Inflation disc structure

Abstract

The utility model relates to an inflation disc structure which is in gas connection with an inflation system and is used for filling gas into a semiconductor container. The inflation disc structure comprises a carrying disc and an air guide loop. The carrying disc is provided with an upper surface and a lower surface, and the upper surface is used for carrying the semiconductor container. The air guide loop is arranged on the lower surface of the carrying disc and provided with an air outlet channel and an air conveying channel. The air outlet channel penetrates from the lower surface of the carrying disc to the upper surface of the carrying disc. The gas conveying channel is of a groove structure and is arranged on the lower surface of the carrying disc. Gas provided by the inflation system flows through the gas conveying channel and the gas outlet channel and then is guided into the semiconductor container. The inflatable disc structure can simplify the structure, is easy to manufacture and assemble, can reduce external pipelines, and can increase the capacity of a photomask storage cabinet for accommodating a photomask container.

Description

TECHNICAL FIELD

[0001] The utility model belongs to a kind of container inflation technical field, specifically a kind of inflation disc structure for mask container. BACKGROUND

[0002] Electronic products continue to develop towards light, thin, small, high frequency, high performance and other characteristics, so that the core semiconductor components used in electronic products need to be miniaturized and have high performance, so the circuit pattern line diameter of existing semiconductor components has developed from microns to nanometers. The current semiconductor component manufacturing technology develops rapidly, and the lithography technology plays an important role. As long as a specific pattern needs to be formed on a semiconductor substrate or component, it needs to rely on the application of lithography technology, and the application of mask is the essence of lithography technology.

[0003] Since the mask uses exposure principle, the light source and the shadow with the corresponding pattern are projected onto the semiconductor component, and then the semiconductor layer with the required pattern is obtained through etching technology. However, there are many harmful substances such as particles, moisture, gas and chemical solvent molecules in the process, which will adhere to the surface of the mask, causing pollution on the surface of the mask. Any particles or pollution attached to the mask may cause quality deterioration of the semiconductor component pattern. Therefore, in general, the mask must be placed in a mask container with high cleanliness, good airtightness, low gas emission and high antistatic protection, so as to avoid particle pollution of the mask by providing a dust-free environment.

[0004] In order to further improve the cleanliness inside the mask container, the existing technology connects an inflation system to the mask container, so that the gas is introduced into the mask container by the inflation system, so as to avoid the mask from being polluted by particles in the mask container. These inflation systems can be applied to, such as, material loading and unloading workstations beside the process equipment, mask storage cabinets or mask transportation equipment. It usually uses an inflation disc as the interface to carry the mask container, such as the inflation disc stacked in the mask storage cabinet. The existing inflation disc is mainly composed of a carrier disc, which is connected to the inflation system by external pipeline. As for the mask storage cabinet, it places a plurality of mask containers up and down on the stacked inflation disc. The existing inflation disc generally has external pipeline and joint, which causes the upper and lower adjacent inflation discs to further consider avoiding the space interference of the above-mentioned external joint and pipeline. At present, about 5-8 centimeters need to be increased, which reduces the capacity of the mask storage cabinet that can accommodate mask containers.

[0005] In addition, when the reticle container is placed on the surface of the inflation tray, the reticle container cannot be positioned on the inflation tray smoothly due to the clamping direction or position deviation, and the tightness between the inflation tray and the air inlet valve of the reticle container is also affected, so that the dryness and humidity in the reticle container cannot be maintained, and therefore how to solve these problems is a very important issue and is also the issue to be solved by the utility model.

[0006] In view of the above-mentioned defects, the present inventors believe that it is necessary to improve, and based on many years of experience in related technology and product design and manufacture, and in the light of excellent design concepts, the above-mentioned disadvantages are researched and improved, and after continuous efforts, an inflation tray structure is successfully developed to overcome the inconvenience caused by the exposed pipeline and the difficulty in positioning the reticle container of the existing inflation tray. Content of the utility model

[0007] The main purpose of the utility model is to provide an inflation tray structure, which can simplify the structure, be easy to manufacture and assemble, and reduce external pipelines, and further increase the capacity of the reticle storage cabinet for storing reticle containers.

[0008] The main purpose of the utility model is to provide an inflation tray structure, which can automatically guide and correct the accurate positioning of the reticle container on the inflation tray when the reticle container is placed on the surface of the inflation tray, which will help the industrial applicability and practicality.

[0009] The main purpose of the utility model is to provide an inflation tray structure, which can further improve the tightness between the reticle container and the inflation tray, avoid the dryness and humidity in the reticle container, and effectively improve the cleanliness inside the reticle container.

[0010] To achieve the above-mentioned purposes, the utility model provides an inflation tray structure, in which a gas is connected to an inflation system to fill a semiconductor container with gas. The inflation tray structure comprises a tray and a gas guide circuit. The tray has an upper surface and a lower surface, and the upper surface is used to support the semiconductor container. The gas guide circuit is arranged on the lower surface of the tray, and the gas guide circuit has a gas outlet channel and a gas inlet channel. The gas outlet channel penetrates from the lower surface of the tray to the upper surface of the tray and is connected to the semiconductor container. The gas inlet channel is a groove structure arranged on the lower surface of the tray and is connected to the gas outlet channel and the inflation system respectively, so that the gas provided by the inflation system flows through the gas inlet channel and the gas outlet channel and is introduced into the semiconductor container.

[0011] In an embodiment of the inflation tray structure of the utility model, a channel bottom cover is further arranged, which is locked to the lower surface of the tray corresponding to the gas guide circuit, so that the groove structure forms a closed groove structure.

[0012] In an embodiment of the air filling tray structure of the present application, the upper surface of the tray has a placement area and at least one sensing element, wherein the sensing element is arranged in the placement area and used to detect whether the semiconductor container exists and is placed in the placement area.

[0013] In an embodiment of the air filling tray structure of the present application, at least one limiting block is further arranged around the placement area to limit the semiconductor container in the placement area when the tray carries the semiconductor container.

[0014] In an embodiment of the air filling tray structure of the present application, the limiting block has a guide slope arranged at the top end of the inner edge of the limiting block to guide the semiconductor container to be smoothly placed in the placement area.

[0015] In an embodiment of the air filling tray structure of the present application, a sealing ring is further arranged around the gas flow channel to increase the air tightness of the groove structure when the bottom cover of the gas flow channel is locked to the lower surface of the tray.

[0016] In an embodiment of the air filling tray structure of the present application, the gas guide circuit has a Y-shaped or T-shaped gas flow channel to improve the smoothness of the gas flow.

[0017] In an embodiment of the air filling tray structure of the present application, at least one gas nozzle is further arranged on the upper surface of the tray in a detachable manner to fill the semiconductor container with gas.

[0018] To achieve the above-mentioned purpose, the present application provides an air filling tray structure, wherein gas is connected to an air filling system to fill a semiconductor container with gas, and the air filling tray structure comprises a tray and at least one gas nozzle. The tray is gas-connectable to the semiconductor container and the air filling system, and has an upper surface and a lower surface, wherein the upper surface is used to carry the semiconductor container. The gas nozzle is arranged on the upper surface in a detachable manner and is gas-connectable to the tray to fill the semiconductor container with gas.

[0019] In an embodiment of the air filling tray structure of the present application, the lower surface further comprises a gas flow channel, and the gas is connected to the at least one gas nozzle.

[0020] In an embodiment of the air filling tray structure of the present application, the gas flow channel is a groove structure.

[0021] After referring to the drawings and the following embodiments, those skilled in the art can understand other purposes of the present application, technical means and implementation forms of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 is a schematic view of the appearance of the air filling tray structure of the present application actually applied to a mask storage cabinet;

[0023] Figure 2 is the appearance schematic view of the inflatable disc structure of the utility model when bearing the mask container;

[0024] Figure 3 is the appearance schematic view of the inflatable disc structure of the utility model;

[0025] Figure 4 is the appearance schematic view of the bottom surface of the inflatable disc structure of the utility model;

[0026] Figure 5 is the exploded schematic view of the bottom surface of the inflatable disc structure of the utility model, which is used for explaining the state of each element and the relative relationship thereof;

[0027] Figure 6 is the cross-sectional schematic view of the inflatable disc structure of the utility model at the line 6-6; Figure 4

[0028] Figure 7 is the top view schematic view of the inflatable disc structure of the utility model, which is used for explaining the relative position of each element of the inflatable disc;

[0029] Figure 8 is the cross-sectional schematic view of the inflatable disc structure of the utility model in actual use, which is used for explaining the inflated state thereof.

[0030] 100: storage cabinet

[0031] 200: semiconductor container

[0032] 250: inflatable head

[0033] 300: inflatable system

[0034] 10: inflatable disc

[0035] 11: loading disc

[0036] 111: upper surface

[0037] 112: lower surface

[0038] 115: placing area

[0039] 12: limiting block

[0040] 15: positioning bolt

[0041] 16: mounting groove

[0042] 17: concave ring groove

[0043] 18: first sealing ring

[0044] 20: air nozzle

[0045] 21: mounting body

[0046] ​22: docking cylinder

[0047] 220: bevelled rim

[0048] 23: mounting cavity

[0049] 24: opening

[0050] 240: lip

[0051] 25: gas guide seat

[0052] 26: ring slot

[0053] 27: second sealing ring

[0054] 28: through hole

[0055] 30: gas guide loop

[0056] 31: gas outlet passage

[0057] 321: stepped fitting portion

[0058] 322: ring slot

[0059] 33: gas flow channel

[0060] 331: stepped fitting portion

[0061] 332: ring slot

[0062] 34: interface portion

[0063] 35: sealing ring member

[0064] 36: flow channel bottom cover

[0065] 37: limiting ring rim

[0066] L1: axis of gas nozzle

[0067] L2: central axis of carrier disc placement area DETAILED DESCRIPTION

[0068] The utility model will be explained below through examples, the embodiment of the utility model is not used to limit the utility model must be implemented in any specific environment, application or special way as described in the example. Therefore, the description about the example is only for the purpose of explaining the utility model, and is not used to limit the utility model. It should be noted that the following examples and the drawings, and the size relationship between the elements in the drawings is for easy understanding, and is not used to limit the actual proportion.

[0069] The utility model discloses a kind of gas filling disc structures for filling gas to semiconductor container, please refer to Figure 1 And 2As shown, it serves as a storage cabinet 100 (e.g.) Figure 1 As shown in Figure 2), multiple semiconductor containers 200 are placed on infeed / outfeed workstations or transport equipment. Each inflation tray 10 can hold one semiconductor container 200, and each inflation tray 10 can be gas-connected to an inflation system 300 to provide clean gas filling to the semiconductor container 200. Taking a photomask container as an example, the photomask container can be a standard mechanical interface photomask transfer box (Reticle SMIF Pod, RSP) that houses photomasks of 150mm or 200mm size. In other embodiments of this utility model, the semiconductor container 200 can also be a front-opening unified pod (FOUP). The bottom surface of the semiconductor container 200 is provided with at least one inflation head 250 communicating with the inside and outside of the container, so that clean gas can be introduced into the interior of the semiconductor container 200 through the inflation head 250, and further prevent the photomask or wafer inside the semiconductor container 200 from being contaminated by particles or harmful gases.

[0070] The inflatable disc 10 of this utility model can be referred to as follows: Figures 2 to 4 As shown, it is composed of an integral carrier tray 11, which can be molded from aluminum alloy, aluminum-magnesium alloy, metal, plastic, or polymer material. The carrier tray 11 has an upper surface 111 and a lower surface 112 facing each other. The upper surface 111 of the carrier tray 11 has a placement area 115 for selective placement of the semiconductor container 200, and the carrier tray 11 has at least one air nozzle 20 within the placement area 115. As shown in the figure, this embodiment uses two air nozzles 20 as an example, and the air nozzles 20 can respectively correspond to two inflation heads 250 placed on the bottom of the semiconductor container 200 in the placement area 115. The lower surface 112 of the carrier tray 11 is provided with a gas guiding circuit 30, which can be gas-connected to the inflation system 300 and the two air nozzles 20.

[0071] like Figure 2 , 3As shown, the upper surface 111 of the carrier plate 11 has at least one limiting block 12 around the placement area 115 for limiting the position of the semiconductor container 200. The limiting block 12 can be an L-shaped body or a stop block abutting against the corner edge of the bottom profile of the semiconductor container 200. The present application mainly adopts the stop block corresponding to each edge of the bottom profile of the semiconductor container 200 as the main embodiment. Specifically, the limiting block 12 and the carrier plate 11 can be an integral structure or a separate structure, and the integral structure is the best embodiment, but it is not limited thereto. The limiting block 12 has a guide slope 121 at the top end of the inner edge corresponding to the semiconductor container 200, which can guide the semiconductor container 200 to be smoothly placed in the placement area 115 of the carrier plate 11. Furthermore, according to other embodiments, the carrier plate 11 is provided with a plurality of sensing elements 13 in the placement area 115. The sensing elements can be micro switches or proximity switches, which are used to detect whether the semiconductor container 200 exists and is placed in the placement area 115 of the carrier plate 11, so that the inflation system can determine whether to perform the inflation action on the semiconductor container. According to other embodiments, the carrier plate 11 is provided with a plurality of positioning pins 15 in the placement area 115. The positioning pins 15 can have different diameters or different angles, which are used to cooperate with the corresponding insertion holes (not shown) on the bottom surface of the semiconductor container 200, as a foolproof function for determining whether the placement direction of the semiconductor container 200 is correct.

[0072] As shown, Figures 4 to 6 The gas guide circuit 30 is formed on the carrier plate 11 by integral molding or machining. The gas guide circuit 30 has an outlet passage 31 penetrating from the lower surface 112 of the carrier plate 11 to the upper surface 111 of the carrier plate, which can be connected to the gas nozzle 20 and the semiconductor container. In addition, the gas guide circuit 30 has a gas supply channel 33 arranged on the lower surface 112 of the carrier plate 11, which is a groove structure and can be connected to the outlet passage 31 and the inflation system 300, respectively, so that the gas provided by the inflation system flows through the gas supply channel 33 and the outlet passage 31 and is introduced into the semiconductor container.

[0073] The gas flow channel 33 of the gas guide circuit 30 can be, but not limited to, a Y-shaped layout or a T-shaped layout. In particular, the Y-shaped layout of the gas flow channel 33 of the present embodiment can improve the smoothness of the gas flow. Further, the gas flow channel 33 has an interface 34 penetrating through the opposite side walls to communicate with the outside, and the gas is connected to the gas filling system 300. The gas flow channel 33 has a connected step joint 321, 331 formed at the opening periphery of the lower surface 112 of the carrier plate 11, and the step joint 321, 331 has a ring groove 322, 332 for jointly embedding a sealing ring 35. In addition, the lower surface 112 of the carrier plate 11 is locked with a flow channel bottom cover 36 on the step joint 321, 331, and the locking method can be selected from the combination of bolts and screw holes. The inner surface of the flow channel bottom cover 36 is provided with a limiting ring 37 for limiting the edge of the sealing ring 35, so that the inside of the carrier plate 11 can form a closed gas flow channel 33 with the flow channel bottom cover 36 and the sealing ring 35, thereby reducing the external pipeline. In an embodiment, the gas flow channel 33 of the carrier plate 11 can be integrally molded to avoid the generation of particles during use, thereby greatly improving the cleanliness of the flow channel. The interface 34 of the gas flow channel 33 can be connected to the gas filling system 300 through a joint.

[0074] Further, as shown in Figure 3 and 6 The gas nozzle 20 can be integrally formed or separately locked in the placement area 115 of the carrier plate 11, and the axis L1 of at least one of the gas nozzles 20 is offset from the central parallel axis L2 of the placement area 115 of the carrier plate 11 (as shown in Figure 7As shown, so that the semiconductor container 200 placed in the placement area 115 can produce a confirmation of the correct placement position is not wrong foolproof effect. In a preferred embodiment, the gas nozzle 20 of the utility model is selected from the detachable structure which can be locked on the loading plate 11, the gas nozzle 20 is provided with a mounting groove 16 for embedding the gas nozzle 20 around the opening of the gas outlet passage 31 on the upper surface 111 of the loading plate 11, and a concave ring groove 17 around the opening of the gas outlet passage 31 is arranged in the mounting groove 16, a first sealing ring 18 with the top edge slightly protruding from the surface of the mounting groove 16 is arranged in the mounting groove 16, so that the gas-tight effect can be produced when the gas nozzle 20 is locked in the mounting groove 16. Furthermore, the locking mode of the gas nozzle 20 can be selected from the combination of bolts and screw holes, and according to other embodiments, the gas nozzle 20 has a mounting body 21, the mounting body 21 has a pair of connecting cylinders 22 protruding from the upper surface 111 of the loading plate 11, the outer part of the connecting cylinder 22 is provided with a tapered edge 220 converging to the top end, which is used to guide the relative air inlet head 250 of the semiconductor container 200 to be mutually connected. Furthermore, the connecting cylinder 22 is formed with a mounting cavity 23 penetrating the inside, and the mounting cavity 23 is formed with an opening 24 at the top end of the mounting body 21, the inner edge of the opening 24 is formed with a lip 240 towards the center, and the mounting body 21 is screwed with a gas guide seat 25 in the mounting cavity 23, the bottom surface of the gas guide seat 25 can be attached to the opposite first sealing ring 18 when the gas nozzle 20 is locked in the mounting groove 16 of the loading plate 11.

[0075] In addition, the top end of the gas guide seat 25 has an embedded ring groove 26 for sleeving a second sealing ring 27. When the gas guide seat 25 is screwed in the mounting cavity 23 of the mounting body 21, the second sealing ring 27 can be limited by the lip 240 of the opening 24 of the mounting cavity 23, and the gas guide seat 25 is provided with a through hole 28 corresponding to the opening 24 of the mounting body 21 in the center. In this way, the gas of the inflation system 300 can be filled in the semiconductor container 200 through the gas guide circuit 30 of the loading plate 11 by using the gas nozzle 20, so as to form an inflation plate structure which is simple in structure and easy to manufacture and assemble.

[0076] As shown in Figs. Figure 1 , 2 and 8, the inflation plate 10 can be applied to the storage cabinet 100 for storing the semiconductor containers 200 in layers, and each inflation plate 10 is connected to the inflation system 300 through the pipeline by the interface part 34 of the gas guide circuit 30.

[0077] In operation, when the semiconductor containers 200 are respectively placed on the loading plates 11 of the corresponding inflation plates 10, the limiting blocks 12 at the edges of the placement areas 115 of the loading plates 11 can be used to guide and limit the semiconductor containers 200, and the gas nozzles 20 on the loading plates 11 are used to correspond to the air inlet heads 250 of the semiconductor containers 200. When the semiconductor containers 200 are placed on the upper surface 111 of the loading plate 11, the gas nozzle 20 can be completely combined with the opposite air inlet head 250 of the semiconductor container 200.

[0078] Next, the inflation system 300 selectively inflates the semiconductor container 200, so that the gas of the inflation system 300 can be introduced into the semiconductor container 200 through the gas outlet passage 31 and the gas inlet flow channel 33 in the gas guide circuit 30 of the carrier plate 11, and through the gas nozzle 20 and the inflation head 250 of the semiconductor container 200, so as to maintain the cleanliness of the internal environment of the semiconductor container 200, and avoid the photomask or wafer in the semiconductor container 200 from being polluted by particle adhesion.

[0079] Through the implementation of the foregoing technical means, the inflation disc structure of the present application utilizes the design that the carrier plate 11 of the inflation disc 10 is integrally molded, so that the two side surfaces of the carrier plate 11 form a placement area 115 and a gas guide circuit 30, for respectively placing a semiconductor container 200 and connecting an inflation system 300, and the gas outlet passage 31 and the gas inlet flow channel 33 of the gas guide circuit 30 can be surface treated after processing or molding, so as not to produce particles in use, and at the same time, overcome the problems that the existing perforation processing is not easy and residual processing particles are left, and the phenomenon that external pipelines are easily broken and gas is leaked and space is wasted does not occur, so that the structure can be simplified, and manufacturing and assembly are easy, and external pipelines can be reduced, space can be effectively saved, and the capacity of the photomask storage cabinet in storage can be further increased.

[0080] At the same time, the offset design of the gas nozzle 20 on the inflation disc 10 is utilized, so that the photomask container has the effects of automatic alignment and foolproof when placed on the surface of the inflation disc, which is helpful for the utilization and practicality of the industry.

[0081] The above-described embodiments are only used to illustrate the implementation of the present application and explain the technical features of the present application, and are not used to limit the protection scope of the present application. Any changes or equivalent arrangements that can be easily completed by those skilled in the art belong to the scope claimed by the present application, and the protection scope of the present application should be subject to the patent application range.

Claims

1. An airbag structure, a gas is connected to an airbag system for filling a semiconductor container with a gas, characterized by, Include: A carrier disk having an upper surface and a lower surface, the upper surface being used to support the semiconductor container; and An air guide circuit is disposed on the lower surface of the carrier plate, the air guide circuit having: A gas outlet channel extends from the lower surface of the carrier to the upper surface of the carrier, and is connected to the semiconductor container for gas connection; and A gas delivery channel is a groove structure disposed on the lower surface of the carrier disk and is respectively connected to the gas outlet channel and the gas filling system, so that the gas provided by the gas filling system flows through the gas delivery channel and the gas outlet channel and is introduced into the interior of the semiconductor container.

2. The inflatable disc structure of claim 1, wherein, It includes a flow channel bottom cover, which is locked to the lower surface of the carrier plate corresponding to the air guide circuit, so that the groove structure forms a closed groove structure.

3. The inflatable disc structure of claim 1, wherein, The upper surface of the carrier has a placement area and at least one sensing element, wherein the at least one sensing element is disposed in the placement area for detecting the presence and placement of the semiconductor container in the placement area.

4. The inflatable disc structure of claim 3, wherein, It includes at least one limiting block disposed around the placement area to restrict the semiconductor container within the placement area when the carrier tray carries the semiconductor container.

5. The inflatable disc structure of claim 4, wherein, The limiting block has a guide ramp located at the top of its inner edge to guide the semiconductor container smoothly into the placement area.

6. The inflatable disc structure of claim 2, wherein, It includes a sealing ring. When the bottom cover of the flow channel is locked to the lower surface of the carrier, the fixing ring is located around the flow channel to increase the airtightness of the groove structure.

7. The inflatable disc structure of claim 1, wherein, The air delivery channel of the air guide circuit is arranged in a Y-shape or a T-shape to improve airflow smoothness.

8. The inflatable disc structure of claim 1, wherein, It includes at least one gas nozzle, which is detachably disposed on the upper surface of the carrier for filling the semiconductor container with gas.

9. An inflatable disc structure, wherein gas is connected to an inflatable system for filling a semiconductor container with gas, characterized in that, Include: A carrier disk, with gas connected to the semiconductor container and the gas filling system, has an upper surface and a lower surface, the upper surface being used to support the semiconductor container; and At least one gas nozzle is detachably disposed on the upper surface, and the gas is connected to the carrier for filling the semiconductor container with the gas.

10. The plenum structure of claim 9, wherein, The lower surface further includes an airflow channel through which gas is connected to the at least one air nozzle.

11. The inflatable disc structure of claim 10, wherein, The gas delivery channel is a groove structure.

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