Transfer box for semiconductor packaging

Abstract

The utility model relates to the technical field of transfer boxes, and discloses a transfer box for semiconductor packaging, which comprises a box body, two ends of one side of the box body are fixedly connected with a mounting plate, the mounting plate is provided with a limiting mechanism for limiting a semiconductor chip, the limiting mechanism comprises a driving rotating shaft, and the driving rotating shaft is fixedly connected with the mounting plate. And the driving rotating shaft is rotationally connected to one set of mounting plates in a penetrating mode, and one end of the driving rotating shaft is fixedly connected with a threaded rod. According to the utility model, the threaded rod rotates to drive the threaded block to descend, the threaded block descends to drive the upper pressing plate to cover the placement plate through the first sliding block, and meanwhile, the clamping column is inserted into the slot, so that the semiconductor chip placed in the placement groove can be fixed, and the phenomenon that the semiconductor chip is damaged when the box body is transported is prevented. And meanwhile, the threaded rod rotates reversely to drive the upper pressing plate to ascend to leave the placement plate, so that the upper pressing plate does not need to be manually taken away from the placement plate, and a worker can conveniently take out the semiconductor chip.

Description

TECHNICAL FIELD

[0001] The utility model relates to a transfer box technical field especially relates to a kind of transfer box for semiconductor package. BACKGROUND

[0002] Semiconductor package is a kind of assembly for protecting and connecting semiconductor chip. In electronic equipment, semiconductor chip is usually very small and fragile, needs to be protected by package to provide mechanical protection, electrical connection and thermal management. The main functions of semiconductor package include: protection: package can protect semiconductor chip from mechanical stress, moisture, dust and other external environment damage. They are usually made of materials such as plastic or ceramic, can provide physical isolation and shielding, at present, the transfer box used for semiconductor package containing metal pin has poor stability, cannot effectively limit and fix package, easy to cause pin bending and internal chip damage and other damage to package during transfer process;

[0003] To solve the above problems, through retrieval, prior art discloses (application number: CN202323371943.9) a kind of semiconductor package transfer device;The paper proposes "including: limiting component, for the limiting and fixed semiconductor package;Box body, is set in the limiting component outer side, for installing the limiting component;Buffering component, set in the box body, for the buffering protection of the limiting component installed in the box body.The utility model discloses by setting limiting component, when using, first, semiconductor package is placed in limiting component, effectively limit and fix it;By setting box body and buffering component, limiting component is placed in box body, limiting component is protected by buffering component in box body, to realize the buffering protection of semiconductor package placed in limiting component."

[0004] But the limiting mechanism of the transfer box of the comparative case is inconvenient for staff to take out semiconductor chip, needs manual to take away limiting component, and semiconductor is taken out. UTILITY MODEL CONTENT

[0005] The utility model aims at solving the shortcomings in the prior art, and provides a transfer box for semiconductor package.

[0006] To achieve the above object, the utility model adopts the following technical scheme: a kind of transfer box for semiconductor package, including box body, the one side of the box body both ends is fixedly connected with mounting plate, the mounting plate is installed with the limiting mechanism for limiting semiconductor chip;

[0007] The limiting mechanism comprises a driving rotating shaft, one end of the driving rotating shaft is fixedly connected with a threaded rod, the threaded rod is rotatably connected to a group of mounting plates away from the driving rotating shaft, the threaded rod is threadedly connected with a threaded block, the threaded block is fixedly connected with a first sliding block, one end of the first sliding block away from the threaded block is fixedly connected with an upper pressing plate for limiting the semiconductor chip, and the upper pressing plate is fixedly connected with a pressing block for pressing the semiconductor chip.

[0008] As a further description of the above technical solution:

[0009] Both sides of the box body are provided with first sliding grooves, and the first sliding grooves limit and guide the movement of the upper pressing plate through the first sliding blocks sliding in the first sliding grooves.

[0010] As a further description of the above technical solution:

[0011] The bottom of the upper pressing plate is fixedly connected with a clamping column, and the clamping column is provided with four groups.

[0012] As a further description of the above technical solution:

[0013] Both sides of the box body are provided with second sliding grooves, a placing mechanism is mounted on the second sliding grooves, the placing mechanism comprises a second sliding block, the second sliding block is slidingly connected in the second sliding groove, one end of the second sliding block away from the second sliding groove is fixedly connected with a placing plate, the placing plate is provided with a placing groove for placing the semiconductor chip, and the placing plate is provided with an insertion groove for clamping the clamping column.

[0014] As a further description of the above technical solution:

[0015] The second sliding block is fixedly connected with an extension rod, one end of the extension rod away from the second sliding block is fixedly connected in the second sliding groove, a spring is fixedly connected to the second sliding block away from the second sliding groove, and the spring is sleeved on the extension rod.

[0016] As a further description of the above technical solution:

[0017] The box door is hingedly connected to the box body, and the box door is fixedly connected with a pull rod.

[0018] As a further description of the above technical solution:

[0019] The bottom of the box body is fixedly connected with a pad plate for supporting and preventing the box body from slipping.

[0020] The utility model has the advantages of the following beneficial effects:

[0021] 1. In the utility model, through the screw rod rotation drives the threaded block to descend, the threaded block descends through the first sliding block drives the upper pressing plate cover on the placing plate, simultaneously makes the clamping column insert into the slot, further can fix the semiconductor chip placed in the placing groove, prevents when transporting the box body, the internal semiconductor chip shakes and collides and is damaged, simultaneously the screw rod reverses and drives the upper pressing plate to ascend and leave the placing plate, further need not manual work to take the upper pressing plate away from the placing plate, convenient for staff to take out the semiconductor chip.

[0022] 2. In the utility model, through pulling the pull rod on the placing plate pulls out the placing plate on the box body, further further convenient for staff to take and place the semiconductor chip, simultaneously the spring is installed on the second sliding block, can draw the placing plate close to the box body, convenient for fixing the semiconductor with the upper pressing plate. BRIEF DESCRIPTION OF DRAWINGS

[0023] Figure 1 It is a front view perspective drawing of a transfer box for semiconductor packaging provided by the utility model;

[0024] Figure 2 It is a partial explosion schematic view of a transfer box for semiconductor packaging provided by the utility model;

[0025] Figure 3 It is a partial schematic view of a transfer box for semiconductor packaging provided by the utility model;

[0026] Figure 4 It is Figure 1 The enlarged view of B in the utility model;

[0027] Figure 5 It is Figure 2 The enlarged view of C in the utility model;

[0028] Figure 6 It is Figure 3 The enlarged view of A in the utility model.

[0029] LEGEND:

[0030] 1, box body;2, mounting plate;3, limiting mechanism;31, drive shaft;32, screw rod;33, threaded block;34, first sliding block;35, upper pressing plate;36, pressing block;37, first sliding groove;38, clamping column;4, second sliding groove;5, placing mechanism;51, second sliding block;52, placing plate;53, placing groove;54, slot;55, telescopic rod;56, spring;6, box door;7, pull rod;8, backing plate. DETAILED DESCRIPTION

[0031] With reference to the drawings and embodiments of the present application, the technical solutions in the embodiments of the present application will be described clearly and completely. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative efforts fall within the scope of the present application.

[0032] Embodiment: Please refer to Figures 1-6 The utility model provides an embodiment: a kind of transfer box for semiconductor package, including box body 1, the side of box body 1 both ends is fixedly connected with mounting plate 2, and mounting plate 2 is installed with the limiting mechanism 3 for limiting semiconductor chip;

[0033] Limiting mechanism 3 includes drive shaft 31, and drive shaft 31 is rotatably connected to a group of mounting plate 2, and one end of drive shaft 31 is fixedly connected with threaded rod 32, and the end of threaded rod 32 away from drive shaft 31 is rotatably connected to a group of mounting plate 2, and threaded rod 32 is rotatably connected with threaded block 33, and first sliding block 34 is fixedly connected on threaded block 33, and the end of first sliding block 34 away from threaded block 33 is fixedly connected with upper pressing plate 35 for limiting semiconductor chip, and upper pressing plate 35 is fixedly connected with pressing block 36 for pressing semiconductor chip.

[0034] Working principle: first, after the semiconductor chip of packaging is placed in the placement slot 53 on the placement plate 52, then drive shaft 31 is rotated, drive shaft 31 rotation drives threaded rod 32 to rotate, threaded rod 32 rotation drives threaded block 33 to descend, threaded block 33 descends drive first sliding block 34 to descend, first sliding block 34 descends drive upper pressing plate 35 to descend, finally, cover on placement plate 52, make pressing block 36 press the semiconductor chip fixed in placement slot 53, simultaneously make clamping post 38 insert into slot 54, prevent when the box body 1 is transported, inside semiconductor chip is shaken and collides and is damaged, then when semiconductor chip needs to be taken out, drive shaft 31 can be reversed, finally make upper pressing plate 35 rise and leave placement plate 52, then without manual taking upper pressing plate 35 away from placement plate 52, it is convenient for staff to take out semiconductor chip.

[0035] As a preferred implementation, the two sides of the box body 1 are provided with first sliding grooves 37, and the first sliding grooves 37 limit and guide the movement of the upper pressing plate 35 through the first sliding blocks 34 sliding inside.

[0036] As Figure 2 shown: the first sliding groove 37 on the right side of the box body 1 is hollow, and the first sliding groove 37 on the left side of the box body 1 is embedded in the box body 1.

[0037] As a preferred implementation, the bottom of the upper pressing plate 35 is fixedly connected with clamping columns 38, and the clamping columns 38 are provided with four groups.

[0038] As shown in Figure 1 : The four groups of clamping columns 38 are respectively located at the four corners of the upper pressing plate 35 and directly above the insertion slots 54.

[0039] As a preferred implementation, the two sides of the box body 1 are provided with second sliding grooves 4, the second sliding grooves 4 are provided with placing mechanisms 5, the placing mechanisms 5 include second sliding blocks 51, the second sliding blocks 51 are slidingly connected in the second sliding grooves 4, the ends of the second sliding blocks 51 away from the second sliding grooves 4 are fixedly connected with placing plates 52, the placing plates 52 are provided with placing slots 53 for placing semiconductor chips, and the placing plates 52 are provided with insertion slots 54 for clamping the clamping columns 38.

[0040] As shown in Figure 1 : When the semiconductor chip in the placing slot 53 needs to be taken out, the placing plate 52 can be pulled outwards on the box body 1 by pulling the pull rod 7 on the placing plate 52, thereby further facilitating the staff to take and place the semiconductor chip, and the second sliding block 51 is provided with a spring 56, so that the placing plate 52 can be pulled close to the box body 1, thereby facilitating cooperation with the upper pressing plate 35 to fix the semiconductor.

[0041] As a preferred implementation, the second sliding block 51 is fixedly connected with a telescopic rod 55, the end of the telescopic rod 55 away from the second sliding block 51 is fixedly connected in the second sliding groove 4, the second sliding groove 4 is fixedly connected with a spring 56, the end of the spring 56 away from the second sliding groove 4 is fixedly connected to the second sliding block 51, and the spring 56 is sleeved on the telescopic rod 55.

[0042] As shown in Figure 6 : The telescopic rod 55 and the spring 56 are both provided with two groups, and the two groups of telescopic rods 55 and the two groups of springs 56 are respectively located at the two sides of the box body 1.

[0043] As a preferred implementation, the box body 1 is hingedly connected with a box door 6, and the box door 6 is fixedly connected with a pull rod 7.

[0044] As shown in Figure 1 : The pull rod 7 is provided with an anti-skid sleeve (not shown in the text).

[0045] As a preferred implementation, the bottom of the box body 1 is fixedly connected with a base plate 8 for supporting and preventing the box body 1 from slipping.

[0046] As shown in Figure 1 : The bottom of the box body 1 is provided with four groups of base plates 8, and the material of the base plate 8 is rubber.

[0047] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and is not intended to limit the present application, although the foregoing embodiments of the present application has been described in detail, for the skilled in the art, it still can be modified, or for part of the technical features of the equivalent replacement, the spirit and principles of the present application, made any modification, equivalent replacement, improvement, etc., should be included within the scope of the present application.

Claims

1. A transfer box for semiconductor package, comprising a box body (1), mounting plates (2) are fixed at both ends of one side of the box body (1), characterized in that: The mounting plate (2) is provided with a limiting mechanism (3) for limiting the semiconductor chip; The limiting mechanism (3) comprises a driving shaft (31), the driving shaft (31) penetrates a group of mounting plates (2) and is rotationally connected to the mounting plates (2), one end of the driving shaft (31) is fixedly connected with a threaded rod (32), the threaded rod (32) is rotationally connected to a group of mounting plates (2) away from the driving shaft (31), the threaded rod (32) is threadedly connected with a threaded block (33) penetrating the threaded rod (32), the threaded block (33) is fixedly connected with a first sliding block (34), one end of the first sliding block (34) away from the threaded block (33) is fixedly connected with an upper pressing plate (35) for limiting the semiconductor chip, and the upper pressing plate (35) is fixedly connected with a pressing block (36) for pressing the semiconductor chip.

2. The transport box for semiconductor packages of claim 1, wherein: The box body (1) is provided with a first sliding groove (37) on both sides, and the first sliding groove (37) limits and guides the movement of the upper pressing plate (35) through the first sliding block (34) sliding in the first sliding groove (37).

3. The transport box for semiconductor packages of claim 2, wherein: The bottom of the upper pressing plate (35) is fixedly connected with a clamping column (38), and the clamping column (38) is provided with four groups.

4. The transport box for semiconductor packages of claim 3, wherein: The box body (1) is provided with a second sliding groove (4) on both sides, the second sliding groove (4) is provided with a placing mechanism (5), the placing mechanism (5) comprises a second sliding block (51), the second sliding block (51) is slidingly connected in the second sliding groove (4), one end of the second sliding block (51) away from the second sliding groove (4) is fixedly connected with a placing plate (52), the placing plate (52) is provided with a placing groove (53) for placing the semiconductor chip, and the placing plate (52) is provided with an insertion groove (54) for clamping the clamping column (38).

5. The transport box for semiconductor packages of claim 4, wherein: The second sliding block (51) is fixedly connected with a telescopic rod (55), one end of the telescopic rod (55) away from the second sliding block (51) is fixedly connected in the second sliding groove (4), the second sliding groove (4) is fixedly connected with a spring (56), one end of the spring (56) away from the second sliding groove (4) is fixedly connected to the second sliding block (51), and the spring (56) is sleeved on the telescopic rod (55).

6. The transport box for semiconductor packages of claim 5, wherein: The box body (1) is hingedly connected with a box door (6), and the box door (6) is fixedly connected with a pull rod (7).

7. The transport box for semiconductor packages of claim 6, wherein: The bottom of the box body (1) is fixedly connected with a pad (8) for supporting and preventing the box body (1) from slipping.

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