Heat dissipation system of power equipment

Abstract

The utility model discloses a heat dissipation system of power equipment. The heat dissipation system comprises a shell, at least one first fan group, at least one guide plate and a plurality of radiators, a sealing cavity for mounting a plurality of heating devices is formed in the shell; the flow guide plate is mounted on the outer side of the shell, so that independent heat dissipation cavities are formed in the shell on the two sides of the flow guide plate; at least one radiator is mounted in each radiating cavity, and the radiator corresponds to the heating device in the sealing cavity in position; the first fan set is installed on the side, away from the shell, of the flow guide plate, and the flow guide plate is suitable for dispersing airflow generated by the first fan set to the heat dissipation cavities in the two sides. The heat dissipation device has the beneficial effects that the outer side area of the shell can be divided into two independent heat dissipation cavities through the separated arrangement of the flow guide plates; the flow guide plate can divide the air flow of the first fan group to two sides, so that independent heat dissipation air channels are formed in the two heat dissipation cavities for heat dissipation, and the heat cascade phenomenon of the whole machine can be effectively reduced.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation system for power devices. Background Technology

[0002] The heating elements of power equipment mainly include power devices and magnetic devices. When power equipment is working normally, the heating elements will generate a lot of heat. If this heat cannot be dissipated in time, the working stability and lifespan of the power equipment will be greatly affected. Therefore, temperature control of power equipment is particularly important.

[0003] Current technologies for cooling power devices primarily involve placing a fan at the bottom of the device and installing heat sinks on heat-generating components. Airflow from the fan blows air into the device, carrying away heat from the heat sinks as it passes through them, thus cooling both the power and magnetic components. However, current technologies use a large number of fans for cooling power devices, resulting in reduced fan utilization. This leads to heat loss from magnetic components located far from the fans, potentially causing severe thermal cascading. Utility Model Content

[0004] One objective of this application is to provide a heat dissipation system for power devices that can solve at least one of the defects in the aforementioned background art.

[0005] To achieve at least one of the above objectives, the technical solution adopted in this application is as follows: a heat dissipation system for a power device, comprising a housing, at least one first fan assembly, at least one guide plate, and multiple heat sinks; a sealed cavity for mounting multiple heat-generating devices is formed within the housing; the guide plate is mounted on the outer side of the housing, such that the housing forms independent heat dissipation cavities on both sides of the guide plate; at least one heat sink is mounted in each heat dissipation cavity, and the position of the heat sink corresponds to that of the heat-generating device in the sealed cavity; the first fan assembly is correspondingly mounted on the side of the guide plate away from the housing, and the guide plate is adapted to disperse the airflow generated by the first fan assembly to the heat dissipation cavities on both sides.

[0006] Preferably, the extension direction of the guide plate is parallel to the edge of the housing, and each guide plate corresponds to at least one first fan group; the guide plate is directly mounted on the surface of the housing; or, the guide plate is mounted on the substrate of the heat sink corresponding to the heat dissipation cavity on both sides.

[0007] Preferably, the guide plate is a straight plate and is vertically installed on the outside of the housing; or, the guide plate is either T-shaped or L-shaped and is installed on the outside of the housing.

[0008] Preferably, the guide plate is V-shaped and installed on the outside of the housing through an open end; or, the guide plate is triangular and installed on the outside of the housing through one side.

[0009] Preferably, the heat-generating device corresponding to each heat dissipation cavity includes at least one of a power device and a magnetic device; the airflow of the first fan group to both sides of the guide plate through the guide plate is adapted to be distributed according to the type and / or quantity of the heat-generating devices corresponding to the heat dissipation cavities on both sides.

[0010] Preferably, the first fan assembly distributes the airflow to both sides of the guide vane by adjusting the relative position of the guide vane.

[0011] Preferably, there is one guide plate, which is installed in the middle of the outer side of the housing; the heating devices in the sealed cavity are evenly distributed according to the position of the heat dissipation cavity.

[0012] Preferably, when the heat-generating device corresponding to the heat dissipation cavity includes both the power device and the magnetic device, the installation position of the power device is close to the guide plate, and the installation position of the magnetic device is far away from the guide plate; the heat sink installed in the heat dissipation cavity includes a first heat sink corresponding to the power device and a second heat sink corresponding to the magnetic device.

[0013] Preferably, the outer side of the housing is provided with a heat exchange zone and a heat dissipation zone by an extended partition plate; the guide plate is installed in the heat dissipation zone and perpendicular to the partition plate, and the heating device installed in the sealed cavity corresponds to the heat dissipation zone; a heat exchange module is provided in the heat exchange zone, and the heat exchange module is used to exchange heat in the sealed cavity.

[0014] Preferably, the heat exchange module includes a heat exchanger and at least one second fan assembly; the heat exchanger is used to absorb heat within the sealed cavity, and the second fan assembly is installed at the air inlet of the heat exchanger to provide airflow to the air inlet of the heat exchanger.

[0015] Compared with the prior art, the beneficial effects of this application are as follows:

[0016] By using the baffle plate to divide the outer area of ​​the housing into two independent heat dissipation chambers, the baffle plate can split the airflow of the first fan group to both sides when the first fan group is working, thereby forming independent heat dissipation air channels in both heat dissipation chambers. This can effectively reduce the thermal cascading phenomenon of the whole machine, and at the same time reduce the number of fans used in the first fan group to reduce heat dissipation costs. Attached Figure Description

[0017] Figure 1This is a schematic diagram of the external structure of one embodiment of this application.

[0018] Figure 2 For this application Figure 1 The illustrated embodiment is a cross-sectional structural diagram of the shell viewed from the side.

[0019] Figure 3 This is a schematic diagram of the external structure of another embodiment of this application.

[0020] Figure 4 For this application Figure 3 The illustrated embodiment is a cross-sectional structural diagram of the shell viewed from the side.

[0021] Figure 5 This is a schematic diagram of the structure of the first heat sink in this application.

[0022] Figure 6 This is a schematic diagram of one embodiment of the guide plate in this application.

[0023] Figure 7 This is a schematic diagram of another embodiment of the guide plate in this application.

[0024] Figure 8 This is a schematic diagram of another embodiment of the guide plate in this application.

[0025] In the figure: housing 1, sealing cavity 100, heat dissipation cavity 101, heat exchange cavity 102, power device 103, magnetic device 104, guide plate 2, guide section 21, mounting section 22, first fan group 3, first radiator 4, substrate 41, heat dissipation fins 42, second radiator 5, partition plate 6, heat exchanger 7, second fan group 8. Detailed Implementation

[0026] The present application will now be further described in conjunction with specific embodiments. It should be noted that, in the description of this specification, the use of terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present application. In this specification, the illustrative expressions of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0027] In the description of this application, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation and positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this application.

[0028] It should be noted that the terms "first," "second," etc., in the specification and claims of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0029] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0030] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0031] The terms “comprising” and “having”, and any variations thereof, in the specification and claims of this application are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or device.

[0032] One preferred embodiment of this application, such as Figures 1 to 4As shown, a heat dissipation system for a power device includes a housing 1, at least one first fan assembly 3, at least one air guide plate 2, and multiple heat sinks. A sealed cavity 100 for mounting multiple heat-generating devices is formed within the housing 1. The air guide plate 2 is mounted on the outer side of the housing 1, such that independent heat dissipation cavities 101 are formed on both sides of the housing 1. At least one heat sink is installed in each heat dissipation cavity 101, and the position of the heat sink corresponds to that of the heat-generating device within the sealed cavity 100. The first fan assembly 3 is mounted on the side of the air guide plate 2 away from the housing 1, and the air guide plate 2 can disperse the airflow generated by the first fan assembly 3 to the heat dissipation cavities 101 on both sides.

[0033] It is understandable that by dividing the space with the guide plate 2, two independent heat dissipation chambers 101 can be created in the outer area of ​​the housing 1. Thus, when the first fan group 3 is working, the guide plate 2 can split the airflow blown out by the first fan group 3 to both sides, thereby forming independent heat dissipation air ducts in both heat dissipation chambers 101 to dissipate heat from the corresponding heat sinks. Figure 2 The dotted line corresponds to the airflow direction of the heat dissipation duct. Compared to the traditional method, this embodiment can divide the entire heat dissipation area into multiple heat dissipation chambers 101. Multiple heat sinks 101 can independently dissipate heat under the diversion effect of the air guide plate 2 on the first fan group 3, thereby reducing or avoiding heat interaction between different heat dissipation chambers 101, and thus effectively reducing the thermal cascading phenomenon of the whole machine. At the same time, due to the improved heat dissipation efficiency, this embodiment can appropriately reduce the number of fans used in the first fan group 3 to reduce heat dissipation costs.

[0034] In this embodiment, the number of first fan groups 3 corresponding to each guide plate 2 can be one or more; for ease of understanding, specific embodiments will be used to illustrate this below.

[0035] For embodiments where a single air deflector 2 corresponds to one first fan group 3, such as 1 and Figure 2 As shown, the air guide plate 2 can correspond to the middle region of the first fan group 3. Thus, when the first fan group 3 is operating normally, the airflow blown out by the first fan group 3 can be split into two after passing through the air guide plate 2, so that it flows into the heat dissipation cavities 101 on both sides of the air guide plate 2 respectively.

[0036] For an embodiment where a single air deflector 2 corresponds to multiple first fan groups 3, such as... Figure 3 and Figure 4 As shown, taking a single air guide plate 2 for two first fan groups 3 as an example, the two first fan groups 3 can be arranged side by side along the extension direction perpendicular to the air guide plate 2. The air guide plate 2 can correspond to the side-by-side position of the two first fan groups 3, so that the air guide plate 2 can guide the airflow blown out by the two first fan groups 3 during normal operation to the two heat dissipation cavities 101 on both sides respectively.

[0037] It is understood that both of the above embodiments can meet the requirements of this application. The use of multiple first fan groups 3 is mainly for situations with high heat generation, while the use of a single first fan group 3 is mainly for situations with low heat generation. The specific choice can be made according to the actual needs of those skilled in the art. For the convenience of the following description, the following description will take a single air guide plate 2 corresponding to a single first fan group 3 as an example.

[0038] It should be understood that the first fan group 3 includes at least one fan. When the first fan group 3 includes multiple fans, the multiple fans can be installed at equal intervals along the extension direction of the guide plate 2. This ensures that the airflow blown by the first fan group 3 onto the heat dissipation cavities 101 on both sides of the guide plate 2 is evenly distributed along the extension direction of the guide plate 2, thereby ensuring uniform heat dissipation of the heat sink 101 and further improving heat dissipation efficiency. The specific structure and working principle of the fans are well known to those skilled in the art, and therefore will not be described in detail here. The number of first fan groups 3 corresponds to the number of guide plates 2. The fans corresponding to the first fan groups 3 can be directly fixedly installed on the guide plates 2, that is, the fans are fixedly installed on the guide plates 2 by mounting brackets. Of course, the fans corresponding to the first fan groups 3 can also be installed at intervals between themselves and the guide plates 2; that is, the fans are installed on the housing 1 or the outer cover of the power equipment (not shown) by mounting brackets, and the entire heat dissipation system is set inside the cover.

[0039] In this embodiment, the extension of the guide plate 2 can be arranged in several ways. Generally, the structure of the housing 1 is a rectangular box structure. When setting the guide plate 2, it can be set along the diagonal of the housing 1 or parallel to the edge of the housing 1. In order to facilitate the uniform distribution of the heating device in the sealed cavity 100, in this embodiment, the extension of the guide plate 2 is preferably parallel to the edge of the housing 1, that is, as shown in the figure. Figure 1 and Figure 3 As shown. The specific number of guide vanes 2 can be set to one or more. For one guide vane 2, as shown... Figure 1 and Figure 3 As shown, it can be installed on the outer middle of the housing 1, thus dividing the outer side of the housing 1 into two spatially close heat dissipation cavities 101. For multiple guide plates 2, they can be equally spaced along the direction perpendicular to their own extension, thus dividing the outer side of the housing 1 into n+1 spatially close heat dissipation cavities 101, where n represents the number of guide plates 2. The specific number of guide plates 2 can be set according to the actual needs of those skilled in the art; for ease of understanding, the following content will use one guide plate 2 as an example for detailed explanation.

[0040] In this embodiment, as Figure 2 and Figure 4 As shown, each heat dissipation cavity 101 corresponds to a heat-generating device including at least one of a power device 103 and a magnetic device 104, and the heat-generating devices are evenly distributed according to the position of the heat dissipation cavity 101. This may result in the heat sinks on both sides of the guide plate 2 absorbing different amounts of heat depending on the type or number of the corresponding heat-generating devices. Therefore, the airflow of the first fan group 3 to both sides of the guide plate 2 can be distributed according to the type and / or number of heat-generating devices corresponding to the heat dissipation cavities 101 on both sides.

[0041] Specifically, there are two main types and / or quantities of heat-generating devices corresponding to the two heat dissipation cavities 101 on both sides of the guide plate 2. For ease of understanding, the two situations will be explained in detail below.

[0042] The first scenario: The two heat dissipation cavities 101 correspond to the same type and the same number of heat-generating devices, for example... Figure 2 and Figure 4 As shown, each heat dissipation cavity 101 corresponds to the same number of power devices 103 and magnetic devices 104; therefore, the heat absorbed by the heat sink in each heat dissipation cavity 101 is basically the same, and at this time, the air flow rate distributed on both sides of the guide plate 2 of the first fan group 3 is 50% of the total air flow rate.

[0043] In the second scenario, the two heat dissipation cavities 101 correspond to different types and numbers of heat-generating devices. For example, one heat dissipation cavity 101 may contain power devices 103 and magnetic devices 104, while the other heat dissipation cavity 101 may only contain power devices 103. The number of power devices 103 in both heat dissipation cavities 101 is the same. In this case, the heat absorbed by the heat sink installed in the heat dissipation cavity 101 containing power devices 103 and magnetic devices 104 is greater than the heat absorbed by the heat sink installed in the other heat dissipation cavity 101. In this situation, the first fan group 3 can allocate a larger airflow to the heat dissipation cavity 101 containing both power devices 103 and magnetic devices 104, and allocate the remaining smaller airflow to the heat dissipation cavity 101 containing only power devices 103.

[0044] It should be noted that if the types and / or quantities of heat-generating devices installed in the two heat dissipation cavities 101 are different, but the heat absorbed by the heat sinks corresponding to the two heat sinks 101 are the same, then the first fan group 3 can also distribute the airflow to the two heat dissipation cavities 101 on both sides of the airflow guide plate 2 evenly.

[0045] It is understandable that both of the above situations may occur during the actual use of power equipment, and those skilled in the art can adjust the airflow distribution of the first fan group 3 according to the actual situation. For ease of understanding, the first situation will be used as an example for detailed explanation below.

[0046] Specifically, regarding the first situation mentioned above, such as Figures 1 to 4 As shown, since the power device 103 generates more heat than the magnetic device 104, when arranging and installing the heat-generating devices, the power device 103 can be installed close to the guide plate 2, and the magnetic device 104 can be installed away from the guide plate 2. Each heat dissipation cavity 101 contains a first heat dissipation 4 corresponding to the power device 103 and a second heat dissipation 5 corresponding to the magnetic device 104. Therefore, the heat absorbed by the first heat dissipation 4 per unit time will be greater than the heat absorbed by the second heat dissipation 5. When the first fan assembly 3 is working, the airflow blown by the first fan assembly 3 to both sides can first pass through the first heat dissipation 4 corresponding to the power device 103, and then through the second heat dissipation 5 corresponding to the magnetic device 104. This ensures that the entire heat dissipation system has optimal heat dissipation efficiency.

[0047] It should be understood that the specific structure and working principle of the first radiator 4 and the second radiator 5 are well-known technologies to those skilled in the art, and the structures of the first radiator 4 and the second radiator 5 are basically the same. Therefore, the structure of the first radiator 4 will be simply described using this example. Figure 5 As shown, the first heat sink 4 includes a substrate 41 and heat dissipation fins 42. The substrate 41 is fixedly mounted on the outside of the housing 1. The housing 1 has holes corresponding to the substrate 41. Power devices 103 can be mounted on the substrate 41 and extend through the holes into the sealed cavity 100 inside the housing 1. Multiple power devices 103 can be mounted on each substrate 41. There are multiple heat dissipation fins 42, all of which are vertically arranged on the side of the substrate 41 away from the housing 1. The extension direction of a single heat dissipation fin 42 is parallel to the airflow direction, and the multiple heat dissipation fins 42 are equally spaced along the extension direction of the first fan group 3. The substrate 41 can absorb the heat generated by the power devices 103 during operation and transfer it to the heat dissipation fins 42 through heat conduction. Then, when the airflow passes through the heat dissipation fins 42, the heat on the heat dissipation fins 42 is carried away through heat exchange.

[0048] In this embodiment, there are several ways to distribute airflow differently on the first fan assembly 3. For example, the airflow on both sides of the guide plate 2 can be distributed differently by changing its structural shape. Alternatively, the relative position between the first fan assembly 3 and the guide plate 2 can be adjusted to distribute the airflow on both sides of the guide plate 2 differently. If the airflow distribution is adjusted by changing the structural shape of the guide plate 2, it may require a special structural design for the guide plate 2, which may increase the design difficulty. Therefore, in this embodiment, the preferred method for distributing the airflow on both sides of the guide plate 2 is to adjust the relative position between the first fan assembly 3 and the guide plate 2. Specifically, if the required airflow on one side of the guide plate 2 is greater than that on the other side, the first fan assembly 3 can be installed relative to the guide plate 2 towards the side with the greater airflow requirement.

[0049] In this embodiment, there are various specific structures for the guide plate 2 that can divert the airflow blown out by the first fan group 3. For ease of understanding, two specific examples will be used to illustrate this in detail below.

[0050] Example 1: The guide plate 2 is a straight plate and is installed vertically on the outside of the housing 1. There are multiple ways to install the guide plate 2 and the housing 1. For example, the guide plate 2 made of metal can be directly welded to the outer surface of the housing 1. The guide plate 2 made of any material can also be inserted into the insertion slot provided on the outer surface of the housing 1.

[0051] Of course, to make the installation of the air deflector 2 easier, such as... Figure 6 As shown, the guide plate 2 can be configured as a T-shaped or L-shaped structure including a guide portion 21 and a mounting portion 22. Thus, during installation, the guide plate 2 can be fixedly mounted to the outer surface of the housing 1 or to the base plate 41 of the radiator installed within the heat dissipation cavities 101 on both sides via the mounting portion 22. Various methods can be used to install the mounting portion 22 to the outer surface of the housing 1 or the base plate 41 of the radiator, such as welding, insertion, bonding, and screw connection. The specific method can be selected according to the actual needs of those skilled in the art.

[0052] Example 2: such as Figure 7 As shown, the guide plate 2 is V-shaped and installed on the outside of the housing 1 through its open end; that is, the guide plate 2 includes two guide sections 21, which are arranged in a V-shape between each other. Each guide section 21 can be a straight plate structure or an arc plate structure. The guide plate 2 can be welded or inserted into the outer surface of the housing 1 or the base plate 41 of the heat sink on both sides through its open end.

[0053] Of course, to make the installation of the air deflector 2 easier, such as... Figure 7 and Figure 8As shown, a mounting part 22 can be provided extending from the guide section 21 at the open end of the guide plate 2, allowing the guide plate 2 to be installed via the mounting part 22 using methods such as welding, bonding, insertion, and screw connection. The mounting part 22 can be configured in various ways, such as... Figure 7 As shown, each guide section 21 extends inward or outward to form a mounting section 22; it can also be as follows: Figure 8 As shown, the ends of the two guide sections 21 are connected by an extended mounting section 22 to form a triangular structure. If the triangular structure formed by the guide plate 2 is an isosceles triangle, the mounting section 22 serves as the base for mounting the guide plate 2; if the triangular structure formed by the guide plate 2 is an equilateral triangle, any side can serve as the mounting section 22 for mounting the guide plate 2.

[0054] It is understood that both of the above examples can meet the requirements of this application, but considering that the V-shaped or triangular structure of the guide plate 2 can have a certain guiding effect on the airflow, the above example two is preferred for the guide plate 2 in this embodiment.

[0055] Those skilled in the art should know that when the heat-generating device is working, most of the heat is absorbed by the heat sink installed in the heat dissipation cavity 101, but some heat remains inside the sealed cavity 100 and cannot be absorbed. Over time, this will cause the internal temperature of the sealed cavity 100 to exceed the set value, affecting the normal operation of the heat-generating device. To further ensure the working safety of the power equipment, the heat absorbed by the heat sink can be dissipated by the cooperation of the first fan group 3 and the guide plate 2, while the heat inside the sealed cavity 100 can be dissipated by an additional heat exchange module.

[0056] In this embodiment, as Figure 1 and Figure 3 As shown, to reduce or avoid the mutual interference between the heat dissipation of the sealed cavity 100 and the heat dissipation of the radiator, a heat exchange zone and a heat dissipation zone can be formed on the outside of the housing 1 by an extended partition plate 6. A guide plate 2 is installed in the heat dissipation zone and perpendicular to the partition plate 6, so that the heat dissipation zone can be divided into two heat dissipation cavities 101 by the guide plate 2; the heat-generating devices installed in the sealed cavity 100 all correspond to the heat dissipation zone. A heat exchange module is provided in the heat exchange zone, and the heat exchange module is used to exchange heat in the sealed cavity 100.

[0057] Specifically, there are various structures for heat exchange modules that can achieve the above functions. For ease of understanding, one such structure will be explained in detail below. Figure 1 and Figure 3As shown, the heat exchange module includes a heat exchanger 7 and at least one second fan assembly 8; the heat exchanger 7 can absorb heat within the sealed cavity 100, and the second fan assembly 8 is installed at the air inlet of the heat exchanger 7 to provide airflow to the air inlet of the heat exchanger 7, thereby dissipating the heat absorbed by the heat exchanger 7.

[0058] It should be understood that the specific structure and working principle of the heat exchanger 7 and the second fan assembly 8 are well known to those skilled in the art, and therefore will not be described in detail here. The second fan assembly 8 may include one or more fans, depending on the structural dimensions and performance of the heat exchanger 7. The specific number of fans in the second fan assembly 8 can be set according to the specific structure of the heat exchanger 7; if the heat exchanger 7 has only one air inlet, i.e., ... Figure 1 As shown, the number of second fan groups 8 is one at this time; if the heat exchanger 7 has two air inlets, that is, as Figure 3 As shown, the number of second fan groups 8 is two at this time.

[0059] The basic principles, main features, and advantages of this application have been described above. Those skilled in the art should understand that this application is not limited to the above embodiments. The embodiments and descriptions in the specification are merely the principles of this application. Various changes and modifications can be made to this application without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection claimed by this application is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation system for a power device, characterized in that, include: Housing; a sealed cavity is formed within the housing for mounting multiple heating devices; At least one deflector; The air guide plate is installed on the outside of the housing so that the housing forms independent heat dissipation cavities on both sides of the air guide plate; Multiple heat sinks; at least one heat sink is installed in each heat dissipation cavity, and the heat sink corresponds to the position of the heat-generating device in the sealed cavity; as well as At least one first fan assembly; the first fan assembly is correspondingly mounted on the side of the air guide plate away from the housing, the air guide plate being adapted to disperse the airflow generated by the first fan assembly to the heat dissipation cavities on both sides.

2. The heat dissipation system for power equipment as described in claim 1, characterized in that, The extension direction of the air guide plate is parallel to the edge of the housing, and each air guide plate corresponds to at least one first fan group; The guide plate is directly mounted on the surface of the housing; or, the guide plate is mounted on the substrate of the heat sink corresponding to the heat dissipation cavities on both sides.

3. The heat dissipation system for power equipment as described in claim 2, characterized in that, The guide plate is a straight plate and is vertically installed on the outside of the housing; Alternatively, the deflector may be T-shaped or L-shaped and mounted on the outside of the housing.

4. The heat dissipation system for the power device as described in claim 2, characterized in that, The guide plate is V-shaped and is installed on the outside of the housing through an open end; Alternatively, the deflector is triangular in shape and is mounted on the outside of the housing via one of its sides.

5. The heat dissipation system for power equipment as described in claim 2, characterized in that, Each heat dissipation cavity corresponds to a heat-generating device that includes at least one of a power device and a magnetic device; The airflow of the first fan group to both sides of the guide plate is adapted to be distributed according to the type and / or number of heat-generating devices corresponding to the heat dissipation cavities on both sides.

6. The heat dissipation system for the power device as described in claim 5, characterized in that, The first fan assembly distributes airflow differently on both sides of the guide vane by adjusting its relative position to the guide vane.

7. The heat dissipation system for the power device as described in claim 5, characterized in that, The number of the guide plate is one, and it is installed in the middle of the outer side of the housing; the heating devices in the sealed cavity are evenly distributed according to the position of the heat dissipation cavity.

8. The heat dissipation system for the power device as described in claim 5, characterized in that, When the heat dissipation cavity corresponds to a heat-generating device that includes both the power device and the magnetic device, the power device is installed close to the guide plate, and the magnetic device is installed far away from the guide plate. The heat sink installed in the heat dissipation cavity includes a first heat sink corresponding to the power device and a second heat sink corresponding to the magnetic device.

9. The heat dissipation system for the power device as described in any one of claims 2-8, characterized in that, The outer side of the housing is provided with a heat exchange area and a heat dissipation area by means of an extended partition plate. The guide plate is installed in the heat dissipation area and perpendicular to the partition plate, and the heating device installed in the sealed cavity corresponds to the heat dissipation area; a heat exchange module is provided in the heat exchange area, and the heat exchange module is used to exchange heat in the sealed cavity.

10. The heat dissipation system for the power device as described in claim 9, characterized in that, The heat exchange module includes a heat exchanger and at least one second fan assembly; the heat exchanger is used to absorb heat in the sealed cavity, and the second fan assembly is installed at the air inlet of the heat exchanger to provide airflow to the air inlet of the heat exchanger.

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