Chip embedded circuit board

By embedding chip packaging units in a prefabricated circuit board and setting heat dissipation fins and electrode patterns, the structural and heat dissipation problems of chip embedded circuit boards in intermediate and finished forms are solved, achieving a robust circuit board structure and good heat dissipation performance to meet different supply requirements.

CN223515115UActive Publication Date: 2025-11-04CHAFA FRIEDRICH SCHAFFEN CO LTD
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Patent Information

Application Number
CN202423005062.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-05
Publication Date
2025-11-04
Estimated Expiration
2034-12-05

AI Technical Summary

Technical Problem

How to design embedded circuit boards for chips so that they have a stable structure in both intermediate and final forms, and possess corresponding working and heat dissipation performance to meet different supply requirements.

Method used

Chip packaging units are embedded in the prefabricated circuit board, with their upper and lower surfaces flush with the circuit board. Heat dissipation fins are set flush with the lower surface of the circuit board, and dielectric and conductive layers are stacked on the circuit board to form an electrode pattern to achieve electrode lead-out, increase the heat dissipation area, and ensure that the circuit board maintains a stable structure at each critical node.

Benefits of technology

It achieves a stable structure and good heat dissipation performance for chip-embedded circuit boards in various intermediate and final forms, which can meet specific supply requirements and adapt to the design needs of different users.

✦ Generated by Eureka AI based on patent content.

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    Figure CN223515115U_ABST
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Abstract

The utility model relates to the technical field of circuit boards, and provides a chip-embedded circuit board comprising a prefabricated circuit board; the chip packaging unit is embedded in the prefabricated circuit board, and the upper surface and the lower surface of the chip packaging unit are flush with the upper surface and the lower surface of the prefabricated circuit board respectively; wherein the back surface of the chip packaging unit is provided with heat dissipation fin needles, and the heat dissipation fin needles are flush with the lower surface of the prefabricated circuit board; the first dielectric layer is stacked on the upper surface of the prefabricated circuit board; and the first conductive layer is stacked on the upper surface of the first dielectric layer, and a first electrode pattern corresponding to the electrode of the chip packaging unit is formed in the first conductive layer. According to the chip embedded circuit board provided by the utility model, a stable structure can be kept at key nodes in the manufacturing process, and the chip embedded circuit board has corresponding working performance and heat dissipation performance, so that the chip embedded circuit board can be supplied in a specific intermediate form, and different supply requirements of the chip embedded circuit board are met.
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