W-band power amplifier with heat dissipation function

Abstract

The utility model relates to the technical field of electronic equipment manufacturing, and discloses a W wave band power amplifier with a heat dissipation function, which comprises a main body assembly, a heat dissipation assembly and a power supply assembly, the main body assembly comprises a sealing shell, a circuit board and a heating element, the heating element is welded on the surface of the circuit board, the circuit board is fixed in the sealing shell, and the heat dissipation assembly is arranged on one side of the heating element. Comprising a heat dissipation piece, the heat dissipation piece comprises a heat conduction sheet, the heat conduction sheet is pasted on one side of the heating element, and a heat dissipation sheet is pasted on the other side of the heat conduction sheet. The wave band power amplifier has the beneficial effects that dust, dirt or other impurities can be quickly and simply cleaned after the heat dissipation plate is used for a long time by arranging the heat dissipation assembly, the wave band power amplifier does not need to be disassembled and cleaned, and the circuit board is prevented from being aged and damaged too quickly.

Description

Technical Field

[0001] This utility model relates to the field of electronic equipment manufacturing technology, and in particular to a W-band power amplifier with heat dissipation function. Background Technology

[0002] W-band power amplifiers are an important component of wireless communication systems and are widely used in fields such as electronic communication, radar, and drones. The main function of a W-band power amplifier is to amplify the power of the input signal in order to drive the load to work normally. In this process, the amplifier needs to convert the DC energy of the power supply into AC energy output. However, since the energy conversion efficiency cannot reach 100%, some energy will be lost in the form of heat, which leads to the heating phenomenon of the power amplifier.

[0003] However, after prolonged use, the heat sink of a traditional W-band power amplifier may accumulate dust, dirt, or other impurities, forming a thermal resistance layer on its surface. This leads to poor heat transfer and reduced heat dissipation efficiency. If a heat sink with accumulated dust, dirt, or other impurities is used in the electronic equipment of a power amplifier for a long time, the circuit board may age and be damaged due to high temperature. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] In view of the problems existing in the above and / or existing W-band power amplifiers with heat dissipation functions, this utility model is proposed.

[0006] Therefore, the problem that this invention aims to solve is that after long-term use, the heat sink of a traditional W-band power amplifier may be covered by dust, dirt or other impurities, leading to a decrease in heat dissipation efficiency and consequently causing aging and damage to the circuit board.

[0007] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a W-band power amplifier with heat dissipation function, which includes a main body component, including a sealed shell, a circuit board and a heating element, wherein the heating element is welded to the surface of the circuit board and the circuit board is fixed inside the sealed shell.

[0008] A heat dissipation assembly is disposed on one side of the heat-generating element and includes a heat dissipation component. The heat dissipation component includes a heat-conducting sheet. The heat-conducting sheet is attached to one side of the heat-generating element, and a heat dissipation sheet is attached to the other side of the heat-conducting sheet.

[0009] As a preferred embodiment of the band power amplifier with heat dissipation function described in this utility model, the heat dissipation component further includes a first limiting strip, which is fixed to the end of the heat sink. Annular seats are fixed at both ends of the first limiting strip, and a second limiting strip is fixed on one side of the annular seat. A circular groove is provided in the annular seat.

[0010] As a preferred embodiment of the band power amplifier with heat dissipation function described in this utility model, the number of the annular seats is four, and the number of the first limiting strips and the number of the second limiting strips are two each.

[0011] As a preferred embodiment of the band power amplifier with heat dissipation function described in this utility model, the heat dissipation component further includes a cleaning component, which includes a sliding tube with square sections fixed at both ends, and the square sections slide between the first limiting strip and the second limiting strip.

[0012] As a preferred embodiment of the band power amplifier with heat dissipation function described in this utility model, the cleaning component further includes a cleaning column, which is rotatable inside the sliding tube. A cleaning strip is fixed on the surface of the cleaning column. A rotation slot is opened on the surface of the sliding tube, and the cleaning strip can rotate within the rotation slot. A torsion spring is provided inside the square section at the bottom of the sliding tube. One end of the torsion spring is fixedly connected to the inner wall of the square section, and the other end is fixed to the surface of the cleaning column.

[0013] As a preferred embodiment of the band power amplifier with heat dissipation function described in this utility model, wherein: a fixed circular plate is provided at the end of the cleaning column, the fixed circular plate is fixedly connected to the end of the cleaning column, and a protrusion is fixed on the surface of the fixed circular plate.

[0014] As a preferred embodiment of the band power amplifier with heat dissipation function described in this utility model, the heat dissipation component further includes a processing component disposed on one side of the second limiting strip. The processing component includes a cleaning rod, which is fixed to one side of the second limiting strip. A small spring is fixed to the surface of the cleaning rod, and a fixing buckle is also fixed to the surface of the cleaning rod. A rotating groove is provided on the surface of the fixing buckle, and a stop bar is rotatably connected to the surface of the fixing buckle through the rotating groove. The stop bar is fixedly connected to one end of the small spring.

[0015] As a preferred embodiment of the band power amplifier with heat dissipation function described in this utility model, the sealing shell surface is provided with ventilation mesh holes, the upper surface of the sealing shell is provided with a stretching groove, and the sliding tube slides in the stretching groove.

[0016] As a preferred embodiment of the band power amplifier with heat dissipation function described in this utility model, a storage slot is further provided below the ventilation mesh, and a storage box is slidably connected in the storage slot.

[0017] As a preferred embodiment of the band power amplifier with heat dissipation function described in this utility model, the surface of the sealed shell is provided with an input port and an output port.

[0018] The beneficial effects of this utility model are: by setting up a heat dissipation component, the heat dissipation plate can quickly and easily clean dust, dirt or other impurities after long-term use, without the need to disassemble and clean the W-band power amplifier, thus preventing the circuit board from aging and being damaged too quickly. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0020] Figure 1 The main view of the W-band power amplifier for heat dissipation.

[0021] Figure 2 A partial cross-sectional view of the main components of a W-band power amplifier for heat dissipation.

[0022] Figure 3 A structural diagram of the heat dissipation component of a W-band power amplifier for heat dissipation function.

[0023] Figure 4 A structural diagram of the cleaning component of a W-band power amplifier for heat dissipation.

[0024] Figure 5 A partial cross-sectional view of the cleaning component of a W-band power amplifier for heat dissipation.

[0025] Figure 6 A partial structural diagram of the processing unit of the W-band power amplifier for heat dissipation. Detailed Implementation

[0026] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0029] Example 1

[0030] Reference Figures 1-5 This is the first embodiment of the present invention. This embodiment provides a W-band power amplifier with heat dissipation function. The W-band power amplifier with heat dissipation function includes a main component 100, including a sealing shell 101, a circuit board 102 and a heating element 103. The heating element 103 is soldered to the surface of the circuit board 102, and the circuit board 102 is fixed inside the sealing shell 101.

[0031] By setting the sealing shell 101, the circuit board 102 and the heating element 103 can be protected, preventing external environmental interference from affecting the circuit board 102 and the heating element 103.

[0032] The heat dissipation assembly 200 is disposed on one side of the heat-generating element 103 and includes a heat dissipation component 201. The heat dissipation component 201 includes a heat-conducting sheet 201a. The heat-conducting sheet 201a is attached to one side of the heat-generating element 103, and a heat dissipation sheet 201b is attached to the other side of the heat-conducting sheet 201a.

[0033] By using a heat-conducting sheet 201a to conduct the heat generated by the heating element 103 to the heat sink 201b, the heat sink 201b can quickly dissipate heat, thus ensuring the normal operation of the heating element 103 on the circuit board 102.

[0034] Specifically, the heat sink 201 also includes a first limiting strip 201c, which is fixed to the end of the heat sink 201b. Both ends of the first limiting strip 201c are fixed with annular seats 201d, and a second limiting strip 201e is fixed to one side of the annular seat 201d. A circular groove 201d-1 is opened in the annular seat 201d.

[0035] The first limiting strip 201c and the second limiting strip 201e are fixed by the annular seats 201d at both ends, so that a groove is formed between the first limiting strip 201c and the second limiting strip 201e, allowing other components to slide. At the same time, the first limiting strip 201c is fixed to the heat sink 201b, so that the annular seats 201d and the second limiting strip 201e are fixed in position. The circular slot 201d-1 is used to provide rotation space for the components therein.

[0036] Specifically, there are four annular seats 201d, and two first limit bars 201c and two second limit bars 201e.

[0037] The first limiting bar 201c and the second limiting bar 201e are used in two groups, upper and lower, with each group including one first limiting bar 201c, one second limiting bar 201e, and two annular seats 201d.

[0038] Specifically, the heat dissipation assembly 200 also includes a cleaning component 202, which includes a sliding tube 202a. Square sections 202b are fixed at both ends of the sliding tube 202a, and the square sections 202b slide between the first limiting strip 201c and the second limiting strip 201e.

[0039] The distance between the first limiting bar 201c and the second limiting bar 201e is fixed, which allows the square section 202b to slide parallel between the two without causing the square section 202b to rotate. This ensures that the sliding tube 202a will not rotate when it is between the first limiting bar 201c and the second limiting bar 201e.

[0040] Specifically, the cleaning component 202 also includes a cleaning column 202d, which is rotatable inside the sliding tube 202a. A cleaning strip 202e is fixed on the surface of the cleaning column 202d. A rotation slot 202a-1 is opened on the surface of the sliding tube 202a, and the cleaning strip 202e can rotate inside the rotation slot 202a-1. A torsion spring 202f is provided inside the square section 202b at the bottom of the sliding tube 202a. One end of the torsion spring 202f is fixedly connected to the inner wall of the square section 202b, and the other end is fixed to the surface of the cleaning column 202d.

[0041] A cleaning strip 202e is fixed to the surface of the cleaning column 202d. The cleaning strip 202e moves horizontally between the gaps of the heat sink 201b to scrape away dust accumulated over long-term use. The rotating slot 202a-1 on the surface of the sliding tube 202a allows the cleaning strip 202e to rotate, facilitating dust removal from its surface during pull-back. The torsion spring 202f connects the square joint 202b and the cleaning column 202d, allowing the cleaning strip 202e to return to its original position after being twisted during use.

[0042] Specifically, a fixed circular plate 202g is provided at the end of the cleaning column 202d. The fixed circular plate 202g is fixedly connected to the end of the cleaning column 202d, and a protrusion 202h is fixed on the surface of the fixed circular plate 202g.

[0043] The function of the fixed circular plate 202g is to prevent the sliding tube 202a from tilting during the sliding process, which would affect the cleaning effect. The protrusion 202h is used for manual pulling of the cleaning column 202d.

[0044] Example 2

[0045] Reference Figure 3 and Figure 6 This is the second embodiment of the present invention, which is based on the previous embodiment.

[0046] Specifically, the heat dissipation assembly 200 also includes a processing component 203, which is disposed on one side of the second limiting strip 201e. The processing component 203 includes a cleaning rod 203a, which is fixed to one side of the second limiting strip 201e. A small spring 203d is fixed on the surface of the cleaning rod. A fixing buckle 203b is also fixed on the surface of the cleaning rod 203a. A rotating groove 203b-1 is opened on the surface of the fixing buckle 203b. A stop bar 203c is rotatably connected to the surface of the fixing buckle 203b through the rotating groove 203b-1. The stop bar 203c is fixedly connected to one end of the small spring 203d.

[0047] The small spring 203d is in its normal state. The cleaning rod 203a is used to install the baffle 203c. Through the rotation of the fixing buckle 203b and the reset action of the small spring 203d, the cleaning rod 203a can pass smoothly during the back and forth pulling process, but the baffle 203c on the cleaning rod 203a will scrape out the dust remaining on the cleaning strip 202e.

[0048] Example 3

[0049] Reference Figure 2 This is the third embodiment of the present invention, which is based on the first two embodiments.

[0050] Specifically, the sealing shell 101 has ventilation mesh holes 101-1 on its surface and a stretching groove 101-2 on its upper surface. The sliding tube 202a slides in the stretching groove 101-2.

[0051] The ventilation mesh 101-1 allows the hot air inside the sealing shell 101 to exchange with the outside air, and the stretch groove 101-2 limits the movement of the cleaning column 202d.

[0052] Specifically, a storage slot 101-3 is provided below the ventilation mesh 101-1, and a storage box 104 is slidably connected inside the storage slot 101-3.

[0053] Storage slot 101-3 is used to place storage box 104, which is used to collect and store fallen dust for easy cleaning.

[0054] Specifically, the surface of the sealing housing 101 is provided with an input port 105 and an output port 106.

[0055] The input signal is connected to the W-band power amplifier through input port 105 and then output through output port 106.

[0056] During use, when dust, dirt, or other impurities accumulate on the heat sink, the hand-held protrusion 202h is pushed along the stretching groove 101-2. At this time, under the action of the torsion spring 202f, the cleaning strip 202e is pushed towards the rotating slot 202a-1 side, preventing the cleaning strip 202e from deflecting and failing to clean the deep gaps of the heat sink 201b. Pulling the protrusion 202h back and forth pushes out the dust, dirt, or other impurities inside the heat sink 201b, causing the dust to fall into the storage box 104 below. After cleaning the heat sink 201b, the cleaning column 202d is pushed along the stretching groove 101-2 into the circular slot 201d-1 of the annular seat 201d on the other side. At this time, the circular slot 201d-1 can be a square section 20. The rotation of 2b provides space. At this time, rotating the protrusion 202h 90 degrees allows the cleaning strip 202e to contact the other side of the rotating slot 202a-1. At this time, pull back the protrusion 202h. After the sliding tube 202a passes the cleaning rod 203a, the cleaning strip 202e has rotated to the side of the baffle 203c. Continue to pull back, and the remaining dust and impurities on the cleaning strip 202e will be scraped off by the baffle 203c and fall into the storage box 104 below. When pulled back to the end, the square section 202b enters the rotating slot 202a-1 again. Rotate the protrusion 202h 90 degrees in the opposite direction to reset the cleaning strip 202e. Pull out the storage box 104, empty the dust, and put it back into the storage slot 101-3. The cleaning is complete.

[0057] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A W-band power amplifier with heat dissipation function, characterized in that: include, The main component (100) includes a sealing shell (101), a circuit board (102), and a heating element (103). The heating element (103) is soldered to the surface of the circuit board (102), and the circuit board (102) is fixed inside the sealing shell (101). A heat dissipation assembly (200) is disposed on one side of the heat-generating element (103) and includes a heat sink (201). The heat sink (201) includes a heat-conducting sheet (201a). The heat-conducting sheet (201a) is attached to one side of the heat-generating element (103), and a heat sink (201b) is attached to the other side of the heat-conducting sheet (201a).

2. The W-band power amplifier with heat dissipation function as described in claim 1, characterized in that: The heat sink (201) further includes a first limiting strip (201c), which is fixed to the end of the heat sink (201b). Annular seats (201d) are fixed at both ends of the first limiting strip (201c), and a second limiting strip (201e) is fixed on one side of the annular seat (201d). A circular groove (201d-1) is opened in the annular seat (201d).

3. The W-band power amplifier with heat dissipation function as described in claim 2, characterized in that: The number of the annular seat (201d) is four, and the number of the first limiting strip (201c) and the number of the second limiting strip (201e) are two each.

4. The W-band power amplifier with heat dissipation function as described in claim 3, characterized in that: The heat dissipation assembly (200) also includes a cleaning component (202), which includes a sliding tube (202a). The sliding tube (202a) has square sections (202b) fixed at both ends. The square sections (202b) slide between the first limiting strip (201c) and the second limiting strip (201e).

5. The W-band power amplifier with heat dissipation function as described in claim 4, characterized in that: The cleaning component (202) further includes a cleaning column (202d), which is rotatable within the sliding tube (202a). A cleaning strip (202e) is fixed to the surface of the cleaning column (202d). A rotating groove (202a-1) is provided on the surface of the sliding tube (202a), and the cleaning strip (202e) can rotate within the rotating groove (202a-1). A torsion spring (202f) is provided inside the square section (202b) at the bottom of the sliding tube (202a). One end of the torsion spring (202f) is fixedly connected to the inner wall of the square section (202b), and the other end is fixed to the surface of the cleaning column (202d).

6. The W-band power amplifier with heat dissipation function as described in claim 5, characterized in that: The cleaning column (202d) is provided with a fixing circular plate (202g) at its end. The fixing circular plate (202g) is fixedly connected to the end of the cleaning column (202d). The surface of the fixing circular plate (202g) is fixed with a protrusion (202h).

7. The W-band power amplifier with heat dissipation function as described in claim 6, characterized in that: The heat dissipation assembly (200) further includes a processing component (203) disposed on one side of the second limiting strip (201e). The processing component (203) includes a cleaning rod (203a), which is fixed to one side of the second limiting strip (201e). A small spring (203d) is fixed to the surface of the cleaning rod, and a fixing buckle (203b) is also fixed to the surface of the cleaning rod. A rotating groove (203b-1) is opened on the surface of the fixing buckle (203b). A stop bar (203c) is rotatably connected to the surface of the fixing buckle (203b) through the rotating groove (203b-1). The stop bar (203c) is fixedly connected to one end of the small spring (203d).

8. The W-band power amplifier with heat dissipation function as described in claim 7, characterized in that: The sealing shell (101) has ventilation mesh holes (101-1) on its surface and a stretching groove (101-2) on its upper surface. The sliding tube (202a) slides in the stretching groove (101-2).

9. The W-band power amplifier with heat dissipation function as described in claim 8, characterized in that: A storage slot (101-3) is also provided below the ventilation mesh (101-1), and a storage box (104) is slidably connected inside the storage slot (101-3).

10. The W-band power amplifier with heat dissipation function as described in claim 1 or 9, characterized in that: The surface of the sealing shell (101) is provided with an input port (105) and an output port (106).

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