Printed board structural member mutual positioning device

Abstract

The utility model relates to a mutual positioning device for structural members of a printed board in the field of phased array communication. The mutual positioning device comprises a tool, the structural members, positioning pins, the printed board, positioning holes, pin hole sites and a solder paste tin flowing groove, the tool penetrates through the positioning holes of the printed board and the pin holes of the structural member through the positioning pins to be fixed. According to the printed board structural member mutual positioning device of the utility model, errors of high-frequency parameters of a circuit caused by inconsistency due to assembly errors can be reduced; the same printed boards and structural members of different modules can be ensured to be consistent in position, and the position of the microstrip board before sintering and the position of the microstrip board after sintering are highly consistent.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of phased array communication, especially to a printed board structure mutual positioning device. BACKGROUND

[0002] In the existing phased array system, for the application with larger scale and higher phase requirement between channels, the phase consistency between channels directly affects the detection accuracy of the phased array system.

[0003] For most circuit installation to the production assembly process of the structure, the position deviation can only be finally corrected by the device or circuit.

[0004] The existing method for controlling the position accuracy of the printed board and the structure mainly includes the positioning hole positioning method. In actual application, since the material of the printed board is generally a soft substrate, the assembly process is a sintering process, and when the sintering clamp presses the soft substrate for sintering, the deformation causes the problem of increased position error.

[0005] Since the circuit board size is generally small by adopting the micro-encapsulation scheme, the material of the printed board is a 5880 soft substrate, the position of the positioning hole on the soft substrate is less, and it is difficult to punch a small positioning hole, and the soft substrate may also cause displacement of the printed board and the structure after sintering due to the release of tin paste deformation pressure during the sintering process.

[0006] As shown in the accompanying Figure 1 To ensure the consistency of the TR component production index, it is necessary to improve the positioning accuracy of the printed board and the structure, reduce the position error caused by the assembly of the microstrip board, and increase the positioning holes for positioning processing of the microstrip board during the sintering process.

[0007] In actual application, the contact surface of the microstrip board and the metal cavity needs to be coated with tin paste for sintering, and the pressing block is used to apply downward pressure to the microstrip board to fix the printed board and the structure as a whole. Figure 1 As shown in the accompanying According to actual engineering experience, since the microstrip board is a soft substrate, the diameter of the positioning hole is difficult to improve, and the positioning hole diameter processing accuracy is generally +0.13mm / -0.08mm, the position processing accuracy is generally ±0.1mm, and the maximum assembly tolerance of the microstrip board and the structure can reach 0.165mm. When the working frequency of the circuit reaches 18GHz or more, the phase error caused by the assembly position can reach 5.28°, and if there are multiple independent connection positions in the actual circuit, the phase difference value caused by the multiple independent connection positions can reach 5.28°×N.

[0008] The utility model discloses a purpose at, aiming at the problem in prior art, propose a kind of printed board structural component mutual positioning device, through the mutual positioning between circuit and structure, improve the precision of circuit installation, reduce the debugging of circuit.

[0009] A kind of printed board structural component mutual positioning device, including tooling, structural component, positioning pin, printed board, positioning hole, pin hole, tin paste tin flow tank;

[0010] The tooling is fixed by positioning pin through the positioning hole of printed board and the pin hole of structural component.

[0011] Further, a kind of printed board structural component mutual positioning device, the tooling is set above structural component, and printed board is set above tooling.

[0012] Further, a kind of printed board structural component mutual positioning device, the structural component and printed board sinter.

[0013] Further, a kind of printed board structural component mutual positioning device, the tooling includes unsintered tooling, sintered tooling;

[0014] Printed board includes unsintered printed board, sintered printed board;

[0015] The sintered tooling is fixed sintered printed board by the structural component below.

[0016] Further, a kind of printed board structural component mutual positioning device, the structural component and printed board are sintered by tin paste, and the tin paste is arranged on tin paste tin flow tank.

[0017] Further, a kind of printed board structural component mutual positioning device, the number of pin hole is ≤3.

[0018] Further, a kind of printed board structural component mutual positioning device, the appearance frame and positioning hole of printed board structural component mutual positioning device limit the position of microstrip board.

[0019] The utility model discloses a kind of printed board structural component mutual positioning device, tooling is fixed by positioning pin through the positioning hole of printed board and the pin hole of structural component, reduce the error of high-frequency parameter of circuit caused by inconsistency due to assembly error;Ensure that different modules each identical printed board and structural component can be position consistent, realize the position before microstrip board sintering and the position after sintering have high consistency. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is the structural schematic view of existing microstrip board and structural component positioning mode.

[0021] Figure 2 It is the structural schematic view of a kind of printed board structural component mutual positioning device.

[0022] Figure 3 This is a schematic diagram of the structure consisting of tooling and sintered microstrip plates.

[0023] Figure 4 This is a structural schematic diagram of the shape of a mutual positioning device for printed circuit board structural components.

[0024] In the diagram: 1-tooling, 2-structural component, 3-locating pin, 4-printed board, 5-locating hole, 6-pin hole position, 7-solder paste flow tray, 8-unsintered tooling, 9-sintered tooling, 10-unsintered printed board, 11-sintered printed board, 12-microstrip board, 13-gap tolerance. Detailed Implementation

[0025] To provide a clearer understanding of the technical features, objectives, and effects of this utility model, the specific embodiments of this utility model are now described with reference to the accompanying drawings.

[0026] As attached Figure 2 The printed circuit board structural component mutual positioning device shown includes a tooling 1, a structural component 2, a positioning pin 3, a printed circuit board 4, a positioning hole 5, a pin hole 6, and a solder paste flow tray 7.

[0027] The tooling 1 is fixed by the positioning pin 3 passing through the positioning hole 5 of the printed circuit board 4 and the pin hole 8 of the structural component 2.

[0028] Furthermore, a mutual positioning device for printed circuit board structural components is provided, wherein the tooling 1 is disposed above the structural component 2, and the printed circuit board 4 is disposed above the tooling 1.

[0029] Furthermore, a mutual positioning device for printed circuit board structural components, wherein the structural component 2 and the printed circuit board 4 are sintered.

[0030] Furthermore, a mutual positioning device for printed circuit board structural components, wherein the tooling 1 includes an unsintered tooling 8 and a sintered tooling 9;

[0031] The printed circuit board 4 includes an unsintered printed circuit board 10 and a sintered printed circuit board 11;

[0032] The sintering fixture 11 fixes the sintered printed circuit board 11 through the lower structural component 2.

[0033] Furthermore, a printed circuit board structural component mutual positioning device is provided, wherein the structural component 2 and the printed circuit board 4 are sintered by solder paste, and the solder paste is disposed on the solder paste flow bath 7.

[0034] Furthermore, in a printed circuit board structural component mutual positioning device, the number of pin holes 6 is ≤3.

[0035] Furthermore, a printed circuit board structural component mutual positioning device is provided, wherein the outer frame and positioning hole 5 of the printed circuit board structural component mutual positioning device limit the position of the microstrip board 12.

[0036] The specific device principle is as follows: the lower structural component 2 is sintered with the printed circuit board 4, and the upper tooling 1 fixes the position of the printed circuit board 4 by the lower structural component 2 during the sintering process, so as to ensure that the position of each identical printed circuit board 4 and structural component 2 of different modules is consistent, and achieve a high degree of consistency between the position of the microstrip 12 before sintering and the position after sintering.

[0037] As attached Figure 4 As shown, the entire printed circuit board structure mutual positioning device is designed according to the shape of the printed circuit board 4 to ensure good positioning characteristics. It can be used for printed circuit board 4 graphics of different shapes. Only the shape of the tooling 1 needs to be modified and processed.

[0038] As attached Figure 3 As shown, positioning is achieved by using the positioning pins 3 designed in the structural component 2 and the tooling 1. The gap tolerance 13 can reach ±0.02mm. However, the machining accuracy of the positioning hole diameter of the ordinary microstrip 12 is at the level of +0.13mm / -0.08mm. Therefore, the consistency of positioning by the microstrip board 12 and the structural component 2 is difficult to control, and it is basically at the level of ±0.1mm. However, after adding the designed tooling 1, when the microstrip board 12 is limited by the outer frame of the tooling 1 and the positioning hole 5 to jointly determine the position of the printed circuit board 4 and the structural component 2, the positioning accuracy of the microstrip board 12 is determined by the position accuracy of the tooling 1. At the same time, the range of position error will be close to the position accuracy of the tooling 1 and the structural component 2 of ±0.05mm.

[0039] After controlling the assembly and sintering process of the microstrip plate 12 and structural component 2 in mass production, even if the external shape error of the microstrip plate 12 is greater than the internal cavity error of the tooling 1 by ±0.05mm, all errors will be biased in one direction, thus ensuring that the mass production state remains consistent.

[0040] This solution utilizes a printed circuit board (PCB) structural component mutual positioning device. The positional error in the X and Y directions on the entire assembly plane is mainly determined by the error between the assembled structural components and the tooling. The positional error without tooling is improved from approximately 0.1 mm to ≤0.05 mm. Depending on the microstrip board's processing capabilities, if the external tolerance level is improved, the processing tolerance level of the tooling can be further improved to achieve higher precision. This enhances the positional accuracy of the microstrip board after sintering, making it suitable for mass production of circuits with consistency requirements. It also addresses the shortcomings of the original conventional design, which lacks positioning or uses individual positioning pins, resulting in a phase error reduction to ±1.6°.

[0041] The basic principle and main features of the present application and the advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited by the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A printed board structure interpositioning device, characterized by, The device includes a jig (1), a structural member (2), a positioning pin (3), a printed board (4), a positioning hole (5), a pin hole (6), and a tin paste flow channel (7). The jig (1) is fixed by the positioning pin (3) through the positioning hole (5) of the printed board (4) and the pin hole (6) of the structural member (2).

2. A printed board structure interpositioning device as claimed in claim 1, characterized in that The jig (1) is arranged above the structural member (2), and the printed board (4) is arranged above the jig (1).

3. A printed board structure interpositioning device as claimed in claim 1, characterized in that The structural member (2) and the printed board (4) are sintered.

4. A printed board structure interpositioning device as claimed in claim 1, characterized in that The jig (1) includes an unsintered jig (8) and a sintered jig (9). The printed board (4) includes an unsintered printed board (10) and a sintered printed board (11). The sintered jig (9) fixes the sintered printed board (11) through the structural member (2) below.

5. A printed board structure interpositioning device as claimed in claim 3, characterized in that The structural member (2) and the printed board (4) are sintered by tin paste arranged on the tin paste flow channel (7).

6. A printed board structure interpositioning device as claimed in claim 1, characterized in that The number of the pin holes (6) is less than or equal to 3.

7. A printed board structure interpositioning device as claimed in claim 1, characterized in that The outer frame of the printed board structural member mutual positioning device and the positioning hole (5) limit the position of the microstrip board (12).

Images