fin assembly 1 is disposed on heat-conducting component 2, and fin assembly 1 contains multiple fins;

[0024] Two clamping plates 3 are arranged opposite each other on both sides of the fin assembly 1. Each clamping plate 3 has multiple spacer slots 31, and the end of each fin away from the heat-conducting component 2 is respectively clamped into each spacer slot 31.

[0025] Specifically, in this embodiment, by setting a retaining plate 3 on both sides of the fin assembly 1, the end of each fin away from the heat-conducting component 2 can be snapped onto the retaining plate, and the spacing between each fin is fixed by each spacing groove 31, which effectively avoids the phenomenon that the spacing of the end of the fin assembly 1 away from the heat-conducting component 2 changes due to compression during carrying or transportation, thus affecting the heat dissipation effect of the fin assembly 1.

[0026] In a preferred embodiment of the present invention, a slot 4 is provided on the side of each fin away from the heat-conducting component 2, and the slot 4 is engaged with the spacer slot 31 in a one-to-one manner.

[0027] Specifically, in this embodiment, the high-efficiency heat dissipation fin device is installed by snapping the retaining plate 3 into the retaining groove 4 on the fin assembly 1, so that the spacing groove 31 on the retaining plate 3 is snapped onto the outside of each fin. This ensures the stability of the spacing of the fin assembly 1 during carrying or transportation. Through the cooperative use of the retaining groove 4, retaining plate 3 and spacing groove 31, the spacing between adjacent fins can be locked, preventing the phenomenon that the distance between fins changes when the fins are squeezed, thereby preventing the problem of reduced heat dissipation effect due to compression deformation.

[0028] In a preferred embodiment of this utility model, the heat-conducting element 2 is a copper plate.

[0029] Specifically, in this embodiment, taking the installation of the high-efficiency heat dissipation finned device of this invention on a power semiconductor as an example, since copper is a metal with a high thermal conductivity, by selecting a copper plate as the heat conductor 2, the heat generated by the power semiconductor can be quickly transferred to the finned assembly 1. The thickness and size of the copper plate are designed according to the heat generation and heat dissipation requirements of the power semiconductor to ensure optimal heat dissipation.

[0030] In a preferred embodiment of this utility model, such as Figures 2 to 4 As shown, it also includes a cooling fan 5, which is positioned above the fin assembly 1. A connecting plate 6 is fixed to the side of the cooling fan 5, and a connecting plate 3 is connected to the bottom of the connecting plate 6.

[0031] Specifically, in this embodiment, by adding a cooling fan 5 to work in conjunction with the fin assembly 1, the heat dissipation efficiency is further improved. Specifically, during the operation of this high-efficiency heat dissipation finned device, the heat generated by the power semiconductor is first transferred to the heat-conducting component 2. Due to the high thermal conductivity of the copper plate, the heat can be quickly distributed inside the copper plate and transferred to the fin assembly 1, and then transferred to the surrounding air through the fin assembly 1. At the same time, the cooling fan 4 generates forced convection after starting, accelerating the airflow around the fin assembly 1, thereby further improving the heat dissipation efficiency.

[0032] Furthermore, to facilitate the installation of the card plate 3, a connecting plate 6 for fixed connection with the cooling fan 5 is fixedly connected to the card plate 3. The connecting plate 6 is fixedly installed on the cooling fan 5 with screws. The design of the connecting plate 6 makes the installation of the card plate 3 simpler and faster, reducing the installation difficulty and cost. By fixing the card plate 3 to the cooling fan 5 through the connecting plate 6, the structural strength of the entire heat dissipation fin device is enhanced, and its resistance to compression and deformation is improved. When it is necessary to install the heat dissipation fin device of this utility model on the power semiconductor, firstly, the heat-conducting element 2 is fixed on the semiconductor body 10, and then the fin group 1 is installed on the heat-conducting element 2, ensuring that the fin group 1 and the heat-conducting element 2 are in close contact. Next, the card slot 4 of the card plate 3 is aligned with the corresponding position on the fin group 1, and the card plate 3 is inserted into the card slot 4. At this time, the spacing groove 31 on the card plate 3 will engage with the outside of each fin, locking the spacing between adjacent fins. Finally, the connecting plate 6 is fixedly installed on the cooling fan 5 with screws and other fasteners, completing the installation of the entire heat dissipation fin device. During operation, the heat generated by the power semiconductor is transferred to the fin assembly 1 through the heat conductor 2, and the fin assembly 1 dissipates the heat into the surrounding air. After the cooling fan 5 is activated, forced convection is generated, which accelerates the airflow around the fin assembly 1, thereby improving the heat dissipation efficiency. Due to the cooperative design of the slot 4, the card plate 3, and the spacer slot 31, even if the fin assembly 1 is squeezed during carrying or transportation, the spacing can remain stable and will not affect the heat dissipation effect.

[0033] In a preferred embodiment of the present invention, each fin includes a first fin 71 located at both sides of the fin group 1 and a plurality of second fins 72 arranged in an array between the two first fins 71.

[0034] Specifically, in this embodiment, the fin assembly 1 includes first fins 71 symmetrically fixed at the end of the heat-conducting element 2 away from the semiconductor body 10, and multiple sets of second fins 72 arranged in an array between the two first fins 71. A slot 4 is formed on both sides of the first fins 71 and the second fins 72, and the sides of the first fins 71 and the second fins 72 are engaged in the spacer slot 31. The array distribution design of the first fins 71 and the second fins 72 makes the heat dissipation area more uniform and improves the heat dissipation efficiency. Through the cooperation of the slot 4 and the spacer slot 31, the distance between the first fins 71 and the second fins 72 is effectively fixed, maintaining a stable heat dissipation effect even when squeezed during carrying or transportation. When installing the heat dissipation fin device, firstly, the heat-conducting element 2 is fixed to the semiconductor body 10, ensuring close contact between the heat-conducting element 2 and the semiconductor body 10. Then, the first fins 71 are symmetrically fixed at the end of the heat-conducting element 2 away from the semiconductor body 10, and then multiple sets of second fins 72 are arranged in an array between the two first fins 71. At this point, the slots 4 will be exposed on both sides of the first fin 71 and the second fin 72. Next, align the slots 4 of the card plate 3 with the corresponding positions on the fin assembly 1, and insert the card plate 3 into the slots 4. The spacing grooves 31 on the card plate 3 will then engage with both sides of the first fin 71 and the second fin 72, locking the spacing between adjacent fins. Finally, the card plate 3 is fixedly connected to the cooling fan 5 via the connecting plate 6, completing the installation of the entire heat dissipation device. During operation, the heat generated by the power semiconductor is efficiently transferred to the fin assembly 1 through the heat conductor 2. Due to the array distribution design of the first fin 71 and the second fin 72, the heat can be more evenly dissipated into the surrounding air. Simultaneously, after the cooling fan 5 is activated, forced convection is generated, accelerating the airflow around the fin assembly 1, thereby improving heat dissipation efficiency.

[0035] In a preferred embodiment of the present invention, each group of second fins 72 includes two fins, and the distance between two adjacent second fins 72 in the same group is greater at the end facing the heat conduction element 2 than at the end away from the heat conduction element 2.

[0036] Specifically, in this embodiment, to improve the heat dissipation effect of the fins, each group of second fins 72 is provided with two fins. The gap between adjacent second fins 22 in the same group is larger at the end near the heat conductor 3 than at the end away from the heat conductor 3. This design helps to form a larger heat dissipation channel in the area near the heat conductor 3, allowing heat to be transferred more smoothly to the outside of the fin group 2. The gap between two adjacent groups of second fins 22 is smaller at the end near the heat conductor 3 than at the end away from the heat conductor 3. This design helps to form a certain pressure gradient inside the fin group 2, causing turbulence when air flows between the fins, thereby enhancing the heat dissipation effect. By adjusting the gap between adjacent second fins 22 in the same group, heat can pass through the heat dissipation channel more smoothly during the transfer process, improving the heat dissipation efficiency. By adjusting the gap between two adjacent groups of second fins 22, turbulence is generated when air flows between the fins, enhancing the heat dissipation effect and further improving the heat dissipation performance of the heat dissipation device. When installing the heat dissipation device, the heat conductor 3, the first fin 21, and the second fin 22 are assembled according to the previous steps. Due to the special design of each group of second fins 72—that is, the gap between adjacent second fins 72 in the same group is larger at the end closer to the heat conductor 2 than at the end farther from the heat conductor 2—the gap between two groups of adjacent second fins 72 is smaller at the end closer to the heat conductor 2 than at the end farther from the heat conductor 2. This design allows heat to be transferred more smoothly to the outside of the fin group 1 through the heat dissipation channel during the heat dissipation process. Simultaneously, the airflow between the fins generates turbulence, which enhances the heat exchange efficiency between the air and the fins, thereby improving the heat dissipation effect. During operation, the heat generated by the power semiconductor is efficiently transferred to the fin group 1 through the heat conductor 2. Due to the special design of the second fins 72, the heat can be dissipated more evenly into the surrounding air. At the same time, after the cooling fan 5 is activated, forced convection is generated, accelerating the airflow around the fin group 1. When the air flows over the fin group 1, it is affected by the special gap between the fins, generating turbulence, which further enhances the heat dissipation effect. Therefore, the entire heat dissipation device can achieve efficient and reliable heat dissipation performance while maintaining a compact structure.

[0037] In a preferred embodiment of the present invention, each fin is provided with a plurality of insertion holes 8, and a plurality of heat pipes 9 are inserted into the fin group 1 through each insertion hole 8.

[0038] Specifically, in this embodiment, to further improve the heat dissipation effect of the fins, multiple heat pipes 9 are inserted into the fin assembly 2. The introduction of heat pipes 9 greatly improves the heat transfer efficiency of the heat dissipation device, allowing heat to be distributed more quickly and evenly onto the fin assembly 1, thereby significantly improving the heat dissipation effect. As a highly efficient heat transfer element, heat pipe 9 provides a more direct and efficient heat transfer path, reducing heat loss and delay during the transfer process. Due to the extremely high heat transfer efficiency and good isothermal properties of heat pipe 9, it can quickly and evenly distribute heat onto the fin assembly 1, thereby significantly improving the heat dissipation effect. At the same time, the introduction of heat pipe 9 also optimizes the heat transfer path, reducing heat loss and delay during the transfer process. This allows the entire heat dissipation device to achieve efficient and reliable heat dissipation performance while maintaining a compact structure.

[0039] This utility model also provides a power semiconductor, such as Figures 2 to 4 As shown, it includes a semiconductor body 10, on which the above-mentioned high-efficiency heat dissipation fin device is provided, wherein the semiconductor body 10 is connected to the side of the heat-conducting component 2 away from the fin assembly 1.

[0040] The above description is only a preferred embodiment of the present utility model and does not limit the implementation method and protection scope of the present utility model. Those skilled in the art should realize that all solutions obtained by equivalent substitutions and obvious changes made using the content of this specification and illustrations should be included within the protection scope of the present utility model.

Claims

1. A high-efficiency heat dissipation fin type device, characterized in that, include: A fin assembly is disposed on a heat-conducting component, and the fin assembly contains multiple fins; Two retaining plates are disposed opposite each other on both sides of the fin assembly. Each retaining plate has multiple spacer slots, and the end of each fin away from the heat-conducting element is respectively engaged in each of the spacer slots.

2. The high-efficiency heat dissipation fin type device according to claim 1, characterized in that, Each fin has a slot on its side away from the heat conductor, and the slots are engaged with the spacer slots one by one.

3. The high-efficiency heat dissipation fin type device according to claim 1, characterized in that, The heat-conducting component is a copper plate.

4. The high-efficiency heat dissipation fin type device according to claim 1, characterized in that, It also includes a cooling fan, which is disposed above the fin assembly. A connecting plate is fixed to the side of the cooling fan, and the bottom of the connecting plate is connected to the card plate.

5. The high-efficiency heat dissipation fin type device according to claim 1, characterized in that, Each of the fins includes a first fin located at both sides of the fin group and multiple sets of second fins arranged in an array between two first fins.

6. The high-efficiency heat dissipation fin type device according to claim 5, characterized in that, Each group of second fins includes two fins, and the distance between two adjacent second fins in the same group is greater at the end facing the heat conductor than at the end away from the heat conductor.

7. The high-efficiency heat dissipation fin type device according to claim 1, characterized in that, Each of the fins has a plurality of insertion holes, and a plurality of heat pipes pass through each of the insertion holes and are inserted into the fin group.

8. A power semiconductor, characterized in that, The device includes a semiconductor body, on which a high-efficiency heat dissipation fin type device as described in any one of claims 1-7 is provided, wherein the semiconductor body is connected to the side of the heat-conducting element opposite to the fin group.

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