Heat dissipation structure, power module and power conversion equipment

Abstract

The utility model provides a heat dissipation structure, a power module and power conversion equipment, and relates to the technical field of electronics. The heat dissipation structure comprises a heat dissipation body, and the heat dissipation body is provided with a connecting structure used for being connected with a chip unit of the power module. The surface, facing the chip unit, of the connecting structure is a first surface, the connecting structure is provided with a solder collecting groove, and the solder collecting groove forms a notch of the groove at the first surface; the first face is used for being connected with the chip unit through welding flux on the two sides of the notch in the width direction of the groove. Thus, in the welding process, redundant welding flux can be collected through the welding flux collecting tank, the possibility that the thickness of a welding flux layer is not uniform due to welding flux stacking is reduced, and the thickness uniformity of the welding flux layer after welding is guaranteed; in addition, bubbles generated by the scaling powder in the welding process can be extruded and discharged more easily. The voidage of welding can be reduced, the welding quality can be improved, and the consistency of batch welding can be managed and controlled.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the technical field of electronics, and in particular, to a heat dissipation structure, a power module and a power conversion device. BACKGROUND

[0002] In a power module, a chip unit is usually connected with a heat dissipation structure such as a heat spreader by soldering, specifically, solder paste is laid on the heat spreader, then the chip unit is placed, and the heat spreader and the chip unit are pressed by a clamp and then put into a soldering device for soldering treatment.

[0003] However, in some cases, there may be a problem of uneven thickness of the solder layer formed by soldering between different positions in the connection area of the heat spreader and the chip unit, which further affects the use performance of the power module such as uniformity of heat conduction. CONTENT OF THE INVENTION

[0004] The present disclosure aims to solve at least one aspect of the problem of uneven thickness of soldering when connecting a heat dissipation structure and a chip unit.

[0005] To at least partially solve at least one aspect of the above problem, in a first aspect, the present disclosure provides a heat dissipation structure, comprising a heat dissipation body provided with a connection structure for connecting with a chip unit of a power module; a surface of the connection structure facing the chip unit is a first surface, the connection structure is provided with a solder collection groove, the solder collection groove forms a groove opening at the first surface; the first surface is used to connect with the chip unit through solder on both sides of the groove opening along the width direction of the groove.

[0006] Optionally, the solder collection groove is formed with a communication opening at at least one end in the extension direction of the groove.

[0007] Optionally, the number of solder collection grooves is multiple, and at least two of the multiple solder collection grooves are connected in communication.

[0008] Optionally, one end of the connection structure away from the first surface is integrally connected or detachably connected with the heat dissipation body.

[0009] Optionally, the connection structure comprises multiple sub-blocks arranged at intervals, and the interval between any two adjacent sub-blocks is used to form the solder collection groove.

[0010] Optionally, the multiple sub-blocks are arranged in a matrix distribution.

[0011] Optionally, the chip unit comprises a chip and an insulation module; the insulation module is provided with a first metal layer facing the chip and a second metal layer facing the first surface; the first metal layer is connected with the chip; the second metal layer is connected with the first surface through solder; the cross-sectional area of the second metal layer is greater than or equal to the area of the first surface; when the second metal layer is connected with the first surface, the second metal layer covers the first surface.

[0012] Optionally, the heat dissipation body is provided with a groove structure, and the connecting structure is arranged at the groove bottom of the groove structure.

[0013] Optionally, the first surface is provided with a plurality of protrusions, and the heights of the plurality of protrusions are consistent.

[0014] Optionally, the solder is a solder sheet, and the solder sheet is internally provided with a support structure.

[0015] In a second aspect, the present disclosure provides a power module comprising a chip unit and the heat dissipation structure according to any one of the first aspect, and the chip unit is welded and connected with the first surface of the heat dissipation structure through solder.

[0016] Optionally, the heat dissipation structure comprises at least one of a vapor chamber and a heat sink.

[0017] Optionally, when the heat dissipation structure comprises the vapor chamber, a plurality of connecting holes are arranged on the vapor chamber.

[0018] In a third aspect, the present disclosure provides a power conversion device comprising the power module according to the second aspect.

[0019] In the heat dissipation structure, the power module and the power conversion device of the present disclosure, the heat dissipation body of the heat dissipation structure is provided with a connecting structure, the connecting structure is connected with the chip unit through solder, the surface of the connecting structure facing the chip unit is a first surface, the connecting structure is provided with a solder collecting groove, the solder collecting groove forms a groove opening at the first surface; when the first surface of the connecting structure is connected with the chip unit through solder on both sides of the groove opening along the width direction of the groove, that is, the part of the first surface located on one side of the groove opening along the width direction of the groove is connected with the chip unit through solder, and the part of the first surface located on the other side of the groove opening along the width direction of the groove is connected with the chip unit through solder, so that the chip unit and the heat dissipation structure are connected as a whole through solder, ensuring the reliable connection of the two, and in the welding process, the excess solder can be collected through the solder collecting groove, which is beneficial to reduce the possibility of uneven thickness of the solder layer caused by solder stacking, to ensure the thickness uniformity of the solder layer after welding, to reduce the welding internal stress; and in this case, the bubbles generated by the flux in the welding process are more easily extruded and discharged, which is beneficial to reduce the porosity of the welding, to improve the welding quality, and to control the consistency of batch welding. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 Structure diagram of the heat dissipation structure in the first embodiment of the present disclosure;

[0021] Figure 2 Structure diagram of the heat dissipation structure in the first embodiment of the present disclosure; Figure 1 Structure diagram of the power module when the heat dissipation structure in the first embodiment of the present disclosure is used in the power module;

[0022] Figure 3 Structure diagram of the heat dissipation structure in the second embodiment of the present disclosure when the heat dissipation structure is a heat plate;

[0023] Figure 4 Structure diagram of the heat dissipation structure in the second embodiment of the present disclosure when the heat dissipation structure is a heat plate; Figure 3 Enlarged view of A in the second embodiment of the present disclosure;

[0024] Figure 5 Structure diagram of the heat dissipation structure in the second embodiment of the present disclosure when the heat dissipation structure is a heat plate; Figure 3 Structure diagram of the power module when the heat dissipation structure in the second embodiment of the present disclosure is used in the power module;

[0025] Figure 6 Structure diagram of the heat dissipation structure in the third embodiment of the present disclosure when the heat dissipation structure is a heat plate and the heat dissipation body is provided with a groove structure;

[0026] Figure 7 Enlarged view of B in the third embodiment of the present disclosure; Figure 6

[0027] Structure diagram of the heat dissipation structure in the third embodiment of the present disclosure when the heat dissipation structure is a heat plate and the heat dissipation body is provided with a groove structure; Figure 8 Figure 6 Structure diagram of the power module when the heat dissipation structure in the third embodiment of the present disclosure is used in the power module;

[0028] Figure 9 Explosive diagram of the power module when the solder in the fourth embodiment of the present disclosure adopts a solder sheet;

[0029] Figure 10 Structure diagram of the power module when the heat dissipation structure in the fifth embodiment of the present disclosure includes a heat plate and a heat sink;

[0030] Figure 11 Structure diagram of the power module when the heat dissipation structure in the fifth embodiment of the present disclosure includes a heat plate and a heat sink; Figure 10 Sectional view of A-A in the fifth embodiment of the present disclosure.

[0031] REFERENCE SIGNS:

[0032] ​1 - heat dissipation structure; 1A - vapor chamber; 1B - heat sink; 11 - heat dissipation body; 12 - connecting structure; 121 - block structure; 1211 - sub-block; 122 - first surface; 123 - solder collection groove; 1231 - communication opening; 1232 - groove opening; 13 - protrusion; 14 - groove structure; 15 - connecting hole; 2 - chip unit; 21 - chip; 22 - insulating module; 221 - first metal layer; 222 - second metal layer; 223 - insulating layer; 23 - plastic package structure; 3 - solder; 31 - soldering pad. DETAILED DESCRIPTION

[0033] In order to make the above objectives, features and advantages of the present disclosure more obvious and easy to understand, the specific embodiments of the present disclosure are described in detail below with reference to the drawings.

[0034] In the description of the present disclosure, it should be noted that unless specifically defined and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0035] In the description of the present disclosure, the description of the terms "embodiment", "one embodiment", "some embodiments", "exemplarily" and "one embodiment" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or embodiment are included in at least one embodiment or embodiment of the present disclosure. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or embodiment. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or embodiments in a suitable manner.

[0036] The terms "first", "second", etc. are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features.

[0037] The Z-axis in the drawings represents the vertical direction, i.e. the up-down position, and the positive direction of the Z-axis, i.e. the direction in which the arrow of the Z-axis points, represents up, and the negative direction of the Z-axis represents down; the X-axis in the drawings represents the front-rear position, and the positive direction of the X-axis, i.e. the direction in which the arrow of the X-axis points, represents the front side, and the negative direction of the X-axis represents the rear side; the Y-axis in the drawings represents the horizontal direction, and is designated as the left-right position, and the positive direction of the Y-axis, i.e. the direction in which the arrow of the Y-axis points, represents the right side, and the negative direction of the Y-axis represents the left side; it should be noted that the above-mentioned meanings of the Z-axis, the Y-axis and the X-axis are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present disclosure.

[0038] In a power module, the chip unit is usually welded to the heat dissipation structure such as a heat spreader by a solder such as solder paste. Specifically, the solder such as solder paste is laid on the heat spreader, and then the chip unit is placed. After the heat spreader and the chip unit are pressed by a clamp, they are placed in a welding device for welding processing. However, in some cases, there may be a problem of uneven thickness of the solder layer formed by welding between positions in the connection area of the heat spreader and the chip unit. This may lead to the following consequences. Reduced heat conduction efficiency: In a power module, uneven thickness of the solder paste may affect the heat conduction efficiency, and thus affect the heat dissipation performance of the module. Unstable welding or missing welding points: Too thin solder paste may lead to unstable welding or missing welding points, affecting the reliability of the connection. High void ratio: In an IGBT module package, uneven thickness of the solder paste may increase the void ratio, affecting the electrical and thermal performance of the module.

[0039] As shown in Figure 1 and Figure 2 , the structure of the heat dissipation structure in the first embodiment of the present disclosure is shown in Figure 1 ; and Figure 2 is a structural schematic diagram of a power module when the heat dissipation structure in the drawing is used in the power module. In a first aspect, the present embodiment provides a heat dissipation structure 1, which comprises a heat dissipation body 11 provided with a connection structure 12 for connecting with a chip unit 2 of a power module; the surface of the connection structure 12 facing the chip unit 2 is a first surface 122, the connection structure 12 is provided with a solder collecting groove 123, and the solder collecting groove 123 forms a groove opening 1232 at the first surface 122; the first surface 122 is used to connect with the chip unit 2 through the solder 3 on both sides of the groove opening 1232 along the width direction of the groove.

[0040] Specifically, referring to Figure 1As shown, the surface of the connecting structure 12 facing the chip unit 2 is a first surface 122, that is, the upper surface of the connecting structure 12 is the first surface 122, and the solder collection groove 123 is recessed at the first surface 122 of the connecting structure 12, and the solder collection groove 123 is in communication with the outside through the groove opening 1232 at the first surface 122.

[0041] It should be understood that the number of solder collection grooves 123 can be one or more. For any optional solder collection groove 123, it has a length direction and a width direction, the length direction being the extension direction of the solder collection groove 123, and the width direction being the direction perpendicular to the length direction and perpendicular to the depth of the groove, such as Figure 1 As shown, it only shows the case of having one solder collection groove 123, and the width direction of the solder collection groove 123 is the left-right direction.

[0042] It should be understood that for any optional solder collection groove 123, the first surface 122 is used to connect the chip unit 2 through the solder 3 at the positions on both sides of the groove opening 1232 along the width direction of the groove, that is, when the connecting structure 12 is soldered with the chip unit 2 through the solder 3, the projection of the chip unit 2 on the first surface 122 is partially located in the area corresponding to the groove opening 1232, and partially located on both sides of the area corresponding to the groove opening 1232. For example, Figure 1 and Figure 2 As shown in the scheme, the projection of the chip unit 2 on the first surface 122 is partially located in the area corresponding to the groove opening 1232, and partially located on the left side of the area corresponding to the groove opening 1232, and partially located on the right side of the area corresponding to the groove opening 1232. It should be understood that in this case, the size of the solder collection groove 123 along its length direction, for example, the front-back direction, can be greater than, less than or equal to the size of the chip unit 2, which is not limited.

[0043] It should be understood that the specific structure of the heat dissipation body 11 is not limited, which is determined according to the specific type of the heat dissipation structure 1. For example, referring to Figures 3-5 As shown, the heat dissipation structure 1 can be a vapor chamber 1A, referring to Figures 10 to 11 As shown, the heat dissipation structure 1 can also be a finned heat sink 1B, which is not limited.

[0044] It should be understood that the connecting structure 12 and the heat dissipation body 11 can be integrally formed, or can be connected separately by welding, bonding process, which is not limited.

[0045] In the embodiment, the heat dissipation body 11 of the heat dissipation structure 1 is provided with a connecting structure 12, and the connecting structure 12 is connected with the chip unit 2, wherein a first surface 122 of the connecting structure 12 faces the chip unit 2, the connecting structure 12 is provided with a solder collecting groove 123, and a groove opening 1232 of the solder collecting groove 123 is formed at the first surface 122; when the first surface 122 of the connecting structure 12 is connected with the chip unit 2 through the solder 3 at both sides of the groove opening 1232 along the width direction of the groove, that is, the part of the first surface 122 located on one side of the groove opening 1232 along the width direction of the groove is connected with the chip unit 2 through the solder 3, and the part of the first surface 122 located on the other side of the groove opening 1232 along the width direction of the groove is connected with the chip unit 2 through the solder 3, so that the chip unit 2 and the heat dissipation structure 1 are connected as a whole through the solder 3, and the reliable connection of the two is ensured; in the welding process, the excess solder 3 can be collected through the solder collecting groove 123, which is beneficial to reduce the possibility of uneven thickness of the solder layer caused by the stacking of the solder 3, to ensure the thickness uniformity of the solder layer after welding, and to reduce the welding internal stress; and in this case, the bubbles generated by the flux in the welding process are more easily extruded and discharged, which is beneficial to reduce the porosity of the welding and improve the welding quality, and is beneficial to the consistency control of batch welding.

[0046] In the optional scheme of the connecting structure 12, referring to Figure 4 , the solder collecting groove 123 is formed with a communication opening 1231 at at least one end in the extension direction of the groove.

[0047] That is, the solder collecting groove 123 extends through the connecting structure 12 in the extension direction to form the communication opening 1231.

[0048] Thus, in the process of welding and connecting the chip unit 2 and the heat dissipation structure 1 through the solder 3, the waste gas and the like can be discharged through the solder collecting groove 123 and the communication opening 1231, for example, the bubbles generated by the flux can be discharged, and it is beneficial to realize the heat exchange and airflow exchange between the solder collecting groove 123 and the external environment, which helps to reduce the possibility of heat concentration of the chip unit 2 and the heat dissipation structure 1 at the solder collecting groove 123, and helps to improve the heat dissipation performance of the power module.

[0049] Further, the number of the solder collecting grooves 123 is multiple, and at least two of the multiple solder collecting grooves 123 are connected in communication. For example, each solder collecting groove 123 is in communication.

[0050] Thus, the solder collecting grooves 123 are arranged in communication, which is beneficial to the flow of the molten solder 3 between the solder collecting grooves 123 in the welding process, and improves the collection performance of the multiple solder collecting grooves 123 for the molten solder 3.

[0051] In an alternative of the connecting structure 12, the connecting structure 12 has an end away from the first surface 122, and the connecting structure 12 has the end away from the first surface 122 integrally connected or detachably connected with the heat dissipation body 11.

[0052] As shown in Figure 1 , exemplarily, the connecting structure 12 is in a block structure 121. The block structure 121 is integrally connected with the heat dissipation body 11. At this time, the block structure 121 can be formed by protruding from the surface of the heat dissipation body 11.

[0053] Exemplarily, the block structure 121 is detachably connected with the heat dissipation body 11, for example, connected through fasteners, which is not shown in the scheme.

[0054] In this way, the connecting structure 12 is in the block structure 121, and the first surface 122 is formed by the upper surface of the block structure 121, which is convenient for arranging the solder 3 on the first surface 122 and connecting the heat dissipation structure 1 with the chip unit 2.

[0055] In an alternative of the block structure 121, the block structure 121 includes a plurality of sub-blocks 1211 arranged at intervals, and the interval between any two adjacent sub-blocks 1211 is used to form the solder collection groove 123.

[0056] As shown in Figure 3 , as shown in Figure 3 , it is a structure schematic diagram of the second embodiment of the heat dissipation structure of the heat plate. Exemplarily, the block structure 121 has eight sub-blocks 1211, and the eight sub-blocks 1211 are arrayed to form a plurality of solder collection grooves 123.

[0057] As shown in Figure 3 , it shows that the groove depth of the solder collection groove 123 can be consistent with the thickness of the block structure 121, but it should be understood that it is not limited to this, for example, the groove depth of the solder collection groove 123 can be greater than the thickness of the block structure 121, and the groove depth of the solder collection groove 123 can also be less than the thickness of the block structure 121.

[0058] In this way, the solder collection groove 123 is formed between any two adjacent sub-blocks 1211, and the edge of the first surface 122 at the part corresponding to the sub-block 1211 (i.e. the upper surface of the sub-block 1211) is adjacent to or corresponds to the circumferential outer edge of the block structure 121, thereby facilitating the outflow of the excess molten solder 3 on the part of the first surface 122 corresponding to the sub-block 1211 (i.e. the upper surface of the sub-block 1211) during the welding process, thereby facilitating the guarantee of the thickness uniformity of the solder layer formed on the part of the first surface 122 corresponding to the sub-block 1211 after welding.

[0059] As shown in Figure 3As shown, in a further alternative scheme, the cross-sectional area of ​​each sub-block 1211 is consistent.

[0060] Specifically, the multiple solder collection grooves 123 serve to evenly divide the upper surface of the first surface 122 into multiple sub-blocks 1211. This results in more uniform thermal conductivity at each sub-block 1211, which helps to improve the uniformity of thermal conductivity of the power module at various points on the first surface 122.

[0061] like Figure 3 As shown, in a further optional scheme, the multiple sub-blocks 1211 are arranged in a matrix distribution.

[0062] Thus, the arrangement of the solder collection groove 123 is beneficial to improving the deformation resistance of the power module in the direction perpendicular to the extension direction of the solder collection groove 123. Among the multiple solder collection grooves 123, there are solder collection grooves 123 extending in the left and right direction as well as solder collection grooves 123 extending in the front and back direction, which is beneficial to improving the deformation resistance of the power module and improving the structural reliability of the power module.

[0063] In the above embodiments, it should be understood that the length, width, and height of the sub-block 1211 can be determined based on specific experiments. For example, the length, width, and height of the sub-block 1211 are 20mm, 15mm, and 0.2mm, respectively. Its height direction is consistent with the depth direction of the solder collection groove 123.

[0064] Optionally, in the above embodiments, the chip unit 2 includes a chip 21 and an insulating module 22; the insulating module 22 has a first metal layer 221 facing the chip 21 and a second metal layer 222 facing the first surface 122, the first metal layer 221 is connected to the chip 21, and the second metal layer 222 is connected to the first surface 122 by solder 3; the cross-sectional area of ​​the second metal layer 222 is greater than or equal to the area of ​​the first surface 122, and when the second metal layer 222 is connected to the first surface 122, the second metal layer 222 covers the first surface 122.

[0065] It should be understood that in this embodiment, the insulating module 22 is taken as a DBC insulating module, and includes a first metal layer 221, an insulating layer 223, and a second metal layer 222 from top to bottom to illustrate the technical solution of this disclosure. However, it is not limited to this, and the number of layers of the insulating module 22 can be set to more as needed, which is not a limitation. The chip unit 2 usually also includes a molding compound structure 23 to encapsulate the chip 21, which will not be described in detail here.

[0066] The connection method between the first metal layer 221 and the chip 21 is not limited. For example, the first metal layer 221 can be soldered to the chip 21 through solder 3 to fix the chip 21 in the insulating module 22.

[0067] The cross-sectional area of the second metal layer 222 is greater than or equal to the area of the first surface 122, and when the second metal layer 222 is connected to the first surface 122, the second metal layer 222 can cover the first surface 122. Exemplarily, the minimum distance between the circumferential edge of the second metal layer 222 and the circumferential edge of the first surface 122 is greater than or equal to 0.2 mm. In this way, in the soldering process of the chip unit 2 and the heat dissipation structure 1, the excess molten solder 3 at the above-mentioned circumferential edge can flow out from the edge and flow downward from the circumferential edge of the first surface 122, reducing the possibility of accumulation of excess molten solder 3 to the insulating layer 223.

[0068] In the above embodiment, optionally, the heat dissipation body 11 is provided with a groove structure 14, and the block structure 121 is arranged at the groove bottom of the groove structure 14.

[0069] As shown in Figures 6 to 8 , Figure 6 is a structural schematic view of the heat dissipation structure when the heat dissipation body is provided with a groove structure and the heat dissipation structure is a uniform heat dissipation plate in the third embodiment of the present disclosure; Figure 7 is a partial enlarged view of B in Figure 6 is a structural schematic view of a power module when the heat dissipation structure in Figure 8 is used for a power module. It should be understood that the depth of the groove structure 14 and the thickness of the block structure 121 are not limited. Figure 6 In this way, the block structure 121 can be arranged by using the groove structure 14, avoiding the size of the heat dissipation structure 1 in the thickness direction from being too large due to the arrangement of the block structure 121; and in the soldering process of the chip unit 2 and the heat dissipation structure 1, the excess molten solder 3 that may flow out from the block structure 121 can also be accommodated by using the groove structure 14, which is simple in structure and strong in practicability.

[0070] In the above embodiment, optionally, a plurality of protrusions 13 are arranged on the first surface 122, and the heights of the plurality of protrusions 13 are consistent.

[0071] As shown in

[0072] , Figure 1 , Figure 4 and Figure 7 , exemplarily, each sub-block 1211 is respectively provided with a plurality of protrusions 13, for example, the upper surface of the sub-block 1211 is rectangular, and the protrusions 13 are respectively arranged at the four corners of the rectangle. The cross-sectional shape of the protrusion 13 can be circular, and the thickness of the protrusion 13 in the up-down direction should generally be less than or equal to the designed thickness of the solder layer (the designed thickness is the thickness of the solder layer required after soldering).

[0073] Thus, in the soldering process of the chip unit 2 and the heat dissipation structure 1, the solder 3 can adopt the paste mixture, facilitating the coating of the solder 3, and the chip unit 2 can be supported by the protrusions 13 when the solder 3 is in the molten state, reducing the possibility of uneven thickness of the solder layer at each position after soldering.

[0074] It should be understood that, in this case, when the solder 3 is coated, the solder 3 is often not coated subjectively in the area corresponding to the solder collection groove 123, but only in the area on the first surface 122 outside the solder collection groove 123. Of course, in order to ensure that the amount of solder 3 is sufficient, part of the solder 3 may overflow into the solder collection groove 123 when the solder 3 is coated.

[0075] As shown in Figure 9 , instead of the above-mentioned manner of providing a plurality of protrusions 13 on the first surface 122, the solder 3 can be a solder sheet 31, and the solder sheet 31 can be internally provided with a support structure.

[0076] The specific structural form of the support structure is not limited, for example, it can be a mesh or other structural form. In the soldering process of the chip unit 2 and the heat dissipation structure 1, the support structure can keep the first surface 122 supporting the chip unit 2 when the solder 3 in the solder sheet 31 is melted, without the need to additionally provide the above-mentioned protrusions 13, which is simple in structure and strong in practicability.

[0077] It should be understood that, in this case, when the solder sheet 31 is arranged, the area of the solder sheet 31 is usually less than or equal to the area of the upper surface of the sub-block 1211, thereby reducing the possibility of the solder 3 entering the solder collection groove 123. Of course, the area of the solder sheet 31 can also be slightly larger than the area of the upper surface of the sub-block 1211, which will not be described in detail here.

[0078] In a second aspect, the present disclosure provides a power module, which comprises a chip unit 2 and a heat dissipation structure 1 as described in the above embodiments, and the chip unit 2 is soldered and connected to the first surface 122 of the heat dissipation structure 1 through the solder 3.

[0079] The part of the structure of the power module has been described in the foregoing, and the power module has all the beneficial effects of the power module, which will not be described in detail here.

[0080] As shown in Figure 2 , 5 , 8, in an optional scheme of the power module, the heat dissipation structure 1 comprises a vapor chamber 1A. The chip unit 2 is connected to the vapor chamber 1A.

[0081] The structural form of the vapor chamber 1A is not limited, which can be a solid vapor chamber 1A, or a liquid two-phase flow vapor chamber 1A.

[0082] In an alternative of the power module, the heat dissipation structure 1 comprises a heat sink 1B. The heat sink 1B can adopt fin heat dissipation. The chip unit 2 is connected with the heat sink 1B.

[0083] As shown in Figure 9 In an alternative of the power module, the heat dissipation structure 1 comprises a heat spreader 1A and a heat sink 1B. The chip unit 2 is connected with the heat spreader 1A, and the heat spreader 1A is connected with the heat sink 1B. The connection manner is not limited.

[0084] In the above embodiments, when the heat dissipation structure 1 comprises the heat spreader 1A, a plurality of connecting holes 15 are arranged on the heat spreader 1A.

[0085] Exemplarily, when the heat dissipation structure 1 and the heat spreader 1A are welded, the connecting holes 15 can be used as positioning holes for connecting with the chip unit 2; can also be used as positioning holes for positioning and connecting with a pressing plate when the chip unit 2 and the heat spreader 1A are pressed; and can also be used for connecting the heat spreader 1A with external components, such as the heat sink 1B (refer to Figure 10 ), after welding. One hole has multiple uses, the structure is simple, and the practicability is strong.

[0086] In a third aspect, the present disclosure provides a power conversion device comprising the power module of the above embodiments. The power conversion device has all the beneficial effects of the power module, which will not be repeated here.

[0087] Although the present disclosure is disclosed as above, the protection scope of the present disclosure is not limited to this. Those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure, and these changes and modifications will fall within the protection scope of the present disclosure.

Claims

1. A heat dissipating structure, characterized by comprising: The heat dissipation body (11) is provided with a connecting structure (12) for connecting with a chip unit (2) of a power module; a surface of the connecting structure (12) facing the chip unit (2) is a first surface (122), the connecting structure (12) is provided with a solder collecting groove (123), the solder collecting groove (123) forms a groove opening (1232) at the first surface (122); the first surface (122) is used for connecting with the chip unit (2) through solder (3) on both sides of the groove opening (1232) in the width direction of the groove.

2. The heat dissipating structure according to claim 1, wherein The solder collecting groove (123) is formed with a communication opening (1231) at at least one end in the extension direction of the groove.

3. The heat dissipating structure according to claim 1, wherein The number of the solder collecting grooves (123) is multiple, and at least two of the multiple solder collecting grooves (123) are connected in communication.

4. The heat dissipating structure according to claim 1, wherein An end of the connecting structure (12) away from the first surface (122) is integrally connected or detachably connected with the heat dissipation body (11).

5. The heat dissipating structure according to claim 4, wherein The connecting structure (12) comprises multiple sub-blocks (1211) arranged at intervals, and the interval between any two adjacent sub-blocks (1211) is used for forming the solder collecting groove (123).

6. The heat dissipating structure according to claim 5, wherein The multiple sub-blocks (1211) are arranged in a matrix distribution.

7. The heat dissipating structure according to claim 4, wherein The chip unit (2) comprises a chip (21) and an insulating module (22); the insulating module (22) has a first metal layer (221) facing the chip (21) and a second metal layer (222) facing the first surface (122), the first metal layer (221) is connected with the chip (21), and the second metal layer (222) is connected with the first surface (122) through solder (3); the cross-sectional area of the second metal layer (222) is greater than or equal to the area of the first surface (122), and when the second metal layer (222) is connected with the first surface (122), the second metal layer (222) covers the first surface (122).

8. The heat dissipating structure according to any one of claims 4 to 7, wherein The heat dissipation body (11) is provided with a groove structure (14), and the connecting structure (12) is arranged at the groove bottom of the groove structure (14).

9. The heat dissipating structure according to any one of claims 1 to 7, wherein The first surface (122) is provided with multiple protrusions (13), and the heights of the multiple protrusions (13) are consistent.

10. The heat dissipating structure according to any one of claims 1 to 7, wherein The solder (3) is a solder sheet (31), and the solder sheet (31) is internally provided with a support structure.

11. A power module, characterized by The heat dissipation structure comprises at least one of a vapor chamber (1A) and a heat sink (1B).

12. The power module of claim 11, wherein, When the heat dissipation structure comprises the vapor chamber (1A), multiple connecting holes (15) are arranged on the vapor chamber (1A).

13. The power module of claim 12, wherein, The power module comprises the power module according to any one of claims 11-13.

14. A power conversion device, characterized by, ​

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