Electronic device

Abstract

The utility model discloses an electronic device, and belongs to the technical field of electronic equipment. The electronic device comprises a circuit board, a first component, a first heat dissipation piece and a second heat dissipation piece, the circuit board comprises a first board and a second board which are opposite to each other, and the first component is arranged on the first board; the first heat dissipation piece is arranged on the side, away from the circuit board, of the first component. The second heat dissipation piece is arranged on the second board face of the circuit board. In the electronic device, a first heat dissipation piece is installed on a first component and used for conducting heat generated by the first component to the outside to achieve heat dissipation; the second heat dissipation piece is installed on the circuit board and used for conducting heat conducted to the circuit board by the first component to the outside to achieve heat dissipation. Through cooperation of the heat dissipation pieces on the two sides, heat in the machine shell can be reduced more efficiently, it is avoided that electronic components work in a high-temperature cavity for a long time, and the electronic device is high in heat dissipation efficiency, stable in performance and long in service life.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment technical field especially relates to an electronic device. BACKGROUND

[0002] With the rapid development of electronic technology, many electronic devices integrate more high-power electronic components inside, for example, the vehicle navigation host computer integrates more high-power high-frequency electronic components inside. These electronic components provide powerful functions while also causing significant heating problems. When the electronic device is running for a long time or operating at high intensity, the temperature inside the device housing will rise sharply, which will affect the performance and service life of the electronic components.

[0003] In related art electronic devices, heat dissipation fins are provided to dissipate heat from electronic components. However, the heat dissipation efficiency is still low, and the heat inside the device body cannot be dissipated in time. SUMMARY

[0004] The purpose of the embodiments of the utility model is to provide an electronic device with improved heat dissipation efficiency and better reliability.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme:

[0006] An electronic device includes:

[0007] A housing is a metal shell.

[0008] A circuit board has a first board surface and a second board surface facing away from each other. The first board surface is provided with a first component.

[0009] A first heat dissipation member is provided on the side of the first component away from the circuit board. The first heat dissipation member is in thermal contact with the first component, and the first heat dissipation member is in thermal contact with the housing and / or at least partially extends to the outside of the housing.

[0010] A second heat dissipation member is provided on the second board surface. The second heat dissipation member is in thermal contact with the area on the side of the circuit board away from the first component, and the second heat dissipation member is in thermal contact with the housing and / or at least partially extends to the outside of the housing.

[0011] Optionally, the housing includes a first shell plate and a second shell plate, the first component is provided on the side of the circuit board close to the first shell plate, and the second heat dissipation member is provided between the circuit board and the second shell plate.

[0012] The second heat-dissipating member comprises a first heat-conducting part, a second heat-conducting part and a third heat-conducting part, the first heat-conducting part is in heat-conducting contact with the second plate surface, the second heat-conducting part and the third heat-conducting part are connected to two ends of the first heat-conducting part, the second heat-conducting part and the third heat-conducting part are arranged in a spaced manner and are in heat-conducting contact with the second shell plate.

[0013] Optionally, the second heat-dissipating member further comprises a fourth heat-conducting part and a fifth heat-conducting part.

[0014] The fourth heat-conducting part is connected to the second heat-conducting part and is bent relative to the second heat-conducting part, one side of the fourth heat-conducting part away from the circuit board is in heat-conducting contact with the second shell plate; the fifth heat-conducting part is connected to the third heat-conducting part and is bent relative to the third heat-conducting part, one side of the fifth heat-conducting part away from the circuit board is in heat-conducting contact with the second shell plate.

[0015] The fourth heat-conducting part is connected to the second shell plate, and the fifth heat-conducting part is connected to the second shell plate.

[0016] Optionally, the second heat-dissipating member is a metal member, the second heat-dissipating member is in electrically-conducting contact with the circuit board, and the second heat-dissipating member is in electrically-conducting contact with the shell.

[0017] Optionally, one side of the second heat-dissipating member close to the circuit board has a first contact surface; a second heat-conducting layer is arranged between the second heat-dissipating member and the circuit board, one side of the second heat-conducting layer is in contact with the first contact surface, and the other side of the second heat-conducting layer is in contact with the second plate surface.

[0018] The first contact surface is provided with a protrusion, the circuit board is provided with an electrically-conductive part, the protrusion is in electrically-conducting contact with the electrically-conductive part, so that the second heat-dissipating member is in electrically-conducting contact with the circuit board.

[0019] Optionally, the electrically-conductive part is a copper-exposed area on the second plate surface, and the protrusion abuts against the copper-exposed area.

[0020] Optionally, the electrically-conductive part is located on the second plate surface, the protrusion abuts against the electrically-conductive part on the second plate surface, and the protrusion is located on the side of the circuit board away from the first component.

[0021] Optionally, one side of the second heat-dissipating member close to the circuit board is provided with a protrusion, the protrusion abuts against the second plate surface, and the protrusion is located on the side of the circuit board away from the first component.

[0022] Optionally, one side of the first heat-dissipating member away from the circuit board is provided with a heat-dissipating fin, the shell is provided with a clearance, and at least part of the heat-dissipating fin extends to the outside of the shell through the clearance.

[0023] And / or, the first heat dissipation piece and the first component are provided with a first heat conduction layer, the second heat dissipation piece and the second plate are provided with a second heat conduction layer, and the first heat conduction layer and the second heat conduction layer are heat conduction silica gel pads.

[0024] Optionally, the second plate is further provided with a plurality of electronic components;

[0025] And / or, the first component is a chip.

[0026] And / or, the electronic device further comprises a mounting screw, the circuit board is mounted on the shell through the mounting screw, and the circuit board is in conductive connection with the shell through the mounting screw.

[0027] Optionally, the electronic device is a vehicle-mounted navigator.

[0028] The electronic device has the advantages that: the first heat dissipation piece is mounted on the first component and is used for conducting heat generated by the first component to the outside to realize heat dissipation; the second heat dissipation piece is mounted on the circuit board and is used for conducting heat conducted by the first component to the outside to realize heat dissipation; through cooperation of the two heat dissipation pieces, heat in the shell can be reduced more efficiently, electronic components can be prevented from working in a high-temperature cavity for a long time, and the electronic device has high heat dissipation efficiency, stable performance and long service life. BRIEF DESCRIPTION OF DRAWINGS

[0029] The utility model will be further explained in detail below according to the drawings and embodiments.

[0030] Figure 1 It is one of the internal structure schematic diagram of the electronic device of the utility model embodiment (part of electronic components is omitted in the drawing);

[0031] Figure 2 It is the enlarged view of A part in Figure 1

[0032] Figure 3 It is the enlarged view of B part in Figure 1

[0033] Figure 4 It is the cross-sectional view of the electronic device of the utility model embodiment;

[0034] Figure 5 It is the enlarged view of C part in Figure 4

[0035] Figure 6 It is the structure schematic view of the second heat dissipation piece in the electronic device of the utility model embodiment;

[0036] Figure 7 ​​​The structure exploded view one of the electronic device is described in the embodiment of the utility model (part of electronic components is omitted in the drawing);

[0037] Figure 8 The structure exploded view two of the electronic device is described in the embodiment of the utility model (part of electronic components is omitted in the drawing);

[0038] Figure 9 The internal structure schematic view two of the electronic device is described in the embodiment of the utility model;

[0039] Figure 10 The schematic view of the second heat dissipation piece of the electronic device is described in the embodiment of the utility model (the solid arrow in the drawing shows the static electricity conduction path).

[0040] In the drawing: 10, the casing; 11, the first shell plate; 111, the position avoiding opening; 12, the second shell plate; 21, the circuit board; 211, the first plate surface; 212, the second plate surface; 22, the first component; 30, the first heat dissipation piece; 40, the second heat dissipation piece; 401, the first contact surface; 41, the first heat conduction part; 42, the second heat conduction part; 43, the third heat conduction part; 44, the fourth heat conduction part; 441, the first positioning part; 45, the fifth heat conduction part; 451, the second positioning part; 46, the convex part; 50, the first heat conduction layer; 60, the second heat conduction layer; 70, the heat dissipation fin; 90, the mounting screw. DETAILED DESCRIPTION

[0041] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the embodiment of the utility model will be further described in detail below in conjunction with the drawings. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment in the utility model, all other embodiments obtained by the person skilled in the art without making creative labor belong to the scope of protection of the utility model.

[0042] In the description of the utility model, unless another explicit provision and limitation, the term "connected", "fixed" should be broad sense understanding, for example, can be fixed connection, can also be detachable connection or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through the intermediate medium, can be the communication inside two elements or the interaction relationship of two elements. For the person skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0043] In the utility model, unless another definite provision and limitation, first feature is in second feature "on" or "under" can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but contact through other feature between them. Moreover, first feature is "on", "above" and "on" second feature includes that first feature is directly above and obliquely above second feature, or only indicates that first feature horizontal height is higher than second feature. First feature is "under", "below" and "under" second feature includes that first feature is directly below and obliquely below second feature, or only indicates that first feature horizontal height is less than second feature.

[0044] In the related art, a large number of heat generating chips are integrated on the circuit board inside the electronic device, adjacent chips will interfere with each other, resulting in increased heat generation. Exemplarily, for a vehicle-mounted navigator, the internal host is provided with a main chip and some other high-power high-frequency devices, and the internal heat generation is large. However, the electronic components will affect the product performance and service life in the high-temperature shell cavity for a long time. In the related art, the electronic device has the problems of limited heat dissipation path of the electronic component and slow heat dissipation speed, which affects the performance and service life of the device.

[0045] Referring to Figures 1 to 10 , the present application provides an electronic device. For a first component with large heat generation, not only the heat is dissipated through the first heat dissipation member arranged on the front surface of the first component, but also the heat is dissipated through the second heat dissipation member arranged at the position corresponding to the back surface of the first component on the circuit board. When the first component works, the heat can be dissipated through the heat dissipation members arranged at different positions from different paths, and the heat dissipation efficiency is high.

[0046] The electronic device can be but is not limited to a vehicle-mounted navigator, and the first component can be but is not limited to a main chip. The electronic device can also be an electronic device in other vehicle-mounted devices, unmanned aerial vehicles, robots, industrial control boxes and the like.

[0047] Please continue to refer to Figures 1 to 10 , the electronic device of the present application will be described in detail below.

[0048] The electronic device includes a shell 10, a circuit board 21, a first heat dissipation member 30 and a second heat dissipation member 40.

[0049] Referring to Figure 1 , Figure 4 , the inside of the shell 10 has an inner cavity, and the inner cavity is used to accommodate the circuit board 21 and other components. The shell 10 plays a role of protecting the circuit board 21 and shielding interference. The shell 10 is made of metal, and the shell 10 has good heat dissipation performance.

[0050] The circuit board 21 is arranged inside the casing 10, and the circuit board 21 has a first board face 211 and a second board face 212 opposite to each other. The first board face 211 of the circuit board 21 is provided with the first component 22, which is one of electronic components, and the first board face 211 and / or the second board face 212 of the circuit board 21 is further provided with other electronic components. It should be noted that the electronic components can be electronic elements, electronic devices, electronic modules, etc. The circuit board 21 is a PCB (printed circuit board 21), and the circuit board 21, together with the first component 22 and the other electronic components, forms a PCBA.

[0051] The first heat dissipation member 30 and the second heat dissipation member 40 are both used to dissipate the heat generated by the first component 22 during operation. Optionally, the first component 22 is a main chip of an electronic device, which generates a large amount of heat during operation. In other embodiments, the first component 22 can also be other electronic components that are prone to heat generation, such as IGBT modules, IPM modules, radio frequency modules, etc.

[0052] With reference to Figure 2 , Figure 5 , Figure 7 , Figure 8 The first heat dissipation member 30 is used to dissipate heat of the first component 22. The back of the first component 22 is arranged on the first board face 211 of the circuit board 21, and the first heat dissipation member 30 is arranged on the side of the first component 22 away from the circuit board 21, i.e. the first heat dissipation member 30 is arranged on the front of the first component 22. The first heat dissipation member 30 is in thermal contact with the front of the first component 22, and the heat generated by the first component 22 can be conducted to the first heat dissipation member 30.

[0053] The second heat dissipation member 40 also plays a role in dissipating the heat generated by the first component 22. The second heat dissipation member 40 is arranged on the second board face 212, and the second heat dissipation member 40 is in thermal contact with the second board face 212 of the circuit board 21. Among them, the circuit board 21 is configured such that the area of the second board face 212 of the circuit board 21 corresponding to the first component 22 is a first area, and the first area is a blank area without other electronic components. The second heat dissipation member 40 is arranged in the first area of the second board face 212 of the circuit board 21, and the second heat dissipation member 40 is also in thermal contact with the first area of the second board face 212 of the circuit board 21. In this way, when the first component 22 generates a large amount of heat, the heat of the first component 22 will be conducted to the circuit board 21, and the part of the circuit board 21 corresponding to the first component 22 will also emit a large amount of heat, and the heat on the circuit board 21 can be conducted to the second heat dissipation member 40.

[0054] In order to dissipate heat outwardly, the first heat dissipation member 30 is in thermal contact with the casing 10 to transfer heat to the casing 10, and heat exchange is performed between the surface of the casing 10 and external air to dissipate heat; or the first heat dissipation member 30 at least partially extends to the outside of the casing 10 to perform heat exchange between the first heat dissipation member 30 and external air to dissipate heat. Correspondingly, the second heat dissipation member 40 is in thermal contact with the casing 10 to transfer heat to the casing 10, and heat exchange is performed between the surface of the casing 10 and external air to dissipate heat; or the second heat dissipation member 40 at least partially extends to the outside of the casing 10 to perform heat exchange between the second heat dissipation member 40 and external air to dissipate heat.

[0055] The heat generated by the first component 22 during operation is transferred to the circuit board 21 and the first heat dissipation member 30, and the first heat dissipation member 30 dissipates heat outwardly. The area of the circuit board 21 corresponding to the position of the first component 22 also generates a large amount of heat, and the second heat dissipation member 40 is arranged on the side of the circuit board 21 away from the first component 22, so that the heat on the circuit board 21 can also be dissipated outwardly in a timely manner. For example, the heat on the side of the circuit board 21 away from the first component 22 can be quickly conducted to the surface of the metal casing 10 through the second heat dissipation member 40 to perform heat exchange with air, so that the heat inside the casing 10 can be reduced more quickly.

[0056] In the present application, no other electronic components are arranged in the first area of the second board surface 212 of the circuit board 21 corresponding to the first component 22, and a space is reserved for arranging the second heat dissipation member 40, so that the heat conducted from the first component 22 to the circuit board 21 can be dissipated outwardly through the second heat dissipation member 40.

[0057] The first heat dissipation member 30 and the second heat dissipation member 40 in the present application cooperate to dissipate heat outwardly from the circuit board 21 to the outside of the casing 10 through different heat dissipation paths, and the heat dissipation paths are more and the heat dissipation efficiency is higher. Moreover, the second heat dissipation member 40 can simultaneously solve the problems of too high working temperature of the first component 22 and too high local temperature of the circuit board 21, and can avoid the problems of stress and deformation of the circuit board 21 due to too high local temperature. Meanwhile, the second heat dissipation member 40 is arranged at a position close to the first component 22 in terms of path, and the heat conduction path is short, the heat conduction efficiency is high, and the heat dissipation efficiency is high.

[0058] Compared with the heat dissipation mode in which the heat conducted from the first component 22 to the circuit board 21 is dissipated through heat exchange between the circuit board 21 and the internal air of the casing 10, the heat dissipation efficiency of the present application is higher. Compared with the mode in which a heat dissipation fan is additionally arranged inside the casing 10, the present application additionally arranges the second heat dissipation member 40 inside the casing 10, which can improve the heat dissipation efficiency while controlling the cost and avoiding noise during operation of the heat dissipation fan.

[0059] In an embodiment, the material of the casing 10 is SECC (Steel Electric Conductivity Cold-rolled), and the casing 10 is a galvanized steel plate. The galvanized steel plate has good thermal conductivity, good electrical conductivity, corrosion resistance, easy processing into different shapes, and smooth and beautiful surface. It can be understood that when the casing 10 is an electrically conductive casing 10, the casing 10 has the function of shielding interference for electronic components, so that the electronic components can work reliably. In other embodiments, the casing 10 can also be made of other metal materials.

[0060] In an embodiment, the first heat dissipation member 30 and the second heat dissipation member 40 are heat dissipation fins, which can be flat plates or can be bent into different shapes. In an embodiment, the first heat dissipation member 30 and the second heat dissipation member 40 are metal members, which can be but are not limited to aluminum alloy members.

[0061] In an embodiment, referring to Figure 1 、 Figure 4 、 Figure 7 、 Figure 8 、 Figure 9 , the casing 10 includes a first casing plate 11 and a second casing plate 12 arranged opposite to each other, the first plate surface 211 faces the first casing plate 11 of the casing 10, and the second plate surface 212 faces the second casing plate 12 of the casing 10. The first component 22 is arranged on the side of the circuit board 21 close to the first casing plate 11, and the second heat dissipation member 40 is arranged between the circuit board 21 and the second casing plate 12.

[0062] The first casing plate 11 and the second casing plate 12 wrap the circuit board 21 inside, so as to avoid the circuit board 21 from being affected by external electromagnetic interference, and the metal casing 10 plays a shielding interference role.

[0063] Optionally, the second heat dissipation member 40 is in thermal contact with the casing 10 to conduct the heat of the circuit board 21 to the casing 10. On this basis, the second heat dissipation member 40 adopts the following structure:

[0064] Referring to Figure 1 、 Figure 6The second heat-dissipating member 40 comprises a first heat-conducting part 41, a second heat-conducting part 42 and a third heat-conducting part 43. The first heat-conducting part 41 is in heat-conducting contact with the second plate surface 212. The second heat-conducting part 42 and the third heat-conducting part 43 are connected to the two ends of the first heat-conducting part 41. The second heat-conducting part 42 and the third heat-conducting part 43 are in arm-like structures. The end of the second heat-conducting part 42, which is away from the first heat-conducting part 41, extends towards the second shell plate 12. The second heat-conducting part 42 is in direct or indirect heat-conducting contact with the second shell plate 12. The end of the third heat-conducting part 43, which is away from the first heat-conducting part 41, extends towards the second shell plate 12. The third heat-conducting part 43 is in direct or indirect heat-conducting contact with the second shell plate 12.

[0065] Exemplarily, when the second shell plate 12 is located on the upper side of the second heat-dissipating member 40 and the circuit board 21 is located on the lower side of the second heat-dissipating member 40, the lower side of the first heat-conducting part 41 is in heat-conducting contact with the second plate surface 212 of the circuit board 21. The second heat-conducting part 42 and the third heat-conducting part 43 are connected to the left and right ends of the first heat-conducting part 41 respectively. The first heat-conducting part 41 of the second heat-dissipating member 40 absorbs the heat of the circuit board 21. The heat of the second heat-conducting part 42 is conducted upwards via the second heat-conducting part 42 and the third heat-conducting part 43 until it is conducted to the second shell plate 12. The outer surface of the metal second shell plate 12 exchanges heat with the external air to dissipate the internal heat to the outside.

[0066] It can be understood that, on the basis of the heat conduction between the first heat-conducting part 41 and the circuit board 21, the second heat-conducting part 42 and the third heat-conducting part 43, which are arranged at intervals, provide two heat-conducting paths from the first heat-conducting part 41 to the shell 10. The increase of the heat-conducting paths is conducive to improving the heat dissipation efficiency. Moreover, the second heat-dissipating member 40 is supported between the second shell plate 12 and the circuit board 21 by the second heat-conducting part 42 and the third heat-conducting part 43 which are arranged at intervals. When the electronic device is in a vibrating environment, the second heat-dissipating member 40 can also be relatively stably maintained at the current position. In addition, the positions where the second heat-conducting part 42 and the third heat-conducting part 43, which are arranged at intervals, are in contact with the second shell plate 12 are also staggered and spaced. In this way, the second shell plate 12 can receive the heat conducted by the second heat-dissipating member 40 through the two spaced areas and exchange the heat to the air through the two spaced areas, so that the cooling effect is good.

[0067] In an embodiment, please continue to refer to Figure 1 , Figure 6 , Figure 7 , Figure 8 The second heat-dissipating member 40 comprises the first heat-conducting part 41, the second heat-conducting part 42, the third heat-conducting part 43, and further comprises a fourth heat-conducting part 44 and a fifth heat-conducting part 45.

[0068] The fourth heat conduction part 44 is connected to one end of the second heat conduction part 42 away from the first heat conduction part 41, and the fifth heat conduction part 45 is connected to one end of the third heat conduction part 43 away from the first heat conduction part 41. The second heat conduction part 42 and the third heat conduction part 43 are both bent relative to the first heat conduction part 41, the fourth heat conduction part 44 is bent relative to the second heat conduction part 42, and the fifth heat conduction part 45 is bent relative to the third heat conduction part 43. Among them, one heat conduction part bent relative to another heat conduction part means that the two heat conduction parts are connected to each other and have an included angle therebetween, and does not limit whether the adjacent heat conduction parts are an integral structure or a split structure.

[0069] The fourth heat conduction part 44 and the fifth heat conduction part 45 are provided, on one hand, to realize heat conduction contact between the second heat dissipation part 40 and the second shell plate 12: the side of the fourth heat conduction part 44 away from the circuit board 21 is in heat conduction contact with the second shell plate 12, and the first heat conduction part 41 is in heat conduction contact with the second shell plate 12 through the fourth heat conduction part 44; the side of the fifth heat conduction part 45 away from the circuit board 21 is in heat conduction contact with the second shell plate 12, and the third heat conduction part 43 is in heat conduction contact with the second shell plate 12 through the fifth heat conduction part 45.

[0070] It can be understood that, by the included angle arrangement of the fourth heat conduction part 44 and the second heat conduction part 42 and the included angle arrangement of the fifth heat conduction part 45 and the third heat conduction part 43, a larger heat conduction area can be provided on the side of the fourth heat conduction part 44 and the fifth heat conduction part 45 away from the circuit board 21, the larger heat conduction area is in contact with a larger area of the second shell plate 12, the heat transfer area is increased, and the heat dissipation efficiency is improved.

[0071] Optionally, referring to Figure 1 , Figure 6 , the fourth heat conduction part 44 and the fifth heat conduction part 45 extend in opposite directions, and the second heat dissipation part 40 is a "several" character-shaped heat dissipation fin. The several-character-shaped second heat dissipation part 40 not only can increase the heat dissipation path, but also can be stably supported between the circuit board 21 and the second shell plate 12. Compared with the solid columnar heat dissipation part, it not only can maintain good heat transfer and heat dissipation performance, but also has the advantages of light weight and low cost. In other embodiments, the fourth heat conduction part 44 extends from the second heat conduction part 42 to the direction close to the third heat conduction part 43, and the fifth heat conduction part 45 extends from the third heat conduction part 43 to the direction away from the second heat conduction part 42.

[0072] Optionally, the fourth heat conduction part 44 is connected with the second shell plate 12, and the fifth heat conduction part 45 is connected with the second shell plate 12. The connection between the fourth heat conduction part 44, the fifth heat conduction part 45 and the second shell plate 12 can be clamping, buckling connection, fastener connection, adhesive fixing and the like. In this way, the configuration of the fourth heat conduction part 44 and the fifth heat conduction part 45 not only increases the contact area of the second shell plate 12, but also limits the relative position of the second heat dissipation part 40 and the second shell plate 12, which is conducive to maintaining the stability of the position of the second heat dissipation part 40. In the case of certain shaking of the electronic device, the heat conduction path between the circuit board 21, the second heat dissipation part 40 and the second shell plate 12 will not be disconnected, and stable heat dissipation will be continued.

[0073] With reference to Figure 6 , Figure 8 The fourth heat conduction part 44 is provided with a first positioning part 441, and the fifth heat conduction part 45 is provided with a second positioning part 451. The fourth heat conduction part 44 is positioned and connected with the second shell plate 12 through the first positioning part 441, and the fifth heat conduction part 45 is positioned and connected with the second shell plate 12 through the second positioning part 451. The first positioning part 441 and the second positioning part 451 can be positioning columns or positioning holes.

[0074] In some embodiments, the fourth heat conduction part 44 and the fifth heat conduction part 45 can also be locked on the second shell plate 12 by screws.

[0075] Optionally, the first heat conduction part 41, the second heat conduction part 42, the third heat conduction part 43, the fourth heat conduction part 44 and the fifth heat conduction part 45 are all flat or sheet-shaped structures. The second heat dissipation part 40 can be formed by bending sheet material, which has a simple structure and low processing cost.

[0076] In other embodiments, the second heat dissipation part can only include the first heat conduction part 41, the second heat conduction part 42 and the third heat conduction part 43.

[0077] In an embodiment, the circuit board 21 is provided with a mounting hole, and a mounting screw 90 passes through the mounting hole of the circuit board 21 to lock and connect the circuit board 21 to the case 10. The circuit board 21 is in conductive contact with the mounting screw 90, and the mounting screw 90 is in conductive contact with the case 10. The case 10 is a metal shell, and the mounting screw 90 also realizes grounding of the circuit board 21.

[0078] The high-power high-frequency electronic components are soldered on the circuit board 21 by soldering. When the circuit board 21 works, the components generate heat, are easily interfered by adjacent components and external electromagnetic interference. It can be understood that when the electronic device has more high-frequency electronic components integrated inside the casing 10, it is crucial to meet the EMC (Electromagnetic Compatibility) requirements to ensure the normal operation of the electronic components. In the embodiment, the grounding of the circuit board 21 can be achieved by installing the screw 90. Grounding is one of the means to meet the EMC requirements, which can avoid excessive EMC static energy.

[0079] In an embodiment, the second heat dissipation member 40 also has the function of grounding the circuit board 21. The second heat dissipation member 40 is a metal member, the second heat dissipation member 40 is in conductive contact with the circuit board 21, and the second heat dissipation member 40 is in conductive contact with the inner wall of the casing 10. Wherein, "conductive contact" refers to the state that two components are directly or indirectly in contact, and static electricity can be transmitted between the two components, and the two components form an electrical connection. The circuit board 21 is in conductive connection with the metal casing 10 through the second heat dissipation member 40. In the case of grounding of the metal casing 10, the circuit board 21 and the electronic components are grounded. Referring to Figure 10 , the solid arrows in the figure show that the static electricity is conducted from the circuit board 21 to the second heat dissipation member 40, and then to the casing 10.

[0080] It can be understood that in some electronic devices, when the number of high-frequency components is large, a simple circuit board 21 grounding design may not meet higher safety requirements. For example, when the mounting screw 90 is used to lock the circuit board 21 and achieve the grounding of the circuit board 21, since the screw material is mainly iron, only three or four mounting screws 90 are used to connect the circuit board 21 and the casing 10, and the EMC grounding point is still not enough. In the embodiment, the second heat dissipation member 40 originally arranged between the circuit board 21 and the casing 10 is also used as a conductive connection member to conductively connect the circuit board 21 and the casing 10. On the basis of the original grounding point between the circuit board 21 and the casing 10, new grounding points can be added. When the grounding points are more, it is helpful to reduce the influence of electromagnetic interference and electrostatic discharge on the equipment, and the risk of excessive EMC static energy can be avoided.

[0081] The electronic device of the embodiment has the functions of improving the heat dissipation performance and grounding the circuit board 21, and multiple functions are achieved by the same component, which is more practical and the structure of the electronic device is more compact.

[0082] Optionally, the second heat-dissipating member 40 comprises a fourth heat-conducting part 44 and a fifth heat-conducting part 45, and the fourth heat-conducting part 44 and the fifth heat-conducting part 45 are directly abutted against the inner wall of the second shell plate 12 from the side of the second heat-dissipating member 40 away from the circuit board 21, so as to realize the heat conduction between the fourth heat-conducting part 44 and the shell 10, the fifth heat-conducting part 45 and the shell 10, and realize the static conduction. In other embodiments, the fourth heat-conducting part 44 and the second shell plate 12, and the fifth heat-conducting part 45 and the second shell plate 12 can be provided with an intermediate layer which is both heat-conducting and electrically-conducting.

[0083] Optionally, referring to Figures 5 to 7 , the second heat-dissipating member 40 is provided with a first contact surface 401 on the side close to the circuit board 21. A second heat-conducting layer 60 is arranged between the second heat-dissipating member 40 and the circuit board 21, and the second heat-conducting layer 60 is in contact with the first contact surface 401 on one side and the second plate surface 212 on the other side. The heat of the circuit board 21 is conducted to the second heat-dissipating member 40 through the second heat-conducting layer 60. The second heat-conducting layer 60 can be, but is not limited to, a heat-conducting silica gel pad which protects the circuit board 21 while conducting heat.

[0084] Please continue to refer to Figure 2 、 Figures 5 to 7 , the first contact surface 401 is provided with a protrusion 46 which is a part of the second heat-dissipating member 40. The circuit board 21 is provided with an electrically-conductive part, and the protrusion 46 is in electrically-conductive contact with the electrically-conductive part, so as to realize the electrically-conductive contact between the second heat-dissipating member 40 and the circuit board 21.

[0085] In the case that the second heat-conducting layer 60 arranged between the second heat-dissipating member 40 and the circuit board 21 occupies a certain height space, the protrusion 46 on the first contact surface 401 can be close to the circuit board 21, so as to realize the electrically-conductive contact between the second heat-dissipating member 40 and the circuit board 21, and the static electricity of the circuit board 21 can be transmitted to the second heat-dissipating member 40.

[0086] In other embodiments, the second heat-dissipating member 40 can also not be provided with the protrusion 46, and the second heat-dissipating member 40 can be locked on the circuit board 21 by a metal electrically-conductive screw, so as to realize the electrically-conductive contact between the second heat-dissipating member 40 and the circuit board 21, thereby allowing the static electricity to be discharged from the second heat-dissipating member 40, and providing a new grounding path based on the second heat-dissipating member 40. For the convenience of understanding, the second heat-dissipating member 40 is described below by taking the example that the second heat-dissipating member 40 is provided with the protrusion 46.

[0087] The electrically-conductive contact between the second heat-dissipating member 40 and the circuit board 21 can be realized by at least two ways.

[0088] One configuration of the second heat sink 40 and the circuit board 21 is as follows: the conductive part is the exposed copper area (not shown in the figure) on the second surface 212 of the circuit board 21, and the end of the protrusion 46 away from the first contact surface 401 abuts against the exposed copper area, thereby enabling the circuit board 21 to make conductive contact with the second heat sink 40 through the protrusion 46, providing a path for electrostatic transfer.

[0089] The second configuration of the second heat sink 40 and the circuit board 21 is not shown in the diagram. The conductive part is a hole in the circuit board 21, located on the hole wall. At least a portion of the protrusion 46 is inserted into the hole, and the outer wall of the protrusion 46 contacts the hole wall, so that the circuit board 21 can make conductive contact with the second heat sink 40 through the protrusion 46.

[0090] It is understandable that one of the above-mentioned configurations of the second heat sink 40 and the circuit board 21 is easier to implement and has lower processing and assembly costs.

[0091] In one embodiment, when the conductive portion of the circuit board 21 is located on the second surface 212, the protrusion 46 abuts against the conductive portion of the second surface 212, and the protrusion 46 is located on the side of the circuit board 21 away from the first component 22. In this embodiment, the protrusion 46 not only serves to achieve conductive contact between the circuit board 21 and the second heat sink 40 to conduct static electricity, but also helps to control the deformation of the circuit board 21 and reduce the risk of electronic components falling off.

[0092] The inventors discovered that when a first heat sink 30 is located on the side of the first component 22 facing away from the circuit board 21, a first thermally conductive layer 50 is generally required between the first heat sink 30 and the first component 22. The first thermally conductive layer 50 can be made of a material with a certain degree of elasticity. In this case, when installing the first heat sink 30, the first heat sink 30, the first thermally conductive layer 50, and the first component 22 need to be tightly pressed together, ensuring that both sides of the first thermally conductive layer 50 are in close contact with the first component 22 and the first heat sink 30, respectively. However, this tight pressing may cause the position of the circuit board 21 corresponding to the first component 22 to be deformed. This deformation and bulging of the circuit board 21 will generate stress on the components on the circuit board 21, potentially leading to the risk of electronic components falling off. For example… Figure 4 , Figure 5 The circuit board 21 is deformed by the first heat sink 30 located on its lower side, and the electronic components on the first board surface 211 and the second board surface 212 near the area where the first component 22 is located are at risk of falling off.

[0093] In this embodiment, the protrusion 46 of the second heat sink 40 near the side of the circuit board 21 abuts against the second surface 212 of the circuit board 21 from the back of the first component 22. It can abut against the circuit board 21 from the opposite direction, preventing the circuit board 21 from deforming due to the compression of the first heat sink 30 and the first heat-conducting layer 50. It can effectively control the deformation of the circuit board 21 and prevent electronic components from falling off.

[0094] Optionally, the first plane is a surface perpendicular to the thickness direction of the circuit board 21, the orthographic projection of the first heat dissipation surface in the first plane is the first projection area, the orthographic projection of the protrusion 46 in the first plane is the second projection area, the orthographic projection of the first component 22 in the first plane is the third projection area, the first projection area is wholly or partially within the third projection area, the second projection area is within the third projection area, and the second projection area is located near the edge of the third projection area.

[0095] Of course, in other embodiments, when the second surface 212 of the circuit board 21 is provided with a conductive part and the protrusion 46 abuts against the conductive part of the second surface 212, the protrusion 46 may also be located outside the second region, that is, the second projection region is located outside the third projection region.

[0096] In other embodiments, a protrusion 46 is provided on the side of the second heat sink 40 near the circuit board 21. The protrusion 46 abuts against the second plate surface 212. The protrusion 46 is located on the side of the circuit board 21 away from the first component 22. The protrusion 46 only has the function of pressing against the circuit board 21 from the opposite direction to prevent the circuit board 21 from deforming due to the compression of the first heat sink 30 and the first heat-conducting layer 50. It does not play the role of making conductive contact with the circuit board 21.

[0097] In one embodiment, to improve the heat dissipation efficiency of the electronic device, the first heat sink 30 is further provided with heat dissipation fins 70 on the side opposite to the circuit board 21. The heat dissipation fins 70 include several uneven fin structures, which can increase the heat dissipation area. The first heat sink 30 and the heat dissipation fins 70 can be an integral component or two components that need to be assembled together.

[0098] Optionally, the housing 10 is provided with a recess 111, through which at least a portion of the heat dissipation fins 70 extend outside the housing 10. By extending the heat dissipation fins 70 outside the housing 10, the contact area with air can be increased, thereby increasing heat dissipation efficiency.

[0099] In an embodiment, the first heat dissipation member 30 and the first component 22 are provided with a first heat conduction layer 50, the second heat dissipation member 40 and the second plate surface 212 are provided with a second heat conduction layer 60, the first heat conduction layer 50 is clamped between the first heat dissipation member 30 and the first component 22, and the second heat conduction layer 60 is clamped between the second heat dissipation member 40 and the circuit board 21. Through the arrangement of the heat conduction layer, the contact efficiency between the surfaces can be higher, and the heat conduction efficiency is higher.

[0100] Optionally, the first heat conduction layer 50 and the second heat conduction layer 60 are both heat-conducting silica gel pads. The use of the heat-conducting silica gel pad with elasticity as the heat conduction layer can make the surfaces more fully contact through extrusion, and the heat dissipation efficiency is higher. In other embodiments, the first heat conduction layer 50 and the second heat conduction layer 60 can also be heat-conducting glue and the like that can improve the heat conduction efficiency.

[0101] In an embodiment, the first plate surface 211 is further provided with a plurality of electronic components. The second plate surface 212 is further provided with a plurality of electronic components. Through the arrangement of more electronic components, higher performance can be provided to meet the higher use requirements of users.

[0102] In an embodiment, the first heat dissipation member 30 and / or the second heat dissipation member 40 is made of aluminum alloy.

[0103] The electronic device of the present application effectively solves the problems of heat dissipation and grounding of high-power and high-frequency components, prevents the deformation of the circuit board 21, and saves costs. The present application can solve the technical problems of limited heat transfer path, large heat in the body that cannot be dissipated in time, and low heat dissipation efficiency of the electronic device with high-power and high-frequency components inside, and can also solve the technical problems of the risk of falling of the components on the PCB caused by the tight compression of the heat-conducting silica gel pad between the first component 22 and the first heat dissipation member 30, and the insufficient EMC grounding point of the circuit board 21.

[0104] In the description herein, it should be understood that the terms "upper", "lower", "left", "right", and the like orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used to distinguish in the description, and have no special meaning.

[0105] In the description of the present specification, the description referring to the terms "an embodiment", "an example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0106] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

[0107] The technical principles of the present application are described above in combination with specific embodiments. These descriptions are only for the purpose of explaining the principles of the present application, and cannot be interpreted in any way as a limitation on the scope of protection of the present application. Based on the explanation here, those skilled in the art can think of other specific embodiments of the present application without having to exert creative labor, and these ways will fall within the scope of protection of the present application.

Claims

1. An electronic device, characterized by comprising: The application relates to a heat dissipation device for a metal casing (10) of an electronic device, comprising: the casing (10) being a metal casing; a circuit board (21) having a first board surface (211) and a second board surface (212) opposite to each other; the first board surface (211) is provided with a first component (22); a first heat dissipation member (30) is arranged on a side of the first component (22) away from the circuit board (21); the first heat dissipation member (30) is in thermal contact with the first component (22), and the first heat dissipation member (30) is in thermal contact with the casing (10) and / or at least partially extends to the outside of the casing (10); a second heat dissipation member (40) is arranged on the second board surface (212); the second heat dissipation member (40) is in thermal contact with a region of the circuit board (21) away from the first component (22), and the second heat dissipation member (40) is in thermal contact with the casing (10) and / or at least partially extends to the outside of the casing (10). The casing (10) comprises a first casing plate (11) and a second casing plate (12); the first component (22) is arranged on a side of the circuit board (21) close to the first casing plate (11); and the second heat dissipation member (40) is arranged between the circuit board (21) and the second casing plate (12). The second heat dissipation member (40) comprises a first thermal conduction part (41), a second thermal conduction part (42) and a third thermal conduction part (43); the first thermal conduction part (41) is in thermal contact with the second board surface (212); the second thermal conduction part (42) and the third thermal conduction part (43) are connected to two ends of the first thermal conduction part (41); and the second thermal conduction part (42) and the third thermal conduction part (43) are arranged in a spaced mode and are in thermal contact with the second casing plate (12). The second heat dissipation member (40) further comprises a fourth thermal conduction part (44) and a fifth thermal conduction part (45). The fourth thermal conduction part (44) is connected to the second thermal conduction part (42) and is bent relative to the second thermal conduction part (42); a side of the fourth thermal conduction part (44) away from the circuit board (21) is in thermal contact with the second casing plate (12); the fifth thermal conduction part (45) is connected to the third thermal conduction part (43) and is bent relative to the third thermal conduction part (43); and a side of the fifth thermal conduction part (45) away from the circuit board (21) is in thermal contact with the second casing plate (12). 2.The electronic device of claim 1, wherein, The fourth thermal conduction part (44) is connected to the second casing plate (12), and the fifth thermal conduction part (45) is connected to the second casing plate (12). The second heat dissipation member (40) is a metal member; the second heat dissipation member (40) is in electric contact with the circuit board (21); and the second heat dissipation member (40) is in electric contact with the casing (10). 3.The electronic device of claim 2, wherein, ​ ​ ​ 4.The electronic device of claim 1, wherein, ​ 5.The electronic device of claim 4, wherein, The second heat-dissipating piece (40) is provided with a first contact surface (401) on one side close to the circuit board (21); a second heat-conducting layer (60) is arranged between the second heat-dissipating piece (40) and the circuit board (21), one side of the second heat-conducting layer (60) is in contact with the first contact surface (401), and the other side is in contact with the second board surface (212); The first contact surface (401) is provided with a protrusion (46), the circuit board (21) is provided with an electrically-conductive part, and the protrusion (46) is in electrically-conductive contact with the electrically-conductive part, so that the second heat-dissipating piece (40) is in electrically-conductive contact with the circuit board (21). 6.The electronic device of claim 5, wherein, The electrically-conductive part is a copper-exposed area on the second board surface (212), and the protrusion (46) abuts against the copper-exposed area. 7.The electronic device of claim 5 or 6, wherein, The electrically-conductive part is on the second board surface (212), the protrusion (46) abuts against the electrically-conductive part on the second board surface (212), and the protrusion (46) is on the side of the circuit board (21) away from the first component (22). 8.The electronic device of claim 1, wherein, The second heat-dissipating piece (40) is provided with a protrusion (46) on one side close to the circuit board (21), the protrusion (46) abuts against the second board surface (212), and the protrusion (46) is on the side of the circuit board (21) away from the first component (22). 9.The electronic device of any one of claims 1 to 6 or 8, wherein, The first heat-dissipating piece (30) is provided with heat-dissipating fins (70) on the side away from the circuit board (21), the casing (10) is provided with a clearance (111), and at least part of the heat-dissipating fins (70) extends outside the casing (10) through the clearance (111); And / or, a first heat-conducting layer (50) is arranged between the first heat-dissipating piece (30) and the first component (22), and a second heat-conducting layer (60) is arranged between the second heat-dissipating piece (40) and the second board surface (212), and the first heat-conducting layer (50) and the second heat-conducting layer (60) are both heat-conducting silica gel pads. 10.The electronic device of any one of claims 1 to 6, 8, wherein, The second board surface (212) is further provided with a plurality of electronic components; And / or, the first component (22) is a chip; And / or, the electronic device further comprises a mounting screw (90), the circuit board (21) is mounted on the casing (10) through the mounting screw (90), and the circuit board (21) is in electrically-conductive connection with the casing (10) through the mounting screw (90). 11.The electronic device of any one of claims 1 to 6, 8, wherein, The electronic device is a vehicle-mounted navigation device.

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