Separation structure of internal PIN and external PIN of SMD spot welding patch sensor

Abstract

The utility model provides an SMD spot welding patch sensor internal and external PIN separating structure, comprising a rubber shell, two sides of the rubber shell are respectively provided with through holes, the interiors of the through holes at two sides are respectively provided with a first connection PIN and a second connection PIN in an inserted manner, one side of the rubber shell is connected with a convex block, and the convex block is connected with a first connection PIN and a second connection PIN. Grooves are arranged among the plurality of bumps, and the bottoms of the first connection PIN and the second connection PIN are connected with bonding pads. According to the SMD spot welding patch sensor inner and outer PIN separating structure provided by the utility model, the phenomenon that a rubber shell and pins are damaged during spot welding is relieved, the quality of SMD spot welding patch products is improved, the phenomenon that wires are broken due to the fact that wire ends are pulled is completely eradicated during pin shaping of a pin shaping machine, the pin damage rate is reduced, meanwhile, the tinning reject ratio is reduced, the situation that outer PINs are damaged during wire cutting is avoided, and the quality of the SMD spot welding patch sensors is improved. The problem that the PIN is oxidized and blackened due to damage to the PIN is structurally reduced.

Description

Technical Field

[0001] This utility model relates to the field of sensors, and more particularly to an SMD spot-welded patch sensor with separate inner and outer pins. Background Technology

[0002] Existing SMD spot-welded surface mount sensors have a housing, pins, and pads integrated into a single structure. This structure primarily exhibits the following defects during the manufacturing process:

[0003] 1. During spot welding, the soldering head can easily damage or crush the outer pins and adhesive of the product, resulting in poor spot welding. 2. Residual paint residue from spot welding may remain on the solder pads. 3. Spot welding can damage the outer pins, resulting in poor soldering. 4. When aligning the pins of a one-piece structure product, the synchronous movement of the solder pads and outer pins can cause wire breakage, resulting in poor pin alignment. 5. The outer pins are easily damaged during wire cutting.

[0004] Therefore, it is necessary to provide a CCC SMD spot-welded patch sensor with separate inner and outer pins to solve the above-mentioned technical problems. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides an SMD spot-welded patch sensor with separate inner and outer pins.

[0006] The SMD spot-welded patch sensor with separate inner and outer pins provided by this utility model includes a housing, with through holes on both sides of the housing, and a first connecting pin and a second connecting pin respectively inserted into the through holes on both sides. A protrusion is connected to one side of the housing, and a groove is provided between the protrusions. The bottom of the first connecting pin and the second connecting pin are both connected to a solder pad.

[0007] In order to achieve the effect of snapping the first connecting pin, as provided by this utility model, the inner and outer pins of the SMD spot welding patch sensor are separated. Preferably, a first connecting piece is connected to the top of one end of the first connecting pin. The first connecting piece is inserted into the inside of the through hole. One end of the first connecting piece extends through the through hole to the bottom of the housing and is connected to a first limiting piece. The outer side of the first limiting piece is attached to the outer side of the housing.

[0008] In order to achieve the effect of snapping the first connecting PIN, as provided by this utility model, the inner and outer PINs of the SMD spot welding patch sensor are separated. Preferably, a second connecting piece is connected to the top of one end of the second connecting PIN. The second connecting piece is snapped into the through hole on the side of the housing away from the first connecting PIN. One end of the second connecting piece extends through the through hole to the outside and is connected to a second limiting piece. The second limiting piece is attached to the outside of the housing.

[0009] Compared with the prior art, the beneficial effects of this utility model are:

[0010] The structure mitigates damage to the housing and pins during spot soldering, improving the quality of SMD spot soldering products. When the pin aligner is used, it eliminates the phenomenon of wire breakage caused by pulling the wire end, reducing the pin damage rate and the soldering defect rate. It also avoids damage to the outer pins during wire cutting, structurally reducing the phenomenon of pin corner oxidation and blackening caused by pin damage. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of a preferred embodiment of the SMD spot-welded patch sensor with separate inner and outer pins provided by this utility model.

[0012] Figure 2 for Figure 1 The diagram shows the structure of the plastic shell.

[0013] Figure 3 for Figure 2 The diagram shows the structure of the first and second connecting pins.

[0014] Figure 4 for Figure 1 The diagram shows the structure of the rubber shell and the through hole.

[0015] The following are the labels in the diagram: 1. Housing; 2. First connecting pin; 3. Through hole; 4. Protrusion; 5. First connecting piece; 6. First limiting piece; 7. Second connecting pin; 8. Second connecting piece; 9. Second limiting piece; 10. Groove; 11. Solder pad. Detailed Implementation

[0016] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0017] Please refer to the following: Figure 1 , Figure 2 , Figure 3 and Figure 4 ,in Figure 1 This is a schematic diagram of a preferred embodiment of the SMD spot-welded patch sensor with separate inner and outer pins provided by this utility model. Figure 2 for Figure 1 The diagram shows the structure of the plastic shell. Figure 3 for Figure 2 The diagram shows the structure of the first and second connecting pins. Figure 4 for Figure 1The diagram shows the structure of the housing and through holes. The SMD spot-welded patch sensor has a separate inner and outer pin structure, including a housing 1. Through holes 3 are opened on both sides of the housing 1. A first connecting pin 2 and a second connecting pin 7 are inserted into the through holes 3 on both sides respectively. A bump 4 is connected to one side of the housing 1. A groove 10 is provided between the multiple bumps 4. The bottom of the first connecting pin 2 and the second connecting pin 7 are both connected to a solder pad 11.

[0018] In the specific implementation process, such as Figure 3 and Figure 4 As shown, a first connecting piece 5 is connected to the top of one end of the first connecting pin 2. The first connecting piece 5 is inserted into the through hole 3. One end of the first connecting piece 5 extends through the through hole 3 to the bottom of the housing 1 and is connected to a first limiting piece 6. The outer side of the first limiting piece 6 is in contact with the outer side of the housing 1.

[0019] refer to Figure 3 and Figure 4 As shown, a second connecting piece 8 is connected to the top of one end of the second connecting pin 7. The second connecting piece 8 is locked in the through hole 3 on the side of the housing 1 away from the first connecting pin 2. One end of the second connecting piece 8 extends through the through hole 3 to the outside and is connected to a second limiting piece 9. The second limiting piece 9 is attached to the outside of the housing 1.

[0020] It should be noted that: the first connecting pin 2, the first connecting piece 5, and the first limiting piece 6 are integrally cast. The first connecting pin 2, the first connecting piece 5, and the first limiting piece 6 are embedded inside the housing 1. The second connecting pin 7, the second connecting piece 8, and the second limiting piece 9 are integrally cast. The second connecting pin 7, the second connecting piece 8, and the second limiting piece 9 are embedded inside the through hole 3 on the other side of the housing 1. The first connecting piece 5 is square in shape, and the second connecting piece 8 is cylindrical in shape.

[0021] The working principle of the SMD spot-welded patch sensor with separate inner and outer PINs provided by this utility model is as follows:

[0022] During use, ensure that the soldering head does not contact the first connecting pin 2 and the second connecting pin 7 during spot welding to avoid damage or crushing of the first connecting pin 2 and the second connecting pin 7. By setting a protrusion 4 at the bottom of the housing 1 to increase the distance between the solder pad 11 and the adhesive, the damage to the adhesive and the presence of paint residue on the surface of the solder pad 11 can be effectively solved. When using a pin trimmer to trim the first connecting pin 2 and the second connecting pin 7 on both sides of the housing 1, be careful that the solder pad 11 and the first connecting pin 2 and the second connecting pin 7 do not vibrate synchronously, which could cause wire breakage. Increase the distance between the solder pad 11 and the first connecting pin 2 and the second connecting pin 7 to avoid damage to the outer pins when cutting the wire.

[0023] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. An SMD spot-welded patch sensor with separate inner and outer pins, characterized in that, The device includes a housing (1), with through holes (3) on both sides of the housing (1). A first connecting pin (2) and a second connecting pin (7) are inserted into the through holes (3) on both sides, respectively. A protrusion (4) is connected to one side of the housing (1), and a groove (10) is provided between the protrusions (4). A solder pad (11) is connected to the bottom of the first connecting pin (2) and the second connecting pin (7).

2. The SMD spot-welded patch sensor with separate inner and outer PINs according to claim 1, characterized in that, The top of one end of the first connecting pin (2) is connected to a first connecting piece (5). The first connecting piece (5) is inserted into the inside of the through hole (3). One end of the first connecting piece (5) extends through the through hole (3) to the bottom of the shell (1) and is connected to a first limiting piece (6). The outer side of the first limiting piece (6) is in contact with the outer side of the shell (1).

3. The SMD spot-welded patch sensor with separate inner and outer PINs according to claim 1, characterized in that, A second connecting piece (8) is connected to the top of one end of the second connecting pin (7). The second connecting piece (8) is fitted into the through hole (3) on the side of the housing (1) away from the first connecting pin (2). One end of the second connecting piece (8) extends through the through hole (3) to the outside and is connected to a second limiting piece (9). The second limiting piece (9) is attached to the outside of the housing (1).

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