Electronic chip production film covering positioning mechanism

Abstract

The utility model provides a laminating positioning mechanism for electronic chip production, which relates to the technical field of electronic chip laminating equipment and comprises a support plate, four corners of the upper surface of the support plate are fixedly connected with slide rails, and the upper ends of the four slide rails are fixedly connected with a mounting plate. During use, an electronic chip is placed on the upper surface of the lower clamping plate, a film material is placed on the upper surface of the electronic chip, the transmission pipe is driven by the motor to rotate, the lower end of the lead screw is rotationally connected to the upper clamping plate through a bearing, and when the transmission pipe rotates, the lead screw drives the upper clamping plate to move up and down under the action of threads, so that the film material is extruded by the upper clamping plate; the four sets of linear bearings limit the moving tracks of the upper clamping plate and the lower clamping plate through the guide rails, the situation that the upper clamping plate and the lower clamping plate shake after being stressed, consequently, film materials are stressed unevenly, and the film laminating quality is affected is avoided, the damper and the spring compress the stroke, absorb kinetic energy and provide buffering after being stressed, the situation that an electronic chip is damaged due to too high stress is avoided, and production loss and production cost are reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic chip film coating equipment technical field especially relates to a kind of electronic chip production film coating positioning mechanism. BACKGROUND

[0002] Electronic chip film coating is a kind of process that protective film or functional film is coated on the surface of electronic chip, commonly used in the production process of semiconductor device, the purpose of this process is to provide protection, increase device functionality or improve performance, film coating can prevent chip from being influenced by external environment such as moisture, corrosion etc. during use, and in some applications, it can also enhance the conductivity of chip, high-temperature resistance or other specific functions, and pressing is a commonly used method to adhere film material to the surface of electronic chip, especially in the process of pressing film or hot pressing film, by pressing, it can ensure that film material is in full contact with the surface of chip, form uniform film layer, and enhance the adhesion of film material and chip.

[0003] But the film coating pressing equipment in prior art is simple in structure, cannot provide buffer when chip is stressed, leading to that stress is concentrated in certain area of chip, especially weak point or high sensitive area of chip such as solder joint, circuit, pin etc., and local excessive stress leads to that circuit on the surface or inside of chip is broken, deformed, even cracked, increasing production cost. UTILITY MODEL CONTENT

[0004] The utility model aims at solving the technical problem that film coating pressing equipment in prior art is simple in structure, cannot provide buffer when chip is stressed, leading to that stress is concentrated in certain area of chip, especially weak point or high sensitive area of chip such as solder joint, circuit, pin etc., and local excessive stress leads to that circuit on the surface or inside of chip is broken, deformed, even cracked, increasing production cost, and proposes a kind of electronic chip production film coating positioning mechanism.

[0005] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme: a kind of electronic chip production film coating positioning mechanism, including support plate, the upper surface of the support plate four corners is fixedly connected with slide rail, the upper end of four slide rails is fixedly connected with mounting plate, the upper surface of the mounting plate is fixedly connected with motor, the output of the motor is fixedly connected with transmission pipe, the upper end of the transmission pipe is rotatably connected to the lower surface of mounting plate by bearing, the inner wall surface of the transmission pipe is threadedly connected with lead screw, the lower end of the lead screw is fixedly connected with upper clamping plate, the upper surface of the support plate is fixedly connected with damper, the upper end of the damper is fixedly connected with lower clamping plate, the lower surface of the lower clamping plate is fixedly connected with spring.

[0006] Further, the upper surface four corners of the upper clamping plate and the upper surface four corners of the lower clamping plate are embedded with linear bearing.

[0007] Further, two straight line bearings are a group, and the inner wall surface of four groups of straight line bearings is sleeved on the outer surface of four slide rails.

[0008] Further, the outer surface of the damper is threadedly connected with an adjusting ring, and the adjusting ring is located below the spring.

[0009] Further, the upper surface of the adjusting ring is fixedly connected with a bidirectional bearing, and the upper surface of the bidirectional bearing is fixedly connected to the lower end of the spring.

[0010] Further, the inner wall surface of the spring is sleeved on the outer surface of the damper.

[0011] Compared with the prior art, the advantages and positive effects of the utility model lie in,

[0012] 1. In the utility model, when in use, the electronic chip is prevented on the upper surface of the lower clamping plate, the film material is placed on the upper surface of the electronic chip, the transmission pipe is rotated through the driving of the motor, the upper end of the transmission pipe is rotatably connected to the lower surface of the mounting plate through the bearing, so that the transmission pipe can rotate smoothly, the lower end of the lead screw is rotatably connected to the upper clamping plate through the bearing, when the transmission pipe rotates, the lead screw drives the upper clamping plate to move up and down under the action of the screw thread, the upper clamping plate extrudes the film material, four groups of straight line bearings limit the moving track of the upper clamping plate and the lower clamping plate through the guide rail, so that the upper clamping plate and the lower clamping plate do not shake after being stressed, the film material is not stressed unevenly, the film coating quality is affected, the damper and the spring are compressed after being stressed, kinetic energy is absorbed, buffer is provided, the electronic chip is not damaged due to excessive stress, and production loss and production cost are reduced.

[0013] 2. In the utility model, the bidirectional bearing extrudes or releases the spring through the rotation of the adjusting ring, the stroke of the spring is controlled, the supporting force provided by the lower clamping plate for the electronic chip is adjusted, the film material of different pressures can be applied, the use range is wide, the spring is sleeved on the outer surface of the damper, when the spring is transversely stressed, the damper provides supporting force, the spring is prevented from being bent and deformed, and normal work of parts is ensured. ACCURATE DRAWINGS

[0014] Figure 1 A three-dimensional structure schematic view of the film coating positioning mechanism for electronic chip production is provided in the utility model.

[0015] Figure 2 A three-dimensional structure schematic view of the lower clamping plate of the film coating positioning mechanism for electronic chip production is provided in the utility model.

[0016] Figure 3 A sectional three-dimensional structure schematic view of the transmission pipe of the film coating positioning mechanism for electronic chip production is provided in the utility model.

[0017] Figure 4The utility model provides a kind of electronic chip production film positioning mechanism damper's three-dimensional structure schematic diagram.

[0018] Legend: 1, support plate; 2, slide rail; 3, mounting plate; 4, motor; 5, transmission pipe; 6, screw; 7, damper; 8, adjusting ring; 9, two-way bearing; 10, spring; 11, lower clamp plate; 12, linear bearing; 13, upper clamp plate. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0020] Embodiment 1

[0021] As Figures 1-4 shown, the utility model provides technical scheme: a kind of electronic chip production film positioning mechanism, including support plate 1, the upper surface of support plate 1 four corners is fixedly connected with slide rail 2, the upper end of four slide rails 2 is fixedly connected with mounting plate 3, the upper surface of mounting plate 3 is fixedly connected with motor 4, the output end of motor 4 is fixedly connected with transmission pipe 5, the upper end of transmission pipe 5 is rotatably connected to the lower surface of mounting plate 3 by bearing, the inner wall surface of transmission pipe 5 is connected with screw 6, the lower end of screw 6 is fixedly connected with upper clamp plate 13, the upper surface of support plate 1 is fixedly connected with damper 7, the upper end of damper 7 is fixedly connected with lower clamp plate 11, the lower surface of lower clamp plate 11 is fixedly connected with spring 10, the upper surface four corners of upper clamp plate 13 and the upper surface four corners of lower clamp plate 11 are embedded with linear bearing 12, two linear bearings 12 are a group, and the inner wall surface of four groups of linear bearings 12 is sleeved on the outer surface of four slide rails 2.

[0022] In this embodiment, when in use, the electronic chip is prevented from being placed on the upper surface of the lower clamping plate 11, the film material is placed on the upper surface of the electronic chip, the transmission pipe 5 is rotated by driving the motor 4, the upper end of the transmission pipe 5 is rotatably connected to the lower surface of the mounting plate 3 through a bearing, and the rotation of the transmission pipe 5 is ensured to be smooth, the lower end of the lead screw 6 is rotatably connected to the upper clamping plate 13 through a bearing, when the transmission pipe 5 rotates, the upper clamping plate 13 moves up and down under the action of the screw thread, the upper clamping plate 13 extrudes the film material, the four groups of linear bearings 12 limit the movement trajectory of the upper clamping plate 13 and the lower clamping plate 11 through the guide rail 2, avoid the upper clamping plate 13 and the lower clamping plate 11 from shaking after being stressed, cause the film material to be unevenly stressed, affect the film coating quality, the damper 7 and the spring 10 are compressed after being stressed, absorb kinetic energy, provide cushioning, avoid the electronic chip from being damaged due to excessive stress, and reduce production loss and production cost.

[0023] Embodiment 2

[0024] As shown in Figures 1-4 , the outer surface of the damper 7 is threadedly connected with an adjusting ring 8, the adjusting ring 8 is located below the spring 10, the upper surface of the adjusting ring 8 is fixedly connected with a bidirectional bearing 9, the upper surface of the bidirectional bearing 9 is fixedly connected to the lower end of the spring 10, and the inner wall surface of the spring 10 is sleeved on the outer surface of the damper 7.

[0025] In this embodiment, the bidirectional bearing 9 extrudes or releases the spring 10 by rotating the adjusting ring 8, controls the stroke of the spring 10, adjusts the supporting force provided by the lower clamping plate 11 for the electronic chip, can be suitable for film materials with different pressures, has a wide range of applications, the spring 10 is sleeved on the outer surface of the damper 7, when the spring 10 is stressed in the transverse direction, the damper 7 provides supporting force, avoids the spring 10 from being bent and deformed, and ensures normal work of the parts.

[0026] Working principle: as Figures 1-4As shown, in use, the electronic chip is prevented on the upper surface of the lower clamping plate 11, the film material is placed on the upper surface of the electronic chip, the transmission pipe 5 is rotated by the driving of the motor 4, the upper end of the transmission pipe 5 is rotatably connected to the lower surface of the mounting plate 3 through a bearing, so that the transmission pipe 5 can rotate smoothly, the lower end of the lead screw 6 is rotatably connected to the upper clamping plate 13 through a bearing, when the transmission pipe 5 rotates, the upper clamping plate 13 moves up and down under the action of the screw thread, the upper clamping plate 13 extrudes the film material, the four groups of linear bearings 12 limit the movement track of the upper clamping plate 13 and the lower clamping plate 11 through the guide rail 2, so that the upper clamping plate 13 and the lower clamping plate 11 do not shake after being stressed, the damper 7 and the spring 10 are compressed after being stressed, the bidirectional bearing 9 extrudes or releases the spring 10 through the rotation of the adjusting ring 8, the stroke of the spring 10 is controlled, the support force provided by the lower clamping plate 11 for the electronic chip is adjusted, the film material of different pressure can be applied, the use range is wide, the spring 10 is sleeved on the outer surface of the damper 7, when the spring 10 is stressed in the transverse direction, the damper 7 provides a support force, the spring 10 is prevented from bending and deforming, and the normal work of the parts is ensured.

[0027] The above is only a preferred embodiment of the present application, and is not intended to limit the present application in other forms. Any skilled person in the art can modify or change the above disclosed technical content to equivalent embodiments applied to other fields, but any simple modification, equivalent change and modification made according to the technical essence of the present application to the above embodiments still falls within the protection scope of the present application.

Claims

1. An electronic chip production film covering positioning mechanism comprising a support plate (1), characterized in that: The upper surface of the support plate (1) is fixedly connected with slide rails (2) at four corners, the upper ends of the four slide rails (2) are fixedly connected with mounting plates (3), the upper surface of the mounting plate (3) is fixedly connected with a motor (4), the output end of the motor (4) is fixedly connected with a transmission pipe (5), the upper end of the transmission pipe (5) is rotatably connected to the lower surface of the mounting plate (3) through a bearing, the inner wall surface of the transmission pipe (5) is threadedly connected with a lead screw (6), the lower end of the lead screw (6) is fixedly connected with an upper clamping plate (13), the upper surface of the support plate (1) is fixedly connected with a damper (7), the upper end of the damper (7) is fixedly connected with a lower clamping plate (11), and the lower surface of the lower clamping plate (11) is fixedly connected with a spring (10).

2. The film positioning mechanism for electronic chip production according to claim 1, wherein: Linear bearings (12) are embedded at the four corners of the upper surface of the upper clamping plate (13) and the four corners of the upper surface of the lower clamping plate (11).

3. The film positioning mechanism for electronic chip production according to claim 2, wherein: Two linear bearings (12) form a group, and the inner wall surfaces of four groups of linear bearings (12) are sleeved on the outer surfaces of the four slide rails (2).

4. The film positioning mechanism for electronic chip production according to claim 1, wherein: The outer surface of the damper (7) is threadedly connected with an adjusting ring (8), and the adjusting ring (8) is located below the spring (10).

5. The film positioning mechanism for electronic chip production according to claim 4, wherein: The upper surface of the adjusting ring (8) is fixedly connected with a bidirectional bearing (9), and the upper surface of the bidirectional bearing (9) is fixedly connected to the lower end of the spring (10).

6. The film positioning mechanism for electronic chip production according to claim 5, wherein: The inner wall surface of the spring (10) is sleeved on the outer surface of the damper (7).

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