Device for improving temperature rise of high-power miniaturized power supply

Abstract

The utility model provides a device for improving temperature rise of a high-power miniaturized power supply, which belongs to the technical field of power supplies, and comprises a charging shell and two groups of circuit boards, the two groups of circuit boards are both arranged in the charging shell, one side of one group of circuit boards is provided with a heat dissipation plate, and the heat dissipation plate is in contact with heating points of the circuit boards; a foam pad is arranged between the heat dissipation plate and the charging shell, one side of the foam pad is attached to the heat dissipation plate, the other side of the foam pad makes contact with the inner wall of the charging shell, and two sets of conductive plug boards are arranged at one end of the charging shell and electrically connected with the two sets of circuit boards. According to the device, the heat dissipation plate is in contact with the heating points of the circuit boards, heat dissipation can be achieved through the heat dissipation plate, and gaps are formed between the two circuit boards and the charging shell, so that air circulation is facilitated, and heat dissipation is assisted; meanwhile, the foam pad is arranged between the heat dissipation plate and the charging shell, flowing of the pouring sealant is effectively prevented, direct contact between the pouring sealant and the charging shell is avoided, and the temperature of the outer surface of the charging shell is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model belongs to power supply technical field, more specifically, especially relate to a device that improves high power miniaturized power supply temperature rise. BACKGROUND

[0002] Nowadays, the technology develops rapidly, and the charger as the indispensable accessory of electronic equipment is also constantly improved, and its power is constantly increased to adapt to the needs of fast charging of various high-energy-consumption electronic equipment. At the same time, the volume is developing towards miniaturization, so that the charger is more convenient to carry and use while improving performance. However, the charger often generates heat during use, especially when the power is constantly increasing, the heat dissipation problem is more prominent. Since the internal space of the charger is small, in order to ensure the heat dissipation of the high-power charger, the glue filling scheme is usually used to evenly dissipate the heat of the components through the potting glue. However, the traditional glue filling has good thermal conductivity, fluidity and permeability, which can fill the entire shell with glue, directly guide the heat to the shell, and cause the temperature of the shell to rise over time. When it exceeds the acceptable range of human temperature sensing, it will directly affect the normal use of the user and may cause a certain safety hazard. CONTENT OF THE UTILITY MODEL

[0003] In order to solve the above technical problems, the utility model provides a device for improving the temperature rise of high-power miniaturized power supply to solve the technical problems in the prior art that the traditional glue filling can fill the entire shell, causing the heat to be guided to the shell and causing the temperature of the shell to rise, affecting the normal use of the user and causing a certain safety hazard.

[0004] The purpose and effect of the device for improving the temperature rise of high-power miniaturized power supply of the utility model are achieved by the following specific technical means:

[0005] A device for improving the temperature rise of high-power miniaturized power supply, comprising a charging shell and two groups of circuit boards, wherein one group of the circuit boards is provided with a heat sink on one side, and the heat sink is in contact with the heat generating point of the circuit board. A foam pad is arranged between the heat sink and the charging shell, one side of the foam pad is attached to the heat sink, and the other side is in contact with the inner wall of the charging shell. Two groups of conductive plugs are arranged at one end of the charging shell, and the conductive plugs are electrically connected with the two groups of circuit boards.

[0006] According to a preferred embodiment, mounting grooves are formed on the opposite inner sides of the charging shell, and the circuit boards are respectively clamped in the two groups of mounting grooves.

[0007] According to a preferred embodiment, the charging shell is provided with four arc-shaped corners, the mounting sliding groove is located on one side of one set of the arc-shaped corners of the charging shell, and the circuit board is clamped in the mounting sliding groove on both sides to form a gap between the circuit board and the charging shell.

[0008] According to a preferred embodiment, one set of the circuit boards is perpendicular to another set of the circuit boards, a connecting block is arranged on one set of the circuit boards, a connecting groove corresponding to the connecting block is arranged on another set of the circuit boards, and the connecting block is clamped in the connecting groove.

[0009] According to a preferred embodiment, a connecting plate is arranged on the heat dissipation plate, the connecting plate is bent towards one side of the circuit board, a connecting clamping plate is arranged on the top of the connecting plate, a connecting clamping groove corresponding to the connecting clamping plate is arranged on the circuit board, the connecting clamping plate is clamped in the connecting clamping groove, and the connecting plate is in contact with the circuit board.

[0010] According to a preferred embodiment, a heat dissipation protrusion is arranged on the heat dissipation plate, the heat dissipation protrusion is in contact with a heat generation point on one side of the circuit board, and a gap is formed between the heat dissipation plate and the circuit board.

[0011] According to a preferred embodiment, the area of the foam pad is smaller than that of the heat dissipation plate, and the foam pad is arranged in a frame structure.

[0012] Compared with the prior art, the utility model has the following beneficial effects:

[0013] 1. The heat dissipation plate is in direct contact with the heat generation point of the circuit board, can quickly absorb the heat generated when the circuit board works, the heat dissipation protrusion on the heat dissipation plate further increases the contact area with the heat generation point, improves the heat conduction efficiency, and ensures that the heat can be quickly transmitted from the heat source to the heat dissipation plate. A gap is formed between the heat dissipation plate and the circuit board, so that the accumulation of heat between the circuit board and the heat dissipation plate is avoided, and the heat can be more efficiently conducted to the heat dissipation plate. Meanwhile, the foam pad is arranged between the heat dissipation plate and the charging shell, one side of the foam pad is attached to the heat dissipation plate, and the other side is in contact with the charging shell. The foam pad forms a space for heat dissipation between the potting adhesive and the shell, prevents the potting adhesive from directly contacting the shell, solves the problem of the temperature of the charger shell, eliminates the safety hazard caused by the excessively high temperature of the shell, and achieves miniaturization and high-density charging.

[0014] 2. The mounting slot on the opposite inner side of the charging shell and the four corner arc-shaped settings, the mounting slot is opened on one side of the arc-shaped, so that the circuit board card is set in the mounting slot, and a gap is formed between the charging shell. This gap not only helps air circulation and assists heat dissipation, but also provides space for heat dissipation when the circuit board is stably installed in the mounting slot, further avoiding the accumulation of heat inside the charger, thereby indirectly reducing the temperature of the shell. At the same time, the connecting plate on the heat sink is bent, and the top connecting card plate is matched with the connecting card slot on the circuit board, so that the connection between the heat sink and the circuit board is firm, ensuring that the heat sink can stably absorb the heat of the circuit board, and also facilitating the installation and disassembly of the heat sink. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is the structure schematic diagram of the assembled utility model;

[0016] Figure 2 is the structure schematic diagram of the split utility model;

[0017] Figure 3 is the structure schematic diagram of the charging shell;

[0018] Figure 4 is Figure 2 the local enlarged view of a region in the

[0019] In the figure, the correspondence between the component name and the drawing number is:

[0020] 11, the charging shell; 12, the conductive plugboard; 13, the mounting slot; 21, the circuit board; 22, the connecting block; 23, the connecting slot; 24, the connecting card slot; 31, the heat sink; 32, the foam pad; 33, the connecting plate; 34, the connecting card plate; 35, the heat dissipation protrusion. DETAILED DESCRIPTION

[0021] The embodiment of the utility model will be further described in detail below in combination with the drawings and examples. The following examples are used to illustrate the technical scheme of the utility model, but cannot be used to limit the protection scope of the utility model.

[0022] Example:

[0023] As Figures 1 to 4As shown, the utility model provides a device for improving high -power miniaturization power supply temperature rise, including charging shell 11 and two groups of circuit board 21, two groups of circuit board 21 are installed in the internal space of charging shell 11, one side of one group of circuit board 21 is provided with heat sink 31, this heat sink 31 contacts the heat spot of circuit board 21, when circuit board 21 generates heat in the working process, heat sink 31 can rely on its contact with heat spot, rapidly absorb these heat. Still be provided with foam pad 32 between heat sink 31 and charging shell 11, one side of foam pad 32 is closely attached on heat sink 31, and the other side is contacted with the inner wall of charging shell 11, the existence of foam pad 32 prevents the direct contact of potting adhesive and shell, effectively solve the problem of charger shell temperature is too high, reduce the security risk caused by the high temperature of shell, provide guarantee for realizing miniaturization high-density charger. The two opposite inner sides of charging shell 11 are provided with installation sliding slot 13, and the two sides of circuit board 21 are respectively clamped in the two groups of installation sliding slot 13, the position of circuit board 21 in charging shell 11 can be stably fixed, even when charger is vibrated or subjected to other external force, circuit board 21 is not easy to displace, thereby guaranteeing the stability and reliability of the internal structure of charger.

[0024] The four corners of charging shell 11 are provided with arc shape, and the installation sliding slot 13 is located at one side of one group of arc shape of charging shell 11, when circuit board 21 is clamped in installation sliding slot 13 through two sides, due to the design of arc shape and the position arrangement of installation sliding slot 13, the gap can be formed between circuit board 21 and charging shell 11, which provides sufficient space for heat dissipation, so that the heat generated in the working process of circuit board 21 will not accumulate in the part contacted with charging shell 11, thereby effectively improving the heat dissipation efficiency.

[0025] One group of circuit board 21 and another group of circuit board 21 adopt vertical layout mode, optimize the space utilization inside charger, and the connecting block 22 is arranged on one group of circuit board 21, and the connecting groove 23 is formed in the other group of circuit board 21 corresponding to the connecting block 22, by clamping the connecting block 22 in the connecting groove 23, the stable connection between the two groups of circuit board 21 is realized, not only guarantee the reliability of circuit connection, make the current can be stably transmitted between two groups of circuit board 21, but also very convenient in the assembling process, can improve production efficiency, reduce assembling difficulty.

[0026] As Figure 2 , Figure 4As shown, the heat dissipation plate 31 is provided with a connecting plate 33, the connecting plate 33 is bent towards one side of the circuit board 21, and a connecting clamping plate 34 is arranged at the top of the connecting plate 33, and the circuit board 21 is provided with a connecting clamping groove 24 corresponding to the connecting clamping plate 34, and the connecting clamping plate 34 is clamped in the connecting clamping groove 24, so that the connecting plate 33 and the circuit board 21 can be in close contact. Such design ensures the firmness of the connection between the heat dissipation plate 31 and the circuit board 21, ensures that the heat dissipation plate 31 can absorb the heat generated by the circuit board 21, and also facilitates the installation and disassembly of the heat dissipation plate 31, and provides convenience for subsequent maintenance and replacement. The heat dissipation plate 31 is also provided with heat dissipation protrusions 35, which are in contact with the heat generating points of one side of the circuit board 21, further increasing the heat dissipation area and improving the heat dissipation efficiency, and the gap formed between the heat dissipation plate 31 and the circuit board 21 is also conducive to the rapid conduction and dissipation of heat.

[0027] The area of the foam pad 32 is smaller than the heat dissipation plate 31, and is arranged in a frame structure, which can not only ensure that the foam pad 32 plays a buffering and supporting role between the heat dissipation plate 31 and the charging shell 11, but also can control the direction and speed of heat transfer through the frame structure, avoid excessive heat transfer to the shell, and also provide a certain space for heat dissipation, further optimize the heat dissipation performance and overall structural stability of the charger.

[0028] The specific use mode and effect of the embodiment are as follows:

[0029] In use, the two groups of conductive plugs 12 at one end of the charging shell 11 are electrically connected with the two groups of circuit boards 21, ensuring that the charger can normally work and the heat dissipation plate 31 can continuously absorb the heat generated by the circuit board 21 and dissipate heat through its heat dissipation structure and cooperation with the foam pad 32 and the charging shell 11.

[0030] The above shows and describes the basic principle and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments.

Claims

1. A device for improving the temperature rise of a high-power miniaturized power supply, comprising a charging housing (11) and two sets of circuit boards (21), characterized in that: Two groups of the circuit board (21) are installed in the charging shell (11), one side of one group of the circuit board (21) is provided with a heat dissipation plate (31), the heat dissipation plate (31) is in contact with the heat spot of the circuit board (21); the heat dissipation plate (31) and the charging shell (11) are provided with a foam pad (32), one side of the foam pad (32) is attached to the heat dissipation plate (31), and the other side is in contact with the inner wall of the charging shell (11); one end of the charging shell (11) is provided with two groups of conductive plugboards (12), and the conductive plugboards (12) are electrically connected with the two groups of circuit boards (21).

2. The device for improving temperature rise of high-power miniaturized power supply according to claim 1, characterized in that: The opposite inner sides of the charging shell (11) are provided with mounting grooves (13), and the two sides of the circuit board (21) are respectively clamped in the two groups of mounting grooves (13).

3. The device for improving temperature rise of high-power miniaturized power supply according to claim 2, characterized in that: The four corners of the charging shell (11) are provided with arcs, the mounting grooves (13) are located on one side of one group of arcs of the charging shell (11), and the circuit board (21) is clamped in the mounting grooves (13) on both sides, and a gap is formed between the circuit board (21) and the charging shell (11).

4. The apparatus for improving temperature rise of a high-power miniaturized power supply according to claim 3, wherein: One group of the circuit board (21) is perpendicular to the other group of the circuit board (21), one group of the circuit board (21) is provided with a connecting block (22), and the other group of the circuit board (21) is provided with a connecting groove (23) corresponding to the connecting block (22), and the connecting block (22) is clamped in the connecting groove (23).

5. The device for improving temperature rise of high-power miniaturized power supply according to claim 1, characterized in that: The heat dissipation plate (31) is provided with a connecting plate (33), the connecting plate (33) is bent towards one side of the circuit board (21), the top of the connecting plate (33) is provided with a connecting clamping plate (34), the circuit board (21) is provided with a connecting clamping groove (24) corresponding to the connecting clamping plate (34), the connecting clamping plate (34) is clamped in the connecting clamping groove (24), and the connecting plate (33) is in contact with the circuit board (21).

6. The apparatus for improving temperature rise of a high-power miniaturized power supply according to claim 5, wherein: The heat dissipation plate (31) is provided with a heat dissipation protrusion (35), the heat dissipation protrusion (35) is in contact with the heat spot of one side of the circuit board (21), and a gap is formed between the heat dissipation plate (31) and the circuit board (21).

7. The device for improving temperature rise of high-power miniaturized power supply according to claim 1, characterized in that: The area of the foam pad (32) is smaller than that of the heat dissipation plate (31), and the foam pad (32) is provided in a frame structure.

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