Wafer baking device and chip mounter

Abstract

The utility model provides a wafer baking device and a chip mounter, and belongs to the technical field of semiconductor processing equipment, and the wafer baking device comprises a box body which is internally provided with a closed accommodation cavity; the vacuum chuck head is arranged in the closed accommodating cavity, and the vacuum chuck head is arranged to be used for adsorbing a wafer; and the heating assembly is arranged in the closed accommodating cavity, the heating assembly and the vacuum chuck head are correspondingly arranged, and the heating assembly is used for baking and heating a wafer on the vacuum chuck head. According to the wafer baking device provided by the invention, the closed accommodating cavity is formed in the box body, the vacuum chuck head and the heating assembly are arranged in the closed accommodating cavity, and when the heating assembly performs baking heating on the wafer, heat is gathered in the closed accommodating cavity and does not overflow, so that energy waste is avoided, and the wafer baking heating efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor processing equipment, in particular to a wafer baking device and a chip mounter. BACKGROUND

[0002] The traditional wafer baking structure adopts an open structure, a baking heating disc is above, a metal protective cover is arranged on the top and the periphery of the baking heating disc, a vacuum chuck head is below, after a wafer is placed on the vacuum chuck head, the wafer is moved close to the baking heating disc through a moving mechanism below the vacuum chuck head, and the purpose of baking heating is achieved. However, in this structure, since the baking disc is directly communicated with air below, most of the heat will overflow to the outside of the baking structure, energy is wasted, and the wafer baking heating efficiency is reduced. SUMMARY

[0003] The present application aims to provide a wafer baking device and a chip mounter, and aims to solve the problem in the related art that the baking disc is directly communicated with air below, heat will overflow to the outside of the baking structure, energy is wasted, and the wafer baking heating efficiency is reduced.

[0004] Additional aspects and advantages of the present application will be set forth in part in the following description, and in part will become apparent to those skilled in the art from the description, or can be learned by practice of the application.

[0005] According to a first aspect of the present application, a wafer baking device is provided, comprising:

[0006] a box body, an enclosed containing cavity is formed inside;

[0007] a vacuum chuck head, arranged in the enclosed containing cavity, the vacuum chuck head is arranged for adsorbing a wafer;

[0008] a heating assembly, arranged in the enclosed containing cavity, the heating assembly is arranged corresponding to the vacuum chuck head, the heating assembly is arranged for baking heating the wafer on the vacuum chuck head;

[0009] an upper feeding port is arranged on the box body corresponding to the vacuum chuck head, allowing the wafer and a mechanical hand to pass through.

[0010] In an exemplary embodiment of the present application, the box body comprises:

[0011] a support frame, the support frame comprises a bottom plate and a fixed framework mounted on the bottom plate, the fixed framework comprises a heating mounting bracket for mounting the heating assembly;

[0012] an upper enclosed box body, surrounding the outside of the heating mounting bracket;

[0013] A lower closed box is arranged outside the fixed frame below the heating mounting bracket, and the lower closed box and the closed box form the closed containing cavity, and the upper feeding opening is left between the lower closed box and the upper closed box.

[0014] In an exemplary embodiment of the present application, the vacuum chuck head is arranged below the heating assembly, and the upper surface of the vacuum chuck corresponds to the position of the upper feeding opening.

[0015] In an exemplary embodiment of the present application, a vacuum connecting rod and a quick plug are further included, the vacuum connecting rod is installed on the bottom plate, the vacuum chuck head is connected above the vacuum connecting rod, the quick plug is installed below the vacuum connecting rod, and the quick plug, the vacuum connecting rod and the vacuum chuck head form a vacuum channel.

[0016] In an exemplary embodiment of the present application, a lifting mechanism is further included and arranged at the bottom of the box, a driving end of the lifting mechanism is connected with the vacuum chuck head, and the lifting mechanism is used to drive the vacuum chuck head, the vacuum connecting rod and the quick plug to move up and down.

[0017] In an exemplary embodiment of the present application, at least one side plate of the upper closed box is arranged as a structure that can be opened and closed; and / or, at least one side plate of the lower closed box is arranged as a structure that can be opened and closed.

[0018] In an exemplary embodiment of the present application, a horizontal moving mechanism is further included and installed on the heating mounting bracket, the heating assembly is installed on the horizontal moving mechanism, and the horizontal moving mechanism is used to move the heating assembly horizontally.

[0019] In an exemplary embodiment of the present application, the horizontal moving mechanism includes a slide rod horizontally installed on the heating mounting bracket and a slide block slidably installed on the slide rod, and the heating assembly is fixedly connected to the slide block.

[0020] In an exemplary embodiment of the present application, a blowing mechanism is further included, the blowing mechanism includes a blowing nozzle and a compressed gas tank, the blowing nozzle is arranged at the bottom of the box, and the blowing direction of the blowing nozzle is towards the heating assembly, the blowing nozzle is connected with a gas pipe, and the gas pipe communicates with the compressed gas tank outside the box through the side wall of the box.

[0021] According to a second aspect of the present application, a die bonder is provided, which includes the wafer baking device as described above.

[0022] The exemplary embodiments of the present application can have the following partial or all beneficial effects:

[0023] In the wafer baking device provided in the example embodiment of the present application, the box body is internally formed with a closed accommodating cavity, the vacuum chuck head and the heating assembly are both arranged inside the closed accommodating cavity, and when the wafer is baked and heated, the heat is all gathered in the closed accommodating cavity and cannot be spilled, so that energy waste is avoided, and the wafer baking and heating efficiency is improved.

[0024] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF DRAWINGS

[0025] The drawings incorporated in the specification and forming a part thereof illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the application. It is clear that the drawings described below are only some embodiments of the present application, and other drawings can be obtained according to these drawings without creative labor for those skilled in the art.

[0026] Figure 1 A front view of the wafer baking device in the example embodiment 1 of the present application is shown;

[0027] Figure 2 A front view of the wafer baking device in the example embodiment 1 of the present application is shown; Figure 1 A sectional view at A-A in the example embodiment 1 of the present application is shown;

[0028] Figure 3 A structural schematic view of the wafer baking device in the example embodiment 1 of the present application is shown.

[0029] Explanation of reference signs:

[0030] 1, upper baffle; 2, lower baffle; 3, bottom plate; 4, support frame body; 5, quick plug; 6, vacuum connecting rod; 7, vacuum chuck head; 8, heating assembly; 9, support rod; 10, vacuum shaft connecting plate; 11, air cylinder; 12, connecting head; 13, air cylinder connecting plate. DETAILED DESCRIPTION

[0031] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments, however, can be implemented in many different forms and should not be construed as limited to the implementations set forth herein; rather, these implementations are provided so that this disclosure will be thorough and complete, and will fully convey the inventive concept of example embodiments to those skilled in the art. Like reference numerals refer to like elements throughout the drawings, and thus a detailed description of them will not be repeated. In addition, the drawings are only schematic and are not necessarily drawn to scale.

[0032] Although relative terms are used in this description, such as "upper," "lower," to describe one component's relationship to another component, these terms are used herein for convenience only and are not intended to be limiting. It is to be understood that when a structure is referred to as being "on" another structure, it can be directly on the other structure or intervening structures can also be present. In addition, terms such as "first" and "second" are used herein only to describe one component's relationship to another component, and do not connote a limitation on the number of such components.

[0033] The terms "a," "an," and "the" are used herein to refer to one or more than one (i.e. to "at least one") of the grammatical object of the article. By the use of the term "including" followed by a listing of elements or interventions and "comprising" is intended to be broad and inclusive, and envisions the listing of elements or interventions and additional elements or interventions that are not specifically mentioned. The use of the term "first," "second," etc. is merely intended to differentiate one component from another and is not intended to limit the number of components. Embodiment 1

[0034] The embodiment provides a specific implementation of a wafer baking device, as shown in Figure 1 , Figure 2 and Figure 3 , including a box body, a vacuum chuck head 7 and a heating assembly 8, the box body has a feeding port corresponding to the vacuum chuck head 7, which allows the wafer and the mechanical arm to pass through, wherein the box body forms a closed containing cavity inside, the vacuum chuck head 7 and the heating assembly 8 are both arranged inside the closed containing cavity, when the wafer is baked and heated, the heat is all gathered in the closed containing cavity, and no overflow occurs, avoiding energy waste, and thus the efficiency of wafer baking and heating can be improved. The vacuum chuck head 7 is arranged in the closed containing cavity, and its main function is to firmly adsorb and fix the wafer by generating negative pressure, and this design ensures that the wafer can maintain a stable position and posture during the baking process, avoiding uneven heating or damage caused by movement or shaking; the heating assembly 8 is responsible for generating and transferring heat to the wafer, since the heating assembly is located in the closed containing cavity, the heat generated by the heating assembly can be maximally absorbed by the wafer, and will not be lost to the external environment, and this design significantly improves the heating efficiency and shortens the baking time; the design of the closed containing cavity effectively prevents the overflow and loss of heat, so that the heat generated by the heating assembly can fully act on the wafer, thereby improving the baking efficiency; since the heat is effectively limited in the baking cavity, the heat radiation to the external environment and the energy waste are reduced, and the overall energy consumption is reduced; the stable heating environment ensures the uniformity and consistency of the wafer baking process, thereby improving the quality and reliability of the product.

[0035] In some other embodiments, multiple vacuum chuck heads 7 can be designed to accommodate wafers of different sizes or shapes, improving the versatility and flexibility of the device.

[0036] In the embodiment, the box body includes a support frame body 4, an upper closed box body, and a lower closed box body. The support frame body 4 includes a bottom plate 3 and a fixed framework installed on the bottom plate 3, and the fixed framework includes a heating installation support for installing a heating assembly. The upper closed box body surrounds the outside of the heating installation support, and the lower closed box body surrounds the outside of the fixed framework below the heating installation support. The lower closed box body forms a closed containing cavity with the upper closed box body, and a loading port is provided between the lower closed box body and the upper closed box body. Specifically, the upper closed box body includes a top plate and an upper side baffle 1, and the lower closed box body includes a bottom plate 3 and a lower side baffle 2. The vacuum chuck head 7 is located in the closed containing cavity, and the wafer is placed on the vacuum chuck head 7. The heating assembly 8 performs baking and heating on the wafer. During the heating process, the side baffle, the top plate, and the bottom plate 3 form a closed containing cavity, which can effectively prevent heat loss and make heat accumulate in the closed containing cavity, thereby better baking the wafer and avoiding energy waste. The support frame body 4 can be made of aluminum alloy or other materials, serving as the support structure of the entire box body. The support frame body 4 not only provides sufficient strength and stability but also serves as the installation basis for other components such as the side baffle, the top plate, and the bottom plate.

[0037] Further, specifically, the upper closed box body includes a top plate and an upper side baffle 1, and the lower closed box body includes a bottom plate 3 and a lower side baffle 2. A loading port is provided between the upper side baffle 1 and the lower side baffle 2 to allow the wafer and the robot to pass through, so as to facilitate the delivery of the wafer to the vacuum chuck head 7 by the robot. The loading port provided between the upper side baffle 1 and the lower side baffle 2 is a channel specially designed for the wafer and the robot. This design allows the robot to accurately deliver the wafer to the vacuum chuck head 7 without affecting the overall closedness of the closed containing cavity, greatly improving the automation degree and efficiency of the operation.

[0038] In this embodiment, the vacuum chuck head 7 is arranged below the heating assembly 8 and faces upward, which can enable the heating assembly 8 to better perform baking heating on the wafer and also enable the wafer to be better placed on the vacuum chuck head 7, avoiding the wafer from falling off during the suction process of the vacuum chuck head 7. Since the vacuum chuck head 7 is arranged below the heating assembly 8 and faces upward, the wafer can directly face the heating source after being sucked, thereby ensuring that heat can be quickly and uniformly transmitted to the surface of the wafer. This efficient heat transmission mode helps to improve the baking efficiency and shorten the baking time; the vacuum chuck head 7 sucks the wafer by generating negative pressure, ensuring that the wafer will not fall off during the baking process due to factors such as vibration or air flow. The upwardly arranged chuck head makes the wafer more stable during suction, reducing the risk of suction failure due to position deviation; arranging the vacuum chuck head 7 below the heating assembly 8 can also reduce the interference of other factors on the wafer baking process. For example, the mechanical hand or other conveying devices will not directly contact the heating assembly 8 when placing the wafer, thereby avoiding heat loss or equipment damage caused by accidental contact.

[0039] In this embodiment, the relative position design of the vacuum chuck head 7 and the heating assembly 8 not only optimizes the baking heating effect, improves the baking efficiency and uniformity, but also enhances the stability of the wafer during the baking process, reducing quality problems caused by wafer falling off or position deviation.

[0040] In some other embodiments, the vacuum chuck head 7 can also be arranged on the side of the heating assembly 8, and the heat emitted by the heating assembly can also be used to perform baking heating on the wafer.

[0041] In this embodiment, as shown in Figure 2 the quick plug connector 5 is also included, and the vacuum chuck head 7 is connected with the external vacuum equipment through the quick plug connector 5. The quick plug connector 5 is installed on the bottom plate 3, and one end located inside the closed containing cavity is connected with the vacuum chuck head 7, and the other end located outside the closed containing cavity is connected with the external vacuum equipment. The external vacuum equipment can be a vacuum pump or other components that can be vacuumized, and no limitation is made thereto. The quick plug connector 5 serves as a bridge between the vacuum chuck head 7 and the external vacuum equipment, realizing quick and reliable connection therebetween. This design not only simplifies the connection process, but also improves the connection efficiency and reduces the problem of air leakage or poor sealing caused by improper connection; the quick plug connector 5 is installed on the bottom plate 3, and one end located inside the closed containing cavity is connected with the vacuum chuck head 7, and the other end extends out of the closed containing cavity and is connected with the external vacuum equipment. Such a layout not only ensures the tightness of the connection, but also avoids interference with the internal structure of the closed containing cavity.

[0042] Further, the vacuum chuck head 7 is connected to the quick connector 5 through the vacuum connecting rod 6 to ensure the good vacuum sealing of the vacuum chuck head 7. Specifically, the vacuum connecting rod 6 is installed on the bottom plate 3, the vacuum chuck head 7 is connected above the vacuum connecting rod 6, and the quick connector 5 is installed below the vacuum connecting rod 6. The quick connector 5, the vacuum connecting rod 6 and the vacuum chuck head 7 form a vacuum channel, so that the vacuum chuck head 7 can adsorb the wafer. The vacuum connecting rod 6 is a connecting component between the vacuum chuck head 7 and the quick connector 5, and its design ensures the good vacuum sealing of the vacuum chuck head 7 during the connection process. Through precise machining and installation, the vacuum connecting rod 6 can effectively prevent gas leakage, thereby ensuring the stability and reliability of the vacuum chuck head 7 when adsorbing the wafer. The vacuum connecting rod 6 is also responsible for transmitting the negative pressure generated by the external vacuum equipment to the vacuum chuck head 7 to achieve firm adsorption of the wafer. The introduction of the quick connector 5 and the vacuum connecting rod 6, as well as the connection mode between them and the vacuum chuck head 7 and the external vacuum equipment, together constitute an efficient and reliable vacuum system in the wafer baking device.

[0043] In this embodiment, a lifting mechanism is also included, which is arranged at the bottom of the box body. The vacuum chuck head 7 is connected to the driving end of the lifting mechanism. The lifting mechanism can drive the vacuum chuck head 7, the vacuum connecting rod 6 and the quick connector 5 to move up and down together. The vacuum chuck head 7 can be controlled to move up and down by the lifting mechanism, so that the vacuum chuck head 7 can better receive the wafer, and after receiving the wafer, it can be raised to the heating assembly 8 to bake and heat the wafer.

[0044] In this embodiment, the lifting mechanism includes a gas cylinder 11, which is connected to the bottom plate 3 at the bottom of the support frame body 4 through a gas cylinder connecting plate 13. The gas cylinder connecting plate 13 is fixedly connected to the bottom plate 3. The gas cylinder 11 is fixedly connected to the gas cylinder connecting plate 13 through a connecting head 12. The connecting head 12 is a quick connector. The driving end of the gas cylinder 11 is connected to a vacuum shaft connecting plate 10, which is fixedly connected to the vacuum connecting rod 6. When the gas cylinder 11 drives the vacuum shaft connecting plate 10 to move up and down, it drives the vacuum connecting rod 6 and the vacuum chuck head 7 installed on the vacuum connecting rod 6 to move up and down. When receiving the wafer, the gas cylinder 11 can be controlled to drive the vacuum chuck head 7 to descend, so that the height of the vacuum chuck head 7 is lower than the feeding port located between the upper baffle 1 and the lower baffle 2, so that the vacuum chuck head 7 can better receive the wafer. After the vacuum chuck head 7 receives and adsorbs the wafer, the gas cylinder 11 is controlled to drive the vacuum chuck head 7 to move upward, close to the heating assembly 8, so that the heat generated by the heating assembly 8 can directly act on the wafer, and the heat loss is minimized as much as possible.

[0045] In other embodiments, the lifting mechanism can also be a screw nut assembly, a pneumatic cylinder, a hydraulic cylinder, or the like, as long as it can drive the vacuum chuck head 7 to move up and down, and the specific structure of the lifting mechanism is not limited.

[0046] In this embodiment, as shown in Figure 3 The support frame body 4 extends a support rod 9, and the heating assembly 8 can be mounted on the support rod 9. The support rod 9 extends from the inside of the support frame body 4, and the support rod 9 is located at the middle part of the support frame body 4. The vacuum chuck head 7 is located at the lower part of the support frame body 4, so that the heating assembly 8 can be correspondingly arranged with the vacuum chuck head 7.

[0047] In this embodiment, the heating assembly 8 is a baking heating disc. The baking heating disc is used to bake and heat the wafer on the vacuum chuck head 7. The baking heating disc has a simple structure and high heating efficiency.

[0048] In other embodiments, the heating assembly 8 can also be an electric heating wire or the like, as long as it can be placed in the support frame body 4 to bake and heat the wafer.

[0049] In this embodiment, as shown in Figure 1 The upper side baffle 1 and the lower side baffle 2 are provided with a loading port allowing the wafer and the robot to pass through. The robot places the wafer on the vacuum chuck head 7 through the loading port on the side baffle. The vacuum chuck head 7 adsorbs the wafer to fix the position of the wafer, so that the wafer does not move during the baking process.

[0050] Further, the side baffle, the top plate, and the bottom plate 3 are sheet metal parts and are fixedly installed on the support frame body 4.

[0051] In this embodiment, at least one side plate of the upper closed box body is provided as a structure that can be opened and closed; and / or, at least one side plate of the lower closed box body is provided as a structure that can be opened and closed. Specifically, at least one upper side baffle 1 on the support frame body 4 can be opened or closed to close the closed accommodation cavity. In other embodiments, at least one lower side baffle 2 on the support frame body 4 can also be opened or closed to close the closed accommodation cavity. In other embodiments, the side plates of the upper closed box body and the lower closed box body can all be provided as structures that can be opened and closed, i.e., the upper side baffle 1 and the lower side baffle 2 can both be opened or closed to close the closed accommodation cavity. During the baking and heating process of the wafer, the side baffles provided as structures that can be opened and closed are all in a closed state.

[0052] By providing at least one side plate of the upper closed box body and the lower closed box body as a structure that can be opened and closed, the internal devices of the box body can be conveniently maintained.

[0053] In the embodiment, the horizontal moving mechanism includes a slide rod horizontally mounted on the heating mounting bracket and a slide block slidably mounted on the slide rod, and the heating assembly is fixedly connected to the slide block. The heating mounting bracket is moved by sliding the slide block on the slide rod, so as to move the heating assembly 8. The heating assembly 8 is moved according to the baking degree of the wafer at different positions, so that the wafer baking is more uniform. Meanwhile, the horizontal moving mechanism can align the heating assembly 8 with the vacuum chuck head 7, so that the wafer is baked more effectively.

[0054] In the embodiment, the purging mechanism includes a blowing nozzle and a compressed gas tank. The blowing nozzle is arranged at the bottom of the box body and blows air towards the heating assembly 8. The blowing pipe is connected with an air pipe, and the air pipe communicates with the compressed gas tank through the side wall (i.e. the side baffle) of the box body. When the heating assembly 8 dries the wafer, the blowing nozzle blows air to the heating assembly 8 at the same time. The water droplets on the wafer are blown off, and the hot air generated by the heating assembly 8 is quickly circulated, so that the temperature of the entire cavity in the box body rapidly rises, and the drying efficiency of the wafer is further improved.

[0055] Working principle:

[0056] In the working process, the baking heating disc continuously works, and the temperature is stabilized in the set range through electrical control. After the wafer after uniform glue or wax throwing is placed on the upper surface center position of the vacuum chuck head 7 through the feeding opening between the upper side baffle and the lower side baffle by the external manipulator, the vacuum system is started. The wafer is adsorbed on the upper surface of the vacuum chuck head 7 through the vacuum channel formed by the quick plug connector 5, the vacuum connecting rod 6 and the vacuum chuck head. The heating assembly 8 heats the wafer, and the heat is filled in the closed containing cavity to improve the heating efficiency. Embodiment 2

[0057] The embodiment provides a specific implementation of a chip mounter, including the wafer baking device in embodiment 1.

[0058] Other embodiments of the application will be apparent to those skilled in the art from consideration of the specification and practice of the application. The application is intended to cover any variations, uses or adaptations of the application following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice in the art to which the application pertains. The specification and examples are to be regarded as exemplary only, and the true scope and spirit of the application are indicated by the appended claims.

Claims

1. A wafer baking apparatus characterized by comprising: The device comprises: a box body, inside which a closed containing cavity is formed; a vacuum chuck head arranged in the closed containing cavity, configured to adsorb a wafer; a heating assembly arranged in the closed containing cavity, corresponding to the vacuum chuck head, configured to perform baking heating on the wafer on the vacuum chuck head; an upper feeding port is arranged on the box body at a position corresponding to the vacuum chuck head, allowing the wafer and a robot to pass through.

2. The wafer baking apparatus according to claim 1, wherein The box body comprises: a support frame, comprising a bottom plate and a fixed framework mounted on the bottom plate, the fixed framework comprising a heating mounting bracket for mounting the heating assembly; an upper closed box body, surrounding the outside of the heating mounting bracket; a lower closed box body, surrounding the outside of the fixed framework below the heating mounting bracket, the lower closed box body and the upper closed box body forming the closed containing cavity, and the upper feeding port is left between the lower closed box body and the upper closed box body.

3. The wafer baking apparatus according to claim 2, wherein The vacuum chuck head is arranged below the heating assembly, and the upper surface of the vacuum chuck head corresponds to the position of the upper feeding port.

4. The wafer baking apparatus according to claim 3, wherein Further comprising a vacuum connecting rod and a quick plug connector, the vacuum connecting rod is mounted on the bottom plate, the vacuum chuck head is connected above the vacuum connecting rod, the quick plug connector is mounted below the vacuum connecting rod, and the quick plug connector, the vacuum connecting rod and the vacuum chuck head form a vacuum channel.

5. The wafer baking apparatus according to claim 4, wherein Further comprising a lifting mechanism arranged at the bottom of the box body, the driving end of the lifting mechanism is connected with the vacuum chuck head, and the lifting mechanism is used to drive the vacuum chuck head, the vacuum connecting rod and the quick plug connector to move up and down.

6. The wafer baking apparatus of claim 2, wherein At least one side plate of the upper closed box body is arranged in a openable and closable structure; and / or, at least one side plate of the lower closed box body is arranged in a openable and closable structure.

7. The wafer baking apparatus of claim 2, wherein Further comprising a horizontal moving mechanism mounted on the heating mounting bracket, the heating assembly is mounted on the horizontal moving mechanism, and the horizontal moving mechanism is used to move the heating assembly horizontally.

8. The wafer baking apparatus according to claim 7, wherein The horizontal moving mechanism comprises a slide rod horizontally mounted on the heating mounting bracket and a sliding block slidably mounted on the slide rod, and the heating assembly is fixedly connected to the sliding block.

9. The wafer baking apparatus of claim 1, wherein Further comprising a purging mechanism, the purging mechanism comprises a blowing nozzle and a compressed gas tank, the blowing nozzle is arranged at the bottom of the box body, and the blowing direction of the blowing nozzle is towards the heating assembly, the blowing nozzle is connected with a gas pipe, and the gas pipe communicates with the compressed gas tank outside the box body through the side wall of the box body.

10. A pick-and-place machine, characterized in that The device comprises the wafer baking device according to any one of claims 1-9. The device comprises the wafer baking device according to any one of claims 1-9.

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