Expandable I / O module

Abstract

The utility model discloses an extensible I / O module which comprises an I / O module body and a mounting plate. Gourd inserting holes are formed in the periphery of the upper side of the mounting plate, inserting rods are welded to the periphery of the rear end of the I / O module body, limiting plates are welded to the tail ends of the inserting rods, the inserting rods are embedded into the gourd inserting holes, fixing bolts are mounted at the upper end of the I / O module body, and a cooling mechanism is mounted at the rear end of the I / O module body. The cooling mechanism is composed of a refrigeration mechanism and a cooling cavity, the cooling cavity is installed at the rear end of the I / O module body and filled with heat conduction oil, and the refrigeration mechanism is installed at the rear end of the cooling cavity. In the use process of the I / O module body, the interior of the cooling cavity is cooled through the refrigeration mechanism, the I / O module body is cooled through the cooling cavity, and the situation that the service life of the I / O module body is affected when the I / O module body is used under the high-temperature condition is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to I / O module technical field, concretely is an I / O module of expandable. BACKGROUND

[0002] I / O module can be divided into discrete, analog and special module and so on, these modules can be installed on the guide rail or rack with multiple slots, each module is inserted into one slot. The guide rail or rack has different specifications, and the number of slots is 4, 8, 12 or the like.

[0003] Chinese patent No. CN202321618853.2 discloses a remote I / O module, which comprises a shell, a core plate assembly and a fixing buckle, the shell has oppositely arranged first and second side walls, the shell has a mounting cavity inside, and a clamping piece is formed on the first side wall; the core plate assembly is arranged in the mounting cavity, and a mating male seat and a mating female seat are connected to the core plate assembly, the mating male seat and the mating female seat are arranged opposite to each other and exposed to the first and second side walls respectively; the fixing buckle is arranged on the second side wall, and the fixing buckle is matched with the clamping piece.

[0004] The prior art is inconvenient to install I / O module, and cannot quickly cool the I / O module during use. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing an I / O module that can be expanded to solve the problems in the prior art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: an I / O module that can be expanded, comprising an I / O module body and a mounting plate; a gourd jack is mounted on the upper side of the mounting plate, a plug rod is welded at the rear end of the I / O module body, a limiting plate is welded at the end of the plug rod, the plug rod is embedded in the gourd jack, a fixing bolt is installed at the upper end of the I / O module body, a cooling mechanism is installed at the rear end of the I / O module body, the cooling mechanism is composed of a refrigeration mechanism and a cooling cavity, the cooling cavity is installed at the rear end of the I / O module body, the cooling cavity is filled with heat-conducting oil, the refrigeration mechanism is installed at the rear end of the cooling cavity, an operation indicator light is installed at the upper end of one side of the I / O module body, a USB interface is installed below the operation indicator light on one side of the I / O module body, a network port is installed at the middle of one side of the I / O module body, and a power interface is installed at the bottom end of the I / O module body.

[0007] Preferably, a second heat-conducting plate is installed at the rear end of the I / O module body, and the second heat-conducting plate is installed inside the cooling cavity.

[0008] Preferably, the front end of the limiting plate is provided with a circular table type.

[0009] Preferably, the rear end of the I / O module body is provided with a rubber pad, which is pasted on the rear end of the I / O module body by adhesive.

[0010] Preferably, the refrigeration mechanism is composed of a refrigeration cavity and a semiconductor refrigeration sheet, the refrigeration cavity is installed at one side of the cooling cavity, and the semiconductor refrigeration sheet is installed inside the refrigeration cavity.

[0011] Preferably, the two sides of the refrigeration cavity are provided with first heat-conducting plates, one end of the heat-conducting plate outside the refrigeration cavity extends out of the refrigeration cavity, and one end of the heat-conducting plate inside the refrigeration cavity extends into the cooling cavity.

[0012] Compared with the prior art, the utility model has the beneficial effects that:

[0013] 1. During installation, the limiting plate at the rear end of the I / O module body is inserted into the large-diameter end of the gourd-shaped insertion hole, and is pulled down so that the insertion rod is embedded into the small-diameter end of the gourd-shaped insertion hole, the insertion rod is clamped by the limiting plate, and is fixed by the fixing bolt, thereby completing the installation of the I / O module body.

[0014] 2. The circular table type of the front end of the limiting plate can reduce the diameter of the front end of the limiting plate, thereby facilitating the quick installation of the limiting plate.

[0015] 3. During use, the refrigeration mechanism is used to install the semiconductor refrigeration sheet in the refrigeration cavity, and the semiconductor refrigeration sheet is used to cool the side of the refrigeration cavity close to the cooling cavity.

[0016] 4. The first heat-conducting plate outside the refrigeration cavity can quickly conduct the heat generated by the semiconductor refrigeration sheet during operation, and the first heat-conducting plate inside the refrigeration cavity can quickly conduct the heat inside the heat-conducting oil to the refrigeration end of the semiconductor refrigeration sheet. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the utility model, and constitute a part of the specification, and are used to explain the utility model together with embodiments of the utility model, and do not constitute a limitation on the utility model. In the drawings:

[0018] Figure 1 It is a structural schematic view of the utility model;

[0019] Figure 2 It is an installation structural schematic view of the utility model;

[0020] Figure 3 It is a side view structure schematic view of the utility model;

[0021] Figure 4 It is a cooling mechanism structure schematic view of the utility model.

[0022] In the drawing: 1, I / O module body; 2, limiting plate; 3, cooling mechanism; 4, cooling cavity; 5, first heat-conducting plate; 6, refrigeration mechanism; 7, running indicator light; 8, USB interface; 9, network port; 10, power interface; 11, gourd jack; 12, fixing bolt; 13, insertion rod; 14, second heat-conducting plate; 15, refrigeration cavity; 16, semiconductor refrigeration sheet; 17, mounting plate; 18, rubber pad. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0024] Please refer to Figure 1 、 Figure 2 、 Figure 3 、 Figure 4 In the embodiments of the utility model, an extendable I / O module includes an I / O module body 1 and a mounting plate 17. A gourd jack 11 is installed on the upper side of the mounting plate 17. An insertion rod 13 is welded to the rear end of the I / O module body 1. A limiting plate 2 is welded to the end of the insertion rod 13. The front end of the limiting plate 2 is designed as a circular table type, which can reduce the caliber of the front end of the limiting plate 2, thereby facilitating the quick installation of the limiting plate 2. The insertion rod 13 is embedded in the gourd jack 11. A fixing bolt 12 is installed on the upper end of the I / O module body 1. A cooling mechanism 3 is installed on the rear end of the I / O module body 1. The cooling mechanism 3 is composed of a refrigeration mechanism 6 and a cooling cavity 4. The cooling cavity 4 is installed on the rear end of the I / O module body 1. The cooling cavity 4 is filled with heat-conducting oil. The refrigeration mechanism 6 is installed on the rear end of the cooling cavity 4. A running indicator light 7 is installed on the upper end of one side of the I / O module body 1. A USB interface 8 is installed below the running indicator light 7 on one side of the I / O module body 1. A network port 9 is installed on one side of the I / O module body 1. A power interface 10 is installed on the bottom end of the I / O module body 1.

[0025] The second heat conduction plate 14 is arranged at the rear end of the I / O module body 1, and is arranged in the cooling cavity 4, so that the heat generated by the I / O module body 1 during operation can be quickly conducted into the cooling cavity 4, thereby facilitating the rapid cooling of the I / O module body 1.

[0026] The rubber pad 18 is arranged at the rear end of the I / O module body 1, and is adhered to the rear end of the I / O module body 1 by means of adhesive, so that the rubber pad 18 can be deformed under pressure when the I / O module body 1 is installed, and the gap between the mounting plate 17 and the I / O module body 1 can be filled, so that the I / O module body 1 is more stable during installation.

[0027] The refrigeration mechanism 6 is composed of the refrigeration cavity 15 and the semiconductor refrigeration sheet 16, the refrigeration cavity 15 is arranged at one side of the cooling cavity 4, and the semiconductor refrigeration sheet 16 is arranged in the refrigeration cavity 15, so that the semiconductor refrigeration sheet 16 can be arranged in the refrigeration cavity 15 during use, and the semiconductor refrigeration sheet 16 can be used to cool the side of the refrigeration cavity 15 close to the cooling cavity 4, the first heat conduction plate 5 is arranged at both sides of the refrigeration cavity 15, one end of the heat conduction plate arranged outside the refrigeration cavity 15 extends out of the refrigeration cavity 15, and one end of the heat conduction plate arranged inside the refrigeration cavity 15 extends into the cooling cavity 4, so that the heat generated by the semiconductor refrigeration sheet 16 during operation can be quickly conducted out of the refrigeration cavity 15, and the heat in the heat conduction oil can be quickly conducted into the refrigeration end of the semiconductor refrigeration sheet 16.

[0028] The working principle and use process of the utility model are as follows: when the I / O module body 1 is installed, the limiting plate 2 at the rear end of the I / O module body 1 is inserted into the large-diameter end of the gourd insertion hole 11, and is pulled downward, so that the insertion rod 13 is embedded in the small-diameter end of the gourd insertion hole 11, the insertion rod 13 is clamped by the limiting plate 2, and is fixed by the fixing bolt 12, so that the installation of the I / O module body 1 is completed, the I / O module body 1 can be conveniently and quickly installed and removed, and the wires are connected with the USB interface 8, the network port 9 and the power supply interface 10 during use, so that the I / O module body 1 is powered, input and output, respectively, the cooling cavity 4 is cooled by the refrigeration mechanism 6 during use of the I / O module body 1, the I / O module body 1 is cooled by the cooling cavity 4, and the service life of the I / O module body 1 is not affected by the use of the I / O module body 1 under high temperature.

[0029] Finally, it should be noted that: the above is only the preferred embodiment of the utility model, and is not used to limit the utility model, although the utility model is described in detail with reference to the foregoing embodiments, for the person skilled in the art, it still can modify the technical scheme recorded in the foregoing each embodiment, or make equivalent replacement to part of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. An expandable I / O module comprising an I / O module body (1) and a mounting plate (17); characterized in that: The installation plate (17) upper side four around position installs the gourd jack (11), the I / O module body (1) rear end four around position welds the plug rod (13), the plug rod (13) end position welds the limit board (2), the plug rod (13) inserts the gourd jack (11) inside, the I / O module body (1) upper end position installs the fixed peg (12), the I / O module body (1) rear end position installs the cooling mechanism (3), the cooling mechanism (3) is by refrigeration mechanism (6) and cooling cavity (4) is composed, the cooling cavity (4) is installed in I / O module body (1) rear end position, the cooling cavity (4) inside fills with heat-conducting oil, the refrigeration mechanism (6) is installed in cooling cavity (4) rear end position, the I / O module body (1) one side upper end position installs the running pilot lamp (7), the I / O module body (1) one side is located in the running pilot lamp (7) below position installs the USB interface (8), the I / O module body (1) one side middle position installs the network port (9), the I / O module body (1) bottom end position installs the power interface (10).

2. The scalable I / O module of claim 1, wherein: The I / O module body (1) rear end position is installed with the second heat-conducting plate (14), and the second heat-conducting plate (14) is installed in the cooling cavity (4).

3. The scalable I / O module of claim 1, wherein: The limit board (2) front end position is set as a circular table type.

4. The scalable I / O module of claim 1, wherein: The I / O module body (1) rear end position is provided with a rubber pad (18), and the rubber pad (18) is pasted on the I / O module body (1) rear end position by adhesive.

5. The scalable I / O module of claim 1, wherein: The refrigeration mechanism (6) is composed of a refrigeration cavity (15) and a semiconductor refrigeration sheet (16), the refrigeration cavity (15) is installed on one side of the cooling cavity (4), and the semiconductor refrigeration sheet (16) is installed in the refrigeration cavity (15).

6. The scalable I / O module of claim 5, wherein: The refrigeration cavity (15) is installed with the first heat-conducting plate (5) on both sides, one end of the heat-conducting plate outside the refrigeration cavity (15) extends out of the refrigeration cavity (15), and one end of the heat-conducting plate inside the refrigeration cavity (15) extends into the cooling cavity (4).

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