Diamond wire outer circle machining equipment

By combining the linear movement and rotation device of the diamond wire outer diameter machining equipment with vacuum chuck fixation, the problems of large workload, high cost and cracking in semiconductor crystal material grinding are solved, realizing efficient and low-cost one-time cutting and forming of outer diameter and OFF edge.

CN223519379UActive Publication Date: 2025-11-07SHANGHAI YUYUAN TECHNOLOGY CO LTD
View PDF 0 Cites 1 Cited by

Patent Information

Application Number
CN202423139256.9
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-19
Publication Date
2025-11-07
Estimated Expiration
2034-12-19

AI Technical Summary

Technical Problem

Existing technologies for processing semiconductor crystal materials suffer from problems such as large grinding workload, high cost, severe grinding wheel wear, and crystal cracking, especially when grinding the outer ring material, resulting in waste and low yield.

Method used

A diamond wire external diameter machining equipment is used, which combines linear movement and rotation with vacuum chuck fixation. Diamond wire is used for grinding, which reduces the amount of grinding on the crystal material, and the vacuum chuck reduces the clamping force to avoid crystal cracking.

Benefits of technology

It reduces the workload and grinding wheel consumption in grinding processes, reduces production costs, improves the yield, avoids crystal cracking, and achieves efficient one-time cutting and shaping of the outer circle and OFF edge.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223519379U_ABST
    Figure CN223519379U_ABST
Patent Text Reader

Abstract

The utility model discloses a diamond wire outer circle machining device, which belongs to the technical field of diamond wire cutting machining and comprises a base, an outer circle machining device and a cutting device. The linear moving device comprises a moving platform, a moving driving source, a screw rod driving part, a guide wheel part and a protective cover; the rotating device is used for providing rotating power for the processed material; the vacuum chuck is used for adsorbing and fixing the processed material in vacuum; the diamond wire cutting device comprises a tensioning reel, a driving reel, a plurality of groups of driven reels and a diamond wire; after machining, the semiconductor crystal blank is divided into the machined crystal with the standard size on the inner side and the redundant crystal circular ring waste on the outer side, so that the workload of grinding machining and the abrasion consumption of a grinding wheel are greatly reduced, the production cost is reduced, meanwhile, the problem that in the prior art, part of crystals crack in the machining process is effectively solved, and the machining quality is improved. And the economical efficiency is improved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The utility model belongs to diamond wire cutting processing technical field, especially relate to a diamond wire external circle processing equipment. BACKGROUND

[0002] Silicon carbide, lithium tantalate, lithium niobate and other semiconductor materials, due to their unique excellent physical and chemical properties, are widely used in high temperature, high frequency, high power, low energy consumption, optical technology industry and other fields, and the related industry is rapidly developing in China.

[0003] The common processing technology of the crystal material at present is as follows: 1 crystal orientation - 2 plane grinding machine processes two end surfaces of the crystal - 3 external circle grinding machine grinds the external circle of the crystal to obtain a crystal with a quasi-standard diameter - 4 external circle grinding machine precisely grinds the silicon carbide crystal with a quasi-standard diameter to obtain a crystal with a standard diameter - 5 plane grinding machine grinds the OFF surface (plane) of the external circle - 6 multi-wire cutting machine cuts the crystal into a wafer - 7 wafer grinding - 8 wafer polishing - 9 wafer detection and cleaning.

[0004] There are several common pain points in the external circle processing procedure of the crystal at present.

[0005] 1. In the process of grinding the excess material of the external circle into powder by the grinding wheel to obtain a crystal with a quasi-standard diameter, the entire external circle needs to be processed into powder, which is a large workload, the grinding wheel and the machine tool are greatly consumed, and the processing cost is high;

[0006] 2. Some crystal materials are expensive, and grinding the external circle into powder will cause great waste. At a unit price of 1000 yuan per kilogram, one ton of material ground into powder will cause a direct economic loss of 1 million yuan, not including the cost of manpower and material resources in the processing process;

[0007] 3. In the process of clamping and processing on the grinding machine, the clamping force is large, and in the coarse grinding process, the feed amount is large, and the grinding force is also large, so the phenomenon of cracking of the crystal during processing often occurs, which reduces the yield and causes economic loss. Utility model content

[0008] The utility model provides a diamond wire external circle processing equipment to solve the problems in the above background technology.

[0009] To achieve the above object, the utility model provides the following technical scheme: a diamond wire external circle processing equipment, the base provides the installation foundation for the equipment;

[0010] The rack provides the installation foundation for the equipment;

[0011] The linear moving device comprises a moving platform, a moving driving source, a screw driving part, a guide rail part and a shield.

[0012] A rotating device for providing rotating power for the material to be processed;

[0013] A vacuum chuck for vacuum-adsorbing and fixing the material to be processed;

[0014] A diamond wire cutting device, a tensioning winding wheel, a driving winding wheel, a plurality of sets of driven winding wheels and a diamond wire.

[0015] Further, the linear moving device comprises:

[0016] A guide rail component arranged on the base, comprising a guide rail and a slider linearly sliding on the guide rail;

[0017] A moving platform connected to the slider linearly sliding on the guide rail component, for realizing linear movement of the material to be processed;

[0018] A moving driving source connected to the screw driving component through a shaft coupling, for driving the screw driving component to rotate to drive the moving platform to linearly translate;

[0019] A screw driving component for converting the rotating motion of the moving driving source into horizontal linear motion;

[0020] A protective cover for isolating the cooling liquid and the processing powder in the processing process, and for preventing the cooling liquid and the processing powder from entering the guide rail component and the screw driving component.

[0021] Further, the rotating device comprises:

[0022] A rotating device housing for providing a mounting basis for constituent parts of the rotating device;

[0023] A turntable bearing mounted on the rotating device housing for providing rotating support for the rotating device;

[0024] A turntable bearing seat for mounting the turntable bearing and providing physical support for the turntable bearing;

[0025] A rotating platform mounted in the inner ring of the turntable bearing for providing a rotating output platform;

[0026] A rotating connecting piece for connecting the rotating platform and the vacuum chuck;

[0027] A rotating driving source mounted in the rotating device housing for providing rotating power for the rotating device;

[0028] A driving source protective cover mounted on the rotating device housing for isolating the rotating driving source from the external environment;

[0029] A speed reduction device is connected to the rotary drive source at one end and connected to the rotary platform at the other end, for reducing the rotational speed of the rotary drive source output by a speed reduction ratio and outputting the reduced rotational speed to the rotary platform.

[0030] Further, the vacuum chuck is threadedly connected with the rotary connecting piece, the surface of the vacuum chuck is a plane structure, and a plurality of staggered grooves are arranged on the upper surface of the vacuum chuck in the circumferential direction and the diameter direction.

[0031] Further, the driving winding wheel is arranged on the surface of the rack, and the driving winding wheel is connected with the output end of the driving source arranged in the rack through a shaft coupling, the tension winding wheel and the driven winding wheel are rotationally connected with the base through shafts, and the surface of the tension winding wheel, the diamond wire and the driven winding wheel is sequentially sleeved with the diamond wire.

[0032] Further, the tension winding wheel is also the driven winding wheel.

[0033] The beneficial effects of the utility model are:

[0034] 1. Without processing all the excess crystal materials on the outer circle into powder to obtain standard diameter crystals, high-speed diamond wire is applied for grinding processing, only the crystal ring area with the diameter and width of the diamond wire needs to be processed into powder, and after processing, the semiconductor crystal blank is divided into the processed crystal with the inner side quasi-standard size and the excess crystal ring waste on the outer side, so that the grinding processing workload and the abrasion consumption of the grinding wheel are greatly reduced, and the production cost is reduced.

[0035] 2. The outer circle and the OFF edge (flat edge) of the crystal can be cut and formed at one time, instead of the traditional process of grinding the outer circle by using an outer circle grinding machine and grinding the OFF edge by using a surface grinding machine, so that time, labor and processing cost are saved.

[0036] 3. When there is a local defect on the periphery of the crystal, eccentric clamping is needed for the outer circle grinding machine processing, adjustment is difficult, processing time is long, and processing difficulty is great, but the utility model only needs to offset the crystal on the chuck by a certain distance, almost without increasing the workload, and is convenient to use.

[0037] 4. The vacuum chuck is used for fixing the crystal, the clamping force of the crystal is greatly reduced, the grinding force is very small, the cracking problem in the processing process of part of the crystals in the prior art is effectively solved, and the economy is improved. BRIEF DESCRIPTION OF DRAWINGS

[0038] Figure 1 It is a three-dimensional structure schematic view of the utility model;

[0039] Figure 2 It is a three-dimensional structure schematic view of the rotary device of the utility model;

[0040] Figure 3 It is the overhead structure schematic view of the base of the utility model;

[0041] Figure 4 It is the front view structure schematic view of the rotating device of the utility model.

[0042] In the figure:

[0043] 1, base; 2, vacuum chuck; 3, rotating device; 31, speed reducer; 32, rotating connecting piece; 33, rotating platform; 34, rotary table bearing seat; 35, rotary table bearing; 36, drive source protective cover; 37, rotating device shell; 38, rotating drive source; 4, tensioning winding wheel; 5, diamond wire; 6, driving winding wheel; 7, driven winding wheel; 8, moving platform; 9, support; 10, rotating device mounting plate; 11, screw driving part; 12, moving drive source; 13, guide rail part; 14, protective cover; 15, rack; 16, material to be processed. DETAILED DESCRIPTION

[0044] In order to further understand the utility model content, characteristics and efficacy of the utility model, the following examples are cited, and the following is described in detail with reference to the drawings.

[0045] Embodiment:

[0046] Please refer to Figure 1 - Figure 4 A diamond wire outer circle processing equipment, comprising:

[0047] The base 1 provides the installation foundation for the equipment, and the base 1 is a square box structure, the bottom of which is placed on the ground;

[0048] The linear moving device comprises a moving platform 8, a moving drive source 12, a screw driving part 11, a guide rail part 13 and a protective cover 14, and is used to push the rotating device 3 to move linearly horizontally, so that the linear moving device moves the vacuum chuck 2 through the rotating device 3, the vacuum chuck 2 pushes the workpiece to be processed to move, and the workpiece to be processed is conveniently moved to the diamond wire 5;

[0049] The rotating device 3 is used to provide rotating power for the material to be processed;

[0050] The vacuum chuck 2 is used to vacuum adsorb and fix the material to be processed;

[0051] The diamond wire cutting device includes a tensioning winding wheel 4, a driving winding wheel 6, several sets of driven winding wheels 7, and diamond wire 5. The driving winding wheel 6 is connected to the output end of the drive source installed in the frame 15. The tensioning winding wheel 4 and the driven winding wheels 7 are rotatably connected to the base 1 through a rotating shaft. The diamond wire 5 is sequentially sleeved on the surfaces of the tensioning winding wheel 4, the driving winding wheel 6, and the driven winding wheels 7. The tensioning winding wheel 4 is also the driven winding wheel 7. When the output end of the drive source drives the driving winding wheel 6 to rotate, the driving winding wheel 6 pulls the tensioning winding wheel 4 and the driven winding wheels 7 to rotate at high speed through the diamond wire 5. The driven winding wheels 7 follow the driving winding wheel 6 to rotate at high speed under the drive of the diamond wire 5. Under the action of the tensioning winding wheel 4, the diamond wire 5 forms a section of diamond wire 5 with a certain tension between the two winding wheels.

[0052] In other embodiments, the linear motion device includes:

[0053] The guide rail component 13 is disposed on the base 1 and includes a guide rail and a slider that slides linearly on the guide rail;

[0054] The mobile platform 8 has a slider that slides linearly on the guide rail component 13 to achieve linear movement of the material being processed.

[0055] The mobile drive source 12 is connected to the lead screw drive component 11 via a coupling, and is used to drive the lead screw drive component 11 to rotate so as to drive the mobile platform 8 to move linearly.

[0056] The lead screw drive component 11 is used to convert the rotational motion of the movable drive source 12 into linear motion. The lead screw drive component 11 includes a lead screw bearing seat, a lead screw arranged parallel to the guide rail component 13, a coupling, and a lead screw nut connected to the lead screw. When the movable drive source 12 rotates, the motion is transmitted to the lead screw through the coupling so that the movable drive source 12 rotates together, driving the lead screw nut to convert the rotational motion into linear motion.

[0057] The protective cover 14 is used to isolate the coolant and machining powder during the machining process, and to prevent the coolant and machining powder from entering the guide rail component 13 and the lead screw drive component 11.

[0058] In other embodiments, the rotating device 3 includes:

[0059] The rotating device housing 37 serves as a mounting base for the components of the rotating device 3;

[0060] The turntable bearing 35 is mounted on the housing 37 of the rotating device and provides rotational support for the rotating device 3.

[0061] Turntable bearing housing 34 is used to mount turntable bearing 35 and provide physical support for turntable bearing 35;

[0062] A rotating platform 33 is installed in the inner ring of the rotary bearing seat 34 to provide a rotating output platform;

[0063] A rotating connecting piece 32 is used to connect the rotating platform 33 and the vacuum chuck 2;

[0064] A rotating driving source 38 is installed in the rotating device housing 37 to provide rotating power for the rotating device 3.

[0065] A driving source protection cover 36 is installed in the rotating device housing 37 to isolate the rotating driving source from the external environment.

[0066] A speed reduction device 31 is connected to one end of the rotating driving source 38 and the other end of the rotating platform 33 to reduce the rotating speed of the rotating driving source 38 output according to the speed reduction ratio and output to the rotating platform 33.

[0067] In other embodiments, the vacuum chuck 2 is threadedly connected with the rotating connecting piece 32, the surface of the vacuum chuck 2 is a flat structure, and a plurality of staggered grooves are arranged on the upper surface of the vacuum chuck 2 in the circumferential direction and the diameter direction.

[0068] In other embodiments, the driving winding wheel 6 is connected to the output end of the driving source installed in the rack 15 through a shaft coupling, the tension winding wheel 4 and the driven winding wheel 7 are rotationally connected to the base 1 through a rotating shaft, the surface of the tension winding wheel 4, the driving winding wheel 6 and the driven winding wheel 7 is sequentially sleeved with the diamond wire 5, and when the diamond wire 5 with a certain tension between the two winding wheels is driven by the driving winding wheel 6 to move at high speed, the processed material fixed on the vacuum chuck 2 is translated in the direction close to the diamond wire 5 under the driving of the rotating device 3, and the diamond wire 5 cuts into the processed material in the diameter direction of the processed material.

[0069] The base 1 is a square frame structure, the bottom of which is placed on the ground, the guide rail component 13 and the screw driving component 11 are installed on the base 1, the screw driving component 11 is connected with the sliding block of the guide rail component 13 and the screw nut of the screw driving component 11 respectively, and the screw driving component 11 and the guide rail component 13 are symmetrically and threadedly installed with the shroud 14 on both sides; during operation, the moving driving source 12 rotates, the moving driving source 12 drives the screw driving component 11 to rotate, and the screw in the screw driving component 11 threadedly cooperates with the screw nut, so that the screw nut moves linearly on the surface of the screw, and drives the moving platform 8 connected with the screw nut to move linearly along the sliding block arranged in the guide rail component 13.

[0070] The rotating device 3 is fixed on the rotating device mounting plate 10, the rotating device mounting plate 10 is connected with the support 9, the support 9 is fixed on the moving platform 8, when the moving driving source 12 rotates, the rotating device 3 moves linearly along the guide rail part 13 together with the moving platform 8, the rotating driving source 38 is installed on the rotating device shell 37, the rotating output shaft of the rotating driving source 38 is connected with the speed reducer 31, the driving source protection cover 36 is installed on the outer periphery of the rotating device shell 37, the rotating driving source 38 is isolated from the external environment; the speed reducer 31 is installed on the rotating device shell 37, the input end of the speed reducer 31 is connected with the rotating driving source 38, and the output end is connected with the rotating platform 33; when the rotating driving source 38 rotates, the rotating platform 33 rotates at a reduced speed after being decelerated by the speed reducer 31; the turntable bearing seat 34 is installed on the rotating device shell 37, the outer ring of the turntable bearing 35 is installed on the turntable bearing seat 34, and the inner ring of the turntable bearing 35 is connected with the rotating platform 33, which provides physical support for the rotating platform 33, so that it can bear larger axial and radial forces when rotating; the rotating connecting piece 32 is installed on the rotating platform 33 and rotates synchronously with the rotating platform 33 during work; the vacuum chuck 2 is connected with the rotating connecting piece 32 and rotates synchronously with the rotating connecting piece 32 during work, which provides vacuum adsorption force for the material to be machined and firmly adsorbs the material to be machined on the vacuum chuck 2.

[0071] The diamond wire cutting device is composed of a driving winding wheel 6, at least one driven winding wheel, and at least one tension winding wheel 4. The diamond wire cutting device is composed of a driving winding wheel 6, two driven winding wheels 7, and a tension winding wheel 4. The tension winding wheel 4 can also be a driven winding wheel 7. The annular diamond wire 5 is wound on the four winding wheels. After being tensioned by the tension winding wheel 4, the diamond wire moves at high speed during work with the high-speed rotation of the driving winding wheel 6.

[0072] When the device works, firstly, the driving power source connected with the mobile driving source 12 and the active winding wheel 6 starts to rotate, and when the active winding wheel 6 rotates at high speed, the active winding wheel 6 drives the diamond wire 5 to move, and when the diamond wire 5 moves, the diamond wire 5 drives the tension winding wheel 4 and the driven winding wheel 7 to rotate at high speed, the processed material adsorbed on the vacuum chuck 2 moves along with the vacuum chuck 2 and the screw driving part 11 to the direction of the diamond wire 5, approaches and is cut by the diamond wire 5 in the diameter direction, when the diamond wire 5 cuts into the diameter size position of the processed material to be processed, the mobile driving source 12 stops rotating, the processed material stops moving to the direction of the diamond wire 5, at the same time, the rotary driving source 38 starts to rotate, drives the rotary connecting piece 32, the vacuum chuck 2 and the processed material to rotate, finally separates the inner circle of the processed material from the outer circle, and completes the outer circle cutting processing, in the process of the outer circle cutting processing, the rotary driving source 38 and the mobile driving source 12 can also be linked according to the set program to process the outer circle of different shapes.

[0073] The basic principle, main features and advantages of the utility model are shown and described above. It should be understood by the person skilled in the art that the utility model is not limited by the above-mentioned embodiments, the above-mentioned embodiments and the description in the specification are only preferred examples of the utility model, and are not used to limit the utility model, various changes and improvements of the utility model can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The protection scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A diamond wire external circle processing apparatus characterized by comprising: The application relates to a device for processing materials, which comprises the following parts: a base (1) for providing a mounting foundation for the device; a rack (15) for providing a mounting foundation for the device; a linear moving device, which comprises a moving platform (8), a moving driving source (12), a screw driving part (11), a guide rail part (13) and a protective cover (14); a rotating device (3) for providing rotating power for the processed material; a vacuum chuck (2) for vacuum adsorbing and fixing the processed material; a diamond wire cutting device, which comprises a tensioning winding wheel (4), a driving winding wheel (6), a plurality of groups of driven winding wheels (7) and a diamond wire (5).

2. The diamond wire outer circle processing apparatus according to claim 1, characterized by: The linear moving device comprises: the guide rail part (13) arranged on the base (1) and comprising a guide rail and a slider sliding linearly on the guide rail; the moving platform (8) connected to the slider sliding linearly on the guide rail part (13) and used for realizing linear movement of the processed material (16); the moving driving source (12) connected to the screw driving part (11) through a shaft coupling and used for driving the screw driving part (11) to rotate so as to drive the moving platform (8) to linearly translate; the screw driving part (11) used for converting the rotating motion of the moving driving source (12) into horizontal linear motion; the protective cover (14) used for isolating cooling liquid and processing powder in the processing process and preventing the cooling liquid and the processing powder from entering the guide rail part (13) and the screw driving part (11).

3. The diamond wire outer circle processing apparatus according to claim 1, characterized in that: The rotating device (3) comprises: a rotating device shell (37) for providing a mounting foundation for constituent parts of the rotating device (3); a rotating table bearing (35) mounted on the rotating device shell (37) and used for providing rotating support for the rotating device (3); a rotating table bearing seat (34) used for mounting the rotating table bearing (35) and providing physical support for the rotating table bearing (35); a rotating platform (33) mounted on an inner ring of the rotating table bearing (35) and used for providing a rotating output platform; a rotating connecting piece (32) used for connecting the rotating platform (33) and the vacuum chuck (2); a rotating driving source (38) mounted in the rotating device shell (37) and used for providing rotating power for the rotating device (3); a driving source protective cover (36) mounted on the rotating device shell (37) and used for isolating the rotating driving source from the external environment; a speed reduction device (31) connected to one end of the rotating driving source (38) and connected to the other end of the rotating platform (33) and used for reducing the rotating speed of the rotating driving source (38) according to a speed reduction ratio and outputting the rotating speed to the rotating platform (33).

4. The diamond wire outer circle processing apparatus according to claim 1, characterized by: The vacuum chuck (2) is threadedly connected with the rotating connecting piece (32), the surface of the vacuum chuck (2) is a plane structure, and a plurality of staggered grooves are arranged on the upper surface of the vacuum chuck (2) in the circumferential direction and the diameter direction.

5. The diamond wire outer circle processing apparatus according to claim 1, characterized by: The active winding wheel (6) is arranged on the surface of the frame (15), and the active winding wheel (6) is connected with the output end of the driving source installed in the frame (15) through a shaft coupling, the tension winding wheel (4) and the driven winding wheel (7) are rotationally connected with the base (1) through rotating shafts, and the surfaces of the tension winding wheel (4), the diamond wire (5) and the driven winding wheel (7) are sequentially sleeved with the diamond wire (5).

6. The diamond wire outer circle processing apparatus according to claim 5, characterized by: The tension winding wheel (4) is also the driven winding wheel (7).

Citation Information

Cited By

  • Adjusting device for grooving of photovoltaic silicon wafer guide wheel

    CN121468804A