Optical fiber transceiver structure

Abstract

The utility model discloses an optical fiber transceiver structure which comprises a transceiver body, heat conducting plates are arranged on the upper surface and the lower surface of the transceiver body, heat conducting fins are arranged on the departing surfaces of the two heat conducting plates, the heat conducting fins are evenly distributed on the heat conducting plates, and heat conducting cushion layers are arranged between the heat conducting plates and the transceiver body. Clamping strips for clamping the heat-conducting plate are fixed at the top and the bottom of two sides of the transceiver body; and packaging adhesive tapes fixed on the transceiver body are arranged on the front surface and the back surface of the heat-conducting plate. The heat-conducting plate and the heat-conducting fins are arranged on the upper surface and the lower surface of the transceiver body to dissipate heat outwards, the heat conduction efficiency of the packaging glue layer formed by the heat-conducting silica gel strips and the heat-conducting cushion layer formed by the heat-conducting paste is high, and the surface area of the transceiver body is greatly increased by the heat-conducting fins and the wiredrawing grooves in the surfaces of the heat-conducting plate and the heat-conducting fins. Moreover, the lower part of the transceiver body and the heat-conducting fins can support and suspend the transceiver body, thereby preventing the whole lower surface from not dissipating heat, and achieving the purpose of integrally improving the heat-conducting and heat-dissipating effects.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of ethernet transmission technology, concretely is a kind of optical fiber transceiver structure. BACKGROUND

[0002] Optical fiber transceiver is a kind of Ethernet transmission media conversion unit for interchanging short distance twisted-pair electrical signal and long distance optical signal, and its function is to convert electrical signal into optical signal and send it out, and convert received optical signal into electrical signal and input it to receiving end.Optical fiber transceiver is generally applied in actual network environment where Ethernet cable cannot be covered and optical fiber must be used to extend transmission distance, and it also plays a huge role in helping to connect optical fiber last one kilometer line to metropolitan area network and outer network.

[0003] Generally, optical fiber transceiver itself generates heat, however, the equipment generates more and more heat after long time use of optical fiber transceiver, even in the case that there is no damage and no contact failure in circuit and component of optical fiber transceiver, when temperature reaches a certain degree, optical fiber transceiver will crash, which affects normal work.Most of optical fiber transceivers on the market only dissipate heat through surface heat dissipation holes, and the heat dissipation effect of heat dissipation holes is poor due to the relatively closed use environment of optical fiber transceiver, which is not conducive to stable operation of optical fiber transceiver. UTILITY MODEL CONTENT

[0004] In view of the deficiencies in the prior art, the utility model provides an optical fiber transceiver structure to solve the problem of poor heat dissipation effect of optical fiber transceiver on the market and unstable operation.

[0005] To solve the above technical problems, the utility model provides the following technical scheme:

[0006] An optical fiber transceiver structure, comprising a transceiver body, the upper surface and the lower surface of the transceiver body are provided with heat-conducting plates, the facing away surfaces of the two heat-conducting plates are provided with heat-conducting fins, the heat-conducting fins are uniformly distributed on the heat-conducting plates, a heat-conducting pad layer is arranged between the heat-conducting plates and the transceiver body, the top and the bottom of the two sides of the transceiver body are fixed with clamping strips clamping the heat-conducting plates, and the front surface and the back surface of the heat-conducting plates are provided with encapsulation adhesive tapes fixed on the transceiver body.

[0007] Preferably, the heat-conducting fins are arranged along the length or width direction of the transceiver body, and the heat-conducting fins are perpendicular to the heat-conducting plates.

[0008] Preferably, the heat-conducting plates and the heat-conducting fins are integrated aluminum plate structures, and the surfaces of the heat-conducting plates and the heat-conducting fins are provided with equidistant wire drawing grooves.

[0009] Preferably, the wire drawing groove is arranged along the length direction of the heat conduction fin.

[0010] Preferably, the heat conduction pad layer is composed of heat conduction paste uniformly coated between the upper and lower surfaces of the heat conduction plate and the transceiver body.

[0011] Preferably, the clamping strip is an L-shaped structure member adhesively fixed on the transceiver body, and the clamping strip is provided with a clamping groove at a position corresponding to the heat conduction plate.

[0012] Preferably, the encapsulation adhesive strip is a heat conduction silica gel strip adhesively fixed on the transceiver body and having a thickness greater than that of the heat conduction pad layer, and the two ends of the encapsulation adhesive strip are also clamped in the clamping groove.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] (1) The utility model discloses a heat conduction fin and a heat conduction plate are arranged on the upper and lower surfaces of the transceiver body to dissipate heat outward, the encapsulation adhesive layer composed of the heat conduction silica gel strip and the heat conduction pad layer composed of the heat conduction paste have high heat conduction efficiency, the heat conduction fin and the heat conduction plate and the wire drawing groove on the surface of the heat conduction fin greatly increase the surface area of the transceiver body, and the transceiver body and the heat conduction fin can also support and suspend the transceiver body, thereby avoiding that the entire lower surface does not dissipate heat, achieving the purpose of improving the overall heat dissipation effect, helping stable operation and solving the problem that the heat dissipation effect of the optical fiber transceiver on the market is poor and is not conducive to stable operation.

[0015] (2) The heat conduction plate of the utility model is clamped and installed on the transceiver body through the clamping strip, the heat conduction pad layer is composed of the heat conduction paste, the clamping strip and the encapsulation adhesive strip are adhesively fixed on the transceiver body, installation and fixation are convenient, operability is strong, the actual use environment of the transceiver body can be selected to select the direction along the length or width of the transceiver body that is more suitable for heat dissipation, the heat conduction plate and the heat conduction fin can be selectively cut and installed, and the heat conduction plate and the heat conduction fin can reach better heat dissipation effect. DRAWINGS

[0016] Figure 1 It is the overall structure front view of the heat conduction fin arranged along the length direction of the transceiver body.

[0017] Figure 2 It is the overall structure side view of the heat conduction fin arranged along the length direction of the transceiver body.

[0018] Figure 3 It is the encapsulation adhesive strip rear structure front view of the heat conduction fin arranged along the length direction of the transceiver body.

[0019] Figure 4 It is the overall structure front view of the heat conduction fin arranged along the width direction of the transceiver body.

[0020] Figure 5 It is the whole structure side view of the heat conduction fin arranged along the width direction of the transceiver body of the utility model;

[0021] Figure 6 It is the packaging adhesive tape rear structure front view of the heat conduction fin arranged along the width direction of the transceiver body of the utility model;

[0022] Figure 7 It is the card strip front view of the utility model;

[0023] Figure 8 It is the local structure enlarged view of the heat conduction plate and the heat conduction fin of the utility model.

[0024] In the drawing: 1, transceiver body; 2, heat conduction plate; 3, heat conduction fin; 4, heat conduction pad layer; 5, card strip; 6, packaging adhesive tape; 7, wire drawing groove; 8, card slot. DETAILED DESCRIPTION

[0025] The technical scheme in the embodiments of the utility model will be described clearly and completely below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.

[0026] As shown in Figures 1-8 The utility model provides a kind of technical scheme: a kind of optical fiber transceiver structure, including transceiver body 1, the upper surface and lower surface of transceiver body 1 are provided with heat conduction plate 2, the facing away surface of two heat conduction plates 2 is provided with heat conduction fin 3, heat conduction fin 3 is evenly distributed on heat conduction plate 2, heat conduction fin 3 is arranged along the length or width direction of transceiver body 1, and heat conduction fin 3 is perpendicular to heat conduction plate 2, heat conduction plate 2 and heat conduction fin 3 are one-piece aluminum plate structure, and the surface of heat conduction plate 2 and heat conduction fin 3 is provided with equidistant wire drawing groove 7, wire drawing groove 7 is arranged along the length direction of heat conduction fin 3;

[0027] Heat conduction pad layer 4 is arranged between heat conduction plate 2 and transceiver body 1, and heat conduction pad layer 4 is composed of heat conduction paste evenly coated between the upper and lower surfaces of heat conduction plate 2 and transceiver body 1;

[0028] The top and bottom of the two sides of transceiver body 1 are fixed with card strip 5 for clamping heat conduction plate 2, card strip 5 is L-shaped structural member fixedly attached to transceiver body 1, and card slot 8 is arranged at the position corresponding to heat conduction plate 2 of card strip 5;

[0029] The front and back of the heat-conducting plate 2 are provided with encapsulation adhesive strips 6 fixed on the transceiver body 1, the encapsulation adhesive strips 6 are heat-conducting silica gel strips fixed on the transceiver body 1 and the thickness is greater than the thickness of the heat-conducting pad layer 4, and the two ends of the encapsulation adhesive strips 6 are also clamped in the clamping grooves 8.

[0030] Working principle:

[0031] According to the actual use environment of the transceiver body 1, the direction along the length or width of the transceiver body 1 which is more suitable for heat dissipation is selected, the heat-conducting plate 2 and the heat-conducting fins 3 are selectively cut and installed on the transceiver body 1 through the clamping strips 5, the heat is dissipated outward through the heat-conducting plate 2 and the heat-conducting fins 3, the encapsulation adhesive layer formed by the heat-conducting silica gel strips and the heat-conducting pad layer 4 formed by the heat-conducting paste have high heat conduction efficiency, the heat-conducting fins 3 and the wire-drawing grooves 7 on the surfaces of the heat-conducting plate 2 and the heat-conducting fins 3 greatly increase the surface area of the transceiver body 1, and the transceiver body 1 and the heat-conducting fins 3 below can also support and suspend the transceiver body 1, and the overall heat dissipation effect is improved.

[0032] It should be noted that in this document, such as the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or equipment.

[0033] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, replacements and variations of the embodiments can be made without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An optical fiber transceiver structure comprising a transceiver body (1), characterized in that: The upper surface and the lower surface of the transceiver body (1) are provided with heat-conducting plates (2), the surfaces away from each other of the two heat-conducting plates (2) are provided with heat-conducting fins (3), the heat-conducting fins (3) are uniformly distributed on the heat-conducting plates (2), heat-conducting pad layers (4) are arranged between the heat-conducting plates (2) and the transceiver body (1), the top and the bottom of the two sides of the transceiver body (1) are fixed with clamping strips (5) clamping the heat-conducting plates (2), the front surface and the back surface of the heat-conducting plates (2) are provided with encapsulating adhesive strips (6) fixed on the transceiver body (1).

2. An optical fiber transceiver structure according to claim 1, wherein: The heat-conducting fins (3) are arranged along the length or width direction of the transceiver body (1), and the heat-conducting fins (3) are perpendicular to the heat-conducting plates (2).

3. An optical fiber transceiver structure as defined in claim 1, wherein: The heat-conducting plates (2) and the heat-conducting fins (3) are an integral aluminum plate structure, and the surfaces of the heat-conducting plates (2) and the heat-conducting fins (3) are provided with equidistant wire-drawing grooves (7).

4. An optical fiber transceiver structure according to claim 3, wherein: The wire-drawing grooves (7) are arranged along the length direction of the heat-conducting fins (3).

5. An optical fiber transceiver structure as defined in claim 1, wherein: The heat-conducting pad layers (4) are composed of heat-conducting paste uniformly coated between the upper and lower surfaces of the heat-conducting plates (2) and the transceiver body (1).

6. An optical fiber transceiver structure as defined in claim 1, wherein: The clamping strips (5) are L-shaped structural members adhesively fixed on the transceiver body (1), and the clamping strips (5) are provided with clamping grooves (8) at positions corresponding to the heat-conducting plates (2).

7. An optical fiber transceiver structure according to claim 6, wherein: The encapsulating adhesive strips (6) are heat-conducting silica gel strips adhesively fixed on the transceiver body (1) and having a thickness greater than that of the heat-conducting pad layers (4), and the two ends of the encapsulating adhesive strips (6) are also clamped in the clamping grooves (8).

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