Wafer UV film cutting device

Abstract

The utility model provides a wafer UV film cutting device which comprises a frame body, a linear module, a first film cutting assembly, a rotating module and a second film cutting assembly, the linear module and the rotating module are fixedly connected with the frame body, the first film cutting assembly is in sliding connection with the linear module, the first film cutting assembly comprises a first film cutter, and the second film cutter comprises a second film cutter. The first film cutter horizontally moves and lifts above the UV film, and is used for cutting the UV film into a plurality of sheet-shaped UV films; and the second film cutting assembly is connected with the rotating module, the second film cutting assembly comprises a second film cutting knife, and the second film cutting knife performs lifting motion and rotating motion above the sheet-shaped UV film and is used for cutting the sheet-shaped UV film to be consistent with the wafer in size and shape. According to the full-automatic UV film cutting device, full-automatic UV film cutting is provided, the UV film is effectively prevented from being polluted, and the cutting efficiency is improved; according to the utility model, at least two film cutting knives are adopted to cut the UV film respectively, the UV film is cut into a sheet shape firstly and then is cut into the same size and shape as the wafer, and the waste of the UV film is effectively avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer preparation technical field especially relates to a wafer UV film cutting device. BACKGROUND

[0002] With the rapid development of science and technology, the semiconductor industry occupies an increasingly important position in the global scope. In this industry, wafer is the key raw material for manufacturing integrated circuits, and wafer cutting is indispensable in the packaging process of wafer. Before cutting, a layer of adhesive film is attached to the back of the wafer, which can maintain the integrity of the wafer during cutting and reduce problems such as collapse, displacement and falling during cutting.

[0003] The adhesive film is usually fed in the form of a roll, and the film is unwound and tensioned before cutting. In the prior art, the cutting adhesive film is manually cut or cut using a tool, and then transported to the application site. This processing method is inefficient, easy to contaminate the cutting adhesive film, requires skilled workers, causes a lot of material loss, and affects the cutting efficiency of the adhesive film. SUMMARY

[0004] The utility model provides a wafer UV film cutting device to more exactly solve the above-mentioned problems of easy contamination, low efficiency and large loss.

[0005] The utility model is implemented by the following technical solutions:

[0006] The utility model provides a wafer UV film cutting device, which comprises a frame body, a linear module, a first film cutting assembly, a rotary module and a second film cutting assembly. The linear module and the rotary module are fixedly connected with the frame body. The first film cutting assembly is slidingly connected with the linear module. The first film cutting assembly comprises a first film cutting knife, which moves horizontally and vertically above the UV film and cuts the UV film into multiple sheet-shaped UV films. The second film cutting assembly is connected with the rotary module. The second film cutting assembly comprises a second film cutting knife, which moves vertically and rotates above the UV film and cuts the sheet-shaped UV film to be consistent with the size and shape of the wafer.

[0007] Further, the linear module comprises a sliding rail, a sliding block, a lead screw and a linear module driving part. The sliding rail is fixedly connected with the frame body and perpendicular to the frame body. One end of the sliding block is connected with the lead screw, and the other end is slidingly connected with the sliding rail. The output end of the linear module driving part is connected with the lead screw and drives the lead screw to move axially. The lead screw drives the sliding block to move along the direction of the linear module.

[0008] Further, the first film cutting assembly comprises a first cylinder connecting plate, a first film cutting cylinder, a first cutter connecting plate and a first film cutting cutter, the first film cutting cutter is located at the side of the first cutter connecting plate and fixedly connected with one end of the first cutter connecting plate, the output end of the first film cutting cylinder is fixedly connected with the other end of the first cutter connecting plate and used for driving the first film cutting cutter to move up and down.

[0009] Further, the first film cutting cylinder is located at the side of the first cylinder connecting plate and fixedly connected with the first cylinder connecting plate, the first cylinder connecting plate is located at the side of the linear module and perpendicular to the linear module, the first cylinder connecting plate is connected with the sliding block, and the sliding block is used for driving the first film cutting assembly to move along the direction of the linear module.

[0010] Further, the linear module and the first film cutting cylinder are cooperatively moved to drive the first film cutting cutter to move along the direction of the linear module and move up and down.

[0011] Further, the rotary module comprises a mounting platform, a rotary driving piece, a supporting frame, an output shaft and a rotary platform, the mounting platform is fixedly connected with the frame body, the supporting frame is located on the mounting platform and used for supporting the output shaft, the rotary driving piece is located on the mounting platform and used for driving the output shaft to rotate, the rotary platform is located below the mounting platform, the mounting platform is provided with a through hole, the output shaft penetrates through the through hole and connected with the rotary platform, and the output shaft is used for driving the rotary platform to rotate.

[0012] Further, the second film cutting assembly comprises a second cylinder connecting plate, a second film cutting cylinder, a second cutter connecting plate and a second film cutting cutter, the second film cutting cutter is located at the side of the second cutter connecting plate and fixedly connected with one end of the second cutter connecting plate, the output end of the second film cutting cylinder is fixedly connected with the other end of the second cutter connecting plate and used for driving the second film cutting cutter to move up and down.

[0013] Further, the second film cutting cylinder is located at the side of the second cylinder mounting plate and fixedly connected with the second cylinder mounting plate, the second cylinder mounting plate is located at the side of the rotary platform and connected with the rotary platform, and the rotary platform drives the second film cutting assembly to rotate.

[0014] Further, the rotary module and the second film cutting cylinder are cooperatively moved to drive the second film cutting cutter to rotate and move up and down.

[0015] Further, the frame body is vertically placed, and the linear module, the first film cutting assembly, the rotary module and the second film cutting assembly are all arranged on the same side of the frame body.

[0016] The utility model discloses a beneficial effect:

[0017] The utility model proposes a kind of wafer UV film cutting device, including frame body, linear module, first film cutting component, rotary module and second film cutting component, linear module and rotary module are fixedly connected with frame body, first film cutting component is slidably connected with linear module, first film cutting component includes first film cutting knife, first film cutting knife is above UV film horizontal motion and lifting motion, and is used to cut UV film into multiple sheet UV film;Second film cutting component is connected with rotary module, and second film cutting component includes second film cutting knife, and second film cutting knife is above sheet UV film lifting motion and rotary motion, and is used to cut sheet UV film to be consistent with wafer size and shape.The utility model proposes full automation to UV film cutting, effectively avoid the pollution of UV film, improve cutting efficiency;The utility model proposes using at least two film cutting knives to cut UV film respectively, cut UV film into sheet first again cut to be consistent with wafer size and shape, effectively avoid the waste of UV film. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is the overall structural drawing of a kind of wafer UV film cutting device in an embodiment of the utility model;

[0019] Figure 2 It is another angle perspective view of a kind of wafer UV film cutting device in an embodiment of the utility model;

[0020] Figure 3 It is the Figure 2 partial enlarged schematic view of place A in the utility model;

[0021] Figure 4 It is another angle perspective view of a kind of wafer UV film cutting device in an embodiment of the utility model;

[0022] Figure 5 It is the Figure 4 partial enlarged schematic view of place B in the utility model.

[0023] Label explanation: 1, frame body;2, linear module;3, first film cutting component;4, rotary module;5, second film cutting component;21, slide rail;22, sliding block;23, screw;24, linear module driving part;31, first cylinder connecting plate;32, first film cutting cylinder;33, first cutting knife connecting plate;34, first film cutting knife;41, mounting platform;42, rotary driving part;43, support frame;44, output shaft;45, rotary platform;51, second cylinder connecting plate;52, second film cutting cylinder;53, second cutting knife connecting plate;54, second film cutting knife. DETAILED DESCRIPTION

[0024] In order to make the technical scheme of the utility model more clear and complete, the utility model will be further described below in combination with the drawings.

[0025] Please refer to Figure 1 The utility model provides a kind of wafer UV film cutting device, including frame body 1, linear module 2, first film cutting component 3, rotary module 4 and second film cutting component 5, linear module 2 and rotary module 4 are respectively fixedly connected with frame body 1, first film cutting component 3 is slidably connected with linear module 2, first film cutting component 3 includes first film cutting knife 34, first film cutting knife 34 is horizontally moved and lifts and falls above the UV film, and is used to cut UV film into multiple sheet UV film;Second film cutting component 5 is connected with rotary module 4, and second film cutting component 5 includes second film cutting knife 54, second film cutting knife 54 is lifted and falls and rotates above the sheet UV film, and is used to cut sheet UV film to be consistent with wafer size and shape.

[0026] In the embodiment, the frame body 1 is vertically placed, the linear module 2, the first film cutting assembly 3, the rotating module 4 and the second film cutting assembly 5 are arranged on the same side of the frame body 1, the linear module 2 is perpendicular to the frame body 1 in the horizontal direction and is fixedly connected with the frame body 1; the first film cutting assembly 3 is located on the side of the linear module 2 and is slidably connected with the linear module 2, the linear module 2 is used for driving the first film cutting assembly 3 to move horizontally relative to the UV film; the first film cutting assembly 3 comprises a first film cutting cylinder 32 and a first film cutting knife 34, the output end of the first film cutting cylinder 32 is connected with the first film cutting knife 34 and is used for driving the first film cutting knife 34 to move up and down relative to the UV film, the linear module 2 and the first film cutting cylinder 32 are cooperatively moved to drive the first film cutting knife 34 to move horizontally and up and down relative to the UV film, and the first film cutting knife 34 is used for cutting the UV film into a sheet-shaped UV film; the rotating module 4 is located on the side of the first film cutting assembly 3 and is fixedly connected with the frame body 1, the output end of the rotating module 4 is connected with the second film cutting assembly 5 and is used for driving the second film cutting assembly 5 to rotate; the second film cutting assembly 5 comprises a second film cutting cylinder 52 and a second film cutting knife 54, the output end of the second film cutting cylinder 52 is connected with the second film cutting knife 54 and is used for driving the second film cutting knife 54 to move up and down relative to the UV film, the rotating module 4 and the second film cutting cylinder 52 are cooperatively moved to drive the second film cutting knife 54 to rotate and move up and down relative to the UV film, and the second film cutting knife 54 is used for cutting the sheet-shaped UV film to be consistent with the shape and size of the wafer; in a specific embodiment, the UV film is a roll material, the UV roll film is unfolded and tensioned to the film cutting device directly below through a film pulling device, the wafer to be pasted is placed directly below the UV film and the rotating module 4, the first film cutting knife 34 moves horizontally and up and down relative to the UV film and is used for cutting the UV film into a sheet-shaped UV film, the sheet-shaped UV film falls and covers the wafer surface, the second film cutting knife 54 moves up and down and rotates relative to the UV film, the second film cutting knife 54 rotates along the wafer edge and cuts the sheet-shaped UV film to be consistent with the shape and size of the wafer, and the cutting of the wafer UV film is completed.

[0027] The full-automatic UV film cutting device provided by the utility model effectively avoids pollution of the UV film and improves cutting efficiency; the utility model provides at least two film cutting knives for cutting the UV film, the UV film is first cut into a sheet-shaped UV film and then cut to be consistent with the size and shape of the wafer, and waste of the UV film is effectively avoided.

[0028] Please refer to Figure 1The linear module 2 includes a slide rail 21, a slide block 22, a screw rod 23, and a linear module driving element 24. The slide rail 21 is fixedly connected with the frame body 1 and is perpendicular to the frame body 1. The slide block 22 is connected with the screw rod 23 at one end and is in sliding connection with the slide rail 21 at the other end. The linear module driving element 24 is connected with the screw rod 23 at the output end and is used to drive the screw rod 23 to move axially. The screw rod 23 drives the slide block 22 to move along the direction of the linear module 2.

[0029] In a specific implementation, the linear module 2 is fixedly connected with the frame body 1, is located above the UV film, and is perpendicular to the UV film in the horizontal direction. The linear module 2 includes the slide rail 21, the slide block 22, the screw rod 23, and the linear module driving element 24. The slide rail 21 is fixedly connected with the frame body 1 and is perpendicular to the UV film in the horizontal direction. The slide block 22 is connected with the screw rod 23 at one end and is in sliding connection with the slide rail 21 at the other end. The linear module driving element 24 is connected with the screw rod 23 at the output end and is used to drive the screw rod 23 to move axially. The screw rod 23 drives the slide block 22 to move along the direction of the linear module 2. In a specific embodiment, the linear module driving element 24 is a servo motor.

[0030] Please refer to Figure 1 The first film cutting assembly 3 includes a first cylinder connecting plate 31, a first film cutting cylinder 32, a first cutter connecting plate 33, and a first film cutting cutter 34. The first film cutting cutter 34 is located at the side of the first cutter connecting plate 33 and is fixedly connected with one end of the first cutter connecting plate 33. The output end of the first film cutting cylinder 32 is fixedly connected with the other end of the first cutter connecting plate 33 and is used to drive the first film cutting cutter 34 to move up and down relative to the UV film. The first film cutting cylinder 32 is located at the side of the first cylinder connecting plate 31 and is fixedly connected with the first cylinder connecting plate 31. The first cylinder connecting plate 31 is located at the side of the linear module 2 and is perpendicular to the linear module 2. The first cylinder connecting plate 31 is fixedly connected with the slide block 22. The slide block 22 is used to drive the first film cutting assembly 3 to move along the direction of the linear module 2. The linear module 2 and the first film cutting cylinder 32 cooperate to drive the first film cutting cutter 34 to move along the direction of the linear module 2 and to move up and down.

[0031] In a specific implementation: the first film cutting assembly 3 includes a first cylinder connecting plate 31, a first film cutting cylinder 32, a first cutter connecting plate 33, and a first film cutting knife 34. The first film cutting knife 34 is located on the side of the first cutter connecting plate 33 and is fixedly connected to one end of the first cutter connecting plate 33. The output end of the first film cutting cylinder 32 is fixedly connected to the other end of the first cutter connecting plate 33, and the first film cutting cylinder 32 is used to drive the first film cutting knife 34 to move up and down relative to the UV film; the first film cutting cylinder 32 is located on the side of the first cylinder connecting plate 31 and is fixedly connected to the first cylinder connecting plate 31. The first cylinder connecting plate 31 is located on the side of the linear module 2 and is perpendicular to the linear module 2. The first cylinder connecting plate 31 is fixedly connected to the sliding block 22, and the sliding block 22 is used to drive the first film cutting assembly 3 to move along the direction of the linear module 2. The linear module 2 and the first film cutting cylinder 32 cooperate to move to drive the first film cutting knife 34 to move along the direction of the linear module 2 and to move up and down. In a specific embodiment, the first film cutting knife 34 adopts a round knife. The first film cutting knife 34 can be externally connected to a driving member. The driving member drives the first film cutting knife 34 to rotate. The film cutting is more sharp, and the film cutting jam is effectively avoided. The UV film is unwound and tensioned below the film cutting device. The wafer to be pasted is located below the rotating module 4 and the UV film. The movement of the first film cutting knife 34 is outside the wafer. The first film cutting knife 34 rotates and descends to the UV film, and then moves horizontally to cut the UV film into a sheet-shaped UV film. The sheet-shaped UV film falls and covers the surface of the wafer.

[0032] Please refer to Figure 1 The rotating module 4 includes a mounting platform 41, a rotating driving member 42, a support frame 43, an output shaft 44, and a rotating platform 45. The mounting platform 41 is fixedly connected to the frame body 1. The support frame 43 is located on the mounting platform 41 and is used to support the output shaft 44. The rotating driving member 42 is located on the mounting platform 41 and is used to drive the output shaft 44 to rotate. The rotating platform 45 is located below the mounting platform 41. The mounting platform 41 is provided with a through hole. The output shaft 44 penetrates through the through hole and is connected to the rotating platform 45 and is used to drive the rotating platform 45 to rotate. The second film cutting assembly 5 includes a second cylinder connecting plate 51, a second film cutting cylinder 52, a second cutter connecting plate 53, and a second film cutting knife 54. The second film cutting knife 54 is located on the side of the second cutter connecting plate 53 and is fixedly connected to one end of the second cutter connecting plate 53. The output end of the second film cutting cylinder 52 is fixedly connected to the other end of the second cutter connecting plate 53 and is used to drive the second film cutting knife 54 to move up and down relative to the UV film. The second film cutting cylinder 52 is located on the side of the second cylinder mounting plate and is fixedly connected to the second cylinder mounting plate. The second cylinder mounting plate is located on the side of the rotating platform 45 and is connected to the rotating platform 45. The rotating platform 45 drives the second film cutting assembly 5 to rotate. The rotating module 4 and the second film cutting cylinder 52 cooperate to move to drive the second film cutting knife 54 to rotate and move up and down relative to the UV film.

[0033] In a specific implementation: the rotating module 4 includes a mounting platform 41, a rotating drive 42, a support frame 43, an output shaft 44 and a rotating platform 45, the mounting platform 41 is fixedly connected with the frame body 1 and is perpendicular to the frame body 1, the support frame 43 is located on the mounting platform 41, the support frame 43 is connected with the output shaft 44 and is used for supporting the output shaft 44, the rotating drive 42 is located on the mounting platform 41, the output end of the rotating drive 42 is connected with the output shaft 44 and is used for driving the output shaft 44 to rotate, the rotating platform 45 is located below the mounting platform 41, the mounting platform 41 is provided with a through hole, the output shaft 44 passes through the through hole and is connected with the rotating platform 45 and is used for driving the rotating platform 45 to rotate; the second film cutting assembly 5 is located below the mounting platform 41, the second film cutting assembly 5 includes a second cylinder connecting plate 51, a second film cutting cylinder 52, a second cutter connecting plate 53 and a second film cutter 54, the second film cutter 54 is located on the side of the second cutter connecting plate 53 and is fixedly connected with one end of the second cutter connecting plate 53, the output end of the second film cutting cylinder 52 is fixedly connected with the other end of the second cutter connecting plate 53 and is used for driving the second film cutter 54 to move up and down relative to the UV film; the second film cutting cylinder 52 is located on the side of the second cylinder mounting plate and is fixedly connected with the second cylinder mounting plate, the second cylinder mounting plate is located on the side of the rotating platform 45 and is connected with the rotating platform 45, the rotating platform 45 drives the second film cutting assembly 5 to rotate; the rotating module 4 and the second film cutting cylinder 52 cooperate to drive the second film cutter 54 to move up and down and rotate relative to the UV film; in a specific embodiment, the rotating drive 42 adopts a servo motor; the second film cutting cylinder 52 drives the second film cutter 54 to descend to the surface of the wafer covered with the sheet-shaped UV film, the rotating module 4 drives the second film cutter 54 to rotate along the outer edge of the wafer, cuts the sheet-shaped UV film to be consistent with the shape and size of the wafer, and completes the cutting of the wafer UV film; the UV film is first cut into a sheet shape and then cut to be consistent with the shape and size of the wafer, which effectively avoids the waste of UV film material.

[0034] The above is only the preferred embodiment of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A wafer UV film cutting device, characterized by, The application relates to a UV film cutting device, which comprises a frame, a linear module, a first film cutting assembly, a rotating module and a second film cutting assembly, wherein the linear module and the rotating module are fixedly connected with the frame, the first film cutting assembly is slidably connected with the linear module, the first film cutting assembly comprises a first film cutting knife, the first film cutting knife is horizontally moved and lifted above the UV film, and the first film cutting knife is used for cutting the UV film into a plurality of sheet-shaped UV films; the second film cutting assembly is connected with the rotating module, the second film cutting assembly comprises a second film cutting knife, the second film cutting knife is lifted and rotated above the sheet-shaped UV film, and the second film cutting knife is used for cutting the sheet-shaped UV film into a shape consistent with the size and shape of a wafer.

2. The wafer UV film cutting apparatus according to claim 1, wherein The linear module comprises a sliding rail, a sliding block, a screw rod and a linear module driving element, the sliding rail is fixedly connected with the frame and is perpendicular to the frame, one end of the sliding block is connected with the screw rod, the other end of the sliding block is slidably connected with the sliding rail, the output end of the linear module driving element is connected with the screw rod, and the linear module driving element is used for driving the screw rod to axially move, and the screw rod drives the sliding block to move along the direction of the linear module.

3. The wafer UV film cutting apparatus according to claim 2, wherein The first film cutting assembly comprises a first cylinder connecting plate, a first film cutting cylinder, a first cutting knife connecting plate and a first film cutting knife, the first film cutting knife is located at the side of the first cutting knife connecting plate and is fixedly connected with one end of the first cutting knife connecting plate, the output end of the first film cutting cylinder is fixedly connected with the other end of the first cutting knife connecting plate, and the first film cutting cylinder is used for driving the first film cutting knife to lift.

4. The wafer UV film cutting apparatus according to claim 3, wherein The first film cutting cylinder is located at the side of the first cylinder connecting plate and is fixedly connected with the first cylinder connecting plate, the first cylinder connecting plate is located at the side of the linear module and is perpendicular to the linear module, the first cylinder connecting plate is connected with the sliding block, and the sliding block is used for driving the first film cutting assembly to move along the direction of the linear module.

5. The wafer UV film cutting apparatus according to claim 4, wherein The linear module and the first film cutting cylinder are cooperatively moved to drive the first film cutting knife to move along the direction of the linear module and to lift.

6. The wafer UV film cutting apparatus according to claim 1, wherein The rotating module comprises a mounting platform, a rotating driving element, a support frame, an output shaft and a rotating platform, the mounting platform is fixedly connected with the frame, the support frame is located on the mounting platform and is used for supporting the output shaft, the rotating driving element is located on the mounting platform and is used for driving the output shaft to rotate, the rotating platform is located below the mounting platform, the mounting platform is provided with a through hole, the output shaft passes through the through hole and is connected with the rotating platform, and the output shaft is used for driving the rotating platform to rotate.

7. The wafer UV film cutting apparatus according to claim 6, wherein The second film cutting assembly comprises a second cylinder connecting plate, a second film cutting cylinder, a second cutting knife connecting plate and a second film cutting knife, the second film cutting knife is located at the side of the second cutting knife connecting plate and is fixedly connected with one end of the second cutting knife connecting plate, the output end of the second film cutting cylinder is fixedly connected with the other end of the second cutting knife connecting plate, and the second film cutting cylinder is used for driving the second film cutting knife to lift.

8. The wafer UV film cutting apparatus according to claim 7, wherein The second film cutting cylinder is located at the side of the second cylinder connecting plate and is fixedly connected with the second cylinder connecting plate.

9. The wafer UV film cutting apparatus according to claim 8, wherein, The rotating module and the second film cutting cylinder are cooperatively moved to drive the second film cutting knife to rotate and move up and down.

10. The wafer UV film cutting apparatus according to claim 1, wherein The frame body is vertically placed, and the linear module, the first film cutting assembly, the rotating module and the second film cutting assembly are all arranged on the same side of the frame body.

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