Ceramic substrate assembly
By setting a reinforcing layer and a heat exchange layer on the ceramic substrate, the problems of fragility and insufficient thermal management of the ceramic substrate are solved, and stable heat conduction and mechanical protection at high temperatures are achieved.
Patent Information
- Application Number
- CN202422155698.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-03
- Publication Date
- 2025-11-07
- Estimated Expiration
- 2034-09-03
AI Technical Summary
Ceramic substrates are more fragile than flexible materials, and are prone to cracking when subjected to impact or bending. Furthermore, they do not meet the requirements for thermal management when used alone in high power density applications.
A reinforcing layer is provided on the top of the ceramic substrate, and a heat exchange layer is provided on the bottom, including a thermally conductive layer, a functional layer, an insulating layer, a protective layer, and a heat sink layer. The thermally conductive material and the heat diffusion layer are used to improve the heat conduction and dissipation capabilities, and enhance mechanical strength and thermal management.
It improves the mechanical strength and thermal management capabilities of ceramic substrates, enabling them to operate stably in high-temperature environments, reduce device temperature, prevent mechanical damage, and is suitable for high-temperature applications.
Smart Images
Figure CN223528262U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to ceramic substrate technical field, concretely is a kind of ceramic substrate assembly. BACKGROUND
[0002] Ceramic substrate is a kind of basic material for electronic devices, usually made of ceramic materials, such as alumina ceramic or aluminum nitride ceramic. They have good mechanical strength, high temperature resistance and excellent insulation performance, often used in the basic structure of circuit board, used to support and connect electronic components, provide thermal management, electrical connection and protection, etc. The design and composition of ceramic substrate can be adjusted and optimized according to specific application requirements to improve the performance and reliability of the overall device.
[0003] Although the ceramic substrate of prior art has many advantages, such as good mechanical strength, it also has some disadvantages. Ceramic substrate is more fragile than flexible materials (such as polyimide, etc.), and is prone to breakage when subjected to impact or bending, which limits their use in some applications. Although ceramic substrate itself has good thermal conductivity, it may not meet the requirements when used alone in some high power density applications, and additional thermal management measures are needed. SUMMARY
[0004] In view of the deficiencies of the prior art, the utility model provides a kind of ceramic substrate assembly, solve the problem that ceramic substrate is more fragile than flexible materials (such as polyimide, etc.), and is prone to breakage when subjected to impact or bending, which limits their use in some applications. Although ceramic substrate itself has good thermal conductivity, it may not meet the requirements when used alone in some high power density applications, and additional thermal management measures are needed.
[0005] To achieve the above purpose, the utility model is realized by the following technical scheme: a kind of ceramic substrate assembly, including ceramic base layer, the top of the ceramic base layer is provided with reinforcing layer, the bottom of the ceramic base layer is provided with heat exchange layer;
[0006] The reinforcing layer includes a heat-conducting layer disposed on the surface of the ceramic base layer, the heat-conducting layer is provided with a functional layer away from the surface of the ceramic base layer, the functional layer is provided with an insulating layer away from the surface of the heat-conducting layer, and the insulating layer is provided with a protective layer away from the surface of the functional layer;
[0007] The heat exchange layer includes a fin layer disposed at the bottom of the ceramic base layer, and the fin layer is provided with a thermal diffusion layer away from the surface of the ceramic base layer.
[0008] Preferably, the heat-conducting layer is copper powder, and the functional layer is an electroplated layer; copper is an excellent heat-conducting material with high thermal conductivity, which can effectively conduct and disperse heat, help reduce the working temperature of the device, improve the performance and stability of the system, and the metal layer formed by electroplating or evaporation is used for the metallization and connection of the circuit.
[0009] Preferably, the insulating layer is made of silicon nitride, and the protective layer is a thermal interface material (TIM); silicon nitride has high resistivity and good insulation performance, can effectively isolate electronic components, prevent interference and short circuit between circuits, has high stability at high temperature and can withstand high working temperature, generally up to about ℃, is suitable for high-temperature application scenarios, has high hardness, excellent compression resistance and bending resistance, can provide good structural support and protection, the TIM can fill the small gaps between devices, fill uneven surfaces, increase the contact area of heat transfer, reduce thermal resistance, and effectively improve the heat conduction effect, has high thermal conductivity, can effectively improve the heat conduction efficiency, helps quickly transmit heat from the inside to the outside environment, has good elasticity and compression performance, can adapt to deformation under different pressures, maintains stable thermal contact, and ensures the stability of heat transfer.
[0010] Preferably, the heat-conducting layer is copper powder, and the functional layer is an electroplated layer; copper is an excellent heat-conducting material with high thermal conductivity, which can effectively conduct and disperse heat, help reduce the working temperature of the device, improve the performance and stability of the system, and the metal layer formed by electroplating or evaporation is used for the metallization and connection of the circuit.
[0011] Preferably, the surface of the protective layer is provided with a circuit.
[0012] Beneficial effects
[0013] The utility model provides a ceramic substrate assembly. Compared with the prior art, the following beneficial effects are achieved:
[0014] 1、The ceramic substrate assembly can effectively conduct and disperse heat by setting the reinforcing layer, help reduce the device operating temperature, improve system performance and stability, and can withstand higher operating temperature, usually up to about 1200℃, suitable for high temperature application scene, silicon nitride hardness is high, pressure resistance and bending resistance is excellent, can provide good structural support and protection, and the protective layer is thermal interface material TIMs, which can fill the small gap between the devices, fill the uneven surface, increase the contact area of heat transfer, reduce the thermal resistance, effectively improve the heat conduction effect, has higher thermal conductivity, can effectively improve the heat conduction efficiency, help quickly transmit heat from the inside to the external environment, has good elasticity and compression performance, can adapt to deformation under different pressure, maintain stable thermal contact, ensure the stability of heat transfer.
[0015] 2、The ceramic substrate assembly can increase the heat dissipation surface area of the ceramic substrate assembly by setting the heat exchange layer, effectively dissipate heat to the environment through a larger surface area, further improve the heat dissipation capacity, and the heat diffusion layer is aluminum plate, which has higher thermal conductivity, can effectively diffuse heat from the active area to the entire ceramic substrate, help reduce the operating temperature of the device, improve the heat management effect, and prevent mechanical damage to the ceramic substrate during use. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 The utility model structural schematic diagram is shown in the figure;
[0017] Figure 2 The utility model structural schematic diagram is shown in the figure; Figure 1 The utility model structural schematic diagram is shown in the figure;
[0018] In the figure: 1, ceramic base layer;2, heat exchange layer;201, fin layer;202, heat diffusion layer;3, reinforcing layer;301, heat conducting layer;302, functional layer;303, insulating layer;304, protective layer;4, circuit. DETAILED DESCRIPTION
[0019] The technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.
[0020] Please refer to Figures 1-2 The utility model provides a technical scheme: a ceramic substrate assembly, including ceramic base layer 1, the top of ceramic base layer 1 is provided with reinforcing layer 3, and the bottom of ceramic base layer 1 is provided with heat exchange layer 2;
[0021] The reinforcing layer 3 includes a heat-conducting layer 301 arranged on the surface of the ceramic base layer 1, the heat-conducting layer 301 is provided with a functional layer 302 away from the surface of the ceramic base layer 1, the heat-conducting layer 301 is copper powder, copper is an excellent heat-conducting material with high thermal conductivity, which can effectively conduct and disperse heat, help to reduce the working temperature of the device, improve the system performance and stability, the functional layer 302 is an electroplated layer, a metal layer formed by electroplating or evaporation, used for the metallization and connection of the circuit, the functional layer 302 is provided with an insulating layer 303 away from the surface of the heat-conducting layer 301, the insulating layer 303 is provided with a protective layer 304 away from the surface of the functional layer 302, the surface of the protective layer 304 is provided with a circuit 4, the material of the insulating layer 303 is silicon nitride, which has high resistivity and good insulation performance, can effectively isolate electronic components and prevent interference and short circuit between circuits, silicon nitride has high stability in high temperature environment and can withstand high working temperature, usually up to about 1200°C, suitable for high temperature application scenarios, silicon nitride has high hardness, excellent compression resistance and bending resistance, can provide good structural support and protection, the protective layer 304 is a thermal interface material TIMs, which can fill the small gaps between devices, fill uneven surfaces, increase the contact area of heat transfer, reduce thermal resistance, and effectively improve the heat conduction effect, has high thermal conductivity, can effectively improve the heat conduction efficiency, helps to quickly transmit heat from the inside to the outside environment, has good elasticity and compression performance, can adapt to deformation under different pressures, maintains stable thermal contact and ensures the stability of heat transfer;
[0022] The heat exchange layer 2 includes a heat sink layer 201 arranged at the bottom of the ceramic base layer 1, the heat sink layer 201 is a copper alloy plate, which can increase the heat dissipation surface area of the ceramic substrate assembly, effectively dissipate heat to the environment through a larger surface area, further improve the heat dissipation capacity, the heat sink layer 201 is provided with a heat diffusion layer 202 away from the surface of the ceramic base layer 1, the heat diffusion layer 202 is an aluminum plate with high thermal conductivity, which can effectively diffuse heat from the active area to the entire ceramic substrate, help to reduce the working temperature of the device and improve the heat management effect, prevent mechanical damage to the ceramic substrate during use.
[0023] By setting the reinforcing layer 3, the heat can be effectively conducted and dispersed, helping to reduce the device operating temperature, improve system performance and stability, and can withstand higher operating temperature, usually up to about 1200°C, suitable for high temperature application scenarios, silicon nitride hardness is high, pressure resistance and bending performance is excellent, can provide good structural support and protection, and the protective layer 304 is a thermal interface material TIMs, which can fill the small gap between devices, fill uneven surfaces, increase the contact area of heat transfer, reduce thermal resistance, effectively improve the heat conduction effect, has high thermal conductivity, can effectively improve the heat conduction efficiency, help to quickly transmit heat from the inside to the outside environment, has good elasticity and compression performance, can adapt to deformation under different pressure, maintain stable thermal contact, ensure the stability of heat transfer, by setting the heat exchange layer 2, the heat dissipation surface area of the ceramic substrate assembly can be increased, and the heat can be effectively dissipated to the environment through a larger surface area, further improving the heat dissipation capacity, since the heat diffusion layer 202 is an aluminum plate, it has high thermal conductivity, which can effectively spread the heat from the active area to the entire ceramic substrate, helping to reduce the operating temperature of the device and improve the thermal management effect, preventing mechanical damage to the ceramic substrate during use.
[0024] Meanwhile, the contents not described in detail in the specification all belong to the prior art known to those skilled in the art.
Claims
1. A ceramic substrate assembly comprising a ceramic base layer (1), characterized in that: The top of the ceramic base layer (1) is provided with a reinforcing layer (3), and the bottom of the ceramic base layer (1) is provided with a heat exchange layer (2); The reinforcing layer (3) comprises a heat conduction layer (301) arranged on the surface of the ceramic base layer (1), the heat conduction layer (301) is provided with a functional layer (302) away from the surface of the ceramic base layer (1), the functional layer (302) is provided with an insulating layer (303) away from the surface of the heat conduction layer (301), and the insulating layer (303) is provided with a protective layer (304) away from the surface of the functional layer (302); The heat exchange layer (2) comprises a heat dissipation fin layer (201) arranged at the bottom of the ceramic base layer (1), and the heat dissipation fin layer (201) is provided with a heat diffusion layer (202) away from the surface of the ceramic base layer (1).
2. A ceramic substrate assembly as claimed in claim 1, wherein: The heat conduction layer (301) is copper powder, and the functional layer (302) is an electroplated layer.
3. The ceramic substrate assembly of claim 1, wherein: The material of the insulating layer (303) is silicon nitride, and the protective layer (304) is a thermal interface material TIMs.
4. The ceramic substrate assembly of claim 1, wherein: The heat dissipation fin layer (201) is a copper alloy plate, and the heat diffusion layer (202) is an aluminum plate.
5. The ceramic substrate assembly of claim 1, wherein: The surface of the protective layer (304) is provided with a circuit (4).