Base station door plate type heat exchange device and communication base station

Abstract

The utility model discloses a base station door plate type heat exchange device and a communication base station. The first heat exchange mechanism comprises a micro-channel evaporator; the second heat exchange mechanism comprises a micro-channel condenser; the partition plate is arranged between the first heat exchange mechanism and the second heat exchange mechanism; and the first heat exchange mechanism communicates with the second heat exchange mechanism through the guide pipe assembly. According to the base station door plate type heat exchange device and the communication base station provided by the embodiment of the invention, the first heat exchange mechanism and the second heat exchange mechanism are both integrated in the door plate, and the first heat exchange mechanism and the second heat exchange mechanism are communicated through the guide pipe assembly to form internal heat exchange; the first heat exchange mechanism and the second heat exchange mechanism are separated through the partition plate so as to isolate transfer of other heat and other substances, the first heat exchange mechanism and the second heat exchange mechanism further adopt the micro-channel evaporator and the micro-channel condenser correspondingly, and compared with a traditional copper pipe fin type heat exchanger, the overall weight of the base station door plate type heat exchange device is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of communication base station heat dissipation technology, in particular to a base station door plate type heat exchange device and a communication base station. BACKGROUND

[0002] In order to avoid the heat generated by the communication equipment in the base station during the working process from accumulating in the base station and causing the performance of the communication equipment to decline or even be damaged, the existing solution is to install an air conditioning device with a split structure of an indoor unit and an outdoor unit on the base station, and the indoor unit and the outdoor unit are arranged respectively, which causes the air conditioning device to have a large size and occupy a large amount of space in the base station. SUMMARY

[0003] The base station door plate type heat exchange device and the communication base station provided by the embodiments of the present application can integrate the heat exchange structure in the door plate structure and reduce the weight of the heat exchange structure.

[0004] In a first aspect, the present application provides a base station door plate type heat exchange device, comprising: a shell; a first heat exchange mechanism comprising a micro-channel evaporator; a second heat exchange mechanism comprising a micro-channel condenser; a partition plate arranged between the first heat exchange mechanism and the second heat exchange mechanism; and a conduit assembly, wherein the first heat exchange mechanism and the second heat exchange mechanism are connected in communication through the conduit assembly.

[0005] According to an aspect of the embodiments of the present application, the micro-channel evaporator comprises a first liquid collecting cavity, an evaporation cavity and a plurality of evaporation flat tubes, the first liquid collecting cavity and the evaporation cavity are connected in communication through the evaporation flat tubes, and the evaporation flat tubes store a working medium.

[0006] According to an aspect of the embodiments of the present application, the micro-channel evaporator further comprises an equalizing pipe, the equalizing pipe is arranged in the first liquid collecting cavity, the equalizing pipe comprises a first accommodating cavity and a second accommodating cavity, the first accommodating cavity comprises a plurality of first fine holes uniformly distributed along a first direction, the second accommodating cavity comprises a plurality of second fine holes uniformly distributed along the first direction, and the first fine holes and the second fine holes are arranged staggered along the first direction.

[0007] According to an aspect of the embodiments of the present application, the micro-channel evaporator further comprises an air outlet pipe and a liquid inlet pipe, the liquid inlet pipe is connected in communication with the equalizing pipe, and the air outlet pipe is connected in communication with the evaporation cavity.

[0008] According to an aspect of the embodiments of the present application, the micro-channel condenser comprises a second liquid collecting cavity, a condensation cavity and a plurality of condensation flat tubes, the second liquid collecting cavity and the condensation cavity are connected in communication through the condensation flat tubes, and the condensation flat tubes store a working medium.

[0009] According to an aspect of the embodiments of the present application, the micro-channel condenser further comprises an air inlet pipe and a liquid outlet pipe, the air inlet pipe is connected in communication with the condensation cavity, and the liquid outlet pipe is connected in communication with the second liquid collecting cavity.

[0010] According to an aspect of the embodiment of the present application, the conduit assembly comprises a plurality of steam conduits and a plurality of liquid return conduits, the steam conduits and the liquid return conduits being in communication with the first heat exchange mechanism and the second heat exchange mechanism.

[0011] According to an aspect of the embodiment of the present application, the first heat exchange mechanism and the second heat exchange mechanism further comprise a cover plate and a centrifugal fan, the cover plate being connected to the shell, and the centrifugal fan being arranged between the cover plate and the shell.

[0012] According to an aspect of the embodiment of the present application, the base station door plate heat exchange device further comprises a control module, and the first heat exchange mechanism and the second heat exchange mechanism further comprise a temperature and humidity sensor, the control module being electrically connected to the temperature and humidity sensor and the centrifugal fan.

[0013] In a second aspect, the embodiment of the present application provides a communication base station, comprising: an equipment cabinet comprising a cavity and a door hole arranged on a wall of the equipment cabinet and in communication with the cavity, the cavity being configured to place communication equipment and related equipment; and a door plate capable of being arranged in the door hole in an opening and closing manner, the door plate being the base station door plate heat exchange device according to any one of the embodiments of the first aspect.

[0014] The base station door plate heat exchange device and the communication base station provided by the embodiment of the present application have the following advantages: the first heat exchange mechanism and the second heat exchange mechanism are both integrated in the door plate, the two are communicated by the conduit assembly to form internal heat exchange, and the two are separated by the partition plate to isolate the transmission of other heat and other substances; the first heat exchange mechanism and the second heat exchange mechanism further respectively adopt a microchannel evaporator and a microchannel condenser, which reduces the overall weight of the base station door plate heat exchange device compared with a traditional copper tube fin heat exchanger. BRIEF DESCRIPTION OF DRAWINGS

[0015] The features, advantages, and technical effects of the exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0016] Figure 1 is a structural schematic diagram of a base station door plate heat exchange device provided by the embodiment of the present application;

[0017] Figure 2 is Figure 1 is a structural schematic diagram of the first heat exchange mechanism, the second heat exchange mechanism, and the conduit assembly in the embodiment;

[0018] Figure 3 is Figure 1 is a structural schematic diagram of the first liquid collecting cavity and the pressure equalizing pipe in the embodiment;

[0019] Figure 4 is Figure 1 is a structural schematic diagram of the pressure equalizing pipe in the embodiment;

[0020] Figure 5 isFigure 1 An exploded view of the structure of one side of the base station door plate heat exchange device provided by the embodiment;

[0021] Figure 6 is Figure 1 An exploded view of the structure of the other side of the base station door plate heat exchange device provided by the embodiment;

[0022] Figure 7 is Figure 1 A control strategy flowchart of the base station door plate heat exchange device provided by the embodiment;

[0023] Figure 8 is a structural schematic diagram of a communication base station provided by the embodiment.

[0024] wherein:

[0025] 100 - base station door plate heat exchange device;

[0026] 1 - first heat exchange mechanism; 10 - microchannel evaporator; 11 - first liquid collecting cavity; 12 - evaporation cavity; 13 - evaporation flat tube; 14 - pressure equalizing pipe; 15 - gas outlet pipe; 16 - liquid inlet pipe;

[0027] 141 - first containing cavity; 142 - second containing cavity; 1411 - first fine hole; 1421 - second fine hole;

[0028] 2 - second heat exchange mechanism; 20 - microchannel condenser; 21 - second liquid collecting cavity; 22 - condensation cavity; 23 - condensation flat tube; 24 - gas inlet pipe; 25 - liquid outlet pipe; 26 - compressor; 27 - capillary assembly;

[0029] 3 - partition plate;

[0030] 4 - pipe assembly; 41 - steam pipe; 42 - liquid return pipe;

[0031] 5 - cover plate;

[0032] 6 - shell;

[0033] 7 - centrifugal fan;

[0034] 8 - control module;

[0035] 9 - temperature and humidity sensor;

[0036] 101 - equipment box; 102 - cavity; 103 - door hole;

[0037] 1000 - communication base station.

[0038] In the drawings, the same components are designated by the same reference numerals. The drawings are not drawn according to the actual proportions. DETAILED DESCRIPTION

[0039] Features and exemplary embodiments of various aspects of the present application will be described below in detail. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one of ordinary skill in the art that the present application can be practiced without some or all of these specific details. The description of the embodiments is merely illustrative of the present application and is not intended to limit the present application, as is apparent to one of ordinary skill in the art. In the following description, well-known structures and techniques have not been shown in detail in order not to obscure the present application.

[0040] It is to be noted that, in the present document, relational terms such as first and second, and the like, can be used solely to distinguish one entity or action from another entity or action without necessarily implying any actual such relationship or order between such entities or actions. Also, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0041] The positional words appearing in the following description are the directions shown in the drawings, and are not intended to limit the specific structure of the present application. In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "set", "connected" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be directly connected, or indirectly connected. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0042] The base station is a key facility to support the operation of modern communication networks, and is usually deployed in various harsh environments, which puts strict requirements on the stable operation of communication equipment in the base station. Especially in high-temperature environments, the communication equipment is prone to overheat due to the accumulation of heat emitted by itself in the base station and the failure to discharge it in time, resulting in a decline in performance or even damage to the communication equipment.

[0043] Therefore, the air conditioning system of the base station is an important part to ensure the continuous and stable operation of the communication network. In the related art, the air conditioning equipment of the base station is configured as an internal-external machine split structure, and is respectively provided with an internal machine and an external machine, which causes the air conditioning equipment to have a large volume and occupy a large space in the base station.

[0044] Based on the consideration and technical needs of solving the above problems, the application provides a base station door plate type heat exchange device 100 and a communication base station 1000.

[0045] Please refer to Figures 1 to 2 and Figures 5 to 6 The application embodiment provides a base station door plate type heat exchange device 100, which comprises a shell 6, a first heat exchange mechanism 1, a second heat exchange mechanism 2, a partition plate 3 and a pipe assembly 4.

[0046] The first heat exchange mechanism 1 comprises a micro-channel evaporator 10, and the second heat exchange mechanism 2 comprises a micro-channel condenser 20.

[0047] The partition plate 3 is arranged between the first heat exchange mechanism 1 and the second heat exchange mechanism 2.

[0048] The first heat exchange mechanism 1 and the second heat exchange mechanism 2 are connected and communicated through the pipe assembly 4.

[0049] The base station door plate type heat exchange device 100 provided by the application embodiment integrates the first heat exchange mechanism 1 and the second heat exchange mechanism 2 in the door plate, and connects and communicates the two through the pipe assembly 4 to form internal heat exchange, and separates the two through the partition plate 3 to isolate the transmission of other heat and other substances. The first heat exchange mechanism 1 and the second heat exchange mechanism 2 also respectively adopt the micro-channel evaporator 10 and the micro-channel condenser 20, which reduces the overall weight of the base station door plate type heat exchange device 100 compared with the traditional copper tube fin type heat exchanger.

[0050] The shell 6 is a frame structure of the base station door plate, and mainly includes engineering plastic or die-cast alloy material, which can provide accommodation space for related structures in the entire base station door plate type heat exchange device 100 while ensuring a certain structural strength, and is suitable for mass production.

[0051] In the related art, the air conditioning equipment in the base station usually adopts a copper tube fin type heat exchanger as a heat exchange mechanism on one side of the inside. The "one side of the inside" should be understood as the side where the working medium stored in the air conditioning system absorbs heat from the liquid cooling medium and evaporates into the gaseous cooling medium. The heat exchange mechanism arranged on this side mainly functions to absorb heat.

[0052] The copper tube fin heat exchanger is provided with a plurality of fins around the copper tube to increase the outer surface area of the copper tube, thereby improving the heat absorption capacity of the copper tube. However, the copper tube fin heat exchanger is heavy, and directly installing the copper tube fin heat exchanger on the base station door panel cannot support the weight of the copper tube fin heat exchanger, which may cause the base station door panel to be too heavy and the weight distribution to be uneven, and the connection structure of the base station door panel may fail.

[0053] In the copper tube fin heat exchanger, the copper tube and the fin are connected through a tight fitting process, and there is a contact gap between the two, so the heat exchange efficiency of the copper tube fin heat exchanger is also affected by the tight fitting process.

[0054] In the embodiments of the present application, the first heat exchange mechanism 1 adopts a micro-channel evaporator 10, and the second heat exchange mechanism 2 adopts a micro-channel condenser 20. The first heat exchange mechanism 1 and the second heat exchange mechanism 2 both adopt the same heat exchange scheme, which can reduce the weight while maintaining good consistency and uniform weight distribution, and can better adapt to the scheme design of the base station door panel type heat exchange device 100 integrating the heat exchange device in the base station door panel.

[0055] The micro-channel evaporator 10 and the micro-channel condenser 20 are both processed through an all-aluminum brazing process, which eliminates the gap problem between the fin and the copper tube in the copper tube fin heat exchanger, has better heat exchange efficiency, and is manufactured in an all-aluminum integrated manner, which has good consistency and is light in weight.

[0056] Optionally, the micro-channel evaporator 10 of the first heat exchange mechanism 1 has a hydrophilic coating on the surface. The hydrophilic coating is arranged to improve the problem of scale formation on the surface of the micro-channel evaporator 10, thereby improving the evaporation efficiency and accelerating the shedding of condensed water, and improving the refrigeration performance of the base station door panel type heat exchange device 100.

[0057] The process steps for hydrophilic treatment of the surface of the micro-channel evaporator 10 of the first heat exchange mechanism 1 to obtain a hydrophilic coating can be: after the brazing process of the micro-channel evaporator 10 is completed, the micro-channel evaporator 10 is ultrasonically cleaned, and then the micro-channel evaporator 10 is placed in a drying oven to remove surface moisture, and then the micro-channel evaporator 10 is immersed in a hydrophilic coating solution to adhere the hydrophilic coating to the surface of the micro-channel evaporator 10, so as to form a hydrophilic coating on the surface of the micro-channel evaporator 10.

[0058] Optionally, the micro-channel condenser 20 of the second heat exchange mechanism 2 has a hydrophobic coating on the surface. The hydrophobic coating is arranged to ensure the cooling and reflux rate of the working medium inside the micro-channel condenser 20, thereby improving the condensation efficiency and the corrosion resistance of the condenser.

[0059] The process treatment step of performing hydrophobic treatment on the surface layer of the micro-channel condenser 20 of the second heat exchange mechanism 2 to obtain a hydrophobic coating can be: after the brazing treatment of the micro-channel condenser 20 is completed, the micro-channel condenser 20 is ultrasonically cleaned, and then the micro-channel condenser 20 is placed in a drying oven to remove surface moisture, and then the micro-channel condenser 20 is immersed in a hydrophobic coating solution to adhere the hydrophobic coating to the surface of the micro-channel condenser 20, so as to form a hydrophobic coating on the surface of the micro-channel condenser 20.

[0060] The partition plate 3 serves to isolate the first heat exchange mechanism 1 and the second heat exchange mechanism 2. Optionally, the partition plate 3 comprises a heat preservation material, which can ensure that air containing different humidity and temperature outside the base station door plate leaks into the base station door plate, while effectively preventing heat on one side of the first heat exchange mechanism 1 and heat on one side of the second heat exchange mechanism 2 from being transmitted to each other, thereby ensuring the refrigeration efficiency.

[0061] The function of the pipe assembly 4 is to realize the mutual transmission of heat between the first heat exchange mechanism 1 and the second heat exchange mechanism 2. Optionally, the material of the pipe assembly 4 comprises copper, which can further improve the heat exchange efficiency.

[0062] The joint arrangement of the partition plate 3 and the pipe assembly 4 can realize that, when the base station door plate type heat exchange device 100 is in use, the first heat exchange mechanism 1 and the second heat exchange mechanism 2 are separated by the partition plate 3 on the side where the first heat exchange mechanism 1 is located and on the side where the second heat exchange mechanism 2 is located, so as to ensure that there is no other heat transmission and material transmission between the two sides, while the first heat exchange mechanism 1 and the second heat exchange mechanism 2 can complete the mutual transmission and circulation of heat through the pipe assembly 4. In the embodiments of the present application, the first heat exchange mechanism 1 and the second heat exchange mechanism 2 can ensure that the cleanliness does not affect each other while realizing the mutual transmission of heat, thereby reducing the failure rate of the base station door plate type heat exchange device 100 and ensuring the normal and efficient operation of the base station door plate type heat exchange device 100.

[0063] Please refer to Figure 2 In some embodiments, the micro-channel evaporator 10 comprises a first liquid collecting cavity 11, an evaporation cavity 12, and a plurality of evaporation flat tubes 13, the first liquid collecting cavity 11 and the evaporation cavity 12 are connected through the evaporation flat tubes 13, and the evaporation flat tubes 13 store working medium.

[0064] In these embodiments, in the micro-channel evaporator 10, the working medium reaches the evaporation cavity 12 from the first liquid collecting cavity 11 through the evaporation flat tubes 13, the working medium evaporates by absorbing heat in the evaporation flat tubes 13, and the working medium changes from liquid state to gaseous state, so that the first heat exchange mechanism 1 realizes the function of absorbing heat.

[0065] Optionally, the working medium can be a specially designed mixed working medium, and the working medium material can include one or more of chlorofluorocarbons (CFCs), hydrochlorofluorocarbons (HCFCs), hydrofluorocarbons (HFCs), ammonia, carbon dioxide, and hydrocarbons. The specific material of the working medium is not limited in the embodiments of the present application.

[0066] It should be understood that the working medium is stored in the evaporation flat tube 13, and the working medium in a gaseous, liquid or gas-liquid mixed state exists in the structure at different positions in the micro-channel evaporator 10. Among them, the volume of the plurality of evaporation flat tubes 13 connected with the first liquid collecting chamber 11 and the evaporation chamber 12 accounts for a major part of the volume of the entire micro-channel evaporator 10. Therefore, the positional relationship of the working medium in the entire micro-channel evaporator 10 can be described as that the working medium is stored in the evaporation flat tube 13.

[0067] The working medium mainly exists in a liquid state in the first liquid collecting chamber 11. When part of the working medium volatilizes into the evaporation flat tube 13, the evaporation flat tube 13 has a large surface area per unit volume due to the number and shape of the flat tube, so the working medium can absorb the heat generated externally and evaporate, thereby entering the evaporation chamber 12 through the evaporation flat tube 13. The working medium in the evaporation chamber 12 mainly exists in a gaseous state, thereby realizing the heat absorption function of the first heat exchange mechanism 1.

[0068] Please refer to Figure 3 and Figure 4 In some embodiments, the micro-channel evaporator 10 further includes an equalizing pipe 14, which is arranged in the first liquid collecting chamber 11. The equalizing pipe 14 includes a first containing chamber 141 and a second containing chamber 142. The first containing chamber 141 includes a plurality of first fine holes 1411 uniformly distributed along the first direction X. The second containing chamber 142 includes a plurality of second fine holes 1421 uniformly distributed along the first direction X. The first fine holes 1411 and the second fine holes 1421 are arranged staggered along the first direction X.

[0069] In these embodiments, the micro-channel evaporator 10 preliminarily divides the liquid working medium in the first liquid collecting chamber 11 through the first containing chamber 141 and the second containing chamber 142 in the equalizing pipe 14, and then re-divides the liquid working medium through the first fine holes 1411 in the first containing chamber 141 and the second fine holes 1421 in the second containing chamber 142. The first fine holes 1411 and the second fine holes 1421 include a plurality of uniformly distributed fine holes, and are arranged staggered along the first direction X, so that the flow distribution of the liquid working medium finally flowing out of the first fine holes 1411 and the second fine holes 1421 of the equalizing pipe 14 is uniform.

[0070] In the related art, the heat exchanger structure on the side where the working medium absorbs heat and evaporates is a micro-channel evaporator 10, which can cause uneven distribution of cold energy. Since the liquid working medium entering the first liquid collection chamber 11 enters the first liquid collection chamber 11 from one end of the first liquid collection chamber 11, the liquid working medium can be concentrated at one end of the first liquid collection chamber 11, and uneven distribution can occur before reaching the other end.

[0071] Optionally, the first liquid collection chamber 11 is coated with a hydrophilic coating, which can solve the above problems to some extent. However, as the use time increases, the hydrophilic coating gradually peels off and fails, which can still cause the above problems to reappear.

[0072] In the embodiments of the present application, the above problems can be further solved by providing an equalizing pipe 14.

[0073] The equalizing pipe 14 includes a plurality of first holes 1411 arranged in a first accommodating cavity 141 and a plurality of second holes 1421 arranged in a second accommodating cavity 142. Optionally, the first holes 1411 and the second holes 1421 are arranged in a plurality of different manners in the first direction X.

[0074] In some optional embodiments, the first holes 1411 and the second holes 1421 can be arranged in a staggered manner, and arranged in an alternating manner in the first direction X.

[0075] In some optional embodiments, a plurality of first holes 1411 form a first group of holes, and a plurality of second holes 1421 form a second group of holes. The first holes 1411 and the second holes 1421 can also be arranged in an alternating manner between the first group of holes and the second group of holes.

[0076] In some optional embodiments, all the first holes 1411 form a group, and all the second holes 1421 form a group. The first holes 1411 and the second holes 1421 can also be arranged in a staggered manner between all the first holes 1411 and all the second holes 1421.

[0077] In the embodiments of the present application, the first holes 1411 and the second holes 1421 can also include more different arrangement manners, as long as the first holes 1411 and the second holes 1421 are uniformly distributed in the first direction X between themselves, and the first holes 1411 and the second holes 1421 are staggered in the first direction X.

[0078] Please refer to Figure 2 In some embodiments, the micro-channel evaporator 10 further includes an air outlet pipe 15 and a liquid inlet pipe 16. The liquid inlet pipe 16 is in communication with the equalizing pipe 14, and the air outlet pipe 15 is in communication with the evaporation chamber 12.

[0079] In these embodiments, the gas outlet pipe 15 is in communication with the evaporation cavity 12 to further lead the gaseous working medium out of the micro-channel evaporator 10, and the liquid inlet pipe 16 is in communication with the equalizing pipe 14 in the first collecting cavity 11 to lead the liquid working medium into the micro-channel evaporator 10.

[0080] Optionally, the liquid inlet pipe 16 is in communication with both the first containing cavity 141 and the second containing cavity 142 in the equalizing pipe 14, further ensuring the uniform distribution of the liquid working medium in the first collecting cavity 11.

[0081] Please refer to Figure 2 In some embodiments, the micro-channel condenser 20 comprises a second collecting cavity 21, a condensing cavity 22, and a plurality of condensing flat tubes 23, the second collecting cavity 21 is in communication with the condensing cavity 22 through the condensing flat tubes 23, and the condensing flat tubes 23 store the working medium.

[0082] In these embodiments, in the micro-channel condenser 20, the working medium reaches the second collecting cavity 21 from the condensing cavity 22 through the condensing flat tubes 23, the working medium releases heat and liquefies in the condensing flat tubes 23, and the working medium changes from gaseous state to liquid state, so that the second heat exchange mechanism 2 realizes the function of releasing heat.

[0083] The working medium in the micro-channel evaporator 10 in the first heat exchange mechanism 1 is the same kind of working medium as the working medium in the micro-channel condenser 20.

[0084] The working medium stored in the condensing flat tubes 23 should be understood as that the working medium in gaseous state, liquid state, or mixed state of gas and liquid exists in the structures at different positions in the micro-channel condenser 20, and the volume of the plurality of condensing flat tubes 23 connected with the second collecting cavity 21 and the condensing cavity 22 accounts for a major part of the volume of the entire micro-channel condenser 20. Therefore, the positional relationship of the working medium in the entire micro-channel condenser 20 can be described as that the working medium is stored in the condensing flat tubes 23.

[0085] The working medium mainly exists in gaseous state in the condensing cavity 22, when part of the working medium volatilizes into the condensing flat tubes 23, due to the large number and the shape of the flat tubes, the condensing flat tubes 23 have large surface area per unit volume, so the working medium can effectively release heat to the outside and liquefy, thereby entering the second collecting cavity 21 through the condensing flat tubes 23, and the working medium in the second collecting cavity 21 mainly exists in liquid state, realizing the function of releasing heat of the second heat exchange mechanism 2.

[0086] Please refer to Figure 2 In some embodiments, the micro-channel condenser 20 further comprises a gas inlet pipe 24 and a liquid outlet pipe 25, the gas inlet pipe 24 is in communication with the condensing cavity 22, and the liquid outlet pipe 25 is in communication with the second collecting cavity 21.

[0087] In these embodiments, the gas inlet pipe 24 is in communication with the condensing cavity 22 to further introduce the gaseous working medium into the micro-channel condenser 20, and the liquid outlet pipe 25 is in communication with the second liquid collecting cavity 21 to lead the liquid working medium out of the micro-channel condenser 20.

[0088] In some alternative embodiments, referring to Figure 6 , the second heat exchange mechanism 2 further comprises a compressor 26 and a capillary assembly 27.

[0089] The compressor 26 is capable of lifting low-pressure gas to high-pressure gas, and its main working principle is to compress the volume of the gas to increase the pressure of the gas. After the compressor 26 compresses the gas to lift the low-pressure gas to the high-pressure gas, it can also deliver the compressed high-pressure gas to the conduit assembly 4.

[0090] Through the compressor 26, the gaseous working medium can be lifted in pressure and temperature, further ensuring that the working medium has a pressure and temperature that can smoothly circulate between the first heat exchange mechanism 1 and the second heat exchange mechanism 2, and achieve the heat exchange effect.

[0091] The capillary assembly 27 is used to control the flow and pressure of the working medium, and can control the flow rate of the working medium entering the micro-channel evaporator 10, further ensuring that the working medium can be fully heat exchanged. The capillary assembly 27 itself can also exchange heat with the external environment, further ensuring the smooth circulation of the working medium between the first heat exchange mechanism 1 and the second heat exchange mechanism 2.

[0092] Referring to Figure 2 , in some embodiments, the conduit assembly 4 comprises a plurality of steam conduits 41 and a plurality of liquid return conduits 42, and the steam conduits 41 and the liquid return conduits 42 are in communication with the first heat exchange mechanism 1 and the second heat exchange mechanism 2.

[0093] In these embodiments, the steam conduits 41 in the conduit assembly 4 are used to deliver the gaseous working medium that has been evaporated by absorbing heat, and the liquid return conduits 42 are used to deliver the liquid working medium that has been liquefied by releasing heat. The steam conduits 41 and the liquid return conduits 42 in the conduit assembly 4 comprise a plurality of conduits, which reduces the flow rate and pressure in each steam conduit 41 and liquid return conduit 42, while ensuring uniform flow distribution and uniform pressure distribution under high pressure.

[0094] After the working medium is injected into the micro-channel evaporator 10 and the micro-channel condenser 20, the micro-channel evaporator 10 can absorb heat on one side to cause the working medium to quickly generate bubbles and separate, and the working medium can absorb heat during the process of phase change, evaporation and conversion into gaseous working medium. After the working medium evaporates, it flows into the micro-channel condenser 20 through the steam conduit 41 to transfer heat to the side of the micro-channel condenser 20.

[0095] The working medium releases heat and condenses on this side, and transforms from gaseous working medium to liquid working medium by phase change, and returns to the micro-channel evaporator 10 through the return liquid conduit 42 due to gravity, to complete the cycle of heat absorption and heat release of the working medium.

[0096] In some alternative embodiments, the base station door plate heat exchange device 100 does not need an additional power source to help the working medium circulation, and only relies on the heat transfer and transfer characteristics in the phase change process between evaporation and liquefaction of the working medium and gravity to complete the working cycle, which is simple in composition and low in maintenance cost.

[0097] Please refer to Figure 5 and Figure 6 In some embodiments, the first heat exchange mechanism 1 and the second heat exchange mechanism 2 further include a cover plate 5 and a centrifugal fan 7, the cover plate 5 is connected with the shell 6, and the centrifugal fan 7 is arranged between the cover plate 5 and the shell 6.

[0098] In these embodiments, the cover plate 5 is connected with the shell 6 to form an internal space between the cover plate 5, the partition plate 3 and the shell 6, and the centrifugal fan 7 arranged between the cover plate 5 and the shell 6 realizes heat exchange between the semi-closed space and the outside through the gap reserved on the cover plate 5.

[0099] Optionally, the centrifugal fan 7 is a DC fan, which can realize non-mechanical speed regulation, and can reduce the speed in the case of low heat exchange demand, so as to realize energy saving while ensuring temperature control.

[0100] In some alternative embodiments, the base station door plate heat exchange device 100 does not need an additional power source to help the working medium circulation, and only needs to be provided with a cover plate 5 and a centrifugal fan 7 on both sides of the first heat exchange mechanism 1 and the second heat exchange mechanism, the cover plate 5, the partition plate 3 and the shell 6 form an internal space, and only the fan of the centrifugal fan 7 is used for heat exchange between the internal space and the outside, which is simple in composition and low in maintenance cost.

[0101] Please refer to Figure 5 In some embodiments, the base station door plate air conditioner further includes a control module 8, and the first heat exchange mechanism 1 and the second heat exchange mechanism 2 further include a temperature and humidity sensor 9, and the control module 8 is electrically connected with the temperature and humidity sensor 9 and the centrifugal fan 7.

[0102] In these embodiments, the temperature and humidity sensor 9 can collect temperature and humidity information at different positions, and then uniformly collect and give to the control module 8 for processing, and the control module 8 further judges the situation and controls the speed and start-stop of the centrifugal fan 7, to realize an intelligent control strategy.

[0103] The control module 8 adjusts the rotating speed of the centrifugal fan 7 according to the temperature difference collected by the temperature and humidity sensors 9 arranged at different positions, controls the cooling air flow of the micro-channel evaporator 10 and the micro-channel condenser 20, and achieves the best heat exchange effect of the micro-channel evaporator 10 and the micro-channel condenser 20. In the case of low temperature, the fan can be turned off to achieve energy saving.

[0104] Optionally, the control module 8 includes a main controller, a rotating speed controller, a memory and an acquisition unit. The rotating speed controller is composed of a control component and an acquisition component, and the main controller is electrically connected with the rotating speed controller, the memory, the acquisition unit, the temperature and humidity sensors 9 and the centrifugal fan 7.

[0105] The memory is used for storing software programs and units, including the program command corresponding to the rotating speed controller in the embodiment of the application. The main controller runs the program command of the rotating speed controller stored in the memory, so as to realize the processing of application and data, and to execute various functions, including the rotating speed control function in the embodiment of the application.

[0106] The memory can be, but is not limited to, a random access memory (RAM), a read only memory (ROM), a programmable read only memory (PROM), an erasable programmable read only memory (EPROM), an electric erasable programmable read only memory (EEPROM) and the like.

[0107] Optionally, the temperature and humidity sensors 9 include the temperature and humidity sensors 9 arranged on one side of the first heat exchange mechanism 1 and the temperature and humidity sensors 9 arranged on one side of the second heat exchange mechanism 2.

[0108] The acquisition unit collects the temperature and humidity inside and outside and the rotating speed of the fan through the temperature and humidity sensors 9 and the centrifugal fan 7 on both sides, and regularly stores the above data in the memory.

[0109] The acquisition component in the rotating speed controller collects the temperature inside and outside and the rotating speed of the fan according to the preset time period when the base station door plate type heat exchange device 100 starts. The control component in the rotating speed controller adjusts the rotating speed according to the collected data, so as to improve the heat exchange efficiency or save energy.

[0110] Optionally, please refer to Figure 7The adjustment strategy of the control module 8 for controlling and adjusting the centrifugal fan 7 according to the temperature and humidity sensor 9 can include:

[0111] S1, the base station door plate heat exchange device 100 starts to work, and the centrifugal fan 7 is fully opened.

[0112] S2, the temperature and the rotating speed of the centrifugal fan 7 are acquired by the acquisition unit.

[0113] S3, the acquisition unit in the rotating speed controller judges whether the indoor temperature is lower than 25℃.

[0114] If yes, the process enters step S4; if not, step S5 is entered.

[0115] S4, the centrifugal fan 7 is turned off.

[0116] S5, the acquisition unit in the rotating speed controller judges whether the indoor temperature is higher than 25℃ and lower than 30℃.

[0117] If yes, the process enters step S6; if not, step S7 is entered.

[0118] S6, the rotating speed of the centrifugal fan 7 is reduced.

[0119] S7, the centrifugal fan 7 is operated at high speed.

[0120] Please refer to Figure 8 In a second aspect, the embodiments of the present application further provide a communication base station 1000, comprising a device box 101 and a door plate.

[0121] The device box 101 comprises a cavity 102 and a door hole 103 arranged on the wall of the device box 101 and communicating with the cavity 102, and the cavity 102 is configured to place communication equipment and related equipment.

[0122] The door plate can be arranged in the door hole 103 in an opening and closing manner, and the door plate is the base station door plate heat exchange device 100 provided in any one of the embodiments of the first aspect.

[0123] Since the communication base station 1000 provided by the embodiments of the present application comprises the base station door plate heat exchange device 100 of the above-mentioned first aspect, the communication base station 1000 provided by the embodiments of the second aspect of the present application has the beneficial effects of the base station door plate heat exchange device 100 of the first aspect, which will not be described here.

[0124] The first heat exchange mechanism 1 and the second heat exchange mechanism 2 in the base station door plate heat exchange device 100 are fixed by screws, which is convenient to install and will not damage the cabinet door plate.

[0125] While the present application has been described with reference to the preferred embodiments, it is to be understood that various modifications can change the scope of the present application to and equivalents can be substituted for elements thereof without departing from the scope of the present application. Especially, each of the technical features mentioned in the respective embodiments can be combined in an arbitrary manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein but includes all technical solutions falling within the scope of the claims.

Claims

1. A base station door panel heat exchanger device, characterized by, The base station door plate heat exchange device comprises a housing, a first heat exchange mechanism, a second heat exchange mechanism, a partition plate, and a conduit assembly. The micro-channel evaporator comprises a first liquid collecting cavity, an evaporation cavity, and a plurality of evaporation flat tubes. The micro-channel evaporator further comprises an equalizing pipe, an air outlet pipe, and a liquid inlet pipe. The micro-channel condenser comprises a second liquid collecting cavity, a condensation cavity, and a plurality of condensation flat tubes. The micro-channel condenser further comprises an air inlet pipe and a liquid outlet pipe. The conduit assembly comprises a plurality of steam conduits and a plurality of liquid return conduits.

2. The base station door panel heat exchanger of claim 1, wherein, The first heat exchange mechanism and the second heat exchange mechanism further comprise a cover plate and a centrifugal fan.

3. The base station door panel heat exchanger of claim 2, wherein, The base station door plate heat exchange device further comprises a control module, and the first heat exchange mechanism and the second heat exchange mechanism further comprise a temperature and humidity sensor.

4. The base station door panel heat exchanger of claim 3, wherein, The device box comprises a cavity and a door hole provided on a wall of the device box and in communication with the cavity, and the cavity is configured to place communication devices and related devices.

5. The base station door panel heat exchanger of claim 1, wherein, The door plate is capable of being provided in the door hole in an opening and closing manner, and the door plate is the base station door plate heat exchange device according to any one of claims 1 to 9.

6. The base station door panel heat exchanger of claim 5, wherein, ​ 7. The base station door panel heat exchanger of claim 1, wherein ​ 8. The base station door panel heat exchanger of claim 1, wherein, ​ 9. The base station door panel heat exchanger of claim 8, wherein, ​ 10. A communication base station, characterized by comprising: ​ ​ ​

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