Spacing device based on wafer bonding

Abstract

The utility model relates to a spacing device based on wafer bonding, and belongs to the technical field of semiconductor manufacturing. The device comprises a first bonding wafer which is fixed in a clamping groove of cleaning equipment; the plurality of spacing mechanisms are uniformly distributed at the periphery of the first bonding wafer; the spacing mechanism comprises a fixed base, a rotating shaft, a connecting rod and a gasket assembly, and the rotating shaft rotates to drive the connecting rod and change the position of the gasket assembly; the gasket assembly comprises a gasket fixing shaft and a gasket body, and the gasket body is of an umbrella-shaped structure, is arranged above the first bonding wafer and does not make contact with the upper surface of the first bonding wafer; and the second bonding wafer is placed above the gasket body, and a linear contact surface exists between the lower surface of the second bonding wafer and the umbrella-shaped inclined surface of the gasket body so as to reduce pollution. According to the utility model, after the two wafers are cleaned by the megasonic cleaning machine, in-situ direct bonding is realized, so that the occupied space of equipment is greatly reduced, the contact area between the gasket and the wafers is reduced, and the pollution possibility is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a spacer device based on wafer bonding. Background Technology

[0002] With the development of technologies in microelectronics, microelectromechanical systems (MEMS), and multifunctional chip integration, direct bonding technology has emerged. This technology enables bonded structures to achieve structural properties that are difficult to achieve with single-material wafers or traditional processing methods, and has high application value. Consequently, in practical applications, direct bonding is used to achieve connections between wafers.

[0003] In related technologies, to ensure the quality of direct bonding, key indicators such as surface humidity, cleanliness, and flatness of the two bonding surfaces are strictly controlled.

[0004] However, the direct bonding method described above has some problems. As wafer thickness continues to decrease, wafers are prone to warping under gravity, causing premature bonding during the approach of adjacent wafers, making it difficult to readjust alignment accuracy. Furthermore, the currently commonly used method of using spacers to separate wafers, due to their large contact area, easily introduces contaminants, leading to reduced bonding quality and further affecting subsequent semiconductor processing steps. Utility Model Content

[0005] In response to the shortcomings of the existing manufacturing technology, the applicant provides a spacer device based on wafer bonding, which can prevent the upper and lower wafers from bonding before alignment and also reduce the contact area between the wafer and the spacer.

[0006] The technical solution adopted in this utility model is as follows: a spacer based on wafer bonding.

[0007] The device includes:

[0008] The first bonding wafer is fixed in the slot of the cleaning equipment;

[0009] Multiple spacers are evenly distributed around the first bonded wafer;

[0010] Each of the aforementioned interval mechanisms includes a fixed base, a rotating shaft, a connecting rod, and a gasket assembly. The rotation of the rotating shaft drives the connecting rod, and the gasket assembly changes position as the connecting rod rotates.

[0011] The gasket assembly includes a gasket fixing shaft and a gasket body. The gasket body has an umbrella-shaped structure and is disposed above the first bonding wafer. The bottom surface of the gasket body does not contact the upper surface of the first bonding wafer to prevent contamination.

[0012] The second bonding wafer is placed above the gasket body, and a line contact surface exists between the lower surface of the second bonding wafer and the umbrella-shaped slope of the gasket body, so as to reduce pollution.

[0013] In one of the embodiments, the fixed base is fixed with the cleaning device to achieve rigid connection; the rotating shaft is installed on the fixed base to rotate and drive the connecting rod to rotate; the connecting rod has a curvature to adapt to the topography of the wafer.

[0014] In one of the embodiments, the control mechanism is further included to drive the rotating shafts to rotate synchronously and rapidly after the wafer alignment is completed, so that the gasket assembly returns to the initial position, ensures that the upper surface of the first bonding wafer and the lower surface of the second bonding wafer are in contact simultaneously, and meets the high-precision requirement of the in-situ bonding process.

[0015] In one of the embodiments, the blowing mechanism is further included and arranged beside the initial position of the gasket assembly to blow nitrogen to dry the surface of the gasket body before the gasket assembly rotates above the first bonding wafer.

[0016] In one of the embodiments, the gasket fixing shaft is arranged at the end position of the connecting rod and fixed with the connecting rod; the structure of the gasket body is designed as an umbrella-shaped structure simulating the head of a mushroom, the top surface of the gasket body is in the shape of an umbrella surface, and an included angle exists between the umbrella-shaped slope and the lower surface of the second bonding wafer, so that the interval distance between the first bonding wafer and the second bonding wafer can be changed by changing the position of the second bonding wafer on the umbrella-shaped slope.

[0017] In one of the embodiments, the cleaning device is a megasonic cleaning machine.

[0018] In one of the embodiments, the gasket body is made of Teflon material to enhance the hydrophobicity and reduce water stain residues.

[0019] The beneficial effects of the utility model are as follows:

[0020] The utility model has the advantages of compact and reasonable structure, convenient operation, in-situ direct bonding of two wafers after cleaning by the megasonic cleaning machine, greatly reduced land occupation space of the equipment, improved space utilization, and reduced space layout cost.

[0021] The utility model further has the following advantages:

[0022] (1) The gasket body simulates the head of a mushroom and is designed as an umbrella-shaped slope, which can greatly reduce the contact area between the gasket body and the lower surface of the second bonding wafer to reduce the possibility of pollution; and the design of the umbrella-shaped slope can realize flexible adjustment of the interval distance between the upper and lower wafers to adapt to the concave condition of different upper wafers.

[0023] (2) On the side of the initial position of the gasket assembly, a separate blowing mechanism is equipped, the blowing mechanism blows nitrogen to ensure the dryness of the wafer bonding surface and reduce the introduction of particles. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is the overall structure schematic view of the utility model.

[0025] Figure 2 It is the structure schematic view of the single spacing mechanism in the utility model.

[0026] Figure 3 It is the structure schematic view of the gasket assembly in the spacing mechanism of the utility model.

[0027] Figure 4 It is the spacing mechanism and blowing mechanism cooperation schematic view of the utility model.

[0028] Wherein: 1, first bonding wafer;2, second bonding wafer;3, spacing mechanism;4, blowing mechanism;301, fixed base;302, rotating shaft;303, connecting rod;304, gasket assembly;

[0029] 3041, gasket fixing shaft;3042, gasket body. DETAILED DESCRIPTION

[0030] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below in conjunction with the drawings. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application, therefore the present application is not limited by the specific embodiments disclosed below.

[0031] In the description of the present application, if these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the present application.

[0032] In addition, if there are these terms "first", "second", these terms are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can be explicitly or implicitly included at least one of the features. In the description of the present application, if there are the terms "a plurality of", the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0033] In the present application, unless otherwise explicitly specified and limited, if there are the terms "mounting", "connecting", "connecting", "fixing" and the like, these terms should be broadly understood. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] In the present application, unless otherwise explicitly specified and limited, if there are the terms "first" and "second" and the like, the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0035] It should be noted that if an element is referred to as "fixed to" or "provided to" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If there is, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are only for the purpose of description, and do not represent the only implementation.

[0036] Please refer to the accompanying Figure 1 The present application provides a spacer device based on wafer bonding, which comprises a first bonding wafer 1, a second bonding wafer 2, a plurality of spacer mechanisms 3 and a blowing mechanism 4.

[0037] The first bonding wafer 1 is fixed in the clamping groove of the cleaning equipment, and in this embodiment, the cleaning equipment is preferably a megasonic cleaning machine. The first bonding wafer 1 serves as the lower wafer and is stably positioned in the clamping groove of the cleaning equipment.

[0038] Please refer to the accompanying drawings Figure 2 The plurality of spacing mechanisms 3 are uniformly distributed around the first bonding wafer 1, and each spacing mechanism 3 comprises a fixed base 301, a rotating shaft 302, a connecting rod 303, and a gasket assembly 304.

[0039] The fixed base 301 is fixedly connected with the cleaning equipment to achieve rigid connection and ensure the stability of the spacing mechanism 3.

[0040] The rotating shaft 302 is installed on the fixed base 301 and can rotate to drive the connecting rod 303 to rotate.

[0041] The connecting rod 303 has a curvature to adapt to the topography of the wafer and ensure smooth movement during rotation.

[0042] Please refer to the accompanying drawings Figure 3 The gasket assembly 304 comprises a gasket fixing shaft 3041 and a gasket body 3042. The gasket fixing shaft 3041 is arranged at the end of the connecting rod 303 and is fixedly connected with the connecting rod 303. The gasket body 3042 has an umbrella-shaped structure that simulates the shape of a mushroom head. The bottom surface of the gasket body 3042 is not in contact with the upper surface of the first bonding wafer 1 to prevent contamination. Specifically, the top surface of the gasket body 3042 is umbrella-shaped, and there is an included angle between the umbrella-shaped inclined surface and the lower surface of the second bonding wafer 2. By changing the position of the second bonding wafer 2 on the umbrella-shaped inclined surface, the spacing distance between the first bonding wafer 1 and the second bonding wafer 2 can be changed. This design not only reduces the contact area between the gasket and the wafer and reduces the possibility of contamination, but also allows flexible adjustment of the spacing distance.

[0043] The second bonding wafer 2 is placed above the gasket body 3042, and there is a line contact surface between the lower surface of the second bonding wafer 2 and the umbrella-shaped inclined surface of the gasket body 3042, further reducing the possibility of contamination.

[0044] In this embodiment, the device further comprises a control mechanism (not shown in the figure), which is used to drive the plurality of rotating shafts 302 to rotate synchronously and quickly after the wafer alignment is completed, so that each gasket assembly 304 returns to the initial position synchronously. In this way, the upper surface of the first bonding wafer 1 and the lower surface of the second bonding wafer 2 can be in contact at the same time, meeting the high precision requirement of the in-situ bonding process.

[0045] Please refer to the accompanying drawings Figure 4The air blowing mechanism 4 is positioned next to the initial position of the gasket assembly 304. Before the gasket assembly 304 rotates above the first bonding wafer 1, the air blowing mechanism 4 blows nitrogen gas to dry the surface of the gasket body 3042. This ensures the dryness of the wafer bonding surface and reduces particle introduction, further improving bonding quality.

[0046] In this embodiment, the structure of the gasket body 3042 is made of Teflon material. Teflon material has excellent hydrophobicity and anti-fouling properties, which can enhance its hydrophobicity and reduce water stains, thereby further reducing the possibility of contamination.

[0047] In practical work, the working method of this utility model is as follows:

[0048] The first bonding wafer 1 is fixed in the slot of the cleaning equipment;

[0049] Spacer mechanisms 3 are evenly installed around the first bonding wafer 1. The spacer assembly 304 is rotated to the top of the first bonding wafer 1 by means of the cooperation of the rotating shaft 302 and the connecting rod 303. The spacer body 3042 does not contact the upper surface of the first bonding wafer 1.

[0050] Place the second bonding wafer 2 above the pad body 3042, ensuring that there is a sufficiently small line contact surface between the second bonding wafer 2 and the umbrella-shaped bevel at the top of the pad body 3042;

[0051] Perform wafer alignment;

[0052] After wafer alignment, the control mechanism drives the rotating shaft 302 to rotate rapidly, so that the pad assembly 304 returns to its initial position, ensuring that the first bonding wafer 1 and the second bonding wafer 2 are in full-surface contact at the same time, thus completing wafer bonding.

[0053] In the above working method, before wafer alignment, the surface of the gasket body 3042 is dried by blowing air using the air blowing mechanism 4.

[0054] This invention features a rational structure that enables direct in-situ bonding of two wafers after cleaning in a mega-sound cleaning machine, significantly reducing equipment footprint, improving space utilization, and lowering layout costs. Furthermore, the gasket body 3042, designed with an umbrella-shaped bevel mimicking a mushroom head, greatly reduces the contact area between the gasket body 3042 and the lower surface of the second bonding wafer 2, minimizing the possibility of contamination. Simultaneously, the umbrella-shaped bevel design allows for flexible adjustment of the spacing between the upper and lower wafers to accommodate different wafer recesses.

[0055] Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations are described, however, it is to be understood that the application embraces all such possible combinations.

[0056] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A spacer device based on wafer bonding, characterized in that, The utility model relates to a wafer bonding device, which comprises: a first wafer fixed in a clamping groove of a cleaning device; a plurality of spacing mechanisms uniformly distributed around the first wafer; each of the spacing mechanisms comprises a fixed base, a rotating shaft, a connecting rod and a spacer assembly, the rotating shaft drives the connecting rod to rotate, and the spacer assembly changes position with the rotation of the connecting rod; the spacer assembly comprises a spacer fixing shaft and a spacer body, the spacer body is in the shape of an umbrella, the spacer body is arranged above the first wafer, and the bottom surface of the spacer body is not in contact with the upper surface of the first wafer to prevent contamination; a second wafer is placed above the spacer body, and there is a line contact surface between the lower surface of the second wafer and the umbrella-shaped inclined surface of the spacer body to reduce contamination.

2. The wafer bonding based spacing device of claim 1, wherein, the fixed base is fixed between the cleaning device to achieve rigid connection; the rotating shaft is installed on the fixed base to rotate and drive the connecting rod to rotate; the connecting rod has a curvature to adapt to the topography of the wafer.

3. The wafer bonding based spacing device of claim 1, wherein, the control mechanism is used to drive the plurality of rotating shafts to rotate synchronously and rapidly after the wafer alignment is completed, so that the spacer assembly returns to the initial position, the upper surface of the first wafer and the lower surface of the second wafer are in contact at the same time, and the high-precision requirement of the in-situ bonding process is met.

4. The wafer bonding based spacing device of claim 3, wherein, the blowing mechanism is arranged beside the initial position of the spacer assembly and is used to blow nitrogen to dry the surface of the spacer body before the spacer assembly rotates above the first wafer.

5. The wafer bonding based spacing device of claim 1, wherein, the spacer fixing shaft is arranged at the end position of the connecting rod and is fixed with the connecting rod; the structure of the spacer body is in the shape of an umbrella, the top surface of the spacer body is in the shape of an umbrella surface, there is an included angle between the umbrella-shaped inclined surface and the lower surface of the second wafer, and the spacing distance between the first wafer and the second wafer can be changed by changing the position of the second wafer on the umbrella-shaped inclined surface.

6. The wafer bonding based spacing device of claim 1, wherein, the cleaning device is a megasonic cleaner.

7. The wafer bonding based spacing device of claim 1, wherein, the spacer body is made of Teflon material to enhance its hydrophobicity and reduce water stain residue.

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