Gas circuit heating module

Abstract

The utility model discloses a gas path heating module, which comprises a first shell, a second shell, a gas path heating module, a gas path heating module and a gas path heating module, and is characterized in that the first shell is provided with an accommodating space for accommodating a structure to be heated; the heat energy carrier flow channel is arranged in the plate body of the first shell, the heat energy carrier flow channel comprises a preheating channel and a working channel which are communicated with each other, the preheating channel is provided with a heat energy carrier inlet, and a plurality of air holes communicated with the accommodating space of the first shell are formed in the working channel; and the heating device is used for heating the first shell and indirectly heating the preheating channel at the same time. The gas circuit heating module has the advantages that the heating device, the first shell, the heat energy carrier flow channel and the like are combined, the heating and heat preservation efficiency of a to-be-heated structure can be improved, meanwhile, the temperature uniformity of the to-be-heated structure is improved, and the heat energy utilization efficiency is high.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of gas circuit heating, and particularly relates to a gas circuit heating module. BACKGROUND

[0002] In modern society, gaseous substances are widely used in many fields due to their unique physical and chemical properties (e.g., good diffusion coverage ability), especially in precise semiconductor processes. In practical applications, gaseous substances can be used not only to provide a reaction atmosphere, but also for key steps such as cleaning and drying. In these processes, gas transmission is a key link, which involves the delivery of multiple gases under specific temperature and pressure conditions. In order to maintain the gaseous state of the gas and prevent changes in the state of the gas due to temperature changes during delivery, precise temperature control of the piping system is usually required.

[0003] In traditional methods of controlling the temperature of the piping, heat preservation devices are often used to preserve and control the temperature of the piping, such as wrapping heating wires around the piping to achieve heat preservation. However, with the continuous advancement of semiconductor processes, the selection range of gaseous substance raw materials is becoming wider and wider, and the requirements for temperature control of the piping are becoming more and more stringent. The existing methods of controlling the temperature of the piping have some limitations (e.g., poor temperature uniformity, poor heat insulation and heat preservation, etc.), and cannot meet the strict requirements for temperature control in modern semiconductor processes. Therefore, improvements are needed.

[0004] It should be understood that the above statements only provide background technology related to the utility model, and do not necessarily constitute prior art. CONTENT OF THE UTILITY MODEL

[0005] Based on the foregoing technical problems, the purpose of the utility model is to provide a gas circuit heating module that combines a heating device, a first shell, and a heat energy carrier flow channel. The first shell and the preheating channel are heated by the heating device to increase their temperature, and the preheated heat energy carrier is blown into the accommodation space through the air holes of the working channel. The heat energy carrier in a high-temperature gaseous state is used to heat the structure to be heated, increasing the convective heating inside the accommodation space and helping to improve the heating and heat preservation efficiency of the structure to be heated. At the same time, the temperature uniformity of the structure to be heated is also improved, and the heat energy utilization efficiency is high.

[0006] In order to achieve the above purpose, the utility model realizes the following technical solutions:

[0007] A gas circuit heating module, comprising:

[0008] a first shell having an accommodation space for accommodating a structure to be heated;

[0009] a thermal energy carrier flow channel arranged inside the plate body of the first shell, the thermal energy carrier flow channel comprising a preheating channel and a working channel in communication, the preheating channel having a thermal energy carrier inlet, and the working channel having a plurality of air holes in communication with the accommodating space of the first shell;

[0010] a heating device arranged to heat the first shell and simultaneously heat the preheating channel.

[0011] Optionally, the heating device is arranged inside the plate body of the first shell.

[0012] Alternatively, the heating device is arranged in the accommodating space.

[0013] Optionally, the thermal energy carrier flow channel is arranged in a serpentine shape.

[0014] Optionally, the working channel is arranged along the periphery of at least one side wall of the first shell.

[0015] Optionally, the number of air holes in at least a portion of the working channel increases in the direction of flow of the thermal energy carrier.

[0016] And / or, the number of air holes in at least a portion of the working channel is uniformly distributed.

[0017] Optionally, in at least a portion of the working channel, the cross-sectional area of each air hole increases in the direction of flow of the thermal energy carrier.

[0018] And / or, the cross-sectional area of each air hole in at least a portion of the working channel is the same.

[0019] Optionally, the cross-sectional area of the working channel is the sum of the areas of all the air holes arranged on the working channel.

[0020] Optionally, further comprising:

[0021] a second shell arranged to surround at least a portion of the first shell;

[0022] at least one heat insulation structure arranged between the first shell and the second shell, the heat insulation structure and the first shell and / or the second shell forming a heat insulation space therebetween.

[0023] Optionally, the heat insulation structure and the first shell form a first heat insulation space via a first support structure.

[0024] Optionally, the first support structure comprises a first protruding structure of the heat insulation structure.

[0025] And / or, the first support structure comprises a second protruding structure of the first shell.

[0026] Optionally, the first protruding structure is integrally formed with the heat insulation structure.

[0027] The second protruding structure is integrally formed with the second shell.

[0028] Optionally, a second heat insulation space is formed between the heat insulation structure and the second shell through a second supporting structure.

[0029] Optionally, the second supporting structure comprises a third protruding structure of the heat insulation structure.

[0030] And / or, the second supporting structure comprises a fourth protruding structure of the second shell.

[0031] Optionally, the third protruding structure is integrally formed with the heat insulation structure.

[0032] The fourth protruding structure is integrally formed with the second shell.

[0033] Optionally, the heat insulation structure is made of Teflon material.

[0034] Optionally, a plurality of heat insulation structures are arranged between the first shell and the second shell, and the plurality of heat insulation structures are arranged in sequence along the direction from the first shell to the second shell.

[0035] Optionally, the width of the heat insulation space is less than or equal to 5mm, wherein the width direction of the heat insulation space is from the first shell to the second shell.

[0036] Optionally, further comprising:

[0037] A temperature sensor for monitoring the temperature in the first shell and / or the containing space.

[0038] Optionally, further comprising:

[0039] A connecting adapter for connecting the structure to be heated and the first shell.

[0040] Compared with the prior art, the utility model has the following advantages:

[0041] The utility model discloses a kind of gas circuit heating module, heating device, first shell and heat energy carrier flow channel etc are combined, first shell and heat energy carrier are heated by heating device to make its temperature rise, and preheated heat energy carrier is blown into containing space by the air hole of working channel, heat energy carrier of high-temperature gaseous is used to heat the structure to be heated, increase the convection heating inside containing space, the structure to be heated is in high-temperature heat energy carrier environment, it is helpful to improve the heating and heat preservation efficiency of the structure to be heated, while also improve the temperature uniformity of the structure to be heated, heat energy utilization efficiency is higher. BRIEF DESCRIPTION OF DRAWINGS

[0042] In order to more clearly illustrate the technical scheme of the utility model, the drawings needed to be used in the description will be simply introduced below, and obviously, the drawings in the following description are one embodiment of the utility model, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings:

[0043] Figure 1 It is a structure schematic view of the utility model's one kind of gas circuit heating module;

[0044] Figure 2 It is a schematic view of the utility model's one kind of first shell and heat energy carrier flow channel;

[0045] Figure 3 It is a schematic view of the utility model's one kind of heat energy carrier flow channel;

[0046] Figure 4 It is a partial schematic view between the utility model's one kind of first shell and second shell;

[0047] Figure 5 It is a sectional schematic view of the utility model's one kind of heat insulation structure. DETAILED DESCRIPTION

[0048] In order to make the purpose, technical scheme and advantage of the utility model embodiment more clear, the technical scheme in the utility model embodiment will be clearly and completely described below in conjunction with the drawings in the utility model embodiment, obviously, the described embodiment is a part of the embodiment of the utility model, not all embodiments. Based on the embodiment in the utility model, all other embodiments obtained by those skilled in the art without creative labor are within the scope of the utility model protection.

[0049] It is to be understood that the terms "including", "comprising", "having" and their conjugates, as used throughout the text mean "including but not limited to".

[0050] It should be noted that the drawings are very simplified and use non-precise ratios, only to facilitate, clear and assist in the purpose of illustrating the embodiments of the present application.

[0051] In the semiconductor manufacturing process, the temperature control of the gas pipeline plays a decisive role in preventing gas condensation, blockage (especially at the valve) and maintaining the stability of the gas. Fluctuations in temperature can cause changes in the state of the gas, thereby affecting the performance and yield of semiconductor devices. Therefore, in the semiconductor process, effective heat preservation and temperature control of the gas pipeline is an important link.

[0052] Based on the above, the utility model provides a kind of gas circuit heating module 100, the gas circuit heating module 100 can be regarded as a hot tank (Hot Can), for the structure of at least partial area of gas pipeline is heated. As Figures 1 to 3 As shown, the gas circuit heating module 100 includes a first housing 110, a heat energy carrier flow channel 120 and a heating device 130. Wherein, the first housing 110 has a containing space for containing the structure to be heated;The heat energy carrier flow channel 120 is arranged inside the plate body of the first housing 110, and the heat energy carrier flow channel 120 includes a preheating channel 121 and a working channel 122 in communication, the preheating channel 121 has a heat energy carrier inlet 123, and a plurality of gas holes 124 are opened on the working channel 122, which are in communication with the containing space of the first housing 110;The heating device 130 is used to heat the first housing 110, which is connected to heat the preheating channel 121 at the same time.

[0053] In actual application, the structure to be heated is located in the accommodating space of the first shell 110, and the heating device 130 is started to heat the first shell 110. The heat energy carrier is introduced into the preheating passage 121 of the heat energy carrier flow channel 120 through the heat energy carrier inlet 123, and the heating device 130 also indirectly heats the preheating passage 121 at the same time, so that the heat energy carrier is heated. After the heat energy carrier is heated to a preset temperature (that is, the same temperature as the first shell 110) in the preheating passage 121, it flows to the working passage 122 and is sprayed into the accommodating space of the first shell 110 through the air holes 124 of the working passage 122, so as to heat the structure to be heated in the accommodating space.

[0054] As can be seen from the above, the gas circuit heating module 100 of the utility model directly sets the preheating passage 121 inside the plate body of the first shell 110, realizes heat energy transmission to the heat energy carrier through the path of the heating device 130-first shell 110-preheating passage 121, and can realize preheating of the heat energy carrier without separately setting the heating device 130 for the preheating passage 121, which is simple in structure, high in heat transfer efficiency and helpful for saving space. Based on the above structure, the heat energy carrier does not need to be heated in advance and can be directly introduced into the heat energy carrier flow channel 120 to realize preheating in the preheating passage 121. This mode is helpful for saving steps and space, and the temperature consistency of the heat energy carrier is strong. On the other hand, the utility model only opens the air holes 124 of the working passage 122 which are in communication with the accommodating space, and the preheating passage 121 is not directly in communication with the accommodating space. Based on this structure, the low-temperature heat energy carrier is heated to a preset temperature through the preheating passage 121, and then sprayed out of the accommodating space through the air holes 124 of the working passage 122, which can prevent the low-temperature heat energy carrier from being directly blown into the accommodating space to cause low temperature and cold spots in the accommodating space.

[0055] It should be noted that the gas circuit heating module 100 of the utility model can be applied to any application scene that has a demand for heating efficiency uniformity of valve body pipeline and the like, especially in the field of semiconductor technology. For example, in some processes, a solid source needs to be used, and the solid source is heated to a certain temperature in the process and then transported to a reaction chamber under the action of carrier gas. In this case, the gas circuit heating module 100 of the utility model can be used to heat and control the temperature of the gas pipeline, so as to prevent condensation, blockage and the like in the pipeline. In actual application, the temperature T of the structure to be heated by the gas circuit heating module 100 of the utility model can be in the range of 70℃<T<180℃. Of course, the temperature T can also be in other data ranges, and in actual application, the temperature range can be adjusted by adjusting the heating device 130 and the like, which is not limited by the utility model.

[0056] For example, Figure 1As shown, it is a structural schematic diagram of the air path heating module 100 in an embodiment. In this embodiment, the first shell 110 includes a top wall, a bottom wall and a side wall (including a front wall, a rear wall, a left side wall and a right side wall, the front wall is not shown) between the two, the entire first shell 110 is made of aluminum, wherein the rear wall is formed by friction stir welding of two plates, and the heat energy carrier flow channel 120 is formed inside the rear wall by friction stir welding (it can also be provided in other side walls), and the front wall can be provided with a suitable outlet to discharge the gas in the containing space. Further, the heating device 130 is arranged in the left side wall and the right side wall to realize heating of the entire first shell 110 and heating of the preheating channel 121. The aluminum-made first shell 110 can effectively improve the heat transfer efficiency of the heating device 130-first shell 110-preheating channel 121, and the heating device 130 arranged inside the first shell 110 can effectively improve the heat energy utilization rate. Since the compressed dry air (CDA gas) has the advantages of low cost and environmental friendliness, in actual application, the CDA gas can be selected as the heat energy carrier (of course, other gases can also be used).

[0057] It can be understood that the heating device 130 is not limited to being arranged inside the plate of the first shell 110, and in other embodiments, it can also be arranged in the containing space, and in actual application, it can be arranged according to actual needs. At the same time, the first shell 110 is not limited to being made of aluminum, and in other embodiments, it can also be made of other materials with good thermal conductivity, and the utility model does not limit this. On the other hand, the heat energy carrier flow channel 120 is not limited to being arranged only in the rear wall, and the way of embedding the heat energy carrier flow channel 120 inside the plate of the first shell 110 is not limited to the above, and the utility model does not limit this.

[0058] As shown, Figure 2 and Figure 3 As shown, the preheating channel 121 of the heat energy carrier flow channel 120 can be arranged in the inner side of the working channel 122 in a serpentine distribution manner, which makes the preheating channel 121 have sufficient length to sufficiently preheat the heat energy carrier, ensures the temperature state of the heat energy carrier delivered into the working channel 122, and at the same time, this way makes the preheating channel 121 not need to occupy too much space, which is helpful for saving space. The working channel 122 of the heat energy carrier flow channel 120 is arranged along the edge / outer ring of the rear wall in a circumferential direction, so that its jet range covers a large range of the contour range of the containing space in the first shell 110, which is convenient for the heated heat energy carrier to diffuse and fill the whole domain of the containing space, and is helpful for realizing omnidirectional heating and heat preservation of the structure to be heated.

[0059] It can be understood that the working channel 122 is not limited to being arranged circumferentially along the edge of the rear wall, but can also be arranged circumferentially along the edge of other side walls. Optionally, the working channel 122 is arranged circumferentially along the edge of at least one side wall of the first shell 110. On the other hand, the overall shape of the heat energy carrier flow channel 120 is not limited to the above, but can also be other shapes in other embodiments, which are not limited by the utility model.

[0060] In actual application, the air supply state of the working channel 122 to the containing space can be adjusted by adjusting the air holes 124 arranged on the working channel 122. Optionally, the number of air holes 124 in at least part of the working channel 122 increases along the flow direction of the heat energy carrier; and / or the number of air holes 124 in at least part of the working channel 122 is uniformly distributed. When the number of air holes 124 on the working channel 122 is uniformly distributed, the corresponding containing space area can be uniformly heated; when the number of air holes 124 on the working channel 122 increases along the flow direction of the heat energy carrier, too many heat energy carriers can be prevented from being supplied to the containing space by the front part of the working channel 122, and the ability of the rear part of the working channel 122 to supply heat energy carriers to the containing space can be ensured. On the other hand, optionally, in at least part of the working channel 122, the cross-sectional area of each air hole 124 increases along the flow direction of the heat energy carrier, which helps to ensure the ability of the rear part of the working channel 122 to supply heat energy carriers; and / or the cross-sectional area of each air hole 124 in at least part of the working channel 122 is the same, which helps to ensure the uniformity of the supply of heat energy carriers to the containing space. In actual application, it can be set according to actual needs.

[0061] On the other hand, the cross-sectional area of the working channel 122 can be the sum of the areas of all air holes 124 arranged on the working channel 122. This way, the air inlet and air outlet of the working channel 122 are in a balanced state, which helps to maintain the stability of the state in the containing space and ensure the temperature stability of the structure to be heated. Of course, the relationship between the two areas is not limited to being equal, and in other embodiments, the cross-sectional area of the working channel 122 can be slightly larger than the sum of the areas of all air holes 124 arranged on the working channel 122. In actual application, it can be set according to needs, which is not limited by the utility model.

[0062] On the other hand, the air path heating module 100 can also include a second shell 140 and at least one heat insulation structure 150 (see Figure 1 and Figure 4The second housing 140 is disposed surrounding at least a portion of the first housing 110; the at least one thermal insulation structure 150 is disposed between the first housing 110 and the second housing 140, and the thermal insulation structure 150 forms a thermal insulation space with the first housing 110 and / or the second housing 140 (e.g., Figure 4 The first insulation space 160 and the second insulation space 170 are included. Based on the above structure, the first shell 110 and the second shell 140 are separated by the insulation structure 150 and the insulation space to block heat. At the same time, the insulation structure 150 and the insulation space can form a stepped heat transfer, which helps to reduce the heat loss of the first shell 110 and its internal space, and achieves heat insulation of the first shell 110 and its internal space, ensuring that the gas path heating module 100 has good heat insulation performance. In practical applications, the insulation space is usually filled with air, which is essentially an air insulation layer. Since the thermal conductivity of air is 0.03, which is basically the lowest among all materials, it has strong heat insulation ability. A significant stepped heat dissipation can be formed between the insulation space and the insulation structure 150, further reducing heat dissipation, thereby ensuring that the heat loss of the gas path heating module 100 is small.

[0063] like Figure 1 , Figure 4 and Figure 5 As shown in the figure, in one embodiment, the second housing 140 completely surrounds and covers the first housing 110. A heat insulation structure 150 is provided between the first housing 110 and the second housing 140. The heat insulation structure 150 adopts a double-sided hollow design, that is, both its first and second sides have recessed structures. The protrusions on the periphery of the recessed structures on the first and second sides respectively form a first support structure 151 and a second support structure 152, so that the heat insulation structure 150 forms a first heat insulation space 160 and a second heat insulation space 170 with the first housing 110 and the second housing 140 through the first support structure 151 and the second support structure 152, respectively. In this embodiment, the first housing 110, the heat insulation structure 150, and the second housing 140 are combined to form two layers of heat-insulating air insulation between the first housing 110 and the second housing 140. The entire air circuit heating module 100 forms a clear stepped heat dissipation through the first heat insulation space 160-heat insulation structure 150-second heat insulation space 170, which can effectively reduce heat loss in the first housing 110 and the containing space, improve the heat insulation between the air circuit heating module 100 and the external environment, and ensure the heat preservation performance of the air circuit heating module 100.

[0064] It can be understood that in actual application, the first heat insulation space 160 and the second heat insulation space 170 can be arranged simultaneously or alternatively, and the utility model does not make limitation to this. On the other hand, the first supporting structure 151 for forming the first heat insulation space 160 between the heat insulation structure 150 and the first shell 110 can comprise the first protruding structure of the heat insulation structure 150 or the second protruding structure of the first shell 110, which can be selected and arranged according to the requirement in actual application, and the utility model does not make limitation to this. Optionally, the first protruding structure is integrally formed with the heat insulation structure 150, and the second protruding structure is integrally formed with the first shell 110, so as to facilitate machining and assembly and improve the overall stability. Similarly, the second supporting structure 152 for forming the second heat insulation space 170 between the heat insulation structure 150 and the second shell 140 can comprise the third protruding structure of the heat insulation structure 150 or the fourth protruding structure of the second shell 140, which can be selected and arranged according to the requirement in actual application, and the utility model does not make limitation to this. Optionally, the third protruding structure is integrally formed with the heat insulation structure 150, and the fourth protruding structure is integrally formed with the second shell 140, so as to facilitate machining and assembly and improve the overall stability.

[0065] On the other hand, the first shell 110 and the second shell 140 can have a plurality of heat insulation structures 150, which are arranged in sequence along the direction from the first shell 110 to the second shell 140, and at least two adjacent heat insulation structures 150 have a heat insulation space therebetween. In this way, the first shell 110 and the second shell 140 can have a plurality of heat blocking structures, forming a plurality of heat transfer steps, so as to reduce the heat dissipation of the entire air path heating module 100, improve the heat insulation between the air path heating module 100 and the external environment, and ensure the heat preservation performance of the air path heating module 100.

[0066] In actual application, the first shell 110 can be made of aluminum material, and the second shell 140 can be a steel plate. Optionally, the heat insulation structure 150 is made of Teflon material, and the thermal conductivity of the Teflon material is 0.1, which can effectively block the heat transfer and further reduce the heat loss by forming a heat transfer step with the air heat insulation layer. On the other hand, the Teflon material has good heat resistance, which helps to reduce particle pollution. Of course, the first shell 110, the second shell 140 and the heat insulation structure 150 can also be made of other existing materials, and the utility model does not make limitation to this. For example, in an embodiment, the heat insulation structure 150 is made of another existing material with high heat insulation capacity, and the thermal conductivity of the material is less than 0.1.

[0067] Optionally, the width of the insulation space is less than or equal to 5 mm to avoid air convection within the insulation space, which could affect the insulation. The width of the insulation space is directed from the first housing 110 to the second housing 140. For example, in one embodiment, the width of the insulation space is 3 mm. In this embodiment, air convection within the insulation space will not occur, effectively ensuring its insulation effect.

[0068] like Figure 1 As shown, in one embodiment, the gas path heating module 100 further includes a temperature sensor 180, which is used to monitor the temperature within the first housing 110 and / or the accommodating space. In practical applications, by cooperating the heating device 130 and the temperature sensor 180, heating and temperature control of the first housing 110 and the accommodating space can be achieved, thereby adjusting the heating effect on the structure to be heated. For example, in one embodiment, the temperature sensor 180 is a TC thermocouple, which is built into the first housing 110 and used in conjunction with the heating device 130 for temperature control.

[0069] like Figure 1 As shown, in one embodiment, the gas path heating module 100 further includes a connection adapter 190, which is used to connect the structure to be heated and the first housing 110, so that the structure to be heated is physically connected to the gas path heating module 100 as a whole. This structure not only ensures the stability and temperature uniformity of the structure to be heated, but also, because the structure to be heated is in direct contact with the first housing 110, it can be heated not only through a heat carrier, but also by directly transferring heat to the structure to be heated through the first housing 110, which can effectively improve the heating efficiency of the structure to be heated. For example, in one embodiment, the structure to be heated is a valve, and the connection adapter 190 is a valve adapter.

[0070] In conclusion, the gas circuit heating module 100 of the utility model combines the heating device 130, the first shell 110 and the heat energy carrier flow channel 120, etc., the first shell 110 and the heat energy carrier are heated by the heating device 130 to make its temperature rise, and the preheated heat energy carrier is blown into the containing space through the air hole 124 of the working channel 122, the heat energy carrier of high-temperature gas state is used to heat the structure to be heated, the convection heating inside the containing space is increased, the structure to be heated is in the high-temperature heat energy carrier environment, which helps to improve the heating and heat preservation efficiency of the structure to be heated, and the temperature uniformity of the structure to be heated is also improved, and the heat energy utilization efficiency is higher. Therefore, the gas circuit heating module 100 of the utility model can effectively realize the temperature control of the structure to be heated, prevents the gas from condensing and blocking, in actual application, it can be applied to each key position of the gas pipeline (especially the position where the passage space of the structure such as valve is narrow and the gas flow dead angle is more), so as to maintain the stability of the gas in the gas pipeline, thereby ensuring the continuity of the process flow and the reliability of the product, and further improving the quality and production efficiency of the semiconductor product.

[0071] Although the content of the utility model has been introduced in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as the limitation of the utility model. After the above content is read by the person skilled in the art, various modifications and substitutions of the utility model will be obvious. Therefore, the protection scope of the utility model should be limited by the attached claims.

Claims

1. A gas circuit heating module, characterized by, The gas circuit heating module comprises: a first shell having a receiving space for receiving a structure to be heated; a thermal energy carrier flow channel arranged inside a plate body of the first shell, the thermal energy carrier flow channel comprising a preheating passage and a working passage in communication, the preheating passage having a thermal energy carrier inlet, and the working passage having a plurality of air holes in communication with the receiving space of the first shell; a heating device for heating the first shell and simultaneously heating the preheating passage.

2. The gas circuit heating module according to claim 1, wherein: the heating device is arranged inside the plate body of the first shell; or the heating device is arranged in the receiving space.

3. The gas circuit heating module according to claim 1, wherein: the thermal energy carrier flow channel is arranged in a serpentine shape.

4. The gas circuit heating module according to claim 1, wherein: the working passage is arranged along the periphery of at least one side wall of the first shell.

5. The gas circuit heating module according to claim 1, wherein: the number of air holes in at least a part of the working passage increases in the direction of flow of the thermal energy carrier; and / or the number of air holes in at least a part of the working passage is uniformly distributed.

6. The gas circuit heating module according to claim 1, wherein: in at least a part of the working passage, the cross-sectional area of each air hole increases in the direction of flow of the thermal energy carrier; and / or the cross-sectional area of each air hole in at least a part of the working passage is the same.

7. The gas circuit heating module according to claim 1, wherein: the cross-sectional area of the working passage is the sum of the areas of all the air holes arranged on the working passage.

8. The air path heating module of claim 1, wherein, The gas circuit heating module further comprises: a second shell arranged to surround at least a part of the first shell; at least one heat insulation structure arranged between the first shell and the second shell, the heat insulation structure and the first shell and / or the second shell forming a heat insulation space therebetween.

9. The gas circuit heating module according to claim 8, wherein: the heat insulation structure and the first shell form a first heat insulation space therebetween via a first support structure.

10. The gas circuit heating module according to claim 9, wherein: the first support structure comprises a first protruding structure of the heat insulation structure; and / or the first support structure comprises a second protruding structure of the first shell.

11. The gas circuit heating module according to claim 10, wherein: the first protruding structure is integrally formed with the heat insulation structure; and the second protruding structure is integrally formed with the first shell.

12. The gas circuit heating module according to claim 8, wherein: the heat insulation structure and the second shell form a second heat insulation space therebetween via a second support structure.

13. The gas circuit heating module according to claim 12, wherein: the second support structure comprises a third protruding structure of the heat insulation structure; and / or the second support structure comprises a fourth protruding structure of the second shell.

14. The gas circuit heating module according to claim 13, wherein: The third protruding structure is integrally formed with the heat insulation structure. The fourth protruding structure is integrally formed with the second shell.

15. The gas path heating module of claim 8, wherein The heat insulation structure is made of Teflon material.

16. The gas path heating module of claim 8, wherein The first shell and the second shell have a plurality of heat insulation structures arranged in sequence along a direction from the first shell to the second shell, and at least two adjacent heat insulation structures have a heat insulation space therebetween.

17. The gas path heating module of claim 8, wherein The width of the heat insulation space is less than or equal to 5 mm, wherein the width direction of the heat insulation space is from the first shell to the second shell.

18. The airpath heating module of claim 1, wherein, Further comprising: a temperature sensor for monitoring the temperature in the first shell and / or the containing space.

19. The airpath heating module of claim 1, wherein, Further comprising: a connecting adapter for connecting the structure to be heated and the first shell.

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