Backboard with high heat dissipation performance

Abstract

The utility model discloses a backboard with high heat dissipation performance, which comprises a backboard body, a heat dissipation mechanism is arranged on the inner side of the backboard body, the heat dissipation mechanism comprises a heat conduction metal plate, one side of the heat conduction metal plate is fixedly connected with a first heat dissipation fin, the first heat dissipation fin is fixedly connected with a heat pipe, an evaporation section of the heat pipe is in contact with the first heat dissipation fin, and the evaporation section of the heat pipe is in contact with the first heat dissipation fin. A condensation section of the heat pipe is arranged above the first heat dissipation fin, the condensation section of the heat pipe is connected with a second heat dissipation fin, a semiconductor chilling plate is fixedly embedded in the upper end of the back plate body, a refrigeration surface of the semiconductor chilling plate is in contact with a heat conduction surface of the second heat dissipation fin, and a heating surface of the semiconductor chilling plate is arranged outside the back plate body; the heat conduction metal plate, the heat pipe and the second heat dissipation fins are matched with the semiconductor chilling plate, so that heat in the back plate body can be quickly dissipated to the outside, and the whole structure is simple and compact.

Description

Technical Field

[0001] This utility model relates to the field of backplane technology for communication equipment, and in particular to a backplane with high heat dissipation performance. Background Technology

[0002] With the rapid development of industrial automation, the application of industrial communication equipment in industrial control systems has become crucial. As a core component of communication equipment, the display not only shows device status, data information, and the user interface, but also directly affects the ease of operation and user experience. The display backplane, as an important part of the display device, has a significant impact on the device's performance, reliability, and user experience.

[0003] For example, Chinese Patent No. CN218183838U discloses a heat dissipation backplate for a display screen, which includes a backplate body and a cooling mechanism disposed on the mounting surface of the backplate body. The cooling mechanism includes a cooling component disposed in a first heat dissipation groove on the mounting surface of the backplate body, and a heat dissipation component symmetrically disposed on both sides of the backplate body and communicating with the first heat dissipation groove to accelerate the air flow rate inside the first heat dissipation groove. The cooling component includes multiple cooling plates disposed on the bottom wall of the first heat dissipation groove along the opposite direction of the two heat dissipation components in the length direction, two diverting rods respectively disposed on both sides of the multiple cooling plates and connected to the cooling plates, and an inlet pipe and an outlet pipe respectively connected at one end to a liquid delivery component disposed outside the backplate body and at the other end to different diverting rods. The diverting rods communicate with the interior of the cooling plates.

[0004] The backplate is provided with multiple cooling plates in the first heat dissipation groove, and the length direction of the multiple cooling plates is arranged along the opposite direction of the two heat dissipation components. The heat dissipation components accelerate the flow rate and cooperate with the multiple cooling plates to facilitate the discharge of heat from the first heat dissipation groove to the backplate body. The cooling plates can directly absorb the heat in the first heat dissipation groove, which can directly reduce the heat accumulated in the first heat dissipation groove, thereby facilitating the dissipation of heat.

[0005] However, in actual use, the aforementioned backplate requires a corresponding drive pump and coolant circulation tank to drive the coolant to circulate within the distribution bar, resulting in a complex structure and large size for the entire display device.

[0006] Therefore, a backplate with high heat dissipation performance is proposed. Utility Model Content

[0007] The purpose of this invention is to provide a backplate with high heat dissipation performance, thereby solving or at least alleviating one or more of the above-mentioned problems and other problems existing in the prior art.

[0008] To achieve the above objectives, the main technical solutions adopted by this utility model include:

[0009] A high heat dissipation backplate includes a backplate body, and a heat dissipation mechanism is provided on the inner side of the backplate body.

[0010] The heat dissipation mechanism includes a thermally conductive metal plate, a first heat dissipation fin fixedly connected to one side of the thermally conductive metal plate, a heat pipe fixedly connected to the first heat dissipation fin, an evaporation section of the heat pipe in contact with the first heat dissipation fin, a condensation section of the heat pipe disposed above the first heat dissipation fin, a second heat dissipation fin connected to the condensation section of the heat pipe, a thermoelectric cooler fixedly embedded at the upper end of the back plate body, a cooling surface of the thermoelectric cooler in contact with the thermally conductive surface of the second heat dissipation fin, and a heating surface of the thermoelectric cooler disposed on the outside of the back plate body.

[0011] In a high heat dissipation performance backplate according to the present invention, a cooling fan is fixedly installed at the upper end of the backplate body, and the cooling fan is located directly above the heating surface of the semiconductor cooling chip.

[0012] In a high heat dissipation performance backplate according to the present invention, a plurality of through holes are provided on the side of the backplate body, and the first heat dissipation fin is provided with heat dissipation protrusions corresponding to the through holes on the side away from the heat-conducting metal plate, and the heat dissipation protrusions extend into the through holes.

[0013] According to the present invention, a high heat dissipation performance backplate is provided, wherein a protective cover is fixedly installed on the upper end of the backplate body, the cooling fan is located inside the protective cover, an air inlet is provided on one side of the protective cover, and an air outlet is provided on the top of the protective cover.

[0014] In a high heat dissipation backplate according to the present invention, a grid is provided on both the air outlet and the air inlet.

[0015] In a high heat dissipation performance backplate according to the present invention, a temperature switch is fixedly installed at the upper end of the backplate body, the temperature switch is located inside the protective cover, and the cooling fan and the semiconductor cooling chip are both controlled by the temperature switch.

[0016] In a high heat dissipation performance backplate according to the present invention, a thermally conductive silicone grease layer is provided between the thermally conductive surface of the second heat dissipation fin and the cooling surface of the semiconductor cooling chip.

[0017] This utility model has at least the following beneficial effects:

[0018] This utility model can quickly dissipate the heat inside the backplate body to the outside by setting a heat-conducting metal plate, heat pipe, second heat dissipation fins and semiconductor cooling chip, and the overall structure is simple and compact.

[0019] The heat dissipation protrusions and through holes allow heat inside the backplate to be dissipated to the outside, while effectively preventing dust from entering the backplate.

[0020] By setting a temperature switch, when the temperature inside the backplate is below a set threshold, heat dissipation is mainly achieved by radiating heat outwards through the heat dissipation protrusions. When the temperature inside the backplate exceeds the set threshold, the temperature switch controls the operation of the semiconductor cooling chip and the cooling fan, which, together with the heat pipe, can quickly dissipate the heat inside the backplate. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0022] Figure 1 This is a schematic diagram of the structure of the high heat dissipation backplate of this utility model;

[0023] Figure 2 This is a partial structural diagram of the high heat dissipation performance backplate of this utility model;

[0024] Figure 3 This is a schematic diagram of the backplate of this utility model;

[0025] Figure 4 This is a schematic diagram of the heat dissipation component of this utility model.

[0026] Explanation of icon numbers:

[0027] 1. Backplate body; 101. Through hole; 2. Protective cover; 201. Air outlet; 202. Air inlet; 3. Thermally conductive metal plate; 301. First heat dissipation fin; 302. Heat dissipation protrusion; 4. Heat pipe; 5. Second heat dissipation fin; 6. Semiconductor cooling chip; 7. Cooling fan; 8. Temperature switch Detailed Implementation

[0028] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0029] Please refer to Figures 1 to 4As shown, an embodiment of this utility model provides a high heat dissipation performance backplate, including a backplate body 1, with a heat dissipation mechanism disposed on the inner side of the backplate body 1; the heat dissipation mechanism includes a thermally conductive metal plate 3, a first heat dissipation fin 301 fixedly connected to one side of the thermally conductive metal plate 3, a heat pipe 4 fixedly connected to the first heat dissipation fin 301, the evaporation section of the heat pipe 4 contacting the first heat dissipation fin 301, the condensation section of the heat pipe 4 disposed above the first heat dissipation fin 301, the condensation section of the heat pipe 4 connected to a second heat dissipation fin 5, a semiconductor cooling chip 6 fixedly embedded at the upper end of the backplate body 1, the cooling surface of the semiconductor cooling chip 6 contacting the thermally conductive surface of the second heat dissipation fin 5, and in order to ensure the heat conduction effect, a thermally conductive silicone grease layer is disposed between the thermally conductive surface of the second heat dissipation fin 5 and the cooling surface of the semiconductor cooling chip 6, and the heating surface of the semiconductor cooling chip 6 is disposed on the outside of the backplate body 1.

[0030] By adopting the above technical solution, when dissipating heat inside the backplate body 1, the semiconductor cooling chip 6 is activated. The heat inside the backplate body 1 is radiated to the first heat dissipation fin 301 through the heat-conducting metal plate 3. The first heat dissipation fin 301 dissipates the heat to the second heat dissipation fin 5 through the heat pipe 4 connected to the first heat dissipation fin 301. The cooling surface of the semiconductor cooling chip 6 rapidly cools and lowers the temperature of the second heat dissipation fin 5. The overall structure is simple, compact, and easy to control.

[0031] In this embodiment, a cooling fan 7 is fixedly installed on the upper end of the back plate body 1. The cooling fan 7 is located directly above the heating surface of the semiconductor cooling chip 6. The cooling fan 7 can quickly dissipate heat from the heating surface of the semiconductor cooling chip 6 to ensure the normal operation of the semiconductor cooling chip 6.

[0032] In this embodiment, a plurality of through holes 101 are provided on the side of the back plate body 1. The side of the first heat dissipation fin 301 away from the heat-conducting metal plate 3 is provided with heat dissipation protrusions 302 corresponding to the through holes 101. The heat dissipation protrusions 302 extend into the through holes 101. By using the heat dissipation protrusions 302 in conjunction with the through holes 101, the heat inside the back plate body 1 can be dissipated to the outside through the heat dissipation protrusions 302, further improving the heat dissipation effect, and effectively preventing external dust from entering the back plate body 1.

[0033] In this embodiment, a protective cover 2 is fixedly installed on the upper end of the back plate body 1, and the cooling fan 7 is located inside the protective cover 2. An air inlet 202 is opened on one side of the protective cover 2, and an air outlet 201 is opened on the top of the protective cover 2. The protective cover 2 can effectively protect the cooling fan 7.

[0034] Both the air outlet 201 and the air inlet 202 are equipped with grids.

[0035] In this embodiment, a temperature switch 8 is fixedly installed on the upper end of the backplate body 1. The temperature switch 8 is located inside the protective cover 2. The cooling fan 7 and the thermoelectric cooler 6 are both controlled by the temperature switch 8. When the temperature inside the backplate body 1 is lower than the set threshold, the heat dissipation work is mainly carried out by the heat dissipation protrusion 302 to the outside. When the temperature inside the backplate body 1 exceeds the set threshold, the temperature switch 8 controls the thermoelectric cooler 6 and the cooling fan 7 to run, and then, together with the heat pipe 4, the heat inside the backplate body 1 can be quickly dissipated.

[0036] The foregoing description illustrates and describes several preferred embodiments of the present invention. However, as previously stated, it should be understood that the present invention is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the inventive concept described herein through the foregoing teachings or techniques or knowledge in related fields. Any modifications and variations made by those skilled in the art that do not depart from the spirit and scope of the present invention should be within the protection scope of the appended claims.

Claims

1. A backplate with high heat dissipation performance, characterized in that, Includes a backplate body (1), and a heat dissipation mechanism is provided on the inner side of the backplate body (1); The heat dissipation mechanism includes a heat-conducting metal plate (3), a first heat dissipation fin (301) is fixedly connected to one side of the heat-conducting metal plate (3), a heat pipe (4) is fixedly connected to the first heat dissipation fin (301), the evaporation section of the heat pipe (4) is in contact with the first heat dissipation fin (301), the condensation section of the heat pipe (4) is located above the first heat dissipation fin (301), the condensation section of the heat pipe (4) is connected to a second heat dissipation fin (5), a semiconductor cooling chip (6) is fixedly embedded at the upper end of the back plate body (1), the cooling surface of the semiconductor cooling chip (6) is in contact with the heat-conducting surface of the second heat dissipation fin (5), and the heating surface of the semiconductor cooling chip (6) is located outside the back plate body (1).

2. The high heat dissipation performance backplate according to claim 1, characterized in that: A cooling fan (7) is fixedly installed on the upper end of the back plate body (1), and the cooling fan (7) is located directly above the heating surface of the semiconductor cooling chip (6).

3. A high heat dissipation backplate according to claim 2, characterized in that: The backplate body (1) has several through holes (101) on its side. The first heat dissipation fin (301) is provided with heat dissipation protrusions (302) corresponding to the through holes (101) on the side away from the heat-conducting metal plate (3). The heat dissipation protrusions (302) extend into the through holes (101).

4. A high heat dissipation backplate according to claim 3, characterized in that: A protective cover (2) is fixedly installed on the upper end of the back plate body (1). The cooling fan (7) is located inside the protective cover (2). An air inlet (202) is opened on one side of the protective cover (2), and an air outlet (201) is opened on the top of the protective cover (2).

5. A high heat dissipation performance backplate according to claim 4, characterized in that: Both the air outlet (201) and the air inlet (202) are provided with a grid.

6. A high heat dissipation performance backplate according to claim 5, characterized in that: A temperature switch (8) is fixedly installed on the upper end of the back plate body (1). The temperature switch (8) is located inside the protective cover (2). The cooling fan (7) and the semiconductor cooling chip (6) are both controlled by the temperature switch (8).

7. A high heat dissipation backplate according to any one of claims 1-6, characterized in that: A thermally conductive silicone grease layer is provided between the heat-conducting surface of the second heat dissipation fin (5) and the cooling surface of the semiconductor cooling chip (6).

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