Finned radiator with ventilation structure and combined radiating device

Abstract

The utility model relates to the field of heat dissipation of high-power components, in particular to a finned radiator with a ventilation structure and a combined heat dissipation device.The finned radiator comprises a bottom plate and a heat dissipation plate, the bottom plate comprises a bottom plate base material and bottom plate flow channels, the bottom plate base material is connected with the surface of a heat dissipation component, the bottom plate flow channels penetrate through the bottom plate base material, and the bottom plate flow channels are arranged on the bottom plate base material in an array mode; the heat dissipation plate comprises a heat dissipation substrate, heat dissipation runners and heat dissipation fins, the heat dissipation substrate is connected to the upper portion of the bottom plate base material in parallel, the heat dissipation runners penetrate through the heat dissipation substrate, the heat dissipation runners are arranged on the heat dissipation substrate in an array mode, the heat dissipation fins are vertically arranged on the heat dissipation substrate, the heat dissipation fins are arranged on the heat dissipation substrate in an array mode, and the heat dissipation fins are arranged on the heat dissipation substrate in an array mode. A connecting flow channel is arranged between the bottom plate base material and the heat dissipation substrate, and the connecting flow channel is communicated with the bottom plate flow channel and the heat dissipation flow channel. According to the technical scheme, heat dissipation is achieved through convection, the surface area of the radiator is increased, and the heat dissipation efficiency is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of high-power component heat dissipation, in particular to a finned heat sink with a ventilation structure and a combined heat dissipation device. BACKGROUND

[0002] With the development of high frequency, miniaturization and integration of modern electronic equipment, temperature has become an important environmental factor affecting the reliability of electronic products, and the heat dissipation effect directly affects the performance and service life of electronic instruments. In particular, high-efficiency heat dissipation means is needed for high-power components to dissipate heat inside the device to the external environment, control the temperature of electronic components during operation, and ensure the safe, reliable and high-performance operation of electronic equipment.

[0003] As shown in Figure 1 , the finned heat sink belongs to natural heat dissipation technology, which dissipates heat through the heat sink to the surface in contact with the air by conduction, and transfers to the external environment by natural convection and radiation, thereby achieving heat dissipation. The existing finned heat sink has stable performance and low manufacturing cost, but due to the absence of a ventilation structure, the heat inside the device cannot be dissipated by convection to remove the high-temperature gas inside the case, resulting in low heat dissipation efficiency.

[0004] As shown in Figure 2 , forced air cooling heat dissipation technology is a heat dissipation technology that uses a fan to draw or blow air to drive air to flow through the heating surface, and the air and the surface of the heat sink exchange heat to carry away the heat of the high-temperature device. Forced air cooling heat dissipation has stronger heat exchange capacity than natural convection heat dissipation, but also increases the cost, noise pollution and complexity of the device, especially the vibration of the fan can affect the results of precision testing, such as not suitable for probe chip on wafer testing scenarios on microwave radio frequency spread spectrum modules, in addition, the forced air cooling heat dissipation has large ventilation holes, which affects the electromagnetic shielding effect of the product, and the airflow can also bring in dust and other foreign matter.

[0005] Therefore, in the existing heat dissipation technology, the finned heat sink has no ventilation structure, the heat inside the device cannot be dissipated by convection to the external environment, and the heat dissipation efficiency is low; the forced air cooling heat dissipation method produces noise and vibration, which can affect the results of precision testing, such as not suitable for probe chip on wafer testing, in addition, it also increases the complexity and cost of the device, and the reliability is also reduced, in addition, the heat dissipation ventilation hole is large, which affects the electromagnetic shielding effect of the product, and the airflow can also bring in dust and other foreign matter. SUMMARY

[0006] To solve the above problems, the purpose of the present application is to design a hidden ventilation fin heat dissipation structure, which can dissipate the heat inside the equipment to the external environment by convection, improving the heat dissipation efficiency; the ventilation hole is hidden in the bottom of the heat dissipation tooth, and the ventilation hole cannot be seen outside the equipment, so the overall appearance is better; the ventilation hole is in a grid shape at the bottom of the heat dissipation tooth, reducing the risk of foreign matter entering the equipment, and improving the safety of the equipment.

[0007] To achieve the above purpose, the technical scheme adopted by the present application is: a finned heat sink with a ventilation structure, comprising a bottom plate and a heat dissipation plate, the bottom plate comprises a bottom plate base material and a bottom plate flow channel, the bottom plate base material is connected with the surface of the heat dissipation component, the bottom plate flow channel penetrates through the bottom plate base material, the bottom plate flow channel is arranged in an array on the bottom plate base material, the heat dissipation plate comprises a heat dissipation base plate, a heat dissipation flow channel and a heat dissipation fin, the heat dissipation base plate is connected in parallel above the bottom plate base material, the heat dissipation flow channel penetrates through the heat dissipation base plate, the heat dissipation flow channel is arranged in an array on the heat dissipation base plate, the heat dissipation fin is vertically arranged above the heat dissipation base plate, the heat dissipation fin is arranged in an array on the heat dissipation base plate, and a connecting flow channel is arranged between the bottom plate base material and the heat dissipation base plate, the connecting flow channel communicates the bottom plate flow channel and the heat dissipation flow channel.

[0008] The finned heat sink with a ventilation structure described above, the array arrangement mode of the bottom plate flow channel and the heat dissipation flow channel is the same, and the heat dissipation fin is arranged on the heat dissipation base plate in a spaced manner.

[0009] The finned heat sink with a ventilation structure described above, the heat dissipation flow channel and the bottom plate flow channel are arranged in a staggered manner, and the hot air flow on the surface of the heat dissipation component passes through the bottom plate flow channel, the connecting flow channel and the heat dissipation flow channel in sequence and is discharged outward.

[0010] The finned heat sink with a ventilation structure described above, the bottom plate base material comprises a bottom plate frame and a bottom plate strip, the bottom plate strip is arranged in parallel in the bottom plate frame, the bottom plate strip and the bottom of the bottom plate frame are in the same plane, and the bottom plate strip is arranged in a spaced manner with the bottom plate flow channel.

[0011] The finned heat sink with a ventilation structure described above, the heat dissipation base plate comprises a base plate frame and a base plate strip, the base plate strip is arranged in parallel in the base plate frame, the base plate strip is arranged in a spaced manner with the heat dissipation flow channel, and the heat dissipation fin is vertically connected above the base plate strip.

[0012] The finned heat sink with a ventilation structure described above, the width of the base plate strip is not less than the width of the bottom plate flow channel, and the center line of the base plate strip is projected on the center line of the bottom plate flow channel.

[0013] The connecting plate is connected with the bottom plate and the heat dissipation plate at two ends respectively, and the connecting hole is arranged in the connecting plate.

[0014] The heat dissipation fin and the heat dissipation base plate are cut from a metal block.

[0015] The bottom plate flow channel is distributed on the bottom plate base material in a grid shape, and the heat dissipation flow channel is distributed on the heat dissipation base plate in a grid shape.

[0016] A combined heat dissipation device comprises the finned heat dissipation device with the ventilation structure as described in any one of the above, and further comprises a heat dissipation fan fixed outside the heat dissipation fin.

[0017] The finned heat dissipation device with the ventilation structure and the combined heat dissipation device have the following beneficial effects: the heat dissipation flow channel, the connecting flow channel and the base plate flow channel are arranged, heat dissipation is achieved through convection, the surface area of the heat dissipation device is increased, and the heat dissipation efficiency is improved; the heat dissipation flow channel, the connecting flow channel and the base plate flow channel are arranged in a cross "Z" shape and hidden at the bottom of the heat dissipation fin, so that the flow channel cannot be seen outside the equipment when the external heat dissipation fin is high, and the appearance is better in integrity; the heat dissipation fin is cut from a metal block during manufacturing, the integrity of the heat dissipation device is ensured, and the thermal resistance between the heat dissipation fin and the bottom plate base material is reduced; the heat dissipation flow channel and the base plate flow channel are arranged in a grid shape, the risk of foreign matter entering the interior of the equipment is reduced, and the safety of the equipment is improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 It is a schematic diagram of the existing finned heat dissipation device;

[0019] Figure 2 It is a schematic diagram of the existing forced air cooling heat dissipation device;

[0020] Figure 3 It is a schematic diagram of the cross-sectional structure of the finned heat dissipation device described in the embodiment of the present application;

[0021] Figure 4 It is a schematic diagram of the first flow channel structure described in the embodiment of the present application;

[0022] Figure 5 It is a schematic diagram of the second flow channel structure described in the embodiment of the present application.

[0023] Explanation of reference signs: bottom plate 1, heat dissipation plate 2, bottom plate base material 11, bottom plate flow channel 12, bottom plate strip 13, heat dissipation base plate 21, heat dissipation flow channel 22, heat dissipation fin 23, connecting flow channel 3, connecting plate 31, connecting hole 32. DETAILED DESCRIPTION

[0024] In order to better understand the inventive purpose and technical scheme of the present application, the inventive purpose and technical scheme of the present application will be described below in combination with specific embodiments and drawings.

[0025] Embodiment 1

[0026] As shown in Figure 3 , Figure 4 , a finned radiator with ventilation structure comprises a bottom plate 1 and a heat dissipation plate 2, the bottom plate comprises a bottom plate base material 11 and a bottom plate flow channel 12, the bottom plate base material is connected with the surface of the heat dissipation component, the bottom plate flow channel penetrates through the bottom plate base material, and the bottom plate flow channel is arranged in an array on the bottom plate base material.

[0027] The bottom plate base material comprises a bottom plate frame and a bottom plate strip 13, the bottom plate strip is arranged in parallel in the bottom plate frame, the bottom plate strip is in the same plane as the bottom of the bottom plate frame, and the bottom plate strip is arranged in a spaced manner with the bottom plate flow channel.

[0028] The heat dissipation plate comprises a heat dissipation base plate 21, a heat dissipation flow channel 22 and a heat dissipation fin 23, the heat dissipation base plate is connected in parallel above the bottom plate base material, the heat dissipation flow channel penetrates through the heat dissipation base plate, the heat dissipation flow channel is arranged in an array on the heat dissipation base plate, and the heat dissipation fin is arranged in a vertical manner above the heat dissipation base plate and arranged in an array on the heat dissipation base plate.

[0029] A connecting flow channel 3 is arranged between the bottom plate base material and the heat dissipation base plate, and the connecting flow channel is communicated with the bottom plate flow channel and the heat dissipation flow channel.

[0030] The heat dissipation base plate comprises a base plate frame and a base plate strip, the base plate strip is arranged in parallel in the base plate frame, the base plate strip is arranged in a spaced manner with the heat dissipation flow channel, and the heat dissipation fin is connected in a vertical manner above the base plate strip.

[0031] The existing finned radiator cannot dissipate heat through the flow channel, and the heat dissipation efficiency is low, but the hidden ventilation fin radiator of the present application can dissipate heat through convection, thereby improving the heat dissipation efficiency.

[0032] The array arrangement mode of the bottom plate flow channel and the heat dissipation flow channel is the same, and the heat dissipation fin is arranged in a spaced manner on the heat dissipation base plate.

[0033] The heat dissipation flow channel and the bottom plate flow channel are arranged in a staggered manner, and the hot air flow on the surface of the heat dissipation component passes through the bottom plate flow channel, the connecting flow channel and the heat dissipation flow channel in sequence and is discharged outward, as shown by the arrow direction in Figure 3 .

[0034] The width of the base plate strip is not less than the width of the bottom plate flow channel, and the center line of the base plate strip is projected on the center line of the bottom plate flow channel.

[0035] The existing forced air cooling heat dissipation mesh hole has obvious appearance difference with other areas of the case shell, the ventilation hole is hidden at the bottom of the heat dissipation fin, the ventilation hole flow channel is in a cross "Z" shape and is hidden at the bottom of the heat dissipation fin, the ventilation hole cannot be seen outside when the external heat dissipation fin is high, and the overall appearance is better.

[0036] The heat dissipation fin and the heat dissipation substrate are cut from a metal block.

[0037] Embodiment 2

[0038] The same as embodiment 1 is not repeated, and the difference is the connection mode between the bottom plate substrate and the heat dissipation substrate.

[0039] In order to enhance the connection firmness between the bottom plate substrate and the heat dissipation substrate and facilitate heat conduction, the connecting plate 31 and the connecting hole 32 are arranged between the bottom plate and the heat dissipation plate, the two ends of the connecting plate are connected with the bottom plate and the heat dissipation plate respectively, and the connecting hole is arranged in the connecting plate.

[0040] Embodiment 3

[0041] The same as the above embodiment is not repeated, and the difference is that the array arrangement mode of the flow channel is different, as shown in Figure 5 The bottom plate flow channel is distributed in a grid shape on the bottom plate substrate, and the heat dissipation flow channel is distributed in a grid shape on the heat dissipation substrate.

[0042] The existing forced air cooling heat dissipation mesh hole is large in size and brings in dust and other foreign matters; the ventilation hole of the present application is in a grid shape at the bottom of the heat dissipation tooth, which reduces the risk of foreign matters entering the interior of the equipment and improves the safety of the equipment.

[0043] In addition to the array arrangement mode described in the embodiments of the present application, the heat dissipation flow channel and the bottom plate flow channel can also adopt the same annular array arrangement or the same shaped special-shaped array arrangement, and the required arrangement mode can be set according to the specific shape of the surface of the heat dissipation component.

[0044] Embodiment 4

[0045] A combined heat dissipation device comprises a fin type radiator with a ventilation structure as described in the above embodiments, and further comprises a heat dissipation fan fixed on the outside of the heat dissipation fin. The fixing mode of the heat dissipation fan is the same as that of the prior art, which can use bolt fixing or set a plug rod in the middle of the fan and fix it in the plug hole on the surface of the radiator. The heat dissipation fan can not only take away the heat on the surface of the heat dissipation fin, but also directly take away the heat on the surface of the heat dissipation component through the heat dissipation flow channel, the connecting flow channel and the bottom plate flow channel, so as to improve the heat dissipation efficiency and protect the heat dissipation component.

[0046] The above examples are only for illustrating the inventive concept and features of the present application, and the purpose is to enable those skilled in the art to understand the present application and to implement it, and cannot limit the protection scope of the present application. Any equivalent changes or modifications made according to the essence of the present application should be covered within the protection scope of the present application.

Claims

1. A finned heat sink with a venting structure comprising a base plate, a heat sink plate, characterized in that: The bottom plate comprises a bottom plate substrate connected with the surface of the heat dissipation component, and a bottom plate flow channel penetrating through the bottom plate substrate and arranged in an array on the bottom plate substrate; the heat dissipation plate comprises a heat dissipation substrate connected above the bottom plate substrate in parallel, a heat dissipation flow channel penetrating through the heat dissipation substrate and arranged in an array on the heat dissipation substrate, and a heat dissipation fin vertically arranged above the heat dissipation substrate and arranged in an array on the heat dissipation substrate; a connecting flow channel is arranged between the bottom plate substrate and the heat dissipation substrate, and the connecting flow channel is communicated with the bottom plate flow channel and the heat dissipation flow channel.

2. The finned heat sink with venting structure according to claim 1, characterized in that: The array arrangement of the bottom plate flow channel and the heat dissipation flow channel is the same, and the heat dissipation fin is arranged on the heat dissipation substrate in a spaced manner with the heat dissipation flow channel.

3. The finned heat sink with venting structure according to claim 2, wherein: The heat dissipation flow channel and the bottom plate flow channel are arranged in a staggered manner, and the hot air flow of the surface of the heat dissipation component passes through the bottom plate flow channel, the connecting flow channel and the heat dissipation flow channel in sequence and is discharged outward.

4. The finned heat sink with venting structure according to claim 3, characterized in that: The bottom plate substrate comprises a bottom plate frame and a bottom plate strip, the bottom plate strip is arranged in the bottom plate frame in parallel, the bottom plate strip and the bottom of the bottom plate frame are in the same plane, and the bottom plate strip is arranged in a spaced manner with the bottom plate flow channel.

5. The finned heat sink with venting structure according to claim 4, wherein: The heat dissipation substrate comprises a substrate frame and a substrate strip, the substrate strip is arranged in the substrate frame in parallel, the substrate strip is arranged in a spaced manner with the heat dissipation flow channel, and the heat dissipation fin is vertically connected above the substrate strip.

6. The finned heat sink with venting structure according to claim 5, characterized in that: The width of the substrate strip is not less than the width of the bottom plate flow channel, and the center line of the substrate strip is projected on the center line of the bottom plate flow channel.

7. The finned heat sink with venting structure according to claim 6, characterized in that: A connecting plate and a connecting hole are arranged between the bottom plate and the heat dissipation plate, two ends of the connecting plate are connected with the bottom plate and the heat dissipation plate respectively, and the connecting hole is arranged in a spaced manner with the connecting plate.

8. The finned heat sink with venting structure according to claim 7, characterized in that: The heat dissipation fin and the heat dissipation substrate are cut by a metal block.

9. The finned heat sink with venting structure according to claim 8, characterized in that: The bottom plate flow channel is distributed in a grid shape on the bottom plate substrate, and the heat dissipation flow channel is distributed in a grid shape on the heat dissipation substrate.

10. A combination heat sink, characterized by: The finned heat sink with the ventilation structure comprises the finned heat sink according to any one of claims 1-9 and a heat dissipation fan, and the heat dissipation fan is fixed on the outer side of the heat dissipation fin.

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