Gateway device with efficient heat dissipation

Abstract

The utility model relates to a gateway heat dissipation technology device, in particular to a gateway device with efficient heat dissipation, which comprises a high-heat-conductivity shell. The high-thermal-conductivity inner shell is fixedly connected to the interior of the high-thermal-conductivity outer shell; by arranging the lower heat dissipation fins, the triangular heat dissipation fins and the U-shaped heat dissipation groove tops, after the environment air pressure between the high-heat-conduction outer shell and the high-heat-conduction inner shell is reduced by the air extracting pump, alcohol contained between the high-heat-conduction outer shell and the high-heat-conduction inner shell efficiently receives heat from the lower heat dissipation fins and the triangular heat dissipation fins with large heat dissipation areas; after absorbing heat, alcohol rapidly evaporates in a low-pressure environment and is cooled and condensed on the inner wall of the top of the U-shaped heat dissipation groove with a large heat dissipation area, and condensed alcohol liquid flows downwards to the triangular heat dissipation fins along the inner wall of the top of the U-shaped heat dissipation groove so as to absorb heat of the triangular heat dissipation fins. And the capillary grooves can assist the alcohol liquid to quickly and uniformly flow downwards to the slope surface at the upper end and finally flow back to the bottommost part to complete circulation.

Description

Technical Field

[0001] This utility model relates to gateway heat dissipation technology devices, and more particularly to a gateway device with high-efficiency heat dissipation. Background Technology

[0002] A gateway is a network device or software used to connect two different networks, enabling them to communicate with each other. Gateways implement network interconnection above the network layer and are complex network interconnection devices used only for interconnecting two networks with different high-level protocols. The main functions of a gateway include protocol conversion, routing, and data exchange. It can understand different network protocols, enabling different types of networks to communicate effectively.

[0003] Gateways generate a lot of heat during operation, which is not easily dissipated at high room temperatures, thus degrading device performance and shortening the lifespan of internal electronic components in long-term high-temperature environments.

[0004] In existing published literature, utility model patent application number 202323197994.4 discloses a gateway that facilitates heat dissipation, including a base, a gateway body on the top of the base, a cleaning component fixedly connected to the top of the gateway body, a positioning shell fixedly connected to the top of the base, a ventilation slot at the bottom of the inner cavity of the positioning shell, a motor fixedly connected to the bottom of the inner cavity of the positioning shell, a first pulley fixedly connected to the output end of the motor, a belt body sleeved on the surface of the first pulley, a second pulley movably connected to the left side of the inner cavity of the belt body, a transmission rod fixedly connected to the inner cavity of the second pulley, the top and bottom of the transmission rod being movably connected to the inner wall of the positioning shell, and fan blades sleeved on the surface of the transmission rod. By using the motor to drive the fan blades to rotate, air can be blown to cool the bottom of the gateway body, and the cleaning component can clean the dust on the surface of the heat dissipation mesh, thereby improving the heat dissipation efficiency of the gateway body. However, this solution requires additional electricity to start the motor to drive the fan blades to rotate and dissipate heat from the gateway device, thus increasing the overall energy consumption of the gateway device.

[0005] Therefore, considering that the heat generated by the gateway during operation is not easily dissipated at high room temperatures, which can lead to decreased device performance and shortened lifespan of internal electronic components in long-term high-temperature environments, a highly efficient heat dissipation gateway device can be designed. This device allows the alcohol between the high thermal conductivity outer shell and the high thermal conductivity inner shell to rapidly evaporate due to large-area heat absorption in a low-pressure environment, and then rapidly condense due to large-area heat dissipation. This continuous gas-liquid circulation quickly removes heat from the gateway surface without requiring additional power consumption, thus solving the aforementioned problems. Utility Model Content

[0006] To overcome the problem that the heat generated by the gateway is not easily dissipated when it operates in a high-temperature environment, which will cause the device performance to degrade and the lifespan of the internal electronic components to be shortened in a long-term high-temperature environment.

[0007] The technical solution of this utility model is as follows: a high-efficiency heat dissipation gateway device, including a high thermal conductivity outer shell; and a high thermal conductivity inner shell, the high thermal conductivity inner shell being fixedly connected inside the high thermal conductivity outer shell, a U-shaped heat dissipation groove top being fixedly connected to the upper end of the high thermal conductivity outer shell, a docking groove being opened on the lower end face of the U-shaped heat dissipation groove top, a lower heat dissipation fin being fixedly connected to the lower end of the high thermal conductivity inner shell, a triangular heat dissipation fin being fixedly connected to the upper end of the high thermal conductivity inner shell, a sloping surface being provided on both the upper and lower end faces of the high thermal conductivity inner shell, capillary grooves being opened on both the front and rear end faces of the triangular heat dissipation fins, and a gateway main circuit board being installed inside the high thermal conductivity inner shell.

[0008] Preferably, alcohol is added between the high thermal conductivity outer shell and the high thermal conductivity inner shell, and the air between them is extracted by a vacuum pump to reduce the air pressure in the environment where the alcohol is located, making it easier for the alcohol to evaporate upon heating. When the gateway is operating, the heat generated on the main circuit board of the gateway is transferred to the downward heat dissipation fins and triangular heat dissipation fins through the high thermal conductivity inner shell. Utilizing the large heat dissipation area of ​​the downward and triangular heat dissipation fins, the heat from the main circuit board of the gateway is efficiently transferred to the alcohol. After absorbing heat, the alcohol turns into vapor and floats upward. After floating into the groove at the top of the U-shaped heat dissipation groove, which is relatively far from the heat source, it rapidly dissipates heat to the outside using the large heat dissipation area at the top of the U-shaped heat dissipation groove. After the alcohol vapor dissipates heat and turns back into liquid, it flows down the inner wall of the top of the U-shaped heat sink onto the triangular heat sink fins to absorb heat from them. The capillary channels also help the liquid alcohol flow down more quickly and evenly to the upper slope, and finally flow back to the bottom to complete the circulation, achieving a large-area enveloping high-efficiency liquid cooling. At the same time, because the atmospheric pressure of the alcohol environment is reduced, the alcohol will evaporate after absorbing less heat to control the temperature. In addition, the large heat dissipation area of ​​the alcohol vapor covers the inner wall of the top of the U-shaped heat sink and the inner wall of the high thermal conductivity shell, so the temperature in the area between the high thermal conductivity shell and the high thermal conductivity inner shell is also controlled within a lower range.

[0009] Preferably, the top of the triangular heat dissipation fins is inserted into the docking groove, and the top of the U-shaped heat dissipation groove, the triangular heat dissipation fins and the slope surface are all provided with a triangular slope, and the slope of the top of the U-shaped heat dissipation groove and the triangular heat dissipation fins is greater than the slope of the slope surface.

[0010] Preferably, liquid inlet cylinders are fixedly connected to both sides of the high thermal conductivity shell, and the interior of both liquid inlet cylinders is connected to the interior of the high thermal conductivity shell. A sleeve is fixedly connected to the upper end of one of the liquid inlet cylinders.

[0011] Preferably, the upper end of the sleeve and the upper end of the liquid inlet cylinder on the other side are both connected by threaded sealing caps, and an air pump is installed inside the sleeve.

[0012] Preferably, the lower end face of the air pump is fixedly connected to the upper end face of the liquid inlet cylinder, the front end of the high thermal conductivity shell is fixedly connected to a front cover, and the rear end of the high thermal conductivity shell is fixedly connected to a rear cover.

[0013] Preferably, a network cable port is provided at the rear end of the rear cover, and an electrical wire port is provided on one side of the network cable port. Antennas are installed on both sides of the rear end face of the rear cover.

[0014] Preferably, the network cable port, power cable port, and antenna are all electrically connected to the main circuit board of the gateway.

[0015] The beneficial effects of this utility model are:

[0016] By setting up lower heat dissipation fins, triangular heat dissipation fins, and a U-shaped heat dissipation groove top, the ambient air pressure between the high thermal conductivity outer shell and the high thermal conductivity inner shell is reduced by an air pump. The alcohol contained between them efficiently absorbs heat from the lower and triangular heat dissipation fins, which have a large heat dissipation area. After absorbing heat, the alcohol evaporates rapidly in the low-pressure environment and condenses on the inner wall of the U-shaped heat dissipation groove top, which has a large heat dissipation area. The condensed alcohol liquid flows down the inner wall of the U-shaped heat dissipation groove top onto the triangular heat dissipation fins to absorb heat from them. The capillary grooves further assist the alcohol liquid to flow down more quickly and evenly to the upper slope surface and finally flow back to the bottom to complete the circulation, thus achieving a large-area encapsulated high-efficiency liquid cooling without consuming additional electricity during the heat dissipation process. Attached Figure Description

[0017] Figure 1 The diagram shown is a schematic representation of the overall structure of a high-efficiency heat dissipation gateway device according to this utility model.

[0018] Figure 2 The image shown is a rear view of the overall structure of a high-efficiency heat dissipation gateway device according to this utility model.

[0019] Figure 3 The diagram shown is a cross-sectional view of the high thermal conductivity housing structure of a gateway device for efficient heat dissipation according to this utility model.

[0020] Figure 4 The diagram shown is a schematic representation of the high thermal conductivity housing structure of a gateway device for efficient heat dissipation according to this utility model.

[0021] Figure 5 The diagram shown is a schematic representation of the high thermal conductivity inner shell structure of a gateway device for efficient heat dissipation according to this utility model.

[0022] Figure 6The diagram shown is a schematic representation of the top structure of the U-shaped heat dissipation groove of a gateway device for high-efficiency heat dissipation according to this utility model.

[0023] Figure 7 The diagram shown is a schematic of the air pump structure of a high-efficiency heat dissipation gateway device according to this utility model.

[0024] Figure 8 The diagram shown is a schematic diagram of the triangular heat dissipation fin structure of a high-efficiency heat dissipation gateway device according to this utility model.

[0025] Explanation of reference numerals in the attached diagram: 1. High thermal conductivity outer shell; 2. High thermal conductivity inner shell; 3. Top of U-shaped heat dissipation groove; 4. Docking groove; 5. Lower heat dissipation fins; 6. Triangular heat dissipation fins; 7. Sloping surface; 8. Capillary groove; 9. Liquid inlet cylinder; 10. Sleeve; 11. Threaded sealing cap; 12. Air pump; 13. Gateway main circuit board; 14. Front cover; 15. Rear cover; 16. Network cable port; 17. Wire port; 18. Antenna. Detailed Implementation

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0027] Please see Figures 1-8 This utility model provides an embodiment of a high-efficiency heat dissipation gateway device, including a high thermal conductivity outer shell 1 and a high thermal conductivity inner shell 2. The high thermal conductivity inner shell 2 is fixedly connected inside the high thermal conductivity outer shell 1. A U-shaped heat dissipation groove top 3 is fixedly connected to the upper end of the high thermal conductivity outer shell 1. A docking groove 4 is opened on the lower end face of the U-shaped heat dissipation groove top 3. A lower heat dissipation fin 5 is fixedly connected to the lower end of the high thermal conductivity inner shell 2. A triangular heat dissipation fin 6 is fixedly connected to the upper end of the high thermal conductivity inner shell 2. Both the upper and lower end faces of the high thermal conductivity inner shell 2 are provided with a slope surface 7. The front and rear end faces of the triangular heat dissipation fin 6 are provided with capillary grooves 8. A gateway main circuit board 13 is installed inside the high thermal conductivity inner shell 2.

[0028] Preferably, alcohol is added between the high thermal conductivity outer shell 1 and the high thermal conductivity inner shell 2, and the air between the high thermal conductivity outer shell 1 and the high thermal conductivity inner shell 2 is extracted by the vacuum pump 12 to reduce the air pressure of the alcohol environment, making it easier for the alcohol to evaporate due to heat. When the gateway is operating, the heat generated on the gateway main circuit board 13 is transferred to the downward heat dissipation fins 5 and triangular heat dissipation fins 6 through the high thermal conductivity inner shell 2. With the help of the large heat dissipation area of ​​the downward heat dissipation fins 5 and triangular heat dissipation fins 6, the heat of the gateway main circuit board 13 is efficiently conducted to the alcohol. After absorbing heat, the alcohol turns into vapor and floats upward. After floating into the groove of the top 3 of the U-shaped heat dissipation groove, which is relatively far away from the heat source, it quickly dissipates heat to the outside with the help of the large heat dissipation area of ​​the top 3 of the U-shaped heat dissipation groove. After the alcohol vapor dissipates heat and turns back into liquid, it flows down along the inner wall of the top 3 of the U-shaped heat dissipation groove to the triangular heat dissipation fins 6 to absorb the heat of the triangular heat dissipation fins 6. The capillary groove 8 will help the alcohol liquid flow down more quickly and evenly to the upper slope surface 7, and finally flow The cycle returns to the bottom to complete, achieving large-area, highly efficient liquid cooling. Simultaneously, because the atmospheric pressure of the alcohol's environment is reduced, the alcohol absorbs less heat and evaporates to control the temperature. Furthermore, the large heat dissipation area of ​​the alcohol vapor covers the inner wall of the top 3 of the U-shaped heat sink and the inner wall of the high thermal conductivity outer shell 1. Therefore, the temperature in the area between the high thermal conductivity outer shell 1 and the high thermal conductivity inner shell 2 is also controlled within a lower range. The top of the triangular heat dissipation fins 6 is inserted into the docking groove 4, and the U-shaped heat sink... The top 3, triangular heat dissipation fins 6, and slope surface 7 are all provided with triangular slopes, and the slopes of the top 3 and triangular heat dissipation fins 6 of the U-shaped heat dissipation groove are greater than the slopes of the slope surface 7. Both sides of the high thermal conductivity shell 1 are fixedly connected with liquid inlet cylinders 9. The interiors of the two liquid inlet cylinders 9 are connected to the interior of the high thermal conductivity shell 1. A sleeve 10 is fixedly connected to the upper end of one side of the liquid inlet cylinder 9. The upper end of the sleeve 10 and the upper end of the other side of the liquid inlet cylinder 9 are both connected by threaded sealing caps 11. An air pump 12 is installed inside the sleeve 10.

[0029] Please see Figures 1-4 In this embodiment, the lower end face of the air pump 12 is fixedly connected to the upper end face of the liquid inlet cylinder 9. The front end of the high thermal conductivity shell 1 is fixedly connected to the front cover 14, and the rear end of the high thermal conductivity shell 1 is fixedly connected to the rear cover 15. The front cover 14 and the rear cover 15 are used to prevent the gateway main circuit board 13 from contacting dust. The gateway main circuit board 13 is used to realize various functions of the gateway. The rear end of the rear cover 15 is provided with a network cable socket 16, and a wire socket 17 is provided on one side of the network cable socket 16. Antennas 18 are installed on both sides of the rear end face of the rear cover 15. The network cable socket 16, the wire socket 17 and the antennas 18 are all electrically connected to the gateway main circuit board 13.

[0030] When in use, after unscrewing the threaded sealing cap 11 on one side, add alcohol between the high thermal conductivity outer shell 1 and the high thermal conductivity inner shell 2 through the liquid inlet cylinder 9. Then screw on the threaded sealing cap 11 and unscrew the threaded sealing cap 11 on the other side, which is located at the upper end of the sleeve 10. Then start the vacuum pump 12 to extract the air between the high thermal conductivity outer shell 1 and the high thermal conductivity inner shell 2 to reduce the air pressure of the alcohol environment, making it easier for the alcohol to evaporate due to heat. After the vacuum is completed, first screw on the threaded sealing cap 11 located at the upper end of the sleeve 10, and then turn off the vacuum pump 12.

[0031] When the gateway is in operation, the heat generated on the main circuit board 13 of the gateway is transferred to the downward heat dissipation fins 5 and the triangular heat dissipation fins 6 through the high thermal conductivity inner shell 2. With the help of the large heat dissipation area of ​​the downward heat dissipation fins 5 and the triangular heat dissipation fins 6, the heat of the main circuit board 13 of the gateway is efficiently conducted to the alcohol. After absorbing heat, the alcohol turns into vapor and floats upward. After floating into the groove of the top of the U-shaped heat dissipation groove 3, which is relatively far away from the heat source, it quickly dissipates heat to the outside with the help of the large heat dissipation area of ​​the top of the U-shaped heat dissipation groove 3. After the alcohol vapor dissipates heat and turns back into liquid, it flows down along the inner wall of the top of the U-shaped heat dissipation groove 3 to the triangular heat dissipation fins 6 to absorb the heat of the triangular heat dissipation fins 6. The capillary groove 8 will help the alcohol liquid flow down more quickly and evenly to the upper slope surface 7, and finally flow back to the bottom to complete the circulation, so as to achieve a large-area encapsulated high-efficiency liquid cooling.

[0032] Meanwhile, because the atmospheric pressure of the environment where the alcohol is located is reduced, the alcohol will evaporate after absorbing less heat to control the temperature. In addition, the heat dissipation area of ​​the alcohol vapor is large, covering the inner wall of the top 3 of the U-shaped heat dissipation groove and the inner wall of the high thermal conductivity shell 1. Therefore, the temperature in the area between the high thermal conductivity shell 1 and the high thermal conductivity inner shell 2 will also be controlled within a lower range.

[0033] Through the above steps, by setting the lower heat dissipation fins 5, the triangular heat dissipation fins 6, and the top of the U-shaped heat dissipation groove 3, the ambient air pressure between the high thermal conductivity outer shell 1 and the high thermal conductivity inner shell 2 is reduced by the air pump 12. The alcohol contained between the two efficiently receives heat from the lower heat dissipation fins 5 and the triangular heat dissipation fins 6, which have a large heat dissipation area. After absorbing heat, the alcohol evaporates rapidly in the low-pressure environment and dissipates heat and condenses on the inner wall of the top of the U-shaped heat dissipation groove 3, which has a large heat dissipation area. The condensed alcohol liquid flows down along the inner wall of the top of the U-shaped heat dissipation groove 3 to the triangular heat dissipation fins 6 to absorb the heat of the triangular heat dissipation fins 6. The capillary groove 8 will help the alcohol liquid flow down more quickly and evenly to the upper slope surface 7, and finally flow back to the bottom to complete the circulation, so as to achieve a large-area enveloping high-efficiency liquid cooling, and no additional power is required during the heat dissipation process.

Claims

1. A gateway device with high-efficiency heat dissipation, comprising a high thermal conductivity housing (1); characterized in that: It also includes a high thermal conductivity inner shell (2), the high thermal conductivity outer shell (1) is fixedly connected to the high thermal conductivity inner shell (2), the upper end of the high thermal conductivity outer shell (1) is fixedly connected to the top of the U-shaped heat dissipation groove (3), the lower end face of the top of the U-shaped heat dissipation groove (3) is provided with a docking groove (4), the lower end of the high thermal conductivity inner shell (2) is fixedly connected to the lower heat dissipation fin (5), the upper end of the high thermal conductivity inner shell (2) is fixedly connected to the triangular heat dissipation fin (6), the upper end face and the lower end face of the high thermal conductivity inner shell (2) are both provided with a slope surface (7), the front and rear end faces of the triangular heat dissipation fin (6) are both provided with capillary grooves (8), and the gateway main circuit board (13) is installed inside the high thermal conductivity inner shell (2).

2. The gateway device for high-efficiency heat dissipation according to claim 1, characterized in that: The top of the triangular heat dissipation fin (6) is inserted into the docking groove (4). The top of the U-shaped heat dissipation groove (3), the triangular heat dissipation fin (6) and the slope surface (7) are all provided with a triangular slope, and the slope of the top of the U-shaped heat dissipation groove (3) and the triangular heat dissipation fin (6) is greater than the slope of the slope surface (7).

3. The gateway device for high-efficiency heat dissipation according to claim 1, characterized in that: Both sides of the high thermal conductivity shell (1) are fixed with liquid inlet cylinders (9), and the interior of the two liquid inlet cylinders (9) are connected to the inside of the high thermal conductivity shell (1). A sleeve (10) is fixed to the upper end of one side of the liquid inlet cylinder (9).

4. The gateway device for high-efficiency heat dissipation according to claim 3, characterized in that: The upper end of the sleeve (10) and the upper end of the liquid inlet cylinder (9) on the other side are both connected by threaded sealing caps (11), and an air pump (12) is installed inside the sleeve (10).

5. The gateway device for high-efficiency heat dissipation according to claim 4, characterized in that: The lower end face of the air pump (12) is fixedly connected to the upper end face of the liquid inlet cylinder (9), the front end of the high thermal conductivity shell (1) is fixedly connected to the front cover (14), and the rear end of the high thermal conductivity shell (1) is fixedly connected to the rear cover (15).

6. The gateway device for high-efficiency heat dissipation according to claim 5, characterized in that: The rear cover (15) is provided with a network cable port (16) at the rear end, and a wire port (17) is provided on one side of the network cable port (16). Antennas (18) are installed on both sides of the rear end face of the rear cover (15).

7. The gateway device for high-efficiency heat dissipation according to claim 6, characterized in that: The network cable port (16), the power cord port (17), and the antenna (18) are all electrically connected to the main circuit board (13) of the gateway.

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