Circuit board and bottom shell assembling equipment

Abstract

The utility model relates to a circuit board and bottom shell assembling device, comprising a conveying mechanism used for conveying a material tray; the transferring and assembling mechanism comprises a transferring module, a clamping module and a visual module; the pressing mechanism is used for pressing the circuit board; and the jacking mechanism is used for jacking the charging tray on the conveying mechanism along the height direction of the conveying mechanism, so that the circuit board and the pressing mechanism are contacted and extruded. The assembly positions of the circuit board and the bottom shell are identified through the visual module, the circuit board and the bottom shell can be effectively prevented from being askew attached, electronic elements on the circuit board cannot be touched, and therefore the electronic elements are prevented from being damaged, after the circuit board and the bottom shell are assembled, the jacking mechanism jacks the material disc to enable the circuit board to make contact with the pressing mechanism for extrusion, and the assembly efficiency is improved. And the hot glue between the circuit board and the bottom shell is uniformly dispersed, so that the problem of non-uniform dispersion of the hot glue is solved.

Description

Technical Field

[0001] This utility model relates to the field of electronic product assembly technology, and in particular to a circuit board and bottom shell assembly device. Background Technology

[0002] Currently, printed circuit boards (PCBAs) for electronic products typically require a casing to enclose them. Existing technology usually involves applying hot glue to the bottom casing, then manually aligning and assembling the PCBA board to the casing, and finally bonding the circuit board to the casing using hot glue. However, this existing manual assembly method for PCBAs and casings is prone to misalignment. Since the circuit board contains numerous electronic components, hands can easily come into contact with and damage these components during assembly. Furthermore, manual assembly can result in uneven distribution of the hot glue between the circuit board and the casing, leading to subsequent detachment of the circuit board from the casing. Utility Model Content

[0003] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a circuit board and bottom shell assembly device to solve the problems of the existing circuit board and bottom shell assembly method, which easily causes the circuit board and bottom shell to be misaligned, electronic components to be damaged, and hot glue to be unevenly distributed.

[0004] To achieve the above and other related objectives, this utility model provides a circuit board and base shell assembly device, comprising:

[0005] frame;

[0006] A conveying mechanism, mounted on the frame, is used to transport a tray loaded with circuit boards and a bottom shell, the bottom shell being coated with hot glue.

[0007] A transfer assembly mechanism is mounted on the frame. The transfer assembly mechanism includes a transfer module, a clamping module, and a vision module. The clamping module is used to clamp the circuit board on the tray. The vision module is used to identify the gripping position of the circuit board and the assembly position of the circuit board with the bottom shell. The transfer module is used to drive the clamping module and the vision module to move.

[0008] A pressing mechanism is provided on the frame. The pressing mechanism can move along the length of the conveying mechanism. The pressing mechanism is located above the conveying mechanism. The pressing mechanism is used to press the circuit board.

[0009] A lifting mechanism is provided on the frame. The lifting mechanism is used to lift the material tray on the conveying mechanism along the height direction of the conveying mechanism, so that the circuit board comes into contact with and is squeezed by the pressing mechanism.

[0010] Optionally, the clamping module includes a pneumatic gripper and a gripping arm. The gripping arm is connected to the pneumatic gripper, and pins are provided at both ends of the gripping arm along its length. The pins are used to engage with pin holes on the circuit board.

[0011] Optionally, the pin is provided with barbs.

[0012] Optionally, the gripper arm is provided with a weight reduction groove.

[0013] Optionally, the pressing mechanism includes support plates symmetrically arranged on both sides of the conveying mechanism along the width direction, a pressing plate is connected to the support plate, the pressing plate is located above the conveying mechanism, and the support plate is slidably connected to the frame.

[0014] Optionally, the pressing plate is provided with a plurality of pressing posts, which are used to contact and press the circuit board.

[0015] Optionally, the pressing mechanism further includes a displacement driving component, which is disposed on the frame and connected to the support plate. The displacement driving component is used to drive the support plate to move along the length direction of the conveying mechanism.

[0016] Optionally, the displacement driving component is a telescopic cylinder.

[0017] Optionally, the conveying mechanism is provided with a blocking cylinder, which is used to block the material tray along the transmission direction of the conveying mechanism.

[0018] Optionally, the transfer module is a robotic arm module, and the vision module is a CCD camera.

[0019] As described above, this utility model has the following beneficial effects: The circuit board and the base shell coated with hot glue are transported to the circuit board and base shell assembly equipment by the conveying mechanism. The material tray is lifted away from the conveying mechanism by the lifting mechanism. The transfer module drives the clamping module and the vision module to move above the circuit board. After the vision module identifies the gripping position of the circuit board, the clamping module clamps and grips the circuit board. After gripping, the transfer module moves the clamping module and the vision module holding the circuit board to the base shell. After the vision module identifies the assembly position of the circuit board on the base shell, the transfer module drives the clamping module to move and assembles the circuit board and the base shell and then releases the circuit board. After the circuit board and the base shell are assembled, the pressing mechanism is moved above the circuit board and the base shell. The material tray is driven to rise along the height direction of the conveying mechanism by the lifting mechanism, and the circuit board is brought into contact with the pressing mechanism and squeezed, so that the hot glue between the circuit board and the base shell is evenly dispersed. This application uses a vision module to identify the assembly position of the circuit board and the bottom shell, which can effectively prevent the circuit board and the bottom shell from being misaligned and will not touch the electronic components on the circuit board, thereby avoiding damage to the electronic components. After the circuit board and the bottom shell are assembled, the lifting mechanism lifts the material tray so that the circuit board comes into contact with the pressing mechanism and is squeezed, so that the hot glue between the circuit board and the bottom shell is evenly dispersed, thereby solving the problem of uneven hot glue dispersion. Attached Figure Description

[0020] Figure 1 The diagram shown is a structural schematic of a circuit board and bottom shell assembly device according to an embodiment of this application.

[0021] Figure 2 The diagram shown is a structural schematic of the clamping module as illustrated in an embodiment of this application.

[0022] Figure 3 Displayed as Figure 2 Schematic diagram of the center pin;

[0023] Figure 4 The diagram shown is a structural schematic of the pressing mechanism illustrated in an embodiment of this application.

[0024] Explanation of reference numerals in the attached figures

[0025] Frame 1, Conveying mechanism 2, Transfer module 3, Clamping module 4, Pneumatic gripper 401, Grab arm 402, Weight reduction groove 402a, Pin 403, Barb 403a, Vision module 5, Pressing mechanism 6, Support plate 601, Pressing plate 602, Pressing column 602a, Displacement drive component 603, Lifting mechanism 7. Detailed Implementation

[0026] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model.

[0027] Please see Figures 1 to 4 It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this utility model. Therefore, the drawings only show components relevant to this utility model and are not drawn according to the actual number, shape, and size of the components in implementation. In actual implementation, the form, quantity, and proportion of each component can be arbitrarily changed, and the component layout may be more complex. The structures, proportions, and sizes shown in the accompanying drawings are only for illustrative purposes and to assist those skilled in the art in understanding and reading the content disclosed in the specification. They are not intended to limit the implementation conditions of this utility model and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives of this utility model, should still fall within the scope of the technical content disclosed in this utility model. Meanwhile, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in this specification are only for clarity of description and are not intended to limit the scope of implementation of this utility model. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered as within the scope of implementation of this utility model.

[0028] Before describing the embodiments of this utility model in detail, the application environment of this utility model will be described first. The technology of this utility model is mainly applied to the field of electronic product assembly technology. This utility model is used to solve the problems of existing circuit board and base shell assembly methods, which easily lead to misalignment of the circuit board and base shell, damage to electronic components, and uneven distribution of hot glue.

[0029] Please combine Figures 1 to 4 As shown, this utility model provides a circuit board and bottom shell assembly device.

[0030] In an exemplary embodiment of this application, the circuit board and base shell assembly equipment includes: a frame 1; a conveying mechanism 2, disposed on the frame 1, for transporting a tray loaded with circuit boards and a base shell, the base shell being coated with hot glue; a transfer assembly mechanism, disposed on the frame 1, the transfer assembly mechanism including a transfer module 3, a clamping module 4, and a vision module 5, the clamping module 4 for clamping the circuit board on the tray, the vision module 5 for identifying the gripping position of the circuit board and the assembly position of the circuit board and the base shell, the transfer module 3 for driving the clamping module 4 and the vision module 5 to move; a pressing mechanism 6, disposed on the frame 1, the pressing mechanism 6 being movable along the length direction of the conveying mechanism 2, the pressing mechanism 6 being located above the conveying mechanism 2, the pressing mechanism 6 being used to press the circuit board; and a lifting mechanism 7, disposed on the frame 1, the lifting mechanism 7 being used to lift the tray on the conveying mechanism 2 along the height direction of the conveying mechanism 2, so that the circuit board contacts and is pressed by the pressing mechanism 6.

[0031] In this embodiment, the circuit board and the base shell coated with hot glue are transported to the circuit board and base shell assembly equipment by the conveying mechanism 2. The material tray is lifted away from the conveying mechanism 2 by the lifting mechanism 7. The transfer module 3 drives the clamping module 4 and the vision module 5 to move above the circuit board. After the vision module 5 identifies the gripping position of the circuit board, the clamping module 4 clamps and grips the circuit board. After gripping, the transfer module 3 moves the clamping module 4 and the vision module 5 holding the circuit board to the base shell. After the vision module 5 identifies the assembly position of the circuit board on the base shell, the transfer module 3 drives the clamping module 4 to move and assemble the circuit board and the base shell, and then releases the circuit board. After the circuit board and the base shell are assembled, the pressing mechanism 6 is moved above the circuit board and the base shell. The lifting mechanism 7 drives the material tray to be lifted along the height direction of the conveying mechanism 2, and the circuit board is brought into contact with the pressing mechanism 6 and pressed, so that the hot glue between the circuit board and the base shell is evenly dispersed. This application uses a vision module 5 to identify the assembly position of the circuit board and the bottom shell, which can effectively prevent the circuit board and the bottom shell from being misaligned and will not touch the electronic components on the circuit board, thereby avoiding damage to the electronic components. After the circuit board and the bottom shell are assembled, the lifting mechanism 7 lifts the material tray to make the circuit board contact and press the pressing mechanism 6, so that the hot glue between the circuit board and the bottom shell is evenly dispersed, thereby solving the problem of uneven hot glue dispersion.

[0032] It is worth noting that the conveying mechanism 2 is a chain conveying device driven by a servo motor, and the circuit board is provided with screw locking points. The screw locking points are not equipped with electronic components. The pressing mechanism 6 contacts and presses against the screw locking points on the circuit board. The lifting mechanism 7 is a screw drive device or telescopic cylinder driven by a motor.

[0033] In an exemplary embodiment of this application, the clamping module 4 includes a pneumatic gripper 401 and a gripping arm 402. The gripping arm 402 is connected to the pneumatic gripper 401. The two ends of the gripping arm 402 along the length direction are provided with pins 403, which are used to engage with pin holes on the circuit board.

[0034] In this embodiment, the pneumatic gripper 401 is provided with two gripping arms 402. Each gripping arm 402 has pins 403 at both ends along its length. The circuit board has pin holes, which are oblong holes. The position of the pin holes on the circuit board is identified by a vision module, so that the pins 403 are aligned and inserted into the pin holes. After alignment, the pneumatic gripper 401 drives the two gripping arms 402 to open, so that the pins 403 abut against the pin holes to grip the circuit board; or the pneumatic gripper 401 drives the two gripping arms 402 to close, so that the abutment between the pins 403 and the pin holes is released to release the circuit board.

[0035] In an exemplary embodiment of this application, the pin 403 is provided with a barb 403a.

[0036] In this embodiment, by providing a barb 403a on the pin 403, the barb 403a abuts against the bottom surface of the circuit board, thereby limiting the circuit board along the thickness direction and preventing the circuit board from falling off the clamping module 4.

[0037] In an exemplary embodiment of this application, the gripper arm 402 is provided with a weight reduction groove 402a.

[0038] In this embodiment, the weight of the gripper 402 is reduced by creating a weight-reducing groove 402a on the gripper 402. The weight-reducing groove 402a is a strip-shaped groove.

[0039] In an exemplary embodiment of this application, the pressing mechanism 6 includes support plates 601 symmetrically arranged on both sides of the conveying mechanism 2 along the width direction, a pressing plate 602 connected to the support plate 601, the pressing plate 602 being located above the conveying mechanism 2, and the support plate 601 being slidably connected to the frame 1.

[0040] In this embodiment, the support plate 601 extends along the height direction of the conveying mechanism 2, and the pressing plate 602 is connected between the two support plates 601, so that the pressing plate 602 is located above the conveying mechanism 2. Furthermore, the support plate 601 is slidably connected to the frame 1, and the sliding direction is the length direction of the conveying mechanism 2, so that the pressing mechanism 6 can move along the length direction of the conveying mechanism 2 to the top of the circuit board and the bottom shell.

[0041] In an exemplary embodiment of this application, the pressing plate 602 is provided with a plurality of pressing posts 602a, which are used to contact and press against the circuit board.

[0042] In this embodiment, multiple pressing posts 602a are provided on the pressing plate 602 corresponding to the screw fastening points on the circuit board. By pressing the pressing posts 602a against the circuit board, the pressing plate 602 can avoid contact between itself and the electronic components on the circuit board. This achieves uniform hot glue application between the circuit board and the bottom shell while preventing damage to the circuit board.

[0043] In an exemplary embodiment of this application, the pressing mechanism 6 further includes a displacement driving component 603, which is disposed on the frame 1 and connected to the support plate 601. The displacement driving component 603 is used to drive the support plate 601 to move along the length direction of the conveying mechanism 2.

[0044] In this embodiment, the pressing mechanism 6 is moved by setting a displacement driving component 603. The displacement driving component 603 can be a screw transmission device driven by a motor, a gear and rack device driven by a walking motor, or a telescopic cylinder to realize the displacement of the pressing mechanism 6 on the frame 1.

[0045] In one exemplary embodiment of this application, the displacement driving component 603 is a telescopic cylinder.

[0046] In an exemplary embodiment of this application, the conveying mechanism 2 is provided with a blocking cylinder, which is used to block the material tray along the transmission direction of the conveying mechanism 2.

[0047] In this embodiment, a blocking cylinder is used to block the tray at the circuit board and bottom shell assembly equipment, and then the lifting mechanism 7 lifts the tray away from the conveying mechanism 2.

[0048] In an exemplary embodiment of this application, the transfer module 3 is a robotic arm module and the vision module 5 is a CCD camera.

[0049] Working principle: The conveying mechanism 2 transports the circuit board and the base shell coated with hot glue to the circuit board and base shell assembly equipment. The lifting mechanism 7 lifts the tray away from the conveying mechanism 2. The transfer module 3 drives the clamping module 4 and the vision module 5 to move above the circuit board. After the vision module 5 identifies the gripping position of the circuit board, the clamping module 4 clamps and grips the circuit board. After gripping, the transfer module 3 moves the clamping module 4 and the vision module 5 holding the circuit board to the base shell. After the vision module 5 identifies the assembly position of the circuit board on the base shell, the transfer module 3 drives the clamping module 4 to move and assemble the circuit board with the base shell before releasing the circuit board. After the circuit board and base shell are assembled, the pressing mechanism 6 moves above the circuit board and base shell. The lifting mechanism 7 drives the tray to be lifted along the height direction of the conveying mechanism 2, and the circuit board contacts and is pressed by the pressing mechanism 6, thereby dispersing the hot glue between the circuit board and the base shell evenly. This application uses a vision module 5 to identify the assembly position of the circuit board and the bottom shell, which can effectively prevent the circuit board and the bottom shell from being misaligned and will not touch the electronic components on the circuit board, thereby avoiding damage to the electronic components. After the circuit board and the bottom shell are assembled, the lifting mechanism 7 lifts the material tray to make the circuit board contact and press the pressing mechanism 6, so that the hot glue between the circuit board and the bottom shell is evenly dispersed, thereby solving the problem of uneven hot glue dispersion.

[0050] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A circuit board and base assembly device, characterized in that, include: frame; A conveying mechanism, mounted on the frame, is used to transport a tray loaded with circuit boards and a bottom shell, the bottom shell being coated with hot glue. A transfer assembly mechanism is mounted on the frame. The transfer assembly mechanism includes a transfer module, a clamping module, and a vision module. The clamping module is used to clamp the circuit board on the tray. The vision module is used to identify the gripping position of the circuit board and the assembly position of the circuit board with the bottom shell. The transfer module is used to drive the clamping module and the vision module to move. A pressing mechanism is provided on the frame. The pressing mechanism can move along the length of the conveying mechanism. The pressing mechanism is located above the conveying mechanism. The pressing mechanism is used to press the circuit board. A lifting mechanism is provided on the frame. The lifting mechanism is used to lift the material tray on the conveying mechanism along the height direction of the conveying mechanism, so that the circuit board comes into contact with and is squeezed by the pressing mechanism.

2. The circuit board and base assembly equipment according to claim 1, characterized in that: The clamping module includes a pneumatic gripper and a gripping arm. The gripping arm is connected to the pneumatic gripper. The gripping arm has pins at both ends along its length, and the pins are used to engage with pin holes on the circuit board.

3. The circuit board and base assembly equipment according to claim 2, characterized in that: The pin is provided with barbs.

4. The circuit board and base assembly equipment according to claim 3, characterized in that: The gripper arm is equipped with a weight reduction groove.

5. The circuit board and base assembly equipment according to claim 1, characterized in that: The pressing mechanism includes support plates symmetrically arranged on both sides of the conveying mechanism along the width direction. A pressing plate is connected to the support plate, the pressing plate is located above the conveying mechanism, and the support plate is slidably connected to the frame.

6. The circuit board and base assembly equipment according to claim 5, characterized in that: The pressing plate is provided with multiple pressing posts, which are used to contact and press the circuit board.

7. The circuit board and base assembly equipment according to claim 6, characterized in that: The pressing mechanism further includes a displacement driving component, which is disposed on the frame and connected to the support plate. The displacement driving component is used to drive the support plate to move along the length direction of the conveying mechanism.

8. The circuit board and base assembly equipment according to claim 7, characterized in that: The displacement driving component is a telescopic cylinder.

9. The circuit board and base assembly equipment according to claim 1, characterized in that: The conveying mechanism is equipped with a blocking cylinder, which is used to block the material tray along the transmission direction of the conveying mechanism.

10. The circuit board and base assembly equipment according to claim 1, characterized in that: The transfer module is a robotic arm module, and the vision module is a CCD camera.

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