Wafer splitting jig

Abstract

The utility model provides a wafer splitting jig, and relates to the technical field of wafer production. The wafer splitting jig comprises a jig body and at least one cutting part, the jig body is provided with a first plane, and the first plane is used for being supported on the supporting surface; the jig body is provided with a jacking area opposite to the first plane, the jacking area is linear, and the orthographic projection, facing the first plane, of the jacking area is completely arranged in the first plane; the jig body is provided with concave areas between the jacking area and the first plane, and the concave areas are located on the two sides of the extending direction of the jacking area so that the jacking area can protrude out of the jig body; the cutting part is arranged at the first end of the jacking area, and the first end is located at the end, in the extending direction, of the jacking area and deviates from the first plane.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of wafer production, and particularly relates to a wafer dicing jig. BACKGROUND

[0002] In the whole process of wafer from substrate to chip, film plating, etching and patterning are performed multiple times, and the control of performance indexes such as film thickness and patterning effect of each process is quite strict, and then the wafer needs to be diced, the cross section thereof is scanned by a microscope (SEM, Scanning Electron Microscope) and the microstructure is analyzed to ensure the final effect of each process.

[0003] The current manual dicing method is to dice after scribing the front surface of the wafer, but the front surface scribing easily damages the microstructure of the wafer, and the microstructure of the cross section after dicing is unclear, which seriously affects the microscope scanning result. CONTENT OF THE UTILITY MODEL

[0004] One technical problem to be solved by the present disclosure is that the wafer diced by front surface scribing easily damages the microstructure of the wafer, which affects the microscope scanning result.

[0005] To solve the above technical problem, the present disclosure provides a wafer dicing device, which comprises:

[0006] A jig body, the jig body has a first plane for supporting on a support surface; the jig body is provided with a top holding area opposite to the first plane, the top holding area is linear, and the top holding area is completely projected into the first plane; the jig body has a recessed area between the top holding area and the first plane, and the recessed area is located on both sides of the extension direction of the top holding area, so that the top holding area protrudes from the jig body.

[0007] At least one cutting part, the cutting part is arranged at a first end of the top holding area, and the first end is located at the end of the extension direction of the top holding area and faces away from the first plane.

[0008] In some embodiments, the wafer dicing jig described above further comprises a force applying part.

[0009] The force applying part is arranged in the recessed area and protrudes from the jig body, and one side of the force applying part facing the first plane has a force applying surface for movably abutting against a user's finger.

[0010] In some embodiments, the wafer dicing jig described above, wherein the force applying surface is parallel to the first plane.

[0011] In some embodiments, the wafer dicing jig described above, wherein the force applying surface is perpendicular to the recessed area.

[0012] In some embodiments, the wafer dicing jig as described above, further comprising a support portion.

[0013] The support portion is disposed on the side of the force applying portion facing the first plane, and has a second plane flush with the first plane for supporting the support surface.

[0014] In some embodiments, the wafer dicing jig as described above, wherein the width of the supporting region is 0.01-0.3mm.

[0015] In some embodiments, the wafer dicing jig as described above, wherein the cutting portion protrudes from the supporting region.

[0016] The hardness of the cutting portion is greater than that of the wafer to be diced.

[0017] In some embodiments, the wafer dicing jig as described above, comprising two cutting portions.

[0018] The two cutting portions are respectively disposed at the two ends of the supporting region along the extension direction thereof.

[0019] In some embodiments, the wafer dicing jig as described above, wherein the jig body comprises a third plane and a fourth plane.

[0020] The third plane and the fourth plane are respectively disposed at the opposite ends of the first plane, and the ends of the third plane and the fourth plane away from the first plane are connected to form the supporting region.

[0021] In some embodiments, the wafer dicing jig as described above, wherein the inclination angle of the third plane and the fourth plane is 60-75 degrees.

[0022] The side of the third plane away from the fourth plane and the side of the fourth plane away from the third plane are covered with a buffer layer.

[0023] Through the above technical solution, the wafer dicing jig provided by the present disclosure sets the supporting region and the cutting portion in cooperation with the first plane, so that the back surface of the wafer to be diced can be directly scored and cut, and then the scored part is pressed by the supporting region, and the wafer to be diced is pressed downward on both sides of the supporting region by using the supporting region as a lever force point, realizing the manual and rapid dicing of the wafer, which does not affect the microstructure of the wafer and can improve the dicing efficiency. Effectively solves the problem that the front surface scoring of the wafer to be diced easily damages the microstructure of the wafer and affects the scanning result of the microscope. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained from these drawings without creative effort.

[0025] Figure 1 is a first structure schematic diagram of a wafer dicing jig disclosed by the embodiments of the present disclosure;

[0026] Figure 2 is a second structure schematic diagram of a wafer dicing jig disclosed by the embodiments of the present disclosure;

[0027] Figure 3 is a third structure schematic diagram of a wafer dicing jig disclosed by the embodiments of the present disclosure.

[0028] Explanation of reference signs:

[0029] 1, jig body; 2, cutting part; 3, top holding area; 4, force applying part; 5, supporting part; 6, fourth plane. DETAILED DESCRIPTION

[0030] The embodiments of the present disclosure will be further described in detail below with reference to the drawings and embodiments. The detailed description of the following embodiments and drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, and the present disclosure can be implemented in many different forms, and is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0031] The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully express the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these embodiments should be interpreted as merely exemplary, and not as a limitation.

[0032] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like are only for facilitating the description of the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0033] In addition, the "first", "second" and similar words used in the present disclosure do not represent any order, quantity or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0034] It should also be noted that in the description of the present disclosure, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection" should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between the first device and the second device, there can be an intermediate device between the specific device and the first device or the second device, or there can be no intermediate device.

[0035] All terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or excessively formalized sense, unless specifically defined here.

[0036] The currently adopted manual splitting method is to split after scribing on the front surface of the wafer, but scribing on the front surface is easy to damage the microstructure of the wafer, and the microstructure at the fracture surface after splitting is unclear, which seriously affects the microscope scanning result. Scribing on the back surface with the front surface of the wafer facing down will also cause wear of the front surface of the wafer due to the pressing force, which will also damage the microstructure inside the wafer.

[0037] The wafer splitting jig provided by the embodiment sets a protruding top holding area on the jig body, and sets a cutting part at the end of the top holding area, so that the wafer can be manually held to make the back surface of the wafer face the cutting part for scribing operation, avoiding the front surface of the wafer from being pressed and realizing scribing on the back surface of the wafer, thereby avoiding the damage to the microstructure inside the wafer; after scribing by the cutting part, the scribed part of the wafer can be directly attached to the top holding area to complete the manual pressing type splitting, which is efficient and fast.

[0038] Embodiment 1

[0039] Reference is made to the accompanying drawings Figure 1The embodiment discloses a wafer dicing jig which comprises a jig body 1 and at least one dicing part 2; the jig body 1 has a first plane for supporting on a support surface; the jig body 1 is provided with a top holding area 3 opposite to the first plane, the top holding area 3 is linear, and the top holding area 3 is completely projected into the first plane; the jig body 1 is provided with a recessed area between the top holding area 3 and the first plane, the recessed area is located on both sides of the extension direction of the top holding area 3, so that the top holding area 3 protrudes from the jig body 1; the dicing part 2 is arranged at a first end of the top holding area 3, and the first end is located at the end of the extension direction of the top holding area 3 and faces away from the first plane.

[0040] Specifically, in order to solve the problem that front-line dicing wafer is easy to damage the microstructure of the wafer and affect the scanning result of the microscope, the embodiment provides a wafer dicing jig, which is suitable for manual dicing operation, a first plane is arranged on the jig body 1 to realize stable placement of the jig body 1, and a top holding area 3 and a dicing part 2 protruding from the jig body 1 are arranged on the side opposite to the first plane, so that the wafer to be dicing can be operated in a suspended state on the back surface, without contacting any plane or workbench surface, thereby avoiding the damage of the down pressure to the microstructure of the wafer during the line operation; after the line operation, the line operation is directly pressed downward on the top holding area 3 to realize the dicing, without the need of operating the machine or changing the position of the wafer, thereby realizing the rapid dicing.

[0041] Among them, the wafer dicing jig provided by the embodiment is suitable for manual dicing operation, and the line operation and the down pressure dicing can be completed in one working position, without the need of switching the line tool and the dicing tool, thereby greatly improving the operation efficiency of the manual dicing.

[0042] Among them, the jig body 1 is a rigid structure, which can be a solid structure, a hollow structure or a frame structure, as long as it can provide a setting position for the first plane and the top holding area 3 and meet the down pressure during the down pressure dicing, for example: Figure 1 a triangular prism, for example: a circular cone, a prism, a structure in the form of a truncated cone, and the like. The size and shape of the first plane are not limited here, and can be designed and adjusted according to actual needs, for example: Figure 1The rectangle shown, for example: triangle, circle, trapezoid, etc. The first plane is used to support the support surface (not shown in the figure), the support surface is a stable surface such as a desktop, workbench, etc. In this embodiment, the jig body 1 can be placed and supported on the support surface through the first plane to provide stable support for the top holding area 3. The first plane can be covered with a rubber layer (not shown in the figure) or other materials that can increase friction to increase the friction between the first plane and the support surface and improve the stability of the jig body 1. The recessed area on the jig body 1 is between the top holding area 3 and the first plane and is located on both sides of the length direction of the top holding area 3. The height of the recessed area is lower than that of the top holding area 3, thereby providing space for the downward pressing of the wafer. The recessed area can be a planar area or a non-planar area as long as it meets the requirements of the downward pressing of the wafer.

[0043] Among them, the top holding area 3 is a straight line rigid structure, the side of the top holding area 3 away from the first plane has a very small surface width, the length direction of the top holding area 3 can be parallel to any direction of the first plane, the top holding area 3 can be a part of the jig body 1 or an additional structure provided on the jig body 1; In this embodiment, it can be a edge of the jig body 1, or a protrusion, blade, etc. provided additionally on the jig body 1. The top holding area 3 protrudes from the jig body 1, so that the scribed position of the scribed wafer can be directly attached and held on the top holding area 3, and then the wafer is pressed from top to bottom on both sides of the top holding area 3, so that the scribed position generates stress concentration under the action of the top holding area 3 to realize the rapid wafer splitting.

[0044] The cutting part 2 is a structure with a cutting function. In this embodiment, the cutting part 2 can be a material with a hardness greater than that of the wafer to be broken. For example, the wafer can be a silicon wafer, sapphire, or silicon carbide. When the wafer is a silicon wafer, the cutting part 2 can be silicon carbide, sapphire, or diamond. When the wafer is sapphire or silicon carbide, the cutting part 2 can be diamond. In this embodiment, the cutting part 2 can be arranged to protrude from the jig body 1. The protruding part can be, but is not limited to, a pointed part or a strip-shaped part. During the breaking operation, the operator needs to hold the wafer and align the position of the back of the wafer to be broken with the cutting part 2 to perform a straight-line motion, complete the scribing operation, and then place the scribed position on the top holding area 3 so that the scribed position is in contact with the top holding area 3. In this embodiment, the cutting part 2 can also be arranged to be flush with the side of the top holding area 3 away from the first plane. In this arrangement, the wafer can be directly slid on the top holding area 3 to achieve scribing, and after sliding, the scribed position can be directly in contact with the top holding area 3 without the need for position adjustment. In this embodiment, the number of cutting parts 2 can be designed and adjusted according to actual needs. For example, one cutting part 2 can be arranged at one end of the top holding area 3, and one cutting part 2 can be arranged at each end. In this embodiment, the cutting part 2 can be arranged on the top holding area 3 by welding or by adhesion.

[0045] According to the above, the wafer breaking jig provided by the present disclosure can directly scribe the back of the wafer to be broken, and then press the scribed position by the top holding area 3. The top holding area 3 is used as a leverage point to press the wafer to be broken on both sides of the top holding area 3, achieving a manual and rapid breaking of the wafer. This method does not affect the microstructure of the wafer and can improve the breaking efficiency. It effectively solves the problem that scribing the front of the wafer to be broken can easily damage the microstructure of the wafer and affect the scanning results of the microscope.

[0046] The term "and / or" in this document is only a description of the association relationship of the associated objects, indicating that the three relationships can exist, for example, A and / or B, which can be understood as: A and B can exist at the same time, A can exist alone, B can exist alone, and any one of the above three cases can exist.

[0047] In some embodiments, reference is made to the accompanying Figure 2 and the accompanying Figure 3 In this embodiment, the wafer breaking jig further includes a force applying part 4. The force applying part 4 is arranged in the recessed area and protrudes from the jig body 1. The side of the force applying part 4 facing the first plane has a force applying surface for movably contacting the user's finger.

[0048] It can be understood that, in order to ensure the convenience and safety of wafer dicing, the force applying part 4 is arranged in the embodiment, which is a rigid structure, protrudes outward from the recessed area to the jig body 1 and has a height lower than that of the top holding area 3, provides a force applying position for the dicing action, and has a height difference and part of the recessed area between the force applying part 4 and the top holding area 3. The operator can apply force simultaneously above the top holding area 3 and below the force applying part 4 to perform dicing, that is, the operator presses the wafer downward on the upper surface of the wafer with the thumb, and the index finger or other fingers apply force synchronously on the force applying surface with the thumb, thereby reducing the downward pressing force required by the thumb. The force applying surface in the embodiment can be in the form of a plane as shown in Figure 3 , Figure 2 an arc surface as shown in , an irregular surface, a surface with convex particles, a concave-convex surface corresponding to the fingers, and the like, as long as it can cooperate with the fingers to apply force. The force applying part 4 in the embodiment can be integrally formed with the jig body or additionally connected to the jig body 1, for example, by adhesion, welding, clamping, and the like.

[0049] In some embodiments, the wafer dicing jig provided in the embodiment provides that, in specific implementation, the force applying surface is parallel to the first plane.

[0050] It can be understood that, in order to realize the cooperation of the force applying surface with dicing, the force applying surface can be arranged in parallel to the first plane in the embodiment. In this arrangement, the structure of the side of the force applying part 4 facing the top holding area 3 is not limited and can be adjusted according to actual needs or manufacturing process design, as long as the space for pressing the wafer downward is sufficient. For example, it can be recessed in the direction of the first plane as shown in Figure 2 , or can be parallel to the force applying surface as shown in Figure 3 . The arrangement of the force applying surface parallel to the first plane in the embodiment makes the height difference between the force applying surface and the top holding area 3 larger, thereby reducing the pressing force required when pressing the wafer for dicing operation. The operator can use the thumb and other fingers, reduce the dicing difficulty, and improve the dicing efficiency.

[0051] In some embodiments, with reference to the accompanying Figure 3 , the wafer dicing jig provided in the embodiment provides that, in specific implementation, the force applying surface is perpendicular to the recessed area.

[0052] It can be understood that, in order to improve the operation convenience, the force applying surface can also be arranged in the form of being perpendicular to the recessed area in the embodiment. In this arrangement, the structure of the side of the force applying part 4 facing the top holding area 3 is not limited and can be adjusted according to actual needs or manufacturing process design, as long as the space for pressing the wafer downward is sufficient. For example, it can be recessed in the direction of the first plane as shown in Figure 2 , or can be parallel to the force applying surface as shown in Figure 3The force applying surface is vertically recessed in the embodiment, so that the height difference between the force applying surface and the top holding area 3 is small, and the operator can only use the thumb and the index finger or the thumb and the middle finger to operate the wafer splitting, thereby reducing the operation difficulty of the operator, and the other fingers can also be used to prepare to hold the wafer during the wafer splitting, thereby improving the safety of the wafer after the wafer splitting.

[0053] Further, with reference to the accompanying drawings Figure 3 The wafer splitting jig provided in the embodiment further includes a supporting part 5 in specific implementation.

[0054] It can be understood that, in order to improve the stability of the jig as a whole and ensure the strength of the force applying part 4, the supporting part 5 is arranged in cooperation with the force applying part 4 in the embodiment, and the supporting part 5 is a rigid structure, which can be a plate-shaped structure, a rod-shaped structure, a block-shaped structure, a frame structure, etc., as long as the supporting part 5 can provide the second plane flush with the first plane. The second plane of the supporting part 5 and the first plane of the jig body 1 are supported on the supporting surface at the same time, the stability of the jig as a whole is greatly improved, and a certain support can be provided when the wafer is pressed downward, so as to share the stress of the first plane.

[0055] In some embodiments, the wafer splitting jig provided in the embodiment includes a top holding area 3 with a width of 0.01 mm-0.3 mm in specific implementation.

[0056] It can be understood that, in order to ensure rapid splitting, the width of the top holding area 3 can be set to 0.01 mm-0.3 mm in the embodiment, for example, 0.01 mm, 0.1 mm, 0.22 mm, 0.3 mm, etc., which can be designed and adjusted according to actual needs, for example, according to the production line and the specifications of the wafer.

[0057] In some embodiments, with reference to the accompanying drawings Figure 3 The wafer splitting jig provided in the embodiment includes two cutting parts 2 in specific implementation, and the two cutting parts 2 are arranged at two ends of the top holding area 3 along the extension direction thereof.

[0058] It can be understood that, in order to improve the convenience of scribing, the cutting part 2 can be arranged at each end of the top holding area 3 in the embodiment, and then any one of the cutting parts 2 can be selected to perform scribing operation when scribing, thereby reducing the use limitation of the jig. It can be understood that, in the embodiment, the length of the top holding area 3 in the wafer breaking jig is greater than the diameter of the wafer, thereby ensuring that the diameter area corresponding to the scribing position of the wafer is completely matched and contacted by the top holding area, ensuring the integrity and continuity of the section, and avoiding problems such as uneven section or burr. It can be understood that, when the cutting part 2 is provided with two cutting parts 2, the wafer needs to be placed on the top holding area 2 between the two cutting parts 2 after scribing.

[0059] In some embodiments, the wafer breaking jig provided by the embodiment includes a third plane and a fourth plane 6 in specific implementation. The third plane and the fourth plane 6 are arranged at opposite ends of the first plane, and the ends of the third plane and the fourth plane 6 away from the first plane are connected to form a top holding area 3.

[0060] In order to reduce the process difficulty, the jig body 1 can be arranged in the form of a triangular prism in the embodiment, and the first plane, the third plane and the fourth plane 6 are all outer surfaces in the axial direction of the triangular prism. In this arrangement, the top holding area 3 is the edge of the triangular prism, and there is no need to additionally arrange the top holding area 3.

[0061] In some embodiments, the wafer breaking jig provided by the embodiment includes a third plane and a fourth plane 6 in specific implementation. The third plane and the fourth plane 6 are arranged at opposite ends of the first plane, and the ends of the third plane and the fourth plane 6 away from the first plane are connected to form a top holding area 3.

[0062] It can be understood that, in order to improve the breaking effect of the top holding area 3, the inclination angle of the third plane and the fourth plane 6 can be set to 60 degrees to 75 degrees in the embodiment. The greater the inclination of the third plane and the fourth plane 6 relative to the first plane, the smaller the width of the top holding area 3, the better the holding effect. For example, when the inclination angle of the third plane and the fourth plane 6 is set to 60 degrees, the included angle of the two of the top holding area 3 is 60 degrees. When the inclination angle of the third plane and the fourth plane 6 is set to 70 degrees, the included angle of the two of the top holding area 3 is 40 degrees. That is, the smaller the included angle between the third plane 6 and the fourth plane 6, the smaller the width of the top holding area 3 can be set, and the larger the recessed area reserved for wafer down-breaking. At the same time, a buffer layer can also be arranged on the third plane and the fourth plane 6 in the embodiment. The buffer layer can be, but is not limited to, sponge, rubber and other materials with elasticity, thereby being able to protect the wafer and avoid the broken wafer from colliding with the recessed area, thereby affecting the microstructure of the wafer.

[0063] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0064] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be replaced equivalently without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way.

Claims

1. A wafer dicing jig, characterized by, It comprises: A jig body, the jig body has a first plane for supporting on a support surface; the jig body is provided with a top holding area opposite to the first plane, the top holding area is linear, the top holding area is completely placed in the first plane towards the orthographic projection of the first plane; The jig body has a recessed area between the top holding area and the first plane, the recessed area is located on both sides of the extension direction of the top holding area, so that the top holding area protrudes from the jig body; At least one cutting part, the cutting part is provided at the first end of the top holding area, the first end is located at the end of the extension direction of the top holding area and away from the first plane.

2. The wafer dicing jig according to claim 1, characterized in that: It further comprises a force applying part; The force applying part is arranged in the recessed area, the force applying part protrudes from the jig body, and the side of the force applying part towards the first plane has a force applying surface for active contact with the user's fingers.

3. The wafer dicing jig according to claim 2, characterized in that: The force applying surface is parallel to the first plane.

4. The wafer dicing jig according to claim 2, characterized in that: The force applying surface is perpendicular to the recessed area.

5. The wafer dicing jig according to claim 2, characterized in that: It further comprises a supporting part; The supporting part is arranged on the side of the force applying part towards the first plane, and the supporting part has a second plane which is flush with the first plane for supporting on the support surface.

6. The wafer dicing jig according to claim 1, characterized in that: The width of the top holding area is 0.01mm-0.3mm.

7. The wafer dicing jig according to claim 1, characterized in that: The cutting part protrudes from the top holding area; The hardness of the cutting part is greater than the hardness of the wafer to be diced.

8. The wafer dicing jig according to claim 1, characterized in that: It comprises two cutting parts; The two cutting parts are respectively arranged at the two ends of the top holding area along the extension direction thereof.

9. The wafer dicing jig according to claim 1, characterized in that: The jig body comprises a third plane and a fourth plane; The third plane and the fourth plane are respectively arranged at the opposite ends of the first plane, and the end of the third plane and the fourth plane away from the first plane is connected to form the top holding area.

10. The wafer dicing jig according to claim 9, characterized in that: The inclination angle of the third plane and the fourth plane is 60-75 degrees; The side of the third plane away from the fourth plane and the side of the fourth plane away from the third plane are covered with a buffer layer.

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