Heat dissipation substrate structure

Abstract

The utility model belongs to the technical field of heat dissipation, and particularly relates to a heat dissipation substrate structure which comprises a heat conduction substrate. The first outer side wall of the heat conduction substrate and the heating source carry out heat transfer; a connecting groove is concavely formed in the second outer side wall of the heat conducting substrate; the two end parts of the connecting groove respectively extend to the outer side edge of the heat conducting substrate, and the heat conducting substrate is provided with solder paste blocking pieces at the end parts of the connecting groove; a connecting boss is arranged on the bottom face of the connecting groove and used for being connected with heat pipe soldering tin. A solder paste anti-overflow channel is arranged between the outer side wall of the connecting boss and the inner side wall of the connecting groove, and the solder paste anti-overflow channel is arranged in the length direction of the connecting groove; during connection, the surface of the connecting boss is coated with solder paste, then the heat pipe and the connecting boss are heated and welded, the overflowing solder paste enters the solder paste anti-overflow channel, and meanwhile, the solder paste blocking piece is used for blocking, so that the solder paste cannot form salient points or warp on the second outer side wall and the outer side edge of the heat conduction substrate, and a good heat conduction effect is achieved.

Description

Technical Field

[0001] This utility model belongs to the field of heat dissipation technology, and in particular relates to a heat dissipation substrate structure. Background Technology

[0002] A heat pipe is a highly efficient heat-conducting component. The interior of a heat pipe contains capillary structures; the internal gaps of these capillary structures are used to hold the condensate. When the heat pipe is heated, the condensate absorbs heat and evaporates to form water vapor. When the water vapor travels through the heat pipe to the cooler end, it releases heat and condenses back into condensate. The condensate is then transferred back to the warmer end of the heat pipe through the capillary action of the capillary structures. This cycle of vaporization and liquefaction of the condensate rapidly transfers heat from the heat pipe, effectively reducing the surface heat of the heat source.

[0003] Heat transfer between heat pipes and heat sources is typically aided by a heat-conducting plate, which is then connected to the heat pipe using solder paste. During connection, the solder paste tends to flow freely on the flat heat-conducting plate and overflows from the surface to the side edges when connecting the heat pipe. This causes warping of the flat surface of the heat-conducting plate, reducing heat transfer efficiency and thus decreasing the overall heat transfer effect. Utility Model Content

[0004] The purpose of this utility model is to provide a heat dissipation substrate structure, which aims to solve the technical problem in the prior art that solder paste easily flows around on the heat-conducting plate and overflows from the surface of the heat-conducting plate to the side edge when connecting heat pipes, causing poor warping of the heat-conducting plate surface and thus weakening the heat transfer effect.

[0005] To achieve the above objectives, this utility model provides a heat dissipation substrate structure, including a thermally conductive substrate; the thermally conductive substrate is used to transfer heat from a heat source to a heat pipe; the first outer sidewall of the thermally conductive substrate transfers heat with the heat source; a connecting groove is recessed on the second outer sidewall of the thermally conductive substrate; the two ends of the connecting groove extend to the outer edge of the thermally conductive substrate, and a solder paste baffle is provided at the end of the connecting groove on the thermally conductive substrate; a connecting boss is provided on the bottom surface of the connecting groove, and the connecting boss is used to solder with the heat pipe; a solder paste anti-overflow channel is provided between the outer sidewall of the connecting boss and the inner sidewall of the connecting groove, and the solder paste anti-overflow channel is provided along the length direction of the connecting groove.

[0006] Optionally, the surface of the connecting boss is recessed with a plurality of intersecting solder paste guide grooves; the ends of the solder paste guide grooves extend to the outer side wall of the connecting boss to communicate with the solder paste anti-overflow channel.

[0007] Optionally, the thermally conductive substrate has an end anti-overflow recess at the end of the connection groove, the end anti-overflow recess is connected to the connection groove, and the solder paste baffle is provided at the end anti-overflow recess; the width of the end anti-overflow recess is greater than the width of the connection groove.

[0008] Optionally, with the bottom surface of the solder paste anti-overflow channel as the reference surface, the height of the solder paste baffle is greater than or equal to the height of the connecting boss; the height difference between the solder paste baffle and the connecting boss is less than half of the heat pipe orifice diameter.

[0009] Optionally, the connecting groove includes a central groove and side grooves; the central groove is arranged along the straight line of the central axis of the heat-conducting substrate; the side grooves are located on one or both sides of the central groove.

[0010] Optionally, a plurality of connecting grooves are provided; the heat-conducting substrate is polygonal; each outer edge of the heat-conducting substrate is connected to the end of at least one connecting groove.

[0011] Optionally, a heat source connection portion is provided in the middle of the first outer sidewall of the thermally conductive substrate, and thermally conductive silicone grease is provided between the heat source connection portion and the heat source.

[0012] Optionally, the heat source connection portion is provided with a groove structure; the first outer side wall of the heat-conducting substrate is provided with a heat source contact portion next to the heat source connection portion, and the heat source contact portion contacts the surface of the heat source to transfer heat.

[0013] Optionally, a plurality of threaded holes are provided between the first outer sidewall and the second outer sidewall of the heat-conducting substrate, and the heat source is provided with threaded mating holes corresponding to the threaded holes, and the bolt passes through the threaded holes to be adapted to the threaded mating holes for connection.

[0014] Compared with the prior art, the above-mentioned technical solutions in the heat dissipation substrate structure provided by the present invention have at least one of the following technical effects:

[0015] The heat-conducting substrate has a connecting boss in the connecting groove for soldering with the heat pipe. There is a solder paste anti-overflow channel between the connecting boss and the connecting groove along the length of the connecting groove. During connection, solder paste is applied to the surface of the connecting boss, and then the heat pipe is heated and soldered to the connecting boss. The solder paste overflowing during the soldering process enters the solder paste anti-overflow channel. At the same time, a solder paste baffle is provided at the end of the connecting groove to block it, so that the solder paste will not form bumps or warp on the second outer wall and outer edge of the heat-conducting substrate, which has a good heat conduction effect. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the structure of the second outer side wall of this utility model.

[0018] Figure 2This is a cross-sectional view of the present invention.

[0019] Figure 3 This is another sectional view of the present invention.

[0020] Figure 4 This is a schematic diagram of the structure of the first outer side wall of this utility model.

[0021] The following are the labeling elements in the figure:

[0022] 1. Thermally conductive substrate; 11. Connecting groove; 111. Central groove; 112. Side groove; 12. End anti-overflow position; 121. Solder paste stop; 13. Connecting boss; 131. Solder paste guide groove; 132. Solder paste anti-overflow channel; 133. Solder paste; 14. Heat source connection part; 141. Thermal grease; 15. Heat source contact part; 16. Threaded hole;

[0023] 2. Heat source;

[0024] 3. Heat pipe. Detailed Implementation

[0025] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the embodiments of the present invention, and should not be construed as limiting the present invention.

[0026] In the description of the embodiments of this utility model, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0027] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0028] In this embodiment of the invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment of the invention according to the specific circumstances.

[0029] In the first embodiment of this utility model, a heat dissipation substrate structure is provided, as shown in the reference. Figures 1-3 The system includes a heat-conducting substrate 1; the heat-conducting substrate 1 is a plate-shaped structure made of aluminum alloy, and the heat-conducting substrate 1 is used to transfer the heat of the heat source 2 (such as electronic components) to the heat pipe 3; the first outer side wall of the heat-conducting substrate 1 transfers heat to the heat source 2, and the heat transfer method can be set to direct contact connection, or it can be set to assist heat conduction through thermal paste; the second outer side wall of the heat-conducting substrate 1 is recessed with a connecting groove 11, and the second outer side wall is arranged opposite to the first outer side wall.

[0030] Further, refer to Figure 1 and Figure 3 The two ends of the connecting groove 11 extend to the edge of the heat-conducting substrate 1 respectively. The heat-conducting substrate 1 is provided with solder paste baffles 121 at the ends of the connecting groove 11. The bottom surface of the connecting groove 11 is provided with a connecting boss 13, which is used to solder with the heat pipe 3. A solder paste anti-overflow channel 132 is provided between the outer wall of the connecting boss 13 and the inner wall of the connecting groove 11. The solder paste anti-overflow channel 132 is provided along the length direction of the connecting groove 11.

[0031] Compared with the prior art, the above-mentioned one or more technical solutions in the heat dissipation substrate structure provided by the present utility model embodiment have at least one of the following technical effects: the connecting groove 11 of the heat-conducting substrate 1 is provided with a connecting boss 13 for soldering connection with the heat pipe 3, and a solder paste anti-overflow channel 132 is provided between the connecting boss 13 and the connecting groove 11 along the length direction of the connecting groove 11; during connection, solder paste 133 is applied to the surface of the connecting boss 13, and then the heat pipe 3 is heated and soldered to the connecting boss 13. The solder paste 133 overflowing during the soldering process enters the solder paste anti-overflow channel 132. At the same time, a solder paste baffle 121 is provided at the end of the connecting groove 11 to block it, so that the solder paste 133 will not form bumps or warp on the second outer side wall and outer edge of the heat-conducting substrate 1, and has a good heat conduction effect.

[0032] In another embodiment of this utility model, reference is made to Figure 1The surface of the connecting boss 13 is recessed with a plurality of intersecting solder paste guide grooves 131. The solder paste guide grooves 131 are formed by cutting on the surface of the connecting boss 13 through a cutting process. The ends of the solder paste guide grooves 131 extend to the outer side wall of the connecting boss 13 to communicate with the solder paste overflow channel 132. The solder paste guide grooves 131 are used to increase the contact area between the connecting boss 13 and the solder paste 133 to enhance the connection stability. At the same time, excess solder paste 133 can be guided along the solder paste guide grooves 131 to the position where solder paste 133 is lacking or into the solder paste overflow channel 132 to evenly coat the solder paste 133 and reduce the solder paste 133 from condensing into bumps or warping.

[0033] In another embodiment of this utility model, reference is made to Figure 1 The thermally conductive substrate 1 has an end anti-overflow position 12 recessed at the end of the connecting groove 11. The end anti-overflow position 12 is connected to the connecting groove 11. The solder paste baffle 121 is provided at the end anti-overflow position 12. The width of the end anti-overflow position 12 is greater than the width of the connecting groove 11. The end anti-overflow position 12 and the solder paste anti-overflow channel 132 are interconnected and surround the outer periphery of the connecting boss 13 to effectively limit the overflow of solder paste 133 on the connecting boss 13.

[0034] In another embodiment of this utility model, reference is made to Figure 2 With the bottom surface of the solder paste anti-overflow channel 132 as the reference surface, the height of the solder paste baffle 121 is greater than or equal to the height of the connecting boss 13; there is a height difference between the solder paste baffle 121 and the connecting boss 13. When the heat pipe 3 is connected to the connecting boss 13, the outer wall of the heat pipe 3 can abut against the top surface of the solder paste baffle 121 for positioning. At this time, a gap is formed between the heat pipe 3 and the connecting boss 13 to accommodate the solder paste 133, and the solder paste 133 is not easy to overflow from the end of the connecting groove 11; the height difference between the solder paste baffle 121 and the connecting boss 13 is less than half of the diameter of the heat pipe 3, so as to shorten the connection distance between the heat pipe 3 and the heat-conducting substrate 1 and improve the heat conduction efficiency.

[0035] In another embodiment of this utility model, reference is made to Figure 1 The connecting groove 11 includes a central groove 111 and a side groove 112. The central groove 111 is arranged along the straight line of the central axis of the heat-conducting substrate 1. The side groove 112 is located on one or both sides of the central groove 111. The central groove 111 and the side groove 112 cooperate with each other to expand the connection range between the heat pipe 3 and the heat-conducting substrate 1 and improve the heat conduction efficiency. Specifically, the central heat pipe 3 connected to the central groove 111 is set as the main heat dissipation structure of the heat source 2, and the heat on the heat-conducting substrate 1 can be transferred to the central heat pipe 3. The side heat pipe 3 connected to the side groove 112 is set as an auxiliary heat dissipation structure, and one or more of them are evenly arranged on one or both sides of the central heat pipe 3.

[0036] In another embodiment of this utility model, reference is made to Figure 1The connecting groove 11 has several grooves; the heat-conducting substrate 1 is polygonal, such as quadrilateral; each outer edge of the heat-conducting substrate 1 is connected to the end of at least one connecting groove 11, so that the heat pipe 3 can be connected to the heat-conducting substrate 1 in different directions, thus improving the flexibility of use.

[0037] In another embodiment of this utility model, reference is made to Figure 3 A heat source connection portion 14 is provided in the middle of the first outer side wall of the thermally conductive substrate 1. Thermally conductive grease 141 is provided between the heat source connection portion 14 and the heat source 2. The thermally conductive grease 141 is used to quickly transfer the heat from the heat source 2 to the thermally conductive substrate 1. The heat source connection portion 14 is provided with a groove structure. The thermally conductive grease 141 is filled in the groove structure to shorten the distance between the thermally conductive substrate 1 and the heat source 2. A heat source contact portion 15 is provided on the side of the heat source connection portion 14 on the first outer side wall of the thermally conductive substrate 1. The heat source contact portion 15 contacts the surface of the heat source 2 to transfer heat. The cooperation between the thermally conductive grease 141 and the heat source contact portion 15 allows the heat from the heat source 2 to be quickly transferred to the thermally conductive substrate 1.

[0038] In another embodiment of this utility model, reference is made to Figure 4 A plurality of threaded holes 16 are provided between the first outer side wall and the second outer side wall of the heat-conducting substrate 1. The heat source 2 is provided with threaded mating holes corresponding to the threaded holes 16. Bolts pass through the threaded holes 16 to be adapted to the threaded mating holes for connection, so that the heat-conducting substrate 1 and the heat source 2 are threadedly connected.

[0039] The rest of this embodiment is the same as that in Embodiment 1. Features not explained in this embodiment are explained using the methods in Embodiment 1, and will not be repeated here.

[0040] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of this utility model. It should not be construed that the specific implementation of this utility model is limited to these descriptions. For those skilled in the art, the architectural form of this utility model can be flexibly varied without departing from its concept, and a series of products can be derived. Any simple deductions or substitutions should be considered as falling within the patent protection scope defined by the submitted claims.

Claims

1. A heat dissipation substrate structure, comprising a thermally conductive substrate (1); the thermally conductive substrate (1) is used to transfer heat from a heat source (2) to a heat pipe (3); characterized in that, The first outer sidewall of the heat-conducting substrate (1) transfers heat to the heat source (2); the second outer sidewall of the heat-conducting substrate (1) is recessed with a connecting groove (11); the end of the connecting groove (11) extends to the edge of the heat-conducting substrate (1), and the heat-conducting substrate (1) is provided with a solder paste baffle (121) at the end of the connecting groove (11); the bottom surface of the connecting groove (11) is provided with a connecting boss (13), which is used to solder with the heat pipe (3); a solder paste anti-overflow channel (132) is provided between the outer sidewall of the connecting boss (13) and the inner sidewall of the connecting groove (11), and the solder paste anti-overflow channel (132) is arranged along the length direction of the connecting groove (11).

2. The heat dissipation substrate structure according to claim 1, characterized in that, The surface of the connecting boss (13) is recessed with a plurality of intersecting solder paste guide grooves (131); the ends of the solder paste guide grooves (131) extend to the outer side wall of the connecting boss (13) to communicate with the solder paste anti-overflow channel (132).

3. The heat dissipation substrate structure according to claim 1 or 2, characterized in that, The thermally conductive substrate (1) has an end anti-overflow position (12) recessed at the end of the connecting groove (11). The end anti-overflow position (12) is connected to the connecting groove (11). The solder paste baffle (121) is provided at the end anti-overflow position (12). The width of the end anti-overflow position (12) is greater than the width of the connecting groove (11).

4. The heat dissipation substrate structure according to claim 1 or 2, characterized in that, With the bottom surface of the solder paste anti-overflow channel (132) as the reference surface, the height of the solder paste baffle (121) is greater than or equal to the height of the connecting boss (13); the height difference between the solder paste baffle (121) and the connecting boss (13) is less than half of the diameter of the heat pipe (3).

5. The heat dissipation substrate structure according to claim 1 or 2, characterized in that, The connecting groove (11) includes a central groove (111) and a side groove (112); the central groove (111) is arranged along the straight line of the central axis of the heat-conducting substrate (1); the side groove (112) is arranged on one side or both sides of the central groove (111).

6. The heat dissipation substrate structure according to claim 1 or 2, characterized in that, The connecting groove (11) is provided with a plurality of grooves; the heat-conducting substrate (1) is polygonal; each outer edge of the heat-conducting substrate (1) is connected to the end of at least one of the connecting grooves (11).

7. The heat dissipation substrate structure according to claim 1 or 2, characterized in that, A heat source connection portion (14) is provided in the middle of the first outer side wall of the heat-conducting substrate (1), and thermal grease (141) is provided between the heat source connection portion (14) and the heat source (2).

8. The heat dissipation substrate structure according to claim 7, characterized in that, The heat source connection part (14) is provided with a groove structure; the first outer side wall of the heat-conducting substrate (1) is provided with a heat source contact part (15) on the side of the heat source connection part (14), and the heat source contact part (15) contacts the surface of the heat source (2) to transfer heat.

9. The heat dissipation substrate structure according to claim 1 or 2, characterized in that, A plurality of threaded holes (16) are provided between the first outer side wall and the second outer side wall of the heat-conducting substrate (1). The heat source (2) is provided with threaded mating holes corresponding to the threaded holes (16). Bolts pass through the threaded holes (16) to be adapted to the threaded mating holes for connection.

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