Gallium arsenide wafer transfer device

Abstract

The utility model relates to a gallium arsenide wafer transfer device, top ends of frame bodies of two brackets are provided with clamping grooves used for clamping gallium arsenide wafers, top ends of insulating transfer boxes are provided with positioning grooves used for positioning a fixing device, and bottom ends of a bottom plate are provided with springs used for buffering the bottom plate. The top end of the fixing assembly is fixedly provided with a cover plate assembly used for driving the fixing assembly to tightly cover and fix the gallium arsenide wafer. A plurality of gallium arsenide wafers can be placed in the clamping grooves in the bracket; the positioning blocks on the cover plate are controlled to be clamped into the positioning grooves through the grooves, so that the adjacent gallium arsenide wafers can be blocked by the partition plates, and meanwhile, the gallium arsenide wafers are tightly covered and sealed by the fixing plates; therefore, the gallium arsenide wafer is prevented from being damaged due to the fact that the gallium arsenide wafer shakes in the process of transferring the gallium arsenide wafer by using the insulating transfer box.

Description

TECHNICAL FIELD

[0001] The utility model relates to gallium arsenide wafer transfer technical field especially a kind of gallium arsenide wafer transfer device. BACKGROUND

[0002] Gallium arsenide wafer is a kind of semiconductor material with excellent performance, and is widely used in electronic industry;Among them, gallium arsenide wafer is a brittle material, and will be broken during transportation, so it needs to be shockproof during the transfer process of gallium arsenide wafer. For example, as shown in the gallium arsenide wafer transfer device shown in Chinese patent application No. CN201721191192.4, the structure of the box body includes inner wall and outer wall, and the inner wall and the outer wall are clamped with air cushion layer. The inner side of the inner wall is provided with a flange, and the flange is provided with a wafer holder. The upper side of the wafer holder is provided with an arc-shaped groove matched with the outer circle of the wafer. Each arc-shaped groove contains a wafer. The inner side of the box cover is fixedly provided with a pressing block. The pressing block is also provided with an arc-shaped groove matched with the outer circle of the wafer. The arc-shaped groove and the arc-shaped groove on the wafer holder clamp the wafer from the upper and lower sides respectively to prevent the wafer from moving up and down. The lower side of the pressing block is also provided with a partition piece. The partition piece is arranged between every two wafers, and extends downward to the center of the wafer.

[0003] However, when the box body is used to store and transfer gallium arsenide wafers, the partition piece is used to isolate the adjacent two gallium arsenide wafers, but the top end of the gallium arsenide wafer lacks a fixing device for the gallium arsenide wafer clamped in the wafer holder, which easily causes the gallium arsenide wafer to shake during the transfer process of the gallium arsenide wafer, resulting in the gallium arsenide wafer falling off from the wafer holder. UTILITY MODEL CONTENTS

[0004] To solve the problem of the above background technology that the partition piece is used to isolate the adjacent two gallium arsenide wafers, but the top end of the gallium arsenide wafer lacks a fixing device for the gallium arsenide wafer clamped in the wafer holder, which easily causes the gallium arsenide wafer to shake during the transfer process of the gallium arsenide wafer, resulting in the gallium arsenide wafer falling off from the wafer holder, the utility model provides the following technical scheme:

[0005] A gallium arsenide wafer transfer device, comprising an insulating transfer box for storing gallium arsenide wafers, and a fixing device provided above the insulating transfer box for clamping and fixing the gallium arsenide wafers.

[0006] The fixing device comprises a fixing assembly provided in the insulating transfer box for clamping and fixing the gallium arsenide wafers, and a cover plate assembly fixedly installed at the top end of the fixing assembly for driving the fixing assembly to clamp and fix the gallium arsenide wafers.

[0007] Further, the left end of the insulation transfer box is movably connected with a box cover for plugging the top opening of the insulation transfer box, the left end of the box cover is fixedly installed with a buckle, and the right end of the insulation transfer box is fixedly installed with a clamping block matched with the buckle.

[0008] Further, the insulation transfer box is provided with two brackets for placing the gallium arsenide wafer, and the bracket bodies of the two brackets are provided with clamping grooves for clamping the gallium arsenide wafer.

[0009] Further, the top end of the insulation transfer box is provided with four positioning grooves for positioning the fixing device, and the four positioning grooves are arranged in a rectangular array at the top end of the insulation transfer box.

[0010] Further, the bottom end of the two brackets is provided with a bottom plate for supporting the bracket, and the bottom end of the bottom plate is provided with springs for buffering the bottom plate.

[0011] Further, the cover plate assembly comprises a cover plate clamped at the top end of the insulation transfer box for sealing and tightly covering the insulation transfer box, the top end of the cover plate is provided with a groove for the up-down movement of the cover plate, and the left and right ends of the cover plate are fixedly installed with positioning blocks for up-down movement in the positioning grooves.

[0012] Further, the fixing assembly comprises a plurality of partition plates fixedly installed at the bottom end of the cover plate for blocking the adjacent two gallium arsenide wafers, and the bottom end of the cover plate is fixedly installed with a plurality of fixing plates for sealing and tightly covering the top end of the gallium arsenide wafer.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] By setting the insulation transfer box and the fixing device, when the gallium arsenide wafer needs to be transferred, a plurality of gallium arsenide wafers can be placed in the clamping grooves in the brackets; the positioning blocks on the cover plate are clamped into the positioning grooves through the grooves, so that a plurality of partition plates can be used to block the adjacent gallium arsenide wafers, and the fixing plates are used to tightly seal the gallium arsenide wafers, so as to prevent the gallium arsenide wafers from falling off from the bracket and being damaged due to shaking during the transfer of the gallium arsenide wafers by the insulation transfer box. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a whole structure schematic view of the utility model;

[0016] Figure 2 It is a structure schematic view of the insulation transfer box of the utility model;

[0017] Figure 3The utility model discloses an insulating transfer box,

[0018] Figure 4 The utility model discloses a fixing device structure schematic diagram,

[0019] Figure 5 The utility model discloses a cover plate bottom view,

[0020] Figure 6 The utility model discloses a cover plate top view.

[0021] In the drawing, the component name list that each sign represented in the drawing is as follows:

[0022] 100-insulating transfer box, 101-box cover, 102-buckle, 103-clamping block, 104- bracket, 105-clamping groove, 106-positioning groove, 107-bottom plate, 108-spring;

[0023] 200-gallium arsenide wafer,

[0024] 300-fixing device, 310-cover plate assembly, 311-cover plate, 312-positioning block, 313-groove, 320-fixing assembly, 321-baffle, 322-fixing plate. DETAILED DESCRIPTION

[0025] The preferred specific embodiment of the utility model is described in detail below, and clear and complete description is made with the drawings.

[0026] Please refer to Figures 1-6 The utility model provides a gallium arsenide wafer transfer device.

[0027] Including the insulating transfer box 100 for storing gallium arsenide wafer 200, the upper portion of insulating transfer box 100 is provided with the fixing device 300 for the cover fastening of gallium arsenide wafer 200.

[0028] The left end of insulating transfer box 100 is movably connected with the box cover 101 for the cover fastening of insulating transfer box 100, and the right end of box cover 101 is connected with the box body of insulating transfer box 100 through the hinge, so as to facilitate the rotation of box cover 101 and the cover fastening of insulating transfer box 100;The left end of box cover 101 is fixedly installed with buckle 102, and the right end of insulating transfer box 100 is fixedly installed with clamping block 103 for the cover fastening of insulating transfer box 100 with buckle 102 cooperation;So as to realize the cover fastening of insulating transfer box 100 by the clamping connection between buckle 102 and clamping block 103.

[0029] The insulating transfer box 100 is provided with two brackets 104 for placing the gallium arsenide wafer 200, and the two brackets 104 are symmetrically distributed in the box cavity of the insulating transfer box 100. The top end of the bracket 104 is provided with a clamping groove 105 for clamping the gallium arsenide wafer 200, and the clamping groove 105 is linearly arranged at the top end of the bracket 104.

[0030] The top end of the insulating transfer box 100 is provided with four positioning grooves 106 for positioning the fixing device 300, and the four positioning grooves 106 are arranged in a rectangular array at the top end of the insulating transfer box 100. The bottom end of the two brackets 104 is provided with a bottom plate 107 for supporting the bracket 104, and the bottom end of the bottom plate 107 is provided with a spring 108 for buffering the bottom plate 107, and the spring 108 is linearly arranged at the bottom end of the bottom plate 107. The spring 108 is used to buffer the bottom plate 107, so as to buffer the gallium arsenide wafer 200 on the two brackets 104.

[0031] The fixing device 300 comprises a fixing assembly 320 arranged in the insulating transfer box 100 for tightly fixing the gallium arsenide wafer 200, and the top end of the fixing assembly 320 is fixedly installed with a cover plate assembly 310 for driving the fixing assembly 320 to tightly fix the gallium arsenide wafer 200.

[0032] The cover plate assembly 310 comprises a cover plate 311 clamped at the top end of the insulating transfer box 100 for tightly sealing the box cavity of the insulating transfer box 100, and the shape and size of the cover plate 311 are the same as those of the box cavity of the insulating transfer box 100. The top end of the cover plate 311 is provided with a groove 313 for driving the cover plate 311 to move up and down, so as to facilitate the operator to control the cover plate 311 to tightly seal the box cavity of the insulating transfer box 100 through the groove 313. The left and right ends of the cover plate 311 are fixedly installed with a positioning block 312 for moving up and down in the positioning groove 106, and the positioning block 312 is arranged in a rectangular array at the left and right ends of the cover plate 311.

[0033] The fixed assembly 320 comprises a partition plate 321 fixedly installed at the bottom end of the cover plate 311 for blocking the adjacent two gallium arsenide wafers 200, the side of the partition plate 321 in contact with the gallium arsenide wafer 200 is bonded with buffer cotton, and the partition plate 321 is in linear array distribution at the bottom end of the cover plate 311, so that the adjacent gallium arsenide wafers 200 are blocked by the plurality of partition plates 321 to prevent the adjacent gallium arsenide wafers 200 from being damaged due to collision; the bottom end of the cover plate 311 is fixedly installed with a fixed plate 322 for sealing the top end of the gallium arsenide wafer 200, and the fixed plate 322 is in the shape of an arch to facilitate the sealing of the gallium arsenide wafer 200 by the fixed plate 322 in the shape of an arch; and the fixed plate 322 is in linear array distribution at the bottom end of the cover plate 311; so that when the gallium arsenide wafer 200 needs to be transported, the plurality of gallium arsenide wafers 200 can be placed in the clamping groove 105 in the bracket 104; then the positioning block 312 on the cover plate 311 is clamped into the positioning groove 106 through the groove 313, so that the plurality of partition plates 321 can block the adjacent gallium arsenide wafers 200, and the fixed plate 322 can seal the gallium arsenide wafer 200 to prevent the gallium arsenide wafer 200 from falling off from the bracket 104 and being damaged due to shaking during the transportation of the gallium arsenide wafer 200 by the insulating transportation box 100.

[0034] Based on the above content and the drawings, those skilled in the art can understand and implement the present application. In addition, any non-creative modification of the present application by those skilled in the art without creative labor still falls within the protection scope of the present application.

Claims

1. A gallium arsenide wafer transfer device, comprising: The application relates to an insulating transfer box (100) for storing gallium arsenide wafers (200), wherein a fixing device (300) for tightly fixing the gallium arsenide wafers (200) is arranged on the top of the insulating transfer box (100). The fixing device (300) comprises a fixing assembly (320) arranged in the insulating transfer box (100) for tightly fixing the gallium arsenide wafers (200), and a cover plate assembly (310) for driving the fixing assembly (320) to tightly fix the gallium arsenide wafers (200) is fixedly arranged on the top end of the fixing assembly (320).

2. A gallium arsenide wafer transfer apparatus as defined in claim 1, wherein: The left end of the insulating transfer box (100) is movably connected with a box cover (101) for tightly covering the top opening of the insulating transfer box (100), the left end of the box cover (101) is fixedly connected with a buckle (102), and the right end of the insulating transfer box (100) is fixedly connected with a clamping block (103) matched with the buckle (102) to tightly cover the box cover (101).

3. A gallium arsenide wafer transfer apparatus as defined in claim 2, wherein: The insulating transfer box (100) is provided with two brackets (104) for placing the gallium arsenide wafers (200), and the top end of the bracket (104) is provided with a clamping groove (105) for clamping the gallium arsenide wafers (200).

4. A gallium arsenide wafer transfer apparatus as defined in claim 3, wherein: The top end of the insulating transfer box (100) is provided with four positioning grooves (106) for positioning the fixing device (300), and the four positioning grooves (106) are arranged in a rectangular array on the top end of the insulating transfer box (100).

5. A gallium arsenide wafer transfer apparatus as defined in claim 4, wherein: The bottom end of the bracket (104) is provided with a bottom plate (107) for supporting the bracket (104), the bottom end of the bottom plate (107) is provided with a spring (108) for buffering the bottom plate (107), and the spring (108) has a plurality of spring (108).

6. A gallium arsenide wafer transfer apparatus as defined in claim 4, wherein: The cover plate assembly (310) comprises a cover plate (311) clamped on the top end of the insulating transfer box (100) for tightly sealing the insulating transfer box (100), the top end of the cover plate (311) is provided with a groove (313) for the up-down movement of the cover plate (311), and the left and right ends of the cover plate (311) are fixedly connected with positioning blocks (312) for the up-down movement in the positioning grooves (106).

7. A gallium arsenide wafer transfer apparatus as defined in claim 6, wherein: The fixing assembly (320) comprises a partition plate (321) fixedly arranged on the bottom end of the cover plate (311) for blocking the adjacent two gallium arsenide wafers (200), and the partition plate (321) has a plurality of partition plates (321), and the bottom end of the cover plate (311) is fixedly connected with a fixing plate (322) for tightly sealing the top end of the gallium arsenide wafers (200), and the fixing plate (322) has a plurality of fixing plates (322).

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